Abstract: Apparatus and methods for conditioning a polishing pad in a CMP system are provided. In one embodiment, a method includes performing a pre-polish process including urging a conditioner disk against a polishing surface of a polishing pad disposed in a polishing station, moving the conditioner disk relative to the polishing pad in a sweep pattern across the polishing surface while monitoring a rotational force value required to move the conditioner disk relative to the polishing pad, determining a metric indicative of an interaction between the conditioner disk and the polishing surface from the rotational force value, adjusting a polishing recipe in response to the metric, and polishing one or more substrates using the adjusted polishing recipe.

Abstract: A CNC system for effecting a finishing treatment of a surface, including: a mechanical assembly having a mechanical arm, adapted to move within at least two controllable axes of motion; a shoe arrangement, adapted to connect to an end of the arm and having at least one flexible surface finishing pad; and a drive mechanism adapted to drive the arm; a controller; a communication arrangement adapted to deliver communication signals between the controller and the mechanical assembly; and a positioning system providing the controller with positioning information with respect to the mechanical assembly, the system configured whereby the arm is responsive to the controller, the mechanical assembly adapted to urge the working surface against a workpiece surface, whereby a pressure is delivered thereto, the mechanical assembly including a controllable spring arrangement disposed and adapted to contribute to an overall mechanical compliance, normal to the working surface, of the mechanical assembly, the spring arrangem

Abstract: Automated polishing systems include a polisher for polishing the coating on the article and a robotic positioner for moving the polisher relative to the article on an automated path, wherein the polisher polishes at least a part of the coating during movement, a force feedback sensor for determining a force of the polisher against the article during polishing, and a controller for maintaining the polisher within a predetermined force range against the article based at least in part on the force determined by the force feedback sensor.

Abstract: A method and apparatus for releasbly attaching flexible abrasive disks to a flat-surfaced platen that floats in three-point abrading contact with three rigid equal-height flat-surfaced rotable fixed-position workpiece spindles that are mounted on a precision-flat abrading machine base where the spindle surfaces are in a common plane that is co-planar with the base surface. The three spindles are positioned to form a triangle of platen supports where the rotational-centers of each of the spindles are positioned at the center of the annular width of the platen abrading surface. Flat surfaced workpieces are attached to the spindles and the rotating floating-platen abrasive surface contacts all three rotating workpieces to perform single-sided abrading. The platen abrasive can be re-reflattened by attaching equal-thickness abrasive disks to the three spindles that are rotated while in abrading contact with the rotating platen abrasive. There is no wear of the abrasive-disk protected platen surface.

Abstract: Embodiments of the present invention generally provide a load cup used in the transfer of substrates in a chemical mechanical polishing system. The load cup includes an improved substrate edge sensing mechanism to ensure a substrate is present and correctly positioned in the load cup for transfer to a polishing head. In one embodiment, a lever actuated edge sensing mechanism is provided. In one embodiment, the edge of a substrate contacts a lever, which contacts a sensor to detect that the substrate is present and correctly positioned for exchange with a polishing head. Embodiments of the present invention provide reliable detection, while reducing contact with the feature side of the substrate during substrate transfer.

Abstract: A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.

Abstract: A polishing apparatus includes a plurality of stations supported on a platform, the plurality of stations including at least two polishing stations and a transfer station, each polishing station including a platen to support a polishing pad, a plurality of carrier heads suspended from and movable along a track such that each polishing station is selectively positionable at the stations, and a controller configured to control motion of the carrier heads along the track such that during polishing at each polishing station only a single carrier head is positioned in the polishing station.

Abstract: A polishing apparatus polishes a substrate by moving the substrate and a polishing pad relative to each other. The apparatus includes: an elastic modulus measuring device configured to measure an elastic modulus of the polishing pad, and a polishing condition adjustor configured to adjust polishing conditions of the substrate based on a measured value of the elastic modulus. The polishing conditions include pressure of a retaining ring, arranged around the substrate, exerted on the polishing pad and a temperature of the polishing pad.

