Abstract: A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.

Abstract: A device for phasing a threaded grinding stone is phased with respect to a workpiece or a disk dresser prior to the engagement of the threaded grinding stone with the workpiece or with the disk dresser during grinding or dressing. In performing this phasing, it is detected, by means of an AE fluid sensor provided to a grinding stone head which rotatably supports the threaded grinding stone, whether the threaded grinding stone has had contact with the workpiece or the disk dresser. Subsequently, on the basis of the phase of the threaded grinding stone at the time when contact was detected, the threaded grinding stone is positioned in a phase where the aforementioned engagement is feasible.

Abstract: A neck portion grinding apparatus and method is designed to reduce working man-hours and to improve processing accuracy with respect to a processing of a workpiece. The neck portion grinding apparatus includes a grinding device having a disc-like grinding wheel and a wheel rotating device for rotating the grinding wheel, and a machine tool having a main shaft for rotatably supporting a rotating tool and a table mounting the grinding device thereon, and relatively moving the main shaft and the table by numeral control. A shape of a neck portion of the rotating tool can be changed by relatively moving the main shaft and the table while mutually rotating the rotating tool and the grinding wheel, and grinding the rotating tool by the grinding wheel.

Abstract: The invention relates to a device for the double-sided processing of flat work pieces, comprising an upper working disc and a lower working disc, wherein the working discs between the working surfaces thereof facing each other, form a working gap for processing the work pieces, and wherein at least one of the working discs comprises a plurality of bores extending through the working surface for feeding a liquid working medium into the working gap, wherein the bores are combined in several groups, wherein each group of bores is connected to a separate pressurized supply line for the working medium, and at least one pressure control apparatus is provided, which makes it possible to control the pressure of the working medium in the supply lines separately from one another.

Abstract: A rolling machine includes a first clipping component, a second clipping component, a lifting component, and a holding assembly. The first clipping component has a first surface and a second surface opposite to the first surface. The second clipping component has a third surface configured to contact the first surface and a fourth surface opposite to the third surface. The lifting component is connected to the first clipping component and configured to drive the first clipping component to move back and forth. The holding assembly has a first and second holders configured to be symmetrically positioned on both sides of the first clipping component.

Abstract: A grinding device includes a fixed barrel, a moving barrel, a grinding plate, and an actuator. The fixed barrel defines a chamber and includes a number of inner surfaces substantially parallel to a central axis, each of which defines a holding groove therein for holding a workpiece. The moving barrel is received in the chamber and includes a side surface substantially parallel to the central axis and defines an installation groove. The grinding plate is fixedly installed in the installation groove. The actuator is configured for driving the moving barrel to spin and move back and forth along the central axis, and driving the moving barrel to move towards a workpiece so that a surface of the workpiece is grinded into a desired arc surface by the grinding plate, and driving the moving barrel to move towards another workpiece after the desired arc surface of the workpiece is obtained.

Abstract: Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the polishing heads are configured to move, and one or more carriages configured to carry at least one polishing head along the path defined by the track, wherein the one or more carriages are coupled to the track and independently movable along the track.

Abstract: The component to be machined (2) is fixed with its axis in a position exactly determined in relation to the machine base (1) and the seat (3), by means of the sides (8) and the rear face (9) of the vee arranged on the seat and by means of the intermediate organ (11) in the form of a sector of ring, the concave cylindrical facets (23) of which are adapted to the component (2). The component (2) is pressed against the facets (23) by the finger (14) operated by the stirrup (15). The component (2) can be driven in rotation by a floating spindle operated by a servomotor into a position determined in relation to the machine seat (1).

Abstract: A device for measuring tooth surface deviation includes a contact detector that measures the deviation at the tooth surface of a dresser with respect to a grinding tooth surface formed on a helical grinding tooth of a grinding tool when the grinding tool and a dresser toothed wheel are rotated synchronously in a state in which the grinding tooth surface and the dresser tooth surface of the dresser toothed wheel can be brought into contact, and detects contact between the grinding tooth surface and the dresser tooth surface; and a controller that changes the speed of rotation of the dresser toothed wheel in such a way that the detection result of the contact detector comes within the range of contact determination data, and also measures the amount by which the grinding tool and the dresser toothed wheel have been changed in one revolution of the dresser toothed wheel.

