Abstract: A grinding method includes a pre-grinding step of grinding a plate-shaped workpiece to a thickness just before a finish thickness is reached using a finish grinding unit, a thickness measuring step of measuring a thickness of the workpiece after the pre-grinding step, a calculation step of calculating, from the measured thickness of the workpiece, a variation amount of the distance between a holding face of the chuck table and a grinding face of a finish grindstone before and after inclination adjustment of the chuck table, and a height adjustment step of adjusting, on the basis of the variation amount, the inclination of the chuck table while adjusting the height of the finish grinding unit so that the relative moving speed between the finish grindstone and the workpiece in a state in which the grinding face contacts with an upper face of the workpiece becomes equal to zero.

Abstract: An embodiment of the present invention provides a surface plate provided at a wafer double-side grinding device for grinding a wafer. The surface plate includes a plurality of first surface plate grooves formed in a first direction, and a plurality of second surface plate grooves formed in a second direction different from the first direction. The first surface plate grooves and the second surface plate grooves have first and second surface plate groove portions arranged therein, the first and second surface plate groove portions having steps formed in a direction toward the center or an outer periphery of a lower surface plate.

Abstract: An abrasive article includes a support, a first polymeric binder, a second polymeric binder, and abrasive particles. The support includes a plurality of nonwoven layers. A method of forming an abrasive article includes providing a support including, applying a first coating of the first polymeric binder to the support, applying superabrasive particles to the coated support, applying a layer of a second polymeric binder overlying the superabrasive particles. The method further includes compressing the support and applying heat to cure the first polymeric binder. A method of preparing a work piece includes applying a thermal spray coating to the work piece, and polishing the thermal spray coating with the abrasive article.

Abstract: The present invention relates to a sheet for mounting a workpiece and a method for making the same. The method includes the steps of: (a) providing a sheet body having a top surface, a bottom surface, at least one side surface and a plurality of pores, wherein some of the pores open at the side surface; and (b) sealing or narrowing the pores that open at the side surface. Since the pores that open at the side surface are sealed or narrowed, the slurry is prevented from entering into the interior of the sheet body. Therefore, the infiltration distance reaches a predetermined value slowly, thereby increasing the effective life of the sheet.

Abstract: Polishing pad and method of manufacturing the same, the method, whereby materials for forming a polishing layer are mixed and solidified by a chemical reaction so as to manufacture the polishing pad, the method including: grinding organic materials by using a physical method so as to form micro-organic particles; mixing the micro-organic particles formed in the operation with the materials for forming the polishing layer; mixing at least one selected from the group consisting of inert gas, a capsule type foaming agent, and a chemical foaming agent that are capable of controlling sizes of pores, with the mixture in the operation so as to form gaseous pores; performing gelling and hardening of the mixture generated in the operation so as to form a polishing layer; and processing the polishing layer so as to distribute open pores defined by opening gaseous pores on a surface of the polishing layer.

Abstract: Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Abstract: A CMP polishing pad comprising (a) a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured opaque thermoset polyurethane region and at least one aperture region; said at least one cured opaque thermoset region has a porosity from about 10% to about 55% by volume; said at least one aperture region having (1) a top opening positioned below the polishing surface, (2) a bottom opening that is co-planar with said back surface and (3) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region filled with a cured plug of thermoset polyurethane local area transparency material that has a light transmission of less than 80% at a wavelength from 700 to 710 nanometers and is chemically bonded directly to a thermoset polyurethane opaque area; (b) an aperture-free removable release sheet covering at least a portion of said back surface of the polishing l

Abstract: A polishing pad, having a polishing layer comprising a thermoset polyurethane foam, wherein the polishing layer has an in-plane variation of 12 or less in microrubber A hardness, the variation being obtained by measuring the polishing layer from a polishing surface side of the layer, the thermoset polyurethane foam contains, as raw material components, an isocyanate component and active-hydrogen-containing compounds, and the active-hydrogen-containing compounds comprise a trifunctional polyol having at least one terminated hydroxyl group that is a secondary hydroxyl group, and having a hydroxyl group value of 150 to 1,000 mg KOH/g in an amount of 10 to 50 parts by weight for 100 parts by weight of the active-hydrogen-containing compounds.

Abstract: Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.

Abstract: The invention relates to a replaceable fine machining membrane (19) for fixing on a tool head (1), to which pressure can be applied, of a stationary fine machining tool for fine machining a workpiece surface. A fine machining means substrate (27) is integrated in the fine machining membrane (19), said fine machining membrane (19) having a crosslinked elastomer (40) and said fine machining means substrate (27) being embedded in the crosslinked elastomer (40). The invention also relates to a method for producing such a fine machining membrane (19) and to a stationary fine machining tool with a tool head (1) to which pressure can be applied and which has a removable fixing means (31) for fixing such a replaceable fine machining membrane (19). Finally, the invention relates to a method for producing the novel fine machining membrane (19). The invention allows the precise reproducible fine machining of workpiece surfaces even with highly convex or freely shaped membranes (19).

Abstract: The invention provides a polishing pad for chemical-mechanical polishing comprising a porous polymeric material, wherein the polishing pad comprises closed pores and wherein the polishing pad has a void volume fraction of 70% or more. Also disclosed is a method for preparing the aforesaid polishing pad and a method of polishing a substrate by use of theaforesaid polishing pad.