Abstract: The invention relates to a method for grinding a continuous casting product (1), in particular a slab, wherein the continuous casting product (1) in the cross-section has a rectangular contour comprising two long sides (2, 3) disposed opposite of each other and two short sides (4, 5) disposed opposite of each other, wherein in a working position (A), in which the continuous casting product (1) rests on a grinding table (6) with one of the long sides (2) thereof, one of the long sides (2) of the continuous casting product (1) is subjected to a surface treatment by means of at least one grinding tool (7).

Abstract: An automatic grinding machine for end mills for wood, programmable with optical reading of geometric features and for computerized sharpening, has a compact structure, which includes a computerized control panel actuating various assemblies adapted for automated sharpening. A first optical reading assembly has an arm for automatic movement from an inactive position to a position suited for detecting the geometric features of the end mill. A second assembly for holding the end mill is configured to move on command forward and backward and/or simultaneously rotate the mill about its own axis. A third assembly for supporting a cup grinding wheel is mounted on the vertical frame, which rests on a rotatable circular and horizontal base. The grinding wheel can move above and below, longitudinally along the mill and/or in front of it, on the right and left side to sharpen end mills for wood with a left-handed or right-handed helix.

Abstract: A low friction flat-lapping abrading apparatus and method for releasably attaching flexible abrasive disks to a flat-surfaced platen that floats in three-point abrading contact with flat-surfaced workpieces that are attached to three rotary spindles. The rigid equal-height flat-surfaced rotatable fixed-position workpiece spindles are mounted on a flat abrading machine base. They are positioned to form a triangle to provide stable support of the floating platen. All three spindle-tops are co-planar aligned to provide a precision-flat reference plane for mounting of the workpieces. The lapping operation has very high abrading speeds and very low abrading forces. The lightweight but strong lapping machine employs a pivot-balance structure where the weight of the drive motor is used to balance the weight of the abrading platen. Use of low-friction air bearings provides the capability for precision control of the abrading forces. The lapping machine is robust and well suited for a harsh abrading environment.

Abstract: Enhanced methods are disclosed for performing operations such as cleaning, inspection or data acquisition on an external surface of a hollow cylindrical tubular. Preferred embodiments include providing a fluid dispenser and an abrasion assembly on a buggy that travels up and down the length of the tubular as the tubular rotates. The fluid dispenser includes nozzles that dispense cleaning fluids onto the tubular's external surface. The abrasion assembly includes a swivel brush and a brush train providing different styles of abrasion cleaning of the tubular's external surface. Preferred embodiments of the buggy also carry a range finding laser and an optical camera generating samples that may be processed in real time into data regarding the surface contours and the diameter variations on the tubular's external surface. Cleaning and inspection variables such as tubular rotational speed, or buggy speed, may be adjusted responsive to measured surface contour data.

Abstract: A linear, automated apparatus and method for clean, cost-effective, simultaneous lapping and polishing of optics, semiconductors and optoelectronic materials is presented, constructed principally from corrosion resistant stainless steel or nickel, enabling utilization of high purity water based abrasive slurry. The circular stainless steel or nickel lapping plate of the apparatus supports a synthetic nylon or rayon pad, whereby material is abraded from the workpiece primarily through the reciprocal, back and forth, linear movement of the workpiece holder, diametrically across the circular lapping plate, with intermittent rotation in step increments of the workpiece holder and affixed workpiece, tracing arcs of 180 degrees, first in a clockwise and subsequently counterclockwise direction.

Abstract: The invention relates to a method and an arrangement for re-creation of an optimized contour of the leading edges of gas-turbine blades, in which a gas-turbine blade (2) is passed by one or more grinding machine or machines (71, 71?) with the aid of a computer-controlled robot (10). The desired contour is achieved by following a movement procedure which is stored in a data memory (21). The stored movement procedure is designed to convert a blade from a previously determined statistical mean wear state to a likewise previously determined or calculated design contour. The contact pressure of the gas-turbine blade on the grinding disk or disks (71, 71?) is measured and is taken into account in the movement procedure of the robot (10) such that the desired design contour is achieved irrespective of the initial contour and wear of the grinding disks.