Abstract: The invention relates to a machine and process for grinding dies, in which the work axis (CO) of the plate (2.1) in which the die (1) to be machined is anchored is controlled at all the points of its angular movement, allowing the interpolation of the movements of this work axis (CO) with those of an axis of rotation (BO) and with those of respective axes (X and Z), such that the machines has four axes of interpolation, which allows machining dies (1) with their inner or outer diameter rounded or non-rounded and with their transition between these diameters and the side faces constant or variable by means of a single grinding process.

Abstract: In order to grind bar-shaped workpieces which have a non-circular cross-section and flat faces which are parallel to each other, two partial operations are performed consecutively. First, the bar-shaped workpiece is rough ground and finished on the faces by way of double-disk face grinding. The bar-shaped workpiece is clamped on the longitudinal sides in the first clamping position thereof, and the bar-shaped workpiece is transported between two clamping jaws, which clamp the workpiece in the second clamping position thereof on the faces. The first clamping position is then released, and the bar-shaped workpiece is rotated by the clamping jaws. A CNC-controlled peripheral grinding step is performed based on CX interpolation principles. This rough grinds and finishes the longitudinal sides of the bar-shaped workpiece. Transport from the first to the second clamping position is effected by a clamping station, which concomitantly forms the holder for the face grinding operation.

Abstract: The profile grinding machine includes: a base; a work unit disposed on one side on the base and including a work table for gripping a work; and a stone unit disposed on the other side on the base and including a stone rotating mechanism for holding and rotating a grinding stone on its axis. The work unit includes first to third moving device for supporting and moving the work table in an X-direction and a Y-direction perpendicular to each other in a horizontal plane, and in a Z-direction normal to the horizontal plane, respectively. The stone unit includes turning mechanism for turning the grinding stone about a vertical axis substantially coinciding with the leading end portion of the grinding stone.

Abstract: The invention relates to a device for fine machining workpieces, preferably for honing and/or fineboring cylinder bores in crankcases of internal combustion engines, wherein inside a module (1) one or two horizontally displaceable machining units (10, 11, 12, 13) each are provided on two longitudinal sides (2, 3) that are opposite each other for honing and/or fineboring. Each machining unit (10, 11, 12, 13) comprises a spindle (100), a drive for creating the oscillating stroke movement of the spindle (100) and for displacing the machining unit into the working position, a tool holder (8) with a rigid axis, and a feed device (60, 61, 62, 63, 64) for the radial feeding of the machining tools, and between the longitudinal sides equipped with the machining units (10, 11, 12, 13) a service chamber (7) that can be accessed from an end side, wherein at least one tool magazine (30, 31) is associated with the machining units (10, 11, 12, 13) at the rear end side (4) of the module (1).

Abstract: A control unit that relatively moves a headstock and tailstock and a tool to thereby machine a peripheral surface of a workpiece in a radial direction executes control such that a relative feed speed of the tool in the radial direction in a transitional state where an amount of warpage of the workpiece in the radial direction at a machining position increases is faster than a relative feed speed of the tool in the radial direction in a steady state where an amount of warpage of the workpiece in the radial direction at the machining position is constant. By so doing, it is possible to reduce a machining time at the time of the start of machining.

Abstract: A piston processing apparatus includes a work attaching head capable of fixing a piston material, a work rotating device, a grinding wheel, a grinding wheel rotating device, first and second moving mechanisms for moving the grinding wheel, a rotational angle detector for detecting a rotational angle of the work attaching head, a first and second position detectors for detecting a position of a grinding surface of the grinding wheel, a controller controls the first and second moving mechanisms to grind the outer circumferential surface by the grinding wheel based on target-position information of the grinding surface corresponding to a position on the outer circumferential surface of the piston material. According to the piston processing apparatus, the outer circumferential surface of the piston material can be processed into a three-dimensional shape with high-accuracy, and a piston that can improve fuel efficiency.

Abstract: Milling strategies for machining dental ceramic materials are provided that reduce milling time while maintaining strength, accuracy and marginal integrity.

