Abstract: In a wafer processing method, rough grinding using a first grinding stone is divided into first and second steps. In the first step, a wafer is processed into a concave shape at a first transfer rate with a reinforcing rib area slightly left. Thereafter, as primary rough grinding in the second step, the grinding stone is positioned slightly on the inner circumferential side and the wafer is further processed into the concave portion at a second transfer rate faster than the first transfer rate. Since the first transfer rate is suppressed to a rate not to cause a burst chipping, a burst chipping resulting from the second step fast in the processing rate to ensure productivity will occur at the stepped edge portion on the inside of the reinforcing rib area surface. Thus, the flatness of the reinforcing rib area can be ensured.

Abstract: A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.

Abstract: In the method of precisely polishing a work, torque of a sun gear and an internal gear are kept constant and a load applied to a carrier is reduced and maintained. The method comprises the steps of: changing a rotational speed of at least one of the sun gear, the internal gear, an upper polishing plate and a lower polishing plate; measuring rotation torque of a driving motor of at least one of the sun gear and the internal gear; detecting the minimum rotation torque measured in the measuring step; and adjusting the rotational speed of at least one of the sun gear, the internal gear, the upper polishing plate and the lower polishing plate so as to make the rotation torque thereof equal to the minimum rotation torque or running rotation torque, the running rotation torque being greater by a prescribed value than the minimum rotation torque.

Abstract: A method for the circumferential interior treatment of pipe elbows, including a step of positioning a working member within a pipe elbow and moving the working member along a portion of a length of the pipe elbow between selected working positions, while concurrently manipulating the pitch and rotational positioning of the pipe elbow to maintain a concentric rotation of the pipe elbow about the working member.

Abstract: A precision machining method enabling grinding with high accuracy is provided. The method includes a first step of producing an intermediate ground workpiece by roughly grinding a workpiece (a) with a diamond grinding wheel (b), and a second step of producing a final ground workpiece by grinding the intermediate ground workpiece with a grinding wheel for CMG. In the first step, feed of the rotator (6b) and the base (3) is controlled in multiple stages with different feed speeds according to control based on the amount of movement, and in the second step, movement of the rotator (6b) and the base (3) is controlled with a constant pressure or in multiple stages having different constant pressures.

Abstract: To provide a centerless grinding method which facilitates a tooling change and enables automation. A blade 11 is disposed slidable along a first straight line 101, i.e., Y axis, a grinding wheel 7 is disposed slidable along a second straight line 102, i.e., X axis, and a regulating wheel 9 is disposed slidable along a third straight line 103 intersecting with the second straight line at an angle ?2. At a tooling change, then, the blade is moved in a negative direction of the Y axis with an increase in diameter of a workpiece, the grinding wheel is moved in a negative direction of the X axis with an increase in diameter of the workpiece, and the regulating wheel is moved in a positive direction of the Y axis and also in a positive direction of the X axis with an increase in diameter of the workpiece. With this, angles ? and ?, which a contact angular position reference line S makes with line segments OB and OR, are made always constant.

Abstract: Grinding machine with a machine bed, with a tool carriage that is linearly movable on the machine bed in a Y-axis, with a tool spindle, which is mounted in the tool carriage so as to rotate around an X-axis that is perpendicular to the Y-axis, and which can be rotationally driven, with an X-carriage that is linearly movable on the machine bed in the X-axis, with a Z-carriage that is linearly movable on the X-carriage with a Z-axis that is perpendicular to the X-axis and the Y-axis, and with a work piece jig, which is arranged on the Z-carriage so as to pivot around a B-axis, which is parallel to the Y-axis, and which is capable of rotating around its A-axis, which is perpendicular to the B-axis.

Abstract: A tool for forming a desired pattern on a polishing pad establishes a vibration that is coupled to the polishing pad. The vibration removes small portions of the polishing pad according to the desired pattern. The polishing pad is then used in a chemical mechanical polishing (CMP) step to polish a layer on a semiconductor device.

Abstract: A manufacturing method of a spectacle lens improving a manufacturing yield and a production efficiency is provided. The manufacturing method of the spectacle lens in which necessary information for a frame machining of a spectacle lens (progressive-power lens 20) including spectacle rim related information is obtained, and both surfaces of a convex surface and a concave surface are edge/polish machined from a spectacle lens blanks.