Abstract: A grinding center for the simultaneous grinding of a plurality of main and rod bearings and/or central and end-side sections of crankshafts includes first and second stations. Two main bearing grinding spindles, of which the first is movable only in the Z-direction and the second only insignificantly movable in the X-direction, are mounted on a common rod bearing-compound slide. In the final phase of grinding, a correction of variations in size between the two processed rod bearings occurs via a separated drive of the second rod bearing-grinding spindle in accordance with a size or roundness correction. The variations are detected by measuring devices. An inclined profiled grinding wheel is provided for the grinding of the end sections.

Abstract: A device for polishing wheels of truck or cars without removing the valve or the tire of the wheel. The device comprises three parts: a rotative assembly fixed to a stand subject to an angular movement and housed upon a pendulum in extension. The rotative assembly includes a motor connected to a primary speed reducer 10:1 linked to a second speed reducer 60:1 fixed to a jaw turning at an average speed of 3 rpm, on which a wheel is positioned. The device is auto lubricating when a relative orientation of one reducer with respect to the other at 15° allows to maintain oil level in a critical reducer to prevent friction of mobile part inside the critical reducer. The pendulum possesses a pair of wheels to permit the displacement of the assembly on the ground while an actuator located on the pendulum causes the angular movement of the stand.

Abstract: A processing apparatus includes a turn table rotatably provided and having an opening; at least five chuck tables provided on the turn table, each chuck table having a holding surface for holding a workpiece; a support bed inserted through the opening of the turn table; four processing unit supporting mechanisms each including a first support column provided on the outside of the turn table, a second support column provided on the support bed, and a support member mounted to the first and second support columns; four processing units respectively supported by the four processing unit supporting mechanisms, the four processing units respectively corresponding to four of the at least five chuck tables; and four feeding units for respectively moving the four processing units in a direction perpendicular to the holding surfaces of the chuck tables.

Abstract: Industrial pallet has a body with an open bay, in which a work piece can be secured such that it can be worked on from either side of the pallet. An overhead gantry and/or flipping unit may be employed to move from station to station and/or flip the work piece itself or the work piece mounted in the pallet. Aside from the flipping unit, robotic moving and/or loading may be employed by the overhead gantry, which has two axes of motion only. Such components can be combined in a manufacturing system to make parts.

Abstract: There are three flat-surfaced rotary workpiece abrasive lapping spindles that are spaced apart from each other in a circle and are attached to the flat surface of a granite lapping machine base. Flat-surfaced workpieces are attached to the flat rotary surfaces of the workpiece spindles. Flexible abrasive disks are attached to the annular abrading surface of a rotary platen that is positioned to be concentric with the three spaced workpiece spindles. The platen is moved where the disk abrasive surface contacts the workpieces that are attached to the workpiece spindles. Both the platen and the workpieces spindles are rotated at high speeds to flat lap the exposed surfaces of the workpieces. Laser alignment devices are attached to an alignment rotary spindle that is positioned at the center of the workpiece spindle circle. These laser alignment distance sensors are used to co-planar align the top flat surfaces of the workpiece spindles.

Abstract: A method and apparatus for robotic devices that can be used to load and remove workpieces and abrasive disks for an abrading system having a floating, rotatable abrading platen that is three-point supported by annular, flat abrading-surface of the floating platen. The rotary spindles are mounted on the flat horizontal surface of a machine base and the spindle-top flat surfaces are aligned to be precisely co-planar with each other where the rotational-centers of each of the spindles fixed-position rotary flat-surfaced spindles. The flexible abrasive disks are releasably attached to the are positioned at the center of the annular radial-width of the platen abrading-surface. Flat-surfaced workpieces are attached to the spindle-top flat surfaces and the abrasive surface of the abrasive disk that is attached to the rotating floating-platen abrading surface contacts the workpieces to perform single-sided abrading on the workpieces.