Abstract: A carriage arrangement for a machine tool, which can be adjusted similar to a compound slide, has an increased rigidity against a machining force being taken up by said arrangement in that according to the invention a first carriage (1) can be adjusted relative to a machine base (4) along a first trajectory that is tilted toward the direction of force, and a second carriage loaded with the machining force can be adjusted at the first carriage along a second trajectory that is orthogonal to the direction of force (FIG. 1).

Abstract: A grinding machine is provided with first and second grinding wheels selectively used in dependence on the steps of machining operations. The second grinding wheel is grooved so that at least one oblique groove vertically crosses a contact surface on which a grinding surface of the second grinding wheel contacts with a workpiece, and thus, is capable of releasing a dynamic pressure in coolant generated between the grinding surface and the workpiece since coolant supplied from over the contact surface flows out from both of the upper and lower sides of the contact surface through the at least one oblique groove. Since it does not occur that fluctuations in the dynamic pressure generated in coolant cause the distance between the second grinding wheel and the workpiece to be varied, the accuracy in grinding the workpiece with the second grinding wheel can be enhanced.

Abstract: Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the polishing heads are configured to move, and one or more carriages configured to carry at least one polishing head along the path defined by the track, wherein the one or more carriages are coupled to the track and independently movable along the track.

Abstract: Disclosed is an automatic constant pressure polishing apparatus. The automatic constant pressure polishing apparatus comprises a housing having a hollow section therein, a rubber pad installed in the housing and having superior expansion and contraction characteristics, a pressure fixture having a male screw section, which is formed on an outer peripheral surface thereof in order to press and fix the rubber pad, and a central hole formed at a central portion thereof, a slider screw-coupled into the housing to adjust pressure in the housing according to a rotational degree of the rotating shaft, and a polishing pad installed at a front end portion of the housing.

Abstract: Disclosed is a polishing apparatus including a shell, a magnetic controller, an axle, a pusher, a ring, posts, and a stirring element. The shell includes a roof, a floor and a wall between the roof and the floor. Abrasive solution is filled in the shell. The abrasive solution includes abrasive grains and magnetic material. The magnetic controller is located around the wall. The axle can be engaged with a rotary element of a machine. The pusher is connected to the axle and inserted through the roof. A ring is located between the pusher and the wall. Posts are located between the ring and the floor. The stirring element is located on the floor.

Abstract: In through-feed grinding workpieces by grinding stones rotating around the axes of spindles, the spindles are tiltably held by elastic holding means around tilt axes substantially orthogonal to the direction of exit and entrance of the workpieces with respect to the grinding stones. When a grinding loads are imposed on the entrance sides of the grinding stones, the spindles are tilted by offset loads around the tilt axes against the force of urging means in such a manner that the axial displacement and the exit displacement of the grinding stone due to the offset load are substantially the same. The grinding stones are reset around the tilt axes by the elastic holding means immediately before the end of processing at which time the axial displacement is smaller. This makes it possible to reduce the number of defectively ground articles coming from the through-feed grinding and reduce the wear in the grinding stones.

Abstract: A grindstone contact sensing technology capable of sensing the contact position of the honing grindstone with the inner circumference of the work at high precision. A servo motor for driving the spindle rotation, and a servo motor for driving the depth of cut are provided and used respectively as spindle rotation drive source for rotating and driving the rotary spindle having the honing tool and depth-of-cut drive source for moving the honing grindstone at a specified depth of cut, and the contact position of the honing grindstone with the inner circumference of the work is sensed from various electrical information (rotating speed, torque, current value, stagnant pulses, etc.) obtained from the operations of both the servo motors.

Abstract: A method and apparatus for quickly moving workpieces from having abrading contact with abrasive-surfaced rotatable platens using a dynamic-action workholder apparatus frame moving device that is activated by a sensor. Flat-surfaced workpieces are attached to flat-surfaced workholders to abrade one surface of the workpieces by abrasive coated platens. The force moving device can be a spring, an air cylinder, a screw-jack, an electric solenoid or a piezo-electric device. The sensor can be a vibration, shock, motion, force or sound sensor that can to sense abrading process events that could make it desirable to quickly activate moving of the workpieces away from the abrasive disk. The workpiece abrading event can be quickly interrupted by use of this device to avoid damage to workpieces, the abrasive disks or the platen or to quickly change an abrading process. After the workpieces are moved they can be returned to their original abrading position.