Abstract: A polishing machine for optical elements, comprising:—a spindle arranged to rotationally drive an optical element;—a polishing tool mobile relative to the spindle; wherein the polishing machine further comprises a platform mounted on top of a work chamber, the work chamber comprising the spindle, and the platform holding a body on which is mounted the polishing tool.

Abstract: A method of changing the crystallographic orientation of a single crystal body is disclosed that includes the steps of characterizing a crystallographic orientation of the single crystal body and calculating a misorientation angle between a select crystallographic direction of the single crystal body and a projection of the crystallographic direction along a plane of a first exterior major surface of the single crystal body. The method further includes removing material from at least a portion of the first exterior major surface to change the misorientation angle.

Abstract: The invention relates to a grinding machine for grinding of a gear or of a gear-like workpiece, which has a grinding worm (1) with a tooth-shaped profile (2), which consists at least partly from a dressable abrasive material and which is arranged rotatably on a grinding spindle, so that it can rotate around an axis of rotation (C) during grinding and a dressing device (3), with which at least a part of the forming areas (4, 5) of the grinding worm (1) can be profiled, wherein the dressing device (3) has a dressing spindle (6), which bears a disk-shaped dressing tool (7), so that it can rotate around an axis of rotation (B). To allow a faster dressing of the grinding worm the invention is characterized in that the grinding machine further has a dressing bar (8) which has a dressing edge (9), wherein the form of the dressing edge (9) corresponds at least partly to the ideal envelope of the grinding worm (1).

Abstract: A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.

Abstract: A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad) 201 and the wafer held by a holding member (top ring) 52 and moving the polishing member relative to the wafer. The polishing apparatus includes a top ring 52 for holding the wafer, a pressure adjusting mechanism for adjusting a supporting pressure with which the wafer is supported on a supporting surface by a retainer ring, and a control unit for controlling the pressure adjusting mechanism to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer. The top ring comprises an air bag 202 for pressing the wafer against the polishing pad, a retainer ring which surrounds the wafer, and an air bag for pressing the retainer ring.

Abstract: An apparatus for lapping sliders comprises a rotatable lapping plate for lapping elements that are to be formed into sliders, a pushing force adjusting member that has an internal space therein and that extends vertically along an lapping plate axis that is perpendicular to the lapping plate, a pusher for pressing the elements, the pusher being connected to the pushing force adjusting member, and gas supply means for supplying a gas into the internal space, the gas supply means being connected to the pushing force adjusting member. The pushing force adjusting member comprises a first part that includes a connection with the pusher, a second part that includes a coupling between the internal space and the gas supply means, and an axially deformable part that is located between the first part and the second part.

Abstract: A method for grooving or counter-beveling the periphery of an opthamalic lens in a grinding machine is provided. The grinding machine includes a lens support with a mechanism configured to rotate the lens about a first axis, a grooving or counter-beveling wheel rotatable about a second axis which can be tilted relative to the first axis, and a mechanism to adjust the angle of tilt of the second axis relative to the first axis. Initially, a profile for the groove is determined. A single treatment angle corresponding to the profile is calculated, and the angle of tilt of the second axis is adjusted to the value of the single treatment angle. A groove or counter-bevel is ground into the periphery of the lens with the angle of tilt remaining constant throughout the grinding.

Abstract: Milling strategies for machining dental ceramic materials are provided that reduce milling time while maintaining strength, accuracy and marginal integrity.

Abstract: A precision machining apparatus is structured such that a feed-screw mechanism and an actuator are mounted on a second mount which supports a rotating device that rotates a wheel, and grinding is performed while appropriately adjusting the amount of movement of the second mount in a rough grinding stage through an ultra-precision grinding stage. A posture control device is interposed between a first mount and a rotating device that rotates a grinding target body. The thickness and evenness of the grinding target body are measured by an optical probe and the measurement results are sent to a computer. A feedback command is then sent to the posture control device to reduce the difference between target values and the measurement values and posture control is performed accordingly.