Abstract: Three rotary wafer abrasive lapping spindles having attached wafers are mounted on the flat surface of a granite lapping machine base. A flexible raised island abrasive disk is attached to the annular abrading surface of an abrading platen that is rotated at high speeds to flat lap, or polish, the exposed surfaces of the rotating wafers. Resilient wafer pads are used to minimize the effects of the abraded surfaces of the wafers not being precisely parallel to the platen abrading surface due to misalignment of the spindle tops. The resilient pads also compensate for two opposed flat surfaces of wafers not precisely parallel with each other. A mixture of the same types of chemicals that are used in the conventional CMP polishing of wafers with applied coolant water can be used with this abrasive lapping or polishing system to enhance abrading and to continually wash abrading debris from the wafers.

Abstract: A method for adjusting a height position of a polishing head, comprising moving the polishing head to a height position at which the polishing head comes in noncontact with the polishing pad with the polishing head holding no workpiece, and then rotating at least one of the polishing head and the turn table; measuring the load torque current of the at least one of the polishing head and the turn table rotated with the torque-measuring mechanism while the height-adjusting mechanism moves the polishing head toward the polishing pad until the polishing head contacts the polishing pad, and recording the height position of the polishing head as a reference position when a variation in the measured load torque current exceeds a threshold; and adjusting the height position of the polishing head to the predetermined position on the basis of a distance from the reference position.

Abstract: A method of reducing manufacturing defects of semiconductor wafers during a back-grinding process. The method includes receiving a semiconductor wafer on a chuck table, wherein said chuck table has a surface upon which a front side of the wafer is placed, and wherein said chuck table has one or more holes in surface and one or more sensors placed in said one or more holes. The method further includes grinding at least a portion of a back side of the semiconductor wafer. The method further includes monitoring a parameter, while grinding, measured by the one or more sensors and adjusting the grinding based at least on the monitored parameter.

Abstract: An ultrasonic trimming method is composed of steps, driving a cutter blade having a flat plate shape and supported by an arm at an end of an articulated robot via an ultrasonic oscillator, the cutter blade being driven by the arm while the cutter blade is ultrasonically vibrated; cutting a workpiece secured by a workpiece securing portion; and during, operation for cutting, moving the cutter blade held attached to the articulated robot to the position at where the cutting edge is brought into contact with the grindstone, maintaining the cutter blades attitude such that a plane containing the cutting edge thereof contacts the grindstone, and grinding the cutter blade by pressing the cutter blade against a grinding member by the arm while the cutter blade is ultrasonically vibrated, the grinding member being disposed within a movable range of the cutter blade driven by the articulated robot.

Abstract: A flexure assembly comprising a flexure stack comprising a plurality of individual webs connected together with a force in an x-direction to produce a friction in a z-direction orthogonal to the x-direction between the plurality of webs, the friction holding the plurality of webs in engagement. In some embodiments, the flexure assembly includes a second flexure stack fixedly spaced from the first stack comprising a second plurality of individual webs connected together with a second force in the x-direction to produce a second friction in the z-direction between the second plurality of webs. The flexure assembly may be used, for example, for supporting a workpiece such as a slider row bar in a lapping machine.

Abstract: According to an embodiment, a method of manufacturing a semiconductor device includes forming a wiring groove on an insulating film; forming a barrier metal layer and a metal layer; polishing the metal layer by applying a first load on the metal layer; and subsequently polishing the metal layer while applying a second load larger than the first load on the metal layer and spraying a gas onto a polishing pad. The polishing pad is in contact with the metal layer. The barrier metal layer covers an upper surface of the insulating film and an inner surface of the wiring groove, and the metal layer fills an inside of the wiring groove and covers the barrier metal layer.

Abstract: A polishing method includes simultaneously polishing two substrates, a first substrate and a second substrate, on the same polishing pad. A default overpolishing time is stored and an in-situ monitoring system monitors the two substrates. The in-situ monitoring system further determines a first polishing endpoint time and a second polishing endpoint time of the first and second substrates, respectively. The polishing method further includes calculating an overpolishing stop time where the overpolishing stop time is between the first polishing endpoint time plus the default overpolishing time and the second polishing endpoint time plus the default overpolishing time. Polishing of the first substrate is continued past the first polishing endpoint time and polishing of the second substrate is continued past the second polishing endpoint time. Polishing of both the first substrate and the second substrate is halted simultaneously at the overpolishing stop time.