Abstract: In a polishing process, the characteristics of the removal process may be monitored at different lateral positions to identify the clearance of the various device regions with a high degree of reliability. Consequently, upon forming sophisticated metallization structures, undue over-polishing may be avoided while at the same time providing reduced leakage currents due to enhanced material removal.

Abstract: A substrate treating method includes rotating a substrate in a circumferential direction and polishing a peripheral portion of the substrate by pressing a polishing member to it using a pressing mechanism having a pressing pad. An angle of at least a part of the pressing pad with respect to an axial direction, in which the pressing mechanism makes the pressing pad press the peripheral portion of the substrate, is changed by an angle displacement mechanism which actively displaces the angle so that the polishing is performed depending on a surface to be polished in the peripheral portion.

Abstract: The invention relates to a device for polishing hard surfaces, especially glass surfaces, said device comprising polishing system (5) provided with a replaceable polishing disk (6). Said polishing system (5) can be displaced in a two-dimensional manner by means of a displacement device (10) comprising a holding element (11) for the polishing system (5), and guiding elements (12, 18; 20, 25) for displacing the holding element (11) in XY directions. The inventive device enables hard surfaces to be repaired in a simple and precise manner.

Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.

Abstract: A grinding machine wherein coarse and fine grind wheels are mounted to a single rotating spindle. A multiple grind wheel mount is attached to the lower portion of the rotating spindle, the coarse and fine wheels being supported by the wheel mount, the wheel mount containing the mechanism for moving the inner coarse wheel down relative to the stationary outer fine wheel.

Abstract: A holder for workpieces with end surfaces thereof being polished comprises a main body and a framework in which the main body is provided with a plurality of fixtures for holding the workpieces and the ring-shaped first supporting portion, and the framework is provided with the second supporting portion surrounding the outer side of the first supporting portion. The second supporting portion limits the angular movement of the first supporting portion to enable the main body to keep parallel to the polishing surface during the end surface of the respective workpiece is brought into contact with the polishing surface. The structure of the holder is capable of reducing the fabrication time and cost of the first supporting portion tremendously.

Abstract: A polishing apparatus detects the escape of a substrate from a top ring during polishing. The polishing apparatus includes a polishing table having a polishing pad, a top ring, and a substrate escape detection section for detecting escape of the substrate from the top ring. The detection section includes a light irradiation member for irradiating an area of the upper surface of the polishing pad with light, a controller for controlling the light irradiation of the light irradiation member, an image-taking member for taking an image of the area irradiated with the light, and an information processing member for processing information outputted from the image-taking member. The controller controls the light irradiation member in such a manner that it performs light irradiation at least for a period of time during which the substrate is regarded as being in contact with the polishing pad.

Abstract: The system comprises a headstock (1) in which is established a rotary shaft (10) driven via a cone (8) that can be coupled to a drive means, for example a robot, the shaft (10) being linked to a spring (11) which permits axial displacement of the shaft (10) in the upward and downward direction, while coupled to the other end, with the interposition of an eccentric (21), is a plate (2) for carrying an abrasive disc (3) intended for sanding the pins of the fasteners, following the operation of shaving said pins. The eccentric (21) transforms the rotation of the shaft (10) into an orbital motion so that, in combination with the upward and downward displacements by means of the spring (11), the abrasive disc (3) is successfully adapted on the surface on which the pin of the fasteners intended to sand is located.

Abstract: Simultaneous double-side grinding of a plurality of semiconductor wafers involves positioning each wafer freely in a cutout of one of plural carriers which rotate on a cycloidal trajectory, wherein the wafers are machined between two rotating ring-shaped working disks, each disk having a working layer of bonded abrasive, wherein the form of the working gap between working layers is determined during grinding and the form of the working area of at least one disk is altered such that the gap has a predetermined form. The wafers, during machining, may temporarily overhang the gap. The carrier is optionally composed only of a first material, or is completely or partly coated with the first material such that during machining only the first material contacts the working layer, and the first material does not reduce the machining ability of the working layer.