Abstract: A polishing apparatus has a top ring configured to hold a semiconductor wafer on a substrate holding surface, and a pushser configured to deliver the semiconductor wafer to the top ring and receive the semiconductor wafer from the top ring. The pushser includes a push stage having a substrate placement surface on which the semiconductor wafer is placed and an air cylinder configured to vertically move the push stage. The pushser also includes a high-pressure fluid port configured to eject a high-pressure fluid toward the semiconductor wafer.

Abstract: A polishing machine for optical elements includes: —a spindle arranged to rotationally drive an optical element; —a polishing tool mobile relative to the spindle; —a front face provided with a door enabling the access to the spindle and to the polishing tool. The polishing tool is mounted on a body which is rotationally mounted on sliding members by way of a first axis, the sliding members being substantially perpendicular to the front face.

Abstract: The invention relates to a device (20) comprising a workpiece spindle (21) for receiving a gear wheel (25), a tool spindle (29) for receiving a tool and several drives (X, Y, Z, B, C, A1) for machining the gear wheel in individual divisions. According to the invention, one tooth gap of the gear wheel is machined and then the tool is displaced in relation to the gear wheel in order to remove the tool from the tooth gap. The gear wheel is then rotated by a division and the tool is placed against the wheel again to machine another tooth gap. One of the drives (C) can be controlled in such a way that the relative displacement involves a tilting displacement, which modifies the relative angle between the tool and the gear wheel, the tilting displacement being co-ordinated with the displacement of a division.

Abstract: A method of processing a semiconductor wafer using a double side grinder of the type that holds the wafer in a plane with a pair of grinding wheels and a pair of hydrostatic pads. The method includes measuring a distance between the wafer and at least one sensor and determining wafer nanotopology using the measured distance. The determining includes using a processor to perform a finite element structural analysis of the wafer based on the measured distance.

Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.

Abstract: The present invention is a method for obtaining data easily, accurately and effectively that may be used in determination of Sommerfeld Numbers and COF for CMP polishing. Using the Sommerfeld Numbers and COF values thus obtained the lubrication mechanism of CMP polishing with particular materials and under particular conditions can easily and reliably be studied. The method of the present invention is accomplished by use of CMP polishing tools capable of simultaneously measuring shear force and normal force, and rendering a value for the COF while simultaneously enabling the operator to change pressure on and relative velocity of the CMP wafer and CMP polishing pad in real time. Using the said CMP tool, the pressure and relative velocity may be varied separately or together for the desired length of time according to the needs of the operator so that within one CMP process multiple measurements may be taken under the same process conditions.

Abstract: Embodiments of the present invention pertain to a evaluating the quality of a lapping plate. In one embodiment, information that indicates the quality of a lapping plate is received while the lapping plate is being used to lap a slider, and the information is used to evaluate the quality of the lapping plate while the lapping plate is being used to lap the slider.

Abstract: A device for finish-machining of the optically effective surfaces of, in particular, spectacle lenses has a spindle shaft, which has a tool mount section and which is mounted in a spindle housing to be rotatable about a workpiece rotational axis (A). An electric rotary drive has a rotor and a stator by which the spindle shaft operatively connected with the rotor is drivable to rotate about the tool rotational axis. An adjusting device axially displaces the tool mount section with respect to the spindle housing in the direction of the tool rotational axis (linear movement Z). The rotor and the stator are arranged coaxially with the spindle shaft, wherein at least the rotor together with the spindle shaft is axially displaceable with respect to the spindle housing in the direction of the tool rotational axis by the adjusting device.

Abstract: A parallel mechanism adapted to control at least one of pivotal movement and linear movement of a link head having three degrees of freedom. The parallel mechanism has four actuators for driving the link head, and link groups which have four links connected to the four actuators, respectively, and each of which is connected to the link head. A rotation joint interposed between each of the link groups and the link head is made a linear joint which is connected to the link head so as to be relatively movable in one axis direction with respect to the link head.