Abstract: A process and an apparatus for generating control data for controlling a tool on a machine tool comprising at least 5 axes for the production of a predetermined finished part having a base body and at least one flank section protruding from the base body, finished part geometry data of the predetermined finished part geometry of the finished part being generated by means of fundamental geometry parameters and path data being generated by means of the finished part geometry data, the path data indicating the tool path along the surface of the flank section over which the tool has to travel with what tool orientation relative to the workpiece to remove material from the workpiece, the tool orientation of the tool corresponding to an orientation of a axis of rotation of the tool and the tool rotating about the axis of rotation of the tool to remove material from the workpiece.

Abstract: A form tap includes a shank having a shank length and a thread portion that extends along at least a portion of the shank length. The thread portion includes a finishing portion and a chamfer portion. Each of the finishing portion and the chamfer portion include a plurality of threads and each thread has a crest and a root. The plurality of threads of both the finishing portion and the chamfer portion are spaced apart at a constant pitch, such that a crest-to-crest distance between adjacent threads remains constant along the entire thread portion.

Abstract: A method and apparatus for releasably attaching flexible abrasive disks to a flat-surfaced platen that floats in three-point abrading contact with three flat-surfaced rotatable fixed-position workpiece spindles that are mounted on a nominally-flat abrading machine base. The spindle-top flat surfaces are precisely co-planar with each other and approximately co-planar with the machine base horizontal surface. The three spindles are positioned to form a triangle of platen supports where the rotational-centers of each of the spindles are positioned at the center of the annular width of the platen abrading-surface. Flat surfaced workpieces are attached to the spindles and the rotating floating-platen abrasive surface contacts the workpieces to perform single-sided abrading on them. The disk abrasive surfaces can be re-flattened by attaching abrasive disk-type components to the three spindles that are rotated while in abrading contact with the rotating abrasive disk.

Abstract: A method and a device for machining the leading edge of a turbine engine blade by a machining center for which parameters are set is disclosed. The method includes: acquiring a 3D profile of the leading edge of the blade; calculating at least one characteristic of the leading edge from the 3D profile; comparing the value of the calculated characteristic with a known theoretical value of the characteristic to obtain an elementary difference for the characteristic; calculating at least one undulation of the leading edge between at least two consecutive elementary sections from the 3D profile; optimizing the elementary differences obtained as a function of the undulation; setting the parameters of the machining center as a function of the optimized elementary differences for the elementary sections to define machining passes over the leading edge; and machining the leading edge of the blade with the machining center with parameters set.

Abstract: A grinder for sharpening the blades of reel mowers automatically to grind the underside of the blade of the reel mower.

Abstract: A first angular grinding wheel and a straight grinding wheel having rotation axes parallel to each other are arranged on a swivel slide that turns about a turning axis. A reference symmetry plane (MA) that is parallel to a grinding wheel rotation axis and that includes the turning axis and a reference perpendicular plane (MB) that is perpendicular to the reference symmetry plane and that includes the turning axis are defined. A grinding reference point (PA1) of the first angular grinding wheel (TA1) and a grinding reference point (PP1) of the straight grinding wheel (TP1) are arranged asymmetrical with respect to the reference symmetry plane. A distance from the grinding reference point of the straight grinding wheel to the reference symmetry plane is equal to a distance from the grinding reference point of the first angular grinding wheel to the turning axis.

Abstract: An improved grinder/polisher includes a base having a bowl, a rotating drive plate and a drive plate drive that is adapted to support a platen. The grinder/polisher includes a head configured to support a specimen holder. The head has a first drive for rotational drive of the specimen holder and a second drive for moving the specimen holder toward and away from the drive plate. The head includes a load cell operably connected to the first drive and a counter operably connected to the second drive. The counter is configured to determine movement and the extent of movement of the head toward and away from the drive plate. The grinder/polisher includes a control panel mounted within a housing and including a microprocessor controlled control system having a touch panel or screen.