Abstract: An apparatus for cleaning a jet engine includes a supply device configured to make cleaning medium available, a nozzle device configured to introduce the cleaning medium into the jet engine, and a line connection between the supply device and the nozzle device. The cleaning medium can be solid carbon dioxide. A system including a jet engine and the apparatus. A method for cleaning a jet engine using solid carbon dioxide.

Abstract: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

Abstract: A grinding machine for grinding work pieces between centers, as well as for centerless grinding, features a drive for a grinding wheel and a drive for a regulating wheel. The work piece can be supported between the grinding wheel and the regulating wheel either between centers on a work piece axis or on a rest for centerless grinding. The driving axis of the regulating wheel and the work piece axis are parallel, and the wheels can be adjusted relative to the work piece independently of one another. The drive of the regulating wheel serves for driving the work piece while grinding between centers or for driving the work piece during centerless grinding. In addition, a means for measuring the contact pressure of the regulating wheel on the work piece is provided for grinding between centers. This means may consist, for example, of a pressure sensor.

Abstract: A vibration device for a super finishing apparatus for super finishing a mechanical object is disclosed. It comprises at least two sliding means (1, 3), each comprising a guide (5, 7) and an element (9, 11) provided with a through hole (13) for receiving the guide (5, 7), allowing a relative movement between the guide (5, 7) and the element (9, 11) provided with the through hole (13), and a movable structure (15) fixed to the at least two sliding means (1, 3). Further, each sliding means (1, 3) presents at least one liquid fluid inlet (19) allowing a liquid fluid to enter the through hole (13) and suspend the guide (5, 7) in relation to an inner surface of the through hole (13). An attachment tool comprising the vibration device is also disclosed.

Abstract: The method of the invention provides a capability for accurately and uniformly determining the sizes of bores of workpieces, both pre- and post-process, to improve process control, particularly compensation for tool or stone wear and other factors, and process data collection. The present method makes all required bore measurements, including those in both the workpiece bore and the calibration ring or sample workpiece bore, with the honing tool, under controlled static, non-honing conditions, including expanding the tool in the bores in a predetermined manner, such as at a predetermined rate. The method of the invention has utility for honing multiple workpieces to a finished size with a single tool, and also for multiple spindle applications.

Abstract: A device-positioning pedestal capable of positioning devices of different sizes. The device-positioning pedestal comprises a plurality of guide members corresponding to the sides of the device and coming in contact with the sides of the device to position the device, at least one guide member includes a slide mechanism that supports the guide member so as to slide relative to the device-positioning pedestal member and a fixing mechanism that fixes the guide members at desired positions. The guide members are set to be adapted to the size of the device by the guide member-adjusting means separate from the device-positioning pedestal. The guide member-adjusting means adjust the position of the guide members based on the size of the device measured by device size-measuring means separate from the guide member-adjusting means or based on the data of data-recording means attached to the device-positioning pedestal.

Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical, direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

Abstract: Apparatus and method for converting a convention centerless grinding machine to a centerless grinding machine having a servo motor mounted inside the top slide using an internal servo motor bracket. The servo motor bracket is bolted to the spindle head assembly housing and is cantilevered into the top slide to allow required tilt adjustment of the regulating wheel with respect to the top slide while maintaining correct alignment of the servo motor with the regulating wheel spindle. The bracket includes slots allowing a servo motor belt tension to be adjusted. The tension adjustments are conveniently made through an existing opening in the top slide. Locating the servo motor inside the top slide using the internal servo motor bracket of the present invention significantly reduces conversion costs and servo motor maintenance otherwise required by the environment the centerless grinder is operated in, for example, oils and the presence of metal grindings.

Abstract: A method of grinding a ferrous roll may include: rotating a grinding wheel on a machine spindle to form a rotating grinding wheel; rotating a ferrous roll to form a rotating roll surface; bringing the rotating grinding wheel into contact with the rotating roll surface; traversing the rotating grinding wheel across an axial roll length of the rotating roll surface; and grinding the roll surface while varying at least one or both of a grinding wheel rotational speed and a said mill roll rotational speed at an amplitude of +/?1 to 40% with a period of 1 to 30 seconds.

