Abstract: The present invention discloses an improvement on a wafer carrier ring for use in a chemical-mechanical polishing apparatus for uniformly polishing semiconductor wafers. The apparatus comprises of a ring assembly, a stainless steel backing plate and a rubber bladder for holding the ring assembly and the backing plate. The ring assembly comprises of two rings. The first ring is made of a soft material such as Delrin or PBT for holding the stainless steel backing plate which is attached to the wafer. A top portion of the first ring is cutoff to leave an annular notch. The second ring is made of a hard material such as stainless steel and is fitted into the annular notch of the first ring. Both rings are attached to the rubber bladder through two sets of screws which are evenly spaced through a circular path concentric to the circumference of the first ring.

Abstract: A chemical mechanical polishing apparatus for a semiconductor wafer which is capable of polishing uniformly the surface of the semiconductor wafer and of controlling the polishing amount by providing plurality of rotary drums each wrapped in a polishing cloth on the upper surface of a polishing pad and connecting supporters capable of vertical movement to both ends each rotary drum, and includes a rotatable polishing pad in the planar upper surface of which a plurality of recesses are formed for receiving a semiconductor wafer, a plurality of rotatable polishing units located on the polishing pad for planarizing the surface of the semiconductor wafers, a supporter connected at the endpoints of the rotational polishing units which can make a vertical movement, and a slurry applicator located above the rotational polishing units for putting a slurry thereon.

Abstract: A grinding wheel assembly to be mounted on a vertical drive shaft extending from an electric motor through a horizontal table of a grinding apparatus. The grinding wheel assembly includes a core element that is rigidly secured to the drive shaft. A drop-on cylindrical grinding bit of the grinding bit assembly is slidably engaged onto a cylindrical portion of the core element. A slot is formed in the cylindrical portion of the core element and a ridge is formed on the internal bore of the grinding bit so that when the grinding bit is placed on the core element, the grinding bit will rotate upon rotation of the drive shaft.

Abstract: The novel ferrule grinding machine of the present invention has a wire support assembly having a wire that stretches the length of the wire support on which ferrules are strung. The wire rests in a novel guide that aids in producing ferrules within tolerances. The machine also has a grinding wheel and regulating wheel whose speed and composition may be changed to determine the surface finish and concentricity of a ferrule. The regulating wheel infeed assembly controls the size of the ferrules via a computer and a step motor that control the position of the regulating wheel as it tilts on a pivot base to attain the correct size of ferrule. The wire support assembly is placed on a variable speed work traverse that carries the work between the grinding wheel and regulating wheel, while the ferrules are supported on a rest blade such that the ferrules are worked slightly above their center.

Abstract: A high speed knife sharpening apparatus where the surface of a first rotating abrasive element is that of a truncated cone and forms a first facet with microgrooves and a microburr. A second stage is a novel composite cone shaped honing wheel made up of a micro abrasive imbedded in an epoxy matrix. The honing wheel refines the edge developed in the first stage, into an erect triangular shape with a radius of curvature, at the apex (edge), of typically several microns or less depending on the hardness of the knife steel. A unique blade holding system constrains the blade to a precisely defined angle relative to each of the grinding (first) and honing (second) stages. Proportionately larger grinding forces are developed for thicker knife blades, thus sharpening times are approximately the same over the common range of knives from small paring knives (6"), large chef's knives (10") up to kitchen cleavers.

Abstract: A grinding apparatus including a cylindrical grinding wheel assembly mounted on a vertical drive shaft extending from an electric motor through a horizontal work table. The apparatus includes a pressure sensitive electrical switch for activating the motor in response to downward force on the work table. The work table is supported on a housing adapted to contain the motor and can be interchanged with work tables of various sizes and configurations. The grinding wheel assembly includes a core element and a grinding element where the grinding element is secured to the core element by various mechanisms to allow the grinding element to be removed from the core element while the core element is secured to the drive shaft so as to interchange the grinding element in the event that a grinding element has been worn out.

Abstract: In a device for grinding workpieces, in particular workpieces made of ceramic materials, by means of a grinding wheel (24) or the like, the workpiece (23) is oscillated transversely to the machining direction during grinding. At least one ultrasonic transducer (1), whose ultrasonic energy is used as exciting energy for the workpiece (23), is provided as a device (20) for generating the oscillating movement of the workpiece (23). An ultrasonic resonance space (2,4) for amplitude transformation is provided between the ultrasonic transducer (1) and a sonotrode (5) which transmits the vibration to the workpiece (23).

Abstract: A polishing apparatus which can effectively polish a bottom wall of a wafer in the notch portion is disclosed. The polishing apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can enter the notch portion of the wafer, and is rotated around an axis which is parallel with a plane of the surface of the wafer supported on the table; a first rotating member such as a motor for rotating the rotary buff; a movable linkage for supporting the rotary buff; an adjusting member such as a cylinder device for adjusting the pressure applied to the bottom wall of the wafer in the notch portion from the rotary buff; and a second rotating member such as a pulse motor for turning the rotary buff around a predetermined axis so that the applied pressure from the rotary buff acts on the bottom wall of the wafer in the notch portion in a direction approximately perpendicular to the surface of the bottom wall.

Abstract: There is disclosed a turbine comprising a pair of relatively movable working members having closely spaced opposed surfaces with depressions therein acting to transer kinetic energy between a working fluid and the working members.

Abstract: An apparatus and a method for accommodating for differential in an ophthalmic lens grinding operation utilizing bevel edger machines. Such machines typically include a lens former assembly which has a former member upon which a particular frame shaped template rides to form the proper shape of the lens. The method includes the steps of adapting the former lens assembly of the bevel edger machine, externally of the differential settings of the machine, to provide a first profile for increasing the differential profile of the former member for a first lens-like material and allowing for providing a second differential for the former member which provides a proper differential for a second lens blank material. This may be accomplished in providing an adapter which is interposed between the former wheel and the lens template or a stepped former member. This provides for a new differential external to the internal adjustments of the machine.

Abstract: The invention relates to an apparatus of unitary construction to fine-finish gear teeth. The apparatus is a worm having first and second end portions and first and second outer surfaces. The first and second surfaces define a common tooth profile. The first end portion is adapted for grinding and the second end portion is adapted for finishing.

Abstract: A grinding bit apparatus used in conjunction with a grinding machine. A water pump in the form of a cylindrically shaped member having a helical groove on the surface thereof is mounted on the drive shaft of the grinding machine, a lower end portion thereof being located in a water reservoir. A grinding bit is mounted to the drive shaft above the water pump and is passively connected with the water pump so as to rotate with the drive shaft. One or more washers are placed between the water pump and the grinding bit so as to selectively vary the location of the working surface of the grinding bit with respect to the work table. An annular collar openings is provided which depends from the work table to surround the water pump and any portion of the grinding bit below the work surface.