Abstract: A method and an apparatus for grinding an axial workpiece are capable of removing a turning lead portion of an axial workpiece having an oil seal fit portion on its outer circumferential surface by grinding without any grinding fluid. The apparatus includes a headstock of a lathe for rotatably supporting an axial workpiece about its axis, the workpiece having an oil seal fit portion on its outer circumferential surface, and a slide mount disposed so as to be radially movable with respect to a tool turret of the lathe. The apparatus also includes an air cylinder for moving the slide mount back and forth in alignment with the axis of the headstock, an elastic grinding stone wheel rotatably attached to the slide mount to be movable radially back and forth with respect to the oil seal fit portion by the slide mount being moved, and a brushless motor for rotating the elastic grinding stone wheel.

Abstract: A pocket (6) is machined into the surface of a component (9) by pressurising a fluid (1) and directing a jet (11) of the pressurized fluid (1) at the surface to be machined. Continuous relative movement is provided between the component (9) and the pressurized jet (11) of fluid (1) during machining. Material is removed from the component (9) in a series of layers, whereby the path of the fluid jet (11) in one of the layers is perpendicular to the path of the fluid jet (11) in the subsequent layer. The fluid jet (11) operates continuously until the required amount of material has been removed from the component (9).

Abstract: The present invention discloses an automatic polishing device and the method of using the device for the surface finishing of a workpiece such as complex-curved-profile parts. Automatic polishing is performed by mounting the workpiece on an apparatus which enables different orientations along multiple axes and immerging the workpiece in a controlled flow of abrasive slurry. The device of the present invention provides a uniform finish on free form surface. It is also precise, low cost, non-destructive, and non-polluting.

Abstract: A glass-plate working machine 1 is arranged such that while a cutting head 9 for forming a cut line on a glass plate 5 and a grinding head 10 for grinding a peripheral edge of the glass plate 5 bend-broken along the cut line are being moved simultaneously in parallel under numerical control, the cutting head 9 and the grinding head 10 respectively having angle control motors 46 and 49 are synchronously subjected to angular control about axes 39 perpendicular to the surface of the glass plate 5, and the cutting head 9 and the grinding head 10 are moved such that the orientation of a cutter wheel 52 is adjusted to a processing line, and the press contacting direction of a grinding wheel 64 of the grinding head 10 is kept in a normal direction with respect to a processing line of an edge of the glass plate 5.

Abstract: A method of prepping a surface using a high-frequency forced pulsed waterjet entails generating a high-frequency signal having a frequency f using a high-frequency signal generator, applying the high-frequency signal to a transducer having a microtip to cause the microtip of the transducer to vibrate to thereby generate a forced pulsed waterjet through an exit orifice of a nozzle having an exit orifice diameter d and a length L. The forced pulsed waterjet prepares the surface to within a predetermined range of surface roughness. The surface roughness is determined by selecting operating parameters comprising a standoff distance (SD), a traverse velocity VTR of the nozzle, a water pressure P, a water flow rate Q, a length-to-diameter (L/d) ratio, a microtip-to-orifice distance (a), the frequency f, and an amplitude A of the high-frequency signal.

Abstract: A constant force finishing system used to finish a surface of a workpiece includes at least a first movement device arranged to apply a first movement to a finishing tool, the first movement having a range of distance D1. The finishing system also includes a constant force device (CFD) in mechanical communication with the finishing tool, the CFD arranged to apply a second movement in conjunction with the first movement to the finishing tool, the second movement having a range of ?1, where D1>>?1.

Abstract: A chemical mechanical polishing system includes a carrier head having a flexible membrane and a chamber to apply pressure to the flexible membrane, a pressure control unit, a pressure supply line connecting the pressure control unit to the chamber, and a sensor located along the pressure supply line to detect a contaminant in the pressure supply line.

Abstract: Methods and apparatus provide for delivering a controlled supply of gas to at least one aero-mechanical device to impart a gas flow to suspend a material sheet; preventing lateral movement of the material sheet in at least one direction when suspended; and imparting a stream of water, from a side of the material sheet opposite the at least one aero-mechanical device, to cut the material sheet when suspended.