Abstract: A method of polishing objects using an apparatus comprised of a rotary positioning device comprising a turret; a base mounted on the turret; a drive wheel connected to a rotatable shaft, the drive wheel having a perimeter, and the rotatable shaft disposed in a housing. The polishing wheel assembly may include an elongated arm including a proximal end joined to the base, and a distal end; a rotatable polishing wheel supported at the end of the elongated arm; and a polishing belt comprising an inner surface and an outer surface, the inner surface engageable with the perimeters of the drive wheel and the polishing wheel. The method is comprised of contacting the outer surface of the polishing belt to a contact region of the surface of the object; and controlling the contact region by rotating the elongated arm around the turret axis.

Abstract: A disc-like grinding wheel 5 is formed with a circumferential groove 5a, the opposite walls of which define grinding surfaces 5b. A rotated carrier 3 brings a load pin 55 into rotary movement relative to the grinding wheel 5 rotated about an axis 5z, so as to pass the load pin 55 through space between the grinding surfaces 5b, whereby opposite end faces 55a of the load pin 55 are ground simultaneously. Thus, time taken by a grinding process may be reduced as compared with a conventional method wherein one end face is ground at a time.

Abstract: For grinding one of axially spaced journal sections of a workpiece each having a cylindrical surface and a pair of shoulder surfaces extending radially outward from the opposite end portions of the cylindrical surface, a rotating grinding wheel is advanced to grind the shoulder surfaces of one journal section and then to grind the cylindrical surface of the one journal section. At the end of the cylindrical surface grinding, the grinding wheel is retracted by a fixed distance at a slow feed rate and is further retracted at a rapid feed rate. A rest shoe provided on the side opposite to the grinding wheel with the workpiece therebetween is advanced to an advanced position where the rest shoe contacts with another journal section axially spaced from the one journal section to decrease the flection of the workpiece caused by grinding resistance and is retracted away from said another journal section when the fixed-distance retraction of the grinding wheel is completed.

Abstract: An apparatus has a motor, a shaft attached to the motor arranged to be turned by the motor when the motor operates, an attachment at an end of the shaft opposite the motor arranged to allow mounting of components to be ground, a loading block arranged under the end of the shaft having the attachment to support the components to be ground, and an interface to a grinding tool arranged adjacent to the loading block. An apparatus has a motor mounted on a slide, a shaft attached to the motor arranged to spin when the motor operates. an attachment on the end of the shaft to allow attachment of a component, a loading block at least partially supporting the shaft. an interface to a manufacturing tool, the motor and shaft arranged to insert the shaft into the interface when moved along the slide to an engaged position.

Abstract: A robotic machining tool employing an endless machining belt is disclosed. The tool includes a front pulley and a rear pulley which guide the machining belt, a drive unit which turns the rear pulley, a spindle about which the front pulley is free to rotate, and two wheels which flank the front pulley and are mounted idly on the spindle of the front pulley. The two wheels have an outside diameter greater than that of the front pulley in order to roll over a surface to be machined and in order to define a machining distance between the machining belt guided around the front pulley and the surface to be machined.

Abstract: A method and apparatus for removing a coating having an irregular surface configuration that includes mapping the irregular surface configuration, and using the mapping determination in controlling the operation of an abrasive water jet to provide increased material removal rates at the higher points in the irregular surface and decreased material removal rates at the lower points, and thereby even out the surface configuration of the coating. The method and apparatus also includes using a detection device for detecting the presence or absence of an element that is unique to a layer of a coating, and using the detection determination in controlling the operation of the abrasive water jet to stop material removal of the coating when the detection device determines there is an absence of the unique element.

Abstract: A polishing pad can include a first layer and a second layer. The first layer can have a first polishing surface and a first opening. The second layer can have an attaching surface and a second opening substantially contiguous with the first opening. The polishing pad can further include, a pad window lying within the first opening. The pad window can include a second polishing surface. When the pad would be attached to a platen, the first and second polishing surfaces can lie along a same plane, and an opposing surface of the pad window can abut an exterior surface of a platen window. In another aspect, a polishing apparatus can include an exterior surface of a platen window abutting the polishing pad. In still another aspect, a process of polishing can include polishing a workpiece such that the pad window contacts the workpiece and the platen window simultaneously.

Abstract: Provided is a moving mechanism for a blast gun which can easily move a blast gun accommodated in a blasting chamber and which can easily perform other operations from the outside thereof without leaking dust. A plurality of arm members (first input arm 21, second input arm 22, first output arm 31, and second output arm 32) are interlocked to form an input arm 20 and an output arm 30, each having one pair of arm members, one arm of the two arm members is pivotally attached to the other arm so as to be rotatable around an interlocked portion serving as a fulcrum, the input arm 20 is disposed outside the blasting chamber 3, and the output arm 30 is disposed inside the blasting chamber 3.

Abstract: Disclosed is an apparatus for polishing media discs by removing or reducing scratches or substances from the surface of damaged discs, including computer data CDs, DVDs, gaming discs and other media discs. The apparatus enables removal or reduction of scratches and materials that prevent the information or data contained on the disc from being read by a conventional disc reading device. The polishing pressure and time are uniformly controlled at predetermined and precision levels sufficient to remove or reduce scratches from the surface of the disc. Also disclosed is a method of removing or reducing scratches from the surface of media discs by using the apparatus of the present invention. The method can be repeated as many times as necessary or desired in order to obtain a finely polished disc from which data is obtainable by conventional disc reading devices.

Abstract: The end mill grinding device of the present invention includes a tool spindle assembly, which enables multi-axis positioning of a rotating cutting tool being sharpened, and a motor tower, which enables multi-axis positioning of a grinding or cutting wheel for sharpening the end mill tool. The present invention combines linear sharpening and radial tool end grinding capability in the same machine element.

Abstract: The invention relates to a process for producing a semiconductor wafer by double-side grinding of the semiconductor wafer, in which the semiconductor wafer is simultaneously ground on both sides, first by rough-grinding and then by finish-grinding, using a grinding tool. The semiconductor wafer, between the rough-grinding and the finish-grinding, remains positioned in the grinding machine, and the grinding tool continues to apply a substantially constant load during the transition from rough-grinding to finish-grinding. The invention also relates to an apparatus for carrying out the process and to a semiconductor wafer having a local flatness value on a front surface of less than 16 nm in a measurement window of 2 mm×2 mm area and of less than 40 nm in a measurement window of 10 mm×10 mm area.

Abstract: A surface grinder for a ball of a ball valve comprises a ball positioning device at an X axis for driving the ball to rotate about the X axis and a grinding device at a Z axis for driving a grindstone set to rotate about the Z axis, wherein the grindstone set grinds a spherical surface of the ball.

Abstract: A machine tool is provided which comprises a machine base (10), a first support (20,100) mounted on a first rotational machine axis on the base, and a second support (22,102) mounted on a second rotational machine axis on the base. The second rotational axis is parallel to and spaced laterally from the first rotational axis and carries a mount (38,112) moveable relative to the second support along a first linear machine axis orthogonal to the second rotational axis. A control arrangement is operable to control the orientation of the first support on the first rotational axis, and the orientation of the mount relative to the second rotational axis and its location along the linear axis, so as to govern the position and orientation of the first support and the mount relative to each other. Existing machine tools often use long linear guide rails and stacked orthogonal axes which introduce alignment and offset errors.

Abstract: Systems and methods for removing microfeature workpiece surface defects are disclosed. A method for processing a microfeature workpiece in accordance with one embodiment includes removing surface defects from a surface of a microfeature workpiece by engaging the surface with a buffing medium having a first hardness, and moving at least one of the workpiece and the buffing medium relative to the other. After removing the surface defects and before adding additional material to the microfeature workpiece the method can further include engaging the microfeature workpiece with a polishing pad having a second hardness greater than the first hardness. Additional material can be removed from the microfeature workpiece by moving at least one of the microfeature workpiece and the polishing pad relative to the other.

Abstract: The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).

Abstract: The method includes: automatic measurement of the marking characteristics of the lens in a measurement position in order to produce a marking reference of the ophthalmic lens; transfer of the lens in a second transfer movement from the measurement position to an intermediate position which is distinct from the measurement position; transfer of the lens in a third transfer movement from the intermediate position to a trimming position which is distinct from the intermediate position; locking of the ophthalmic lens on trimming elements (6); trimming the lens. The third transfer is carried out by third transfer elements that make up a sub-unit which is distinct and independent from other units or includes elements carrying out the second transfer, and trimming elements, wherein full blocking of the lens on the trimming elements is only completed after the third transfer.