Abstract: Embodiments of the disclosure generally provides a method and apparatus for a polishing article or polishing pad having a microstructure that facilitates uniform conditioning when exposed to laser energy. In one embodiment, a polishing pad comprising a combination of a first material and a second material is provided, and the first material is more reactive to laser energy than the second material. In another embodiment, a method of texturing a composite polishing pad is provided. The method includes directing a laser energy source onto a surface of the polishing pad to affect a greater ablation rate within a first material having a greater laser absorption rate and a lesser ablation rate within a second material having a lesser laser absorption rate to provide a micro-textured surface consistent with microstructure of the composite polishing pad.

Abstract: A fixed abrasive grain wire saw that can improve precision of a cut plane of a workpiece and grinding efficiency and can prolong product life, a method of manufacturing the fixed abrasive grain wire saw, and a method of machining a workpiece by the fixed abrasive grain wire-saw. To fasten abrasive grains to an outer circumferential surface of a metal core wire, a plurality of transfer rollers, in each of which many tiny holes filled with an adhesive are formed, are used to transfer the adhesive to the outer circumferential surface of the core wire to form, on the outer circumferential surface, a plurality of rows of punctiform adhesive layers that are linearly arrayed in the axial direction at regular intervals. The abrasive grains are tentatively fastened to the adhesive layers, after which the abrasive grains are permanently fastened with a metal plated layer formed by electrolytic deposition.

Abstract: An abrasive article includes abrasive particles contained within a hybrid bond that may include a metal bond material and an organic bond material, the article having an average thickness of 250 microns or less and the metal bond material including a solid solution phase and an intermetallic phase distinct from the solid solution phase.

Abstract: When a polishing pad is attached to a polishing table, the polishing pad can be easily positioned on and attached to the polishing table and air pockets are prevented from forming. As a position guide member 130 is inserted into a guide hole 109 with an attachment surface of a polishing pad 108 downward, the polishing pad 108 is positioned on and attached to a polishing table 110. At this time, the guide hole 109 of the polishing pad 108 is guided by the position guide member 130 and the polishing pad 108 is easily positioned so as to match the upper surface of the polishing table 110 with the outer periphery thereof. Then, as release paper is gradually peeled off from a rear surface of the polishing pad 108, the portion where the release paper is peeled off is attached to the polishing table 110.

Abstract: An abrasive article may include an abrasive body having a grinding layer, where the grinding layer may include a bond and abrasive particles contained within the bond. The abrasive body also may include a volumetric ratio GLVb/GLVap of at least about 0.4, where GLVb is a volume percent of bond for a total volume of the grinding layer and GLVap is a volume percent of abrasive particles for a total volume of the grinding layer. The abrasive particles may include seeded sol-gel ceramic and may have an average particle size of at least about 600 microns. In addition, the abrasive particles may include a coupling agent that may include an organic material with a silane functional group. Prior to formation of the abrasive article, the abrasive particles may be coated by the coupling agent at a ratio ACOA/AAB of at least about 0.1, where CCOA is the amount of coupling agent in grams in a pre-formation mixture and AAB is the amount of abrasive particles in pounds (lbs) in the pre-formation mixture.

Abstract: The invention provides a polishing pad comprising a polishing pad body comprising a polishing surface, wherein the polishing body comprises pores, and wherein the polishing surface has a surface roughness of about 0.1 ?m to about 10 ?m.

Abstract: Presently described are methods of making an article via electrostatic deposition of particles, abrasive grains and articles, as well as a method of repairing a painted surface. The abrasive grain comprises a plurality of abrasive particles having a median primary particle size of less than 75 microns, and discrete hydrophobic nanoparticles.

Abstract: An object of the present invention is to provide a polishing pad which hardly generates scratches on the surface of an object to be polished, and has improved dressability. Another object of the present invention is to provide a method for manufacturing a semiconductor device using the polishing pad. A polishing pad of the present invention includes a polishing layer made of a fine cell-containing polyurethane resin foam, wherein the polyurethane resin foam contains a polyurethane resin having an Asker D hardness of 20 to 60 degrees and an abrasion parameter, which is expressed by the following equation, of 1 to 3.

Abstract: An abrasive article includes a backing having a major surface, an adhesion promoting layer overlying the major surface of the backing, and a make layer directly contacting the adhesion promoting layer. The adhesion promoting layer has a thickness of at least about 10 microns and is formed of a polar thermoplastic material, a cross-linkable polymer, or blends thereof.

Abstract: A method for making a multilayer polishing pad includes rotating a cylinder about a central axis. The cylinder encloses in an interior space a single polymer mixture that phase separates under centrifugal force. The method also includes forming the polishing pad from at least some of a polymer formed after the polymer mixture has reacted. The method includes forming at least two distinct layers in the polishing pad by casting and gelling sequentially at least two different polymers.

Abstract: A polishing pad for polishing a substrate. The pad comprises a layer of material having an upper polishing surface and a lower surface interfacing with a proximate platen, the material comprising a mixture of a conductive polymer distributed in a structure of a dielectric polymeric material using predetermined relationships. Additional embodiments provide a pad having a layer of dielectric polymeric material with an upper polishing surface and a lower surface interfacing with a proximate platen. A first set of grooves filled with a conductive polymer extends from the upper polishing surface to the lower surface, the first set of grooves filled with a conductive polymer. A second set of shallower grooves provide for