Abstract: A visual feedback system and method for airfoil polishing is disclosed. In one aspect there is a system for providing visual feedback during a polishing operation of a workpiece. In this system there is a model having a representation of a desired shape of the workpiece. A scanning system generates a representation of a current shape of the workpiece while in-process during the polishing operation. A comparator compares the current shape of the workpiece to the desired shape of the workpiece. An illumination system highlights the workpiece with visible light during the polishing operation. The highlighting of the workpiece with visible light is a function of the comparison between the current shape and the desired shape. The illumination system highlights a portion of the workpiece that needs additional polishing to conform to the desired shape.

Abstract: A multi-axes contouring machine for contouring a workpiece within a cavity of a main frame by moving a machining part along one or more axes simultaneously to the movement of the workpiece along one or more different axes. In an exemplary embodiment, the machining part simultaneously moves along an X and Y axis, while a workpiece moves along a Z axis. Here, the main frame comprises two adjacent side walls each having an opening cut out. A first carriage is attached to one of the side walls to move in the X direction, and a second carriage is attached to the first carriage to move in the Y direction. The machining part is actuated by the X and Y axes-oriented carriages. On another side wall, a carriage is attached to move in a Z direction, and the workpiece is actuated by the Z axis-oriented carriage.

Abstract: To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding device in which the load of the fastening plate 6 also is a load on the grindstone 14 that does the grinding, there is little deflection in the thickness distribution of the substrates that are obtained, even if they are semiconductor substrates having a large substrate diameter of 450 mm.

Abstract: Embodiments of the present invention pertain to a evaluating the quality of a lapping plate. In one embodiment, an information receiver receives information while the lapping plate is being used to lap a slider. The information indicates the quality of a lapping plate. A quality determiner that evaluates the quality of the lapping plate based on the information while the lapping plate is being used to lap the slider.

Abstract: In one embodiment a method is provided for maintaining a substrate processing surface. The method generally includes performing a set of measurements on the substrate processing surface, wherein the set of measurements are taken using a displacement sensor coupled to a processing surface conditioning arm, determining a processing surface profile based on the set of measurements, comparing the processing surface profile to a minimum profile threshold, and communicating a result of the profile comparison.

Abstract: The invention relates to an ophthalmic machining machine comprising machining means and means for supporting a blank. The invention is characterised in that the machine is capable of transferring marks to said blank that can be identified by monitoring means for repositioning the blank on said supporting means after machining the opposite surface. The invention also relates to a workholding tool. The invention is characterised in that said supporting means are mounted on a bearing surface, which is oblique in relation to a surface of a carriage, by depression of an opening surrounded by an O-ring seal and a fixed bearing. The invention also relates to a machining method according to which the markings are transferred to a blank, the position of said markings is assessed by monitoring means which position machining means for the machining process, and each surface of the resulting lens is polished with polishing means.

Abstract: A wafer polishing apparatus includes a polishing tape extending between two guide rollers, a first surface of the polishing tape contacting a surface of a wafer to be polished, a polishing head including a pusher pad, the pusher pad adapted to push the polishing tape against the surface of the wafer to be polished, a color image sensor adjacent to the polishing tape, the color image sensor being adapted to detect a color image of the polishing tape and to output a signal corresponding to the detected color image, and a controller connected to the color image sensor, the controller being adapted to receive the signal output from the color image sensor and to determine when a color of the color image detected by the color image sensor changes, a change in the color image indicating a polishing end point.

Abstract: A device is described comprising: a segmented sanding pad having a plurality of segments, each segment having a longitudinal axis and corresponding to a respective contact roller having a longitudinal axis, wherein, when the sanding pad is moved obliquely, the segments align in accordance with a degree of oblique movement, characterized in that the longitudinal axes of the individual contact rollers and the respective segments are aligned with respect to each other when the gap between the segments is adjusted to the longitudinal axis of the contact rollers.