Abstract: A method for producing a semi-finished product for a plus or minus power lens having a toroidal or atoroidal back that is configured as a prescription surface. According to the method, a blank having a diameter DR and a front having a radius of curvature rV is fixed on its front for the purpose of machining the back and is subjected to cutting, the prescription surface being produced only across a part of the diameter D.

Abstract: The present invention provides a polishing pad used for planarizing inter layer dielectrics and the like by CMP (chemical mechanical polishing) in the manufacturing process of a semiconductor device, a method of producing the polishing pad and a method of producing a semiconductor device by using the polishing pad. The present invention relates to a semiconductor wafer polishing pad having grooves in a polishing surface and formed from a foamed polyurethane, wherein a processed surface of the groove comprising a side surface and a bottom surface has a surface roughness Ra of not more than 10.

Abstract: In a grinding machine, a retraction grinding is performed after a first advance grinding. Within a rotational range for a cylindrical workpiece to rotate from a present rotational phase to a target rotational phase in the retraction grinding, target grinding resistances in respective rotational phases are generated based on residual grinding amounts in the respective rotational phases of the cylindrical workpiece. Then, the retraction grinding is performed and controlled to make a grinding resistance detected by a force sensor agree with the target grinding resistances in respective rotational phases.

Abstract: A system for performing a polishing operation on a component is disclosed, the system comprising a robot, a fixture, a mount system for attaching the fixture to a robotic arm and a drive system mounted on the fixture for driving a polishing tool such that the location of the point of contact of the polishing tool with respect to the component is maintained constant during the polishing operation.

Abstract: In the cylindrical grinding of the main and rod bearings of crankshafts, the rod bearings are ground prior to the main bearings. The advantage of this is that the deformations that unavoidably occur, mainly during grinding of the rod bearings due to the removal of ground material are taken into account and compensated for again during grinding of the main bearings. The rod bearings are ground through CNC-control in the pin-chasing grinding method, and the crankshaft is held in a rotating axis in the process, said axis defined by two bearing points in the longitudinal extension of the crankshaft main bearing which are only machined. Deviations in said actual rotating axis from the determining geometric longitudinal axis of the crankshaft are taken into account in the pin-chasing grinding method by the computer of the grinding machine.

Abstract: The invention relates to a method for the operation of a gear or profile grinding machine (1) for the grinding of pre-geared or pre-profiled workpieces (2), wherein the machine comprises at least one tool spindle (3) which can carry at least one grinding tool (4) and wherein the machine comprises at least two workpiece spindles (5, 6) which can at least temporarily be driven to the tool spindle (3) for cooperation of the workpiece (2) with the grinding tool (4). To improve the ratio between primary processing time and secondary processing time the invention proposes that the at least two workpiece spindles (5, 6) are pivoted around a respective axis of rotation (7, 8) for transportation from a grinding position (I) to a loading station (II) and vice versa, wherein the rotation of the two workpiece spindles (5, 6) takes place independently from another. Furthermore, the invention relates to a gear or profile grinding machine.

Abstract: A load cup apparatus for transferring a substrate in a processing system includes a pedestal assembly having a substrate support, an actuator, and a controller. The actuator is configured to move the pedestal assembly into a loading position in contact with a retaining ring of a carrier head and to generate a retaining ring thickness signal based on a distance travelled by the pedestal assembly. The controller is configured to receive the retaining ring thickness signal from the actuator.

Abstract: A method and apparatus for releasably attaching flexible abrasive disks to a flat-surfaced platen that floats in three-point abrading contact with three flat-surfaced rotatable fixed-position workpiece spindles that are mounted on spherical-rotation two-piece spindle-mount devices that are attached to a nominally-flat abrading machine base. The spindle-top flat surfaces are precisely co-planar with each other. The three spindles are positioned to form a triangle of platen supports where the rotational-centers of each of the spindles are positioned at the center of the annular width of the platen abrading-surface. Flat surfaced workpieces are attached to the spindles and the rotating floating-platen abrasive surface contacts the workpieces to perform single-sided abrading on them. The disk abrasive surfaces can be re-flattened by attaching abrasive disk-type components to the three spindles that are rotated while in abrading contact with the rotating abrasive disk.