Abstract: A grinding method wherein the correlation between the amount of inertial grinding occurring in performing spark-out by a grinding unit and the maximum load current in a motor of the grinding unit is grasped, and a correction value for the amount of inertial grinding corresponding to the maximum load current is preliminarily obtained. When the wafer thickness measured by a thickness measuring gauge has reached the sum of a desired value and the correction value (=the amount of inertial grinding) corresponding to the maximum load current, the spark-out is started. Accordingly, the wafer thickness becomes the desired value after the inertial grinding in performing the spark-out.

Abstract: In a two-step processing mode in which a cup for attaching a lens to a chuck axis is changed from a large diameter cup to a small diameter cup on the way of processing, a roughing path data computing unit for computing first roughing path data larger than the target lens shape data by a predetermined finishing margin, and second roughing path data having a radius vector larger by at least ?a than at least radius vector data of the large diameter cup; and a processing controller for roughing the peripheral edge of the lens based on the second roughing path data in response to a processing start signal, thereafter stopping the processing and further resuming the processing. The processing controller performs, when a processing resuming signal is inputted, processing control of either roughing and finishing, or finishing without roughing.

Abstract: A method of grinding a slot base of a blade retention slot within a rotor disk includes rotationally aligning a grind wheel about an axis of rotation to align a first notch with a first and second opposed lobe of the blade retention slot of the rotor disk; transiting the grind wheel along the blade retention slot that the first notch is passed between a lobe width defined by the first and second opposed lobe of the blade retention slot; rotating the grind wheel about the axis of rotation; and transiting the rotating grind wheel along the blade retention slot to grind a slot base with a rim of the grind disk, the slot base having a width greater than the lobe width of the blade retention slot. A grind wheel includes a rim having at least one notch formed in the rim to grind a slot base of a blade retention slot within a rotor disk.

Abstract: A superfinishing stone 2 is slid on a rotating subject surface 7 as pressed against the subject surface 7 and is held in contact against the subject surface 7 as vibrated thereon in a different direction from the sliding direction. The superfinishing stone includes plural stone portions 3, 4 divided by a split surface 6 inclined to both the sliding direction and the vibrating direction and mutually independently movable along the split surface 6 and in the pressing direction.

Abstract: The present invention relates to an apparatus (10) for processing and measuring workpieces, in particular plate-shaped or cylindrical workpieces, which are provided with cutting teeth (S), with a machine base (12), a processing and measuring device (14) which can be moved relative to the machine base (12), and a workpiece positioning device (16) which can be moved relative to the machine base (12), wherein the processing and measuring device (14) has a pivoting head (26) which can be moved relative to the machine base (12) such that it can pivot about a pivot axis (E1), wherein a processing tool (28) and a measuring probe (30) are provided on the pivoting head (26). In this case provision is made for the processing tool (28) to project from one side of the pivoting head (26) and for the measuring probe (30) to project from the side of the pivoting head (26) which is opposite with respect to the pivot axis (E1).

Abstract: Tip grinding of BLISK blades is performed in a static state of an incrementally rotatable BLISK, with a rotational axis (9) of a grinding wheel (4), which is traversable along an upper edge of the blade, being aligned diagonally to an orientation of the blade upper edge, and hence, in a direction of maximum resistance moment of the blades. The apparatus for the performance of the method features a locating device (7) for a BLISK which is incrementally rotatable by an auxiliary drive (8) as well as a high-speed shaft (3) driven by a main drive (2) for blade tip grinding of conventional rotor wheels fittable to the high-speed shaft (3). The grinding wheel (4) is traversable in Y-direction and rotatable about a center axis extending in X-direction, such that the blade tips in the static state can be ground in the direction of the maximum resistance moment of the blades.

Abstract: A multiplicity of wafers are sliced from a workpiece which has a longitudinal axis and a cross section, the workpiece fastened on a table being fed by a relative movement directed perpendicularly to the longitudinal axis of the workpiece between the table and the wire gang of a wire saw, with a variable forward feed rate through the wire gang formed by a sawing wire moved with an effective speed, the effective speed of the sawing wire being regulated as a function of the forward feed rate and the workpiece cross section so as to result in uniform wear of the sawing wire.