Abstract: A particle cleaning module includes a housing, a substrate holder, a pad holder, an actuator and a pad conditioner. The substrate holder is disposed in the housing, is configured to retain a substrate in a substantially vertical orientation, and is rotatable on a first axis. The pad holder is disposed in the housing, has a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, and is rotatable on a second axis parallel to the first axis. The actuator is operable to move the pad holder relative to the substrate holder to change a distance defined between the pad retaining surface and the substrate. The pad conditioner is disposed in the housing and has a conditioning surface oriented parallel to the pad retaining surface.

Abstract: While data that indicate a relationship between a dressing position P defined by a distance between a rotating shaft 11 of a polishing pad 13 and a rotating shaft 31 of a dresser 30 and shape change of the polishing pad 13 based on input of a target shape of the polishing pad 13 and alternating repetition of dressing the polishing pad 13 by the dresser 30 and measurement of shape of the polishing pad 13 by a pad shape measurement instrument 20 is acquired at a stage prior to commencement of a series of polishing steps for continuously polishing a plurality of polishing target objects (semiconductor wafer W) by a polishing tool 10, the polishing pad 13 is machined to the target shape 13 while the dressing position P is controlled, whereby the dressing position P is set during the polishing steps on the basis of a processing result of this data.

Abstract: An abrasion arrangement is disclosed to abrade a surface of an item, the arrangement comprising a multiple axis robotic arm having at least five axes, an abrading cylinder mounted on the robotic arm and comprising abrasive means which comprise abrasive lamellae of an abrasive sheet, such as abrasive cloth, of which the front side has abrasive properties and which extend substantially radially from an elongated core and means for driving said core to rotate around a longitudinal axis of the core, and control means for controlling the operation of the robotic arm so to control e.g. the position of the abrading cylinder on said surface, the force with which the abrading cylinder is pressed towards said surface and the velocity with which the abrading cylinder is moved with respect to said surface.

Abstract: A die grinder including a body having a longitudinal axis, and a grinding head portion with an output shaft capable of powered rotation. A motor is disposed in the body for rotating the output member. A locking interconnect portion attaches the grinding head portion to the body and is adapted to permit selective rotation of the grinding head portion relative to the body about the longitudinal axis of the body. Thus, the grinding head can be positioned at different selected angles relative to the body.

Abstract: Short and/or rod-shaped workpieces are completely machined by grinding two parallel end faces and the longitudinal sides of the workpiece with very short cycle times. The grinding machine includes two grinding spindles that are arranged in a tandem arrangement with parallel rotational axes on a shared grinding headstock and that are jointly moved in the X direction. In cooperation with a special holding and transport device for the workpieces, two workpieces are each ground, at least partly concurrently, the end faces of the one workpiece being ground in one machining position and the final non-circular grinding of the exterior contour of a second workpiece occurring in a second machining station, the end faces of the second workpiece having already been ground.

Abstract: This invention relates to a mobile floor levelling vehicle for levelling an undulating floor surface, which comprises a vehicle body with front and back displacement means for moving the vehicle body. To carry out the levelling operation the floor levelling vehicle comprises at least one grinding tool which is provided and driven to remove an amount of material from the floor, and at least one additional polishing device provided at a position behind the back displacement members in moving direction of the levelling vehicle.

Abstract: A compound chamfering device that manufactures prism-shaped ingot blocks of excellent surface smoothness is disclosed. The four-corner round surfaces and the four sides of a prism-shaped ingot obtained by using a pair of rotary blades of a slicer to perform four-side peeloff of a cylindrical ingot block are chamfered by rough grinding with a pair of cup wheel type rough grinding grindstones. A pair of cup wheel type finishing grinding grindstones are used to chamfering by finishing grinding the four-corner round surfaces and the four sides of the block.

Abstract: Embodiments of the present invention generally provide a load cup used in the transfer of substrates in a chemical mechanical polishing system. The load cup includes an improved substrate edge sensing mechanism to ensure a substrate is present and correctly positioned in the load cup for transfer to a polishing head. In one embodiment, a lever actuated edge sensing mechanism is provided. In one embodiment, the edge of a substrate contacts a lever, which contacts a sensor to detect that the substrate is present and correctly positioned for exchange with a polishing head. Embodiments of the present invention provide reliable detection, while reducing contact with the feature side of the substrate during substrate transfer.

Abstract: Certain example embodiments of this invention relate to techniques for edge deleting coatings supported by coated articles while a temporary protective coating is applied thereto. More particularly, a stationary, enlarged, and higher powered aspirator is connected to flexible tubing, which itself has an enlarged diameter, that has a nozzle located proximate to a grinding wheel on an edge deletion unit is provided in connection with an edge deletion table. Advantageously, the edge deletion table and aspirator of certain example embodiments are capable of performing edge deletion and removal of a temporary protective coating substantially simultaneously (e.g., from a common area of interest), during which process the debris produced when edge deletion is performed is controlled and removed from the substrate of interest.

Abstract: Some embodiments provide methods of processing wafers comprising: positioning a stacked wafer into a position to be ground, wherein the stacked wafer comprises a first wafer secured with a carrier-wafer, wherein the first wafer is secured with the carrier-wafer such that a surface of the first wafer is exposed to be ground; initiating a grinding of the first wafer while supported by the carrier-wafer; activating one or more sensors relative to the first wafer while grinding the first wafer; determining, while grinding the first wafer, a thickness of the first wafer separate from a thickness of the carrier-wafer as a function of data from the one or more sensors; determining whether the determined thickness of the first wafer has a predefined relationship with a first thickness threshold; and halting the wafer grinding when the thickness of the first wafer has the predefined relationship with the first thickness threshold.

Abstract: A device for fine or finest processing of a rotationally symmetric work piece surface of a work piece (14), with a drive mechanism (12) for driving the work piece (14) around an axis of rotation (16), two guidance mechanisms (20, 22) acting in radial directions with respect to the axis of rotation (16) and at least one tool (38) acting in a radial direction, and a pressing mechanism (42) for pressing the work piece (14) against the drive mechanism (12), wherein the work piece (14) can be disposed between the drive mechanism (12) and the pressing mechanism (42). The pressing mechanism (42) acts in a pressing plane (74) that is offset from the axis of rotation (16) towards a space (78) in which the guidance mechanisms (20, 22) are disposed.

Abstract: A method and apparatus for conditioning a polishing pad in a CMP system is provided. In one embodiment, a method for conditioning a polishing pad includes applying a down force to the conditioning disk that urges the conditioning disk against the polishing pad, measuring a torque required to sweep the conditioning disk across the polishing pad, determining a change in down force by comparing the measured torque to a model force profile (MFP), and adjusting the down force that the conditioning disk applies against the polishing pad in response to the determined change.

Abstract: Systems and methods are provided for use in processing and/or grinding wafers or other work products. Some embodiments provide a grinding apparatus that comprise a base casting; a rotary indexer configured to rotate within the base casting; a work spindle secured with the rotary indexer; a work chuck coupled with the first work spindle, wherein the first work spindle is configured to rotate the first work chuck; a bridge casting secured relative to the base casting, wherein the bridge casting bridges across at least a portion of the rotary indexer and is supported structurally forming a closed stiffness loop; a grind spindle secured with the bridge casting; and a grind wheel cooperated with the grind spindle, wherein the bridge casting secures the grind spindle.

Abstract: According to one embodiment, a CMP method includes starting a polishing of a silicon oxide film by using a slurry including a silicon oxide abrasive and a polishing stopper film including a silicon nitride film, and stopping the polishing when the polishing stopper is exposed. The slurry includes a first water-soluble polymer with a weight-average molecular weight of 50000 or more and 5000000 or less, and a second water-soluble polymer with a weight-average molecular weight of 1000 or more and 10000 or less.

Abstract: A glass manufacturing device includes a working container, a loading device, a sand blower, a shielding device, and a supporting device. The loading device is received in the working container and configured for loading a glass substrate in place. The sand blower is arranged opposite to the loading device and configured for sandblasting the glass substrate. The supporting device is used for supporting the shielding device and pressing the shielding device onto the glass substrate during the process of sandblasting. The shielding device includes a shielding cover having a number of shielding units. The shielding units are configured to shield portions of the glass substrate and prevent the portions of the glass substrate from being cut during sandblasting.

Abstract: The corners of a sheet of glass travelling in a longitudinal direction are ground by a corner bevelling assembly having a fixed frame; a movable frame; a grinding wheel; a supporting arm supporting the grinding wheel and fitted to the movable frame; and an actuating device interposed between the fixed frame and the movable frame, and having a first powered guide-slide assembly for moving the movable frame in a direction parallel to a longitudinal travelling direction of the sheet, and a second powered guide-slide assembly for moving the movable frame with respect to the fixed frame in a transverse direction perpendicular to the longitudinal direction; the corner bevelling assembly also having a reference locator which, in use, is positioned against a longitudinal lateral surface, parallel to the longitudinal direction, of the sheet; a relative-motion assembly for enabling movement, parallel to the transverse direction, of the reference locator with respect to the supporting arm; and a device for detecting the

Abstract: A glass manufacturing device includes a work container, a loading device, a sandblaster, a shield device, and a lift device. The loading device is received in the work container and loads a glass substrate in place. The sandblaster is arranged opposite to the loading device and sandblasts the glass substrate. The lift device is connected to the shield device and used for pressing the shield device onto the glass substrate during the process of sandblasting. The shield device includes a shield cover having a number of shield units. The surfaces of the shield units facing the bottom of the work container are engaged with elastic washers. The shield units are configured to shield portions of the glass substrate and prevent the portions of the glass substrate from being cut during sandblasting.

Abstract: In-situ monitoring during processing of a substrate includes processing a conductive film on a substrate in a semiconductor processing apparatus and generating a signal from an eddy current sensor during processing. The signal includes a first portion generated when the eddy current sensor is adjacent the substrate, a second portion generated when the eddy current sensor is adjacent a metal body and not adjacent the substrate, and a third portion generated when the eddy current sensor is adjacent neither the metal body nor the substrate. The second portion of the signal is compared to the third portion of the signal and a gain is determined based at least on a result of the comparing, and the first portion of the signal is multiplied by the gain to generate an adjusted signal.

Abstract: The corners of a sheet of glass travelling in a longitudinal direction are ground by a grinding assembly having a fixed frame; a movable frame; a grinding wheel; a supporting arm supporting the grinding wheel and fitted to the movable frame; and an actuating device interposed between the fixed frame and the movable frame, and having a first powered guide-slide assembly for moving the movable frame in a direction parallel to a longitudinal travelling direction of the sheet, and a second powered guide-slide assembly for moving the movable frame with respect to the fixed frame in a direction perpendicular to the longitudinal direction; the grinding assembly also having a locator fixed to the supporting arm and defining a stop to keep the sheet at a distance from the grinding wheel; and a compensating device interposed between the supporting arm and the movable frame, and having a third guide-slide assembly and a flexible controlled-damping device.

Abstract: It is an object of the present invention to provide a machine tool with a rest apparatus having high supporting stiffness of a workpiece by the rest apparatus and having flexibility to machine a plurality of kinds of the workpieces selectively and to provide a machining method of the machine tool with the rest apparatus. The machine tool with the rest apparatus comprising a base 10, a spindle head 20 mounted on the base 10 to hold rotatably one end of a workpiece W, a tail stock 30 mounted on the base 10 to be faced to the spindle head 20 and to hold rotatably the other end of the workpiece W, first rest apparatus 52 mounted between the spindle head 20 and the tail stock 30 and fixed to the base 10 un-movably to support the workpiece W, and second rest apparatus 53 mounted between the spindle head 20 and the tail stock 30 and movably mounted on the base 10 to support said workpiece W.

Abstract: An apparatus and method for machining workpieces is provided, in particular, for grinding the surface of non-round workpieces. The workpiece is clamped within a machining unit and the surface of this workpiece is contactlessly measured by means of a measuring device while the workpiece is clamped within the machine.

Abstract: The present invention generally relates to a polishing system. Particularly, the present invention relates a polishing apparatus having one or more modular polishing stations, and a plurality of polishing heads movably connected to a transferring system.

Abstract: Provided are a substrate polishing apparatus and a method of polishing a substrate using the same. The substrate polishing apparatus includes a substrate supporting member, a polishing unit, and a control unit. The substrate is seated on the rotatable substrate supporting member. The polishing unit includes a rotatable and swingable polishing pad to polish a top surface of the substrate. The control unit controls the substrate supporting member and the polishing unit during a polishing process to adjust a value of a polishing variable adjusting a polishing amount of the substrate according to a horizontal position of the polishing pad with respect to the substrate. Therefore, the substrate polishing apparatus may locally adjust the polishing amount of the substrate to improve polishing uniformity and product yield.

Abstract: Versatile methods of refining a first and a second layer of a workpiece are discussed. New refining methods and refining apparatus are disclosed. The new refining methods can help improve yield and appreciably change the cost of manufacture for refining of workpieces. The methods can be applied to workpieces having extremely close tolerances such as semiconductor wafers. New methods of control are also discussed. Methods use controllers, processors, computers, and processor readable memory devices are discussed. Use of stored information is to make changes in process control are discussed. Use of process models are discussed for refining. Determining a changed process control with stored information from first and second layers of a workpiece is disclosed. A changed process control can make an appreciable changes to the cost of manufacture of a workpiece.

Abstract: This invention relates to an apparatus for the prototype and small-batch production of gear wheels with a dressing disk. In accordance with the invention, the dressing disk has an asymmetric flank shape and a defined head radius. Furthermore, this invention relates to a method for the prototype and small-batch production of gear wheels by using such dressing disk.

Abstract: An eyeglass lens processing apparatus including a lens edge position detecting unit for obtaining edge positions, an edge corner processing tool for processing an edge corner of the lens, a correction data input unit for inputting correction data to avoid interference between an edge and a nose pad arm, wherein the correction data includes data on a position of interference between the nose pad arm and the edge, data necessary for setting an amount of processing at an interference position, and an edge processing range, a processing data computing unit for determining a path of processing the edge corner, based on edge position data and the correction data, to obtain data on correction processing and a processing controller for processing the edge corner of the lens by the edge corner processing tool in accordance with the correction processing data.

Abstract: Disclosed is a method for grinding a machine part that is used as a drive shaft, for example, rotates about the longitudinal axis thereof during the grinding process, and is provided with a journal at one axial end thereof and a recess at the opposite end thereof. The grinding process is carried out in one and the same grinding machine. In said grinding method, the machine part is brought into different clamped states by means of a chuck of a workpiece spindle head with releasable clamping jaws and a centering tip, a backrest, and/or a tailstock quill. Changing the clamped states has the advantage that the machine part remains in the same position in a single grinding machine, i.e. the clamped position, in all the different clamped states such that more accurate sizes, shapes, and positions can be obtained in an economical manner and all areas of the machine part which are to be ground are successively accessible to the grinding disks.

Abstract: A glass-plate working apparatus (1) includes a grinding means (7) for grinding a peripheral edge (6) of a glass plate (2); and a grinding supporting means (9) for supporting the glass plate (2) whose peripheral edge (6) is to be ground by the grinding means (7), wherein the grinding supporting means(9) includes a grinding supporting table (101), a plurality of suction cups (102) which are held on the grinding supporting table(101) by being attached by suction to the grinding supporting table (101) and suck and hold the glass plate (2) by sucking the glass plate (2) whose peripheral edge (6) is to be ground, and an arranging means (103) for disposing the plurality of suction cups (102), respectively, at positions corresponding to the shape of the glass plate (2) to be ground.

Abstract: A robotic manipulator for clamping a workpiece includes a power source, a first rotary member, and a clamping mechanism. The first rotary member is connected to and rotated by the power source. The clamping mechanism is non-rotatably connected to the first rotary member and includes a first clamping member and a second clamping member capable of coupling to and decoupling from the first clamping member. The first clamping member and the second clamping member are coupled to each other. A receptacle is defined between the first clamping member and the second clamping member to receive the workpiece. The receptacle has a shape and size substantially the same as the workpiece.

Abstract: Disclosed is a method of processing a synthetic quartz glass substrate for a semiconductor, wherein a polishing part of a rotary small-sized processing tool is put in contact with a surface of the synthetic quartz glass substrate in a contact area of 1 to 500 mm2, and is scanningly moved on the substrate surface while being rotated so as to polish the substrate surface. When the method is applied to the production of a synthetic quartz glass such as one for a photomask substrate for use in photolithography which is important to the manufacture of ICs or the like, a substrate having an extremely excellent flatness and capable of being used even with the EUV lithography can be obtained comparatively easily and inexpensively.

Abstract: A servo stroking method and system for honing wherein the cam stroking motion is controlled via combined acceleration and deceleration cam profiles to produce a finite jerk profile, a precision positioning capability for the honing element or elements, and accurate position feedback. The stroking motion is synchronized with one or more other parameters of the honing operation, such as the feed or rotational position of the honing tool, for generating non-cylindrical and special honed shapes such as tapered, barrel, and helical shapes. The cam profile can be selected for example from a simple harmonic profile, a cycloidal profile, a modified trapezoidal profile, a polynomial profile, and a modified sine profile, or a mix of cam profiles. The servo controlled stroker mechanism can include for instance a ball screw mechanism, a linear motor, a fluid cylinder, a chain drive or a belt drive.

Abstract: A device (1) for machining an ophthalmic lens includes a support for the ophthalmic lens and for driving it in rotation about a blocking axis (A1), a machining module (35) that can be swiveled relative to the support and driving the lens in rotation and that is suitable for pivoting about a swivel axis that is not parallel to the blocking axis of the lens, and at least one drill tool mounted to rotate on the machining module about a first axis of rotation. The machining device includes at least one other machining tool mounted to rotate on the machining module about another axis of rotation that is distinct from the first axis of rotation and that is stationary relative to the first axis of rotation.

Abstract: A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.

Abstract: The present invention relates to an internal rotation type direct motor-drive portable angle grinder. By means of the direct drive, the present invention prevents the emission of noise made by angle type transmission devices; and/or an inertial body is installed on the motor rotating part to form a flywheel to improve the grinding, polishing and machining or cutting abilities of the grinding wheel; and/or a motor is established to be open or semi-hermetic for the space from the interior to a housing and/or a handle of the motor to improve the effect of heat dissipation outward.

Abstract: A method and apparatus for releasably attaching flexible abrasive disks to a flat-surfaced platen that floats in three-point abrading contact with three rigid flat-surfaced rotatable fixed-position workpiece spindles that are mounted on a flat surface of an abrading machine base where the spindle surfaces are in a common plane. Three spindles are positioned to form a three-point triangle of platen supports where the rotational-centers of each of the spindles are positioned at the center of the annular width of the platen abrading surface. The spindles are supported by two-piece spindle-mount devices having a common-radius spherical joint that allows the spindles to be rotated to co-planar align the top flat surfaces of the rotatable spindle-tops and then to be locked into this aligned position. Spindle-mount spherical-action locking devices include mechanical fasteners and stress-free adhesive tabs. Precision-flat platens can be used as an alignment jig for co-planar alignment of the spindles.

Abstract: The present disclosure relates to apparatus for grinding rotary blades, in particular scythe-like blades or circular blades, in particular for machines for slicing food products. The apparatus includes at least one mount for a rotary blade to which the rotary blade can be attached and at least one grinding tool. The grinding tool and the rotary blade attached in the mount are movable relative to one another such that a blade edge extending at the periphery of the rotary blade can be ground by the grinding tool. The apparatus includes a measuring device for determining the extent of the blade edge and a control which is designed to use the determined blade edge extent for controlling the relative movement between the grinding tool and the rotary blade.

Abstract: In a continuous grinding machine for grinding the surface of flat workpieces (20) with at least one grinding station and a transport device (10) for moving the workpieces (20) relative to the grinding station, the grinding station having at least one grinding assembly (22) with a grinding belt (26) and a pressure device (34) for pressing the grinding belt (26) against the workpiece surface, and with a control device (38) for controlling the pressure device (34) depending on the workpiece contour, the transport device (10) is reversible with respect to its feed direction and the control device (38) has means (36) for detecting the workpiece contour depending on the feed direction.

Abstract: A grinding assembly is described, for a grinding head for a grinding machine of glass slabs, comprising: a first (and possibly a second) grinding wheel adapted to tangentially work on the glass edge and whose rotation axis A is parallel to the glass edge to be ground; and a handling system for the grinding wheel for adjusting the removal of glass in an oscillating way or in parallel with the plane of the slab to be ground. A grinding head equipped with the above grinding assembly is further described.

Abstract: A grind wheel includes a rim having at least one notch formed in the rim to grind a slot base of a blade retention slot within a rotor disk.

Abstract: In a system or method for controlling wafer back-grinding, a chuck table has a surface for supporting a semiconductor wafer during a back-grinding process, one or more holes in the surface, and one or more sensors disposed in the one or more holes for monitoring a parameter during back-grinding. A computer-implemented process control tool is coupled to receive one or mote outputs from the one or more sensors and control the back-grinding process based on the received one or more outputs.

Abstract: A polishing pad wear detecting apparatus suitable for a chemical mechanical polishing (CMP) apparatus is provided. The polishing pad wear detecting apparatus includes an arm and a height detector. One end of the arm is fastened on the CMP apparatus. The height detector is disposed on the arm for detecting height variation of a polishing pad.

Abstract: An abrasive apparatus of a sander is provided. The abrasive apparatus is disposed above a worktable of the sander and includes a base and a lift unit. At least one abrasive wheel is provided in the base. The base has a top formed with at least one slot. The lift unit is disposed on the abrasive wheel to bring the abrasive wheel to move up so that an abrasive surface of the abrasive wheel passes through the slot of the base and protrudes from the base for the top of the base to sand the side of a workpiece. The cutting width of the sander can be extended to enhance the use of the sander, so the manufacturing process can be shortened to increase the production efficiency.

Abstract: An apparatus for monitoring the thickness of a conductive layer on a substrate includes a support to hold a substrate having a conductive layer, an eddy current monitoring system including a first plurality of core portions, and a motor to cause relative motion between the support and the eddy current monitoring system such that the substrate moves across the first plurality of core portions in a direction that defines a first axis. At least one core portion is positioned further from a second axis than at least two other core portions. The second axis is orthogonal to the first axis.

Abstract: The honing feed system and method utilizes feedback from various sources during rapid feeding of the honing tool while rotating and stroking, to detect initial contact with a bore surface, to slow the feed to a normal honing rate, involving conditioning the feedback signals to eliminate noise factors such as the stroking movement and forces generated to rotate and feed the tool unopposed.

Abstract: A method for processing a work-piece is disclosed herein. The method includes the step of removing material from a work-piece to a predetermined depth with a tool that changes size. The method also includes the step of passing the tool across the work-piece in one or more passes during the removing step such that a cutting depth into the work-piece changes during a particular pass. Each pass is defined by a pass depth. The method also includes the step of maintaining a substantially constant chip thickness during the removing step. The method also includes the step of selectively maximizing one of a feed rate and a pass depth of material removal at the expense of the other during the removing step to minimize the time of the passing step.

Abstract: An ultrasonic trimming apparatus is composed of an articulated robot, a cutting apparatus, and a grindstone. The cutting apparatus is composed of an ultrasonic oscillator which is supported by the end portion of the articulated robot, a cutter blade which is supported by the ultrasonic oscillator, and a workpiece securing portion which secures a workpiece. The grindstone serving as a grinding member is disposed within the movable range of the cutter blade driven by the robot and is placed in a position at which the cutter blade can pressure contact the cutter blade. The cutter blade is ultrasonically vibrated by the ultrasonic oscillator and is ground while being pressed against the grindstone by means of the articulated robot.

Abstract: Method of grinding cylindrical gears with a threaded grinding wheel wherein the amount of grinding wheel material utilized during shifting remains constant as the wheel diameter decreases, for example, due to dressing. The amount of grinding wheel shifting is adjusted as the grinding wheel diameter decreases.

Abstract: The present invention is a slicing method and a wire saw apparatus including winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel in a reciprocating direction, in which the ingot is sliced with controlling a temperature of the ingot by supplying a slurry for adjusting an ingot temperature to the ingot independently from the slurry for slicing while the slurry for adjusting an ingot temperature is supplied to the ingot only at the exit side of the wire caused to travel in the reciprocating direction. As a result, there is provided a method and a wire saw apparatus in which rapid cooling of an ingot especially in a time close to end of slicing of the ingot can be alleviated, consequently degradation of a nano-topography can be suppressed, and further high-quality wafers having a uniform thickness can be sliced when slicing the ingot by using a wire saw.

Abstract: A polishing head for use in a polishing machine for optical surfaces, having an axis of rotation and a base body having a holding structure intended to be arranged at a polishing spindle and having a transport element intended to be held at a tool change arm, the transport element being positionable against a holding element of the tool change arm in order to perform a tool change, wherein at least one locking element is provided which can be positioned against the tool change arm such that a positive and/or non-positive joint results.

Abstract: The present invention provides a drive for a grinding or cutting machine. The drive comprises a body having a drive coupling for receiving at least one drive shaft in a manner so that the or each drive shaft is drivable by the drive. The drive also comprises a mount for mounting the body to a portion of the machine such as to a linkage arm of an earth grinding or cutting vehicle. The drive coupling is arranged to inter-fit with a portion of the or each drive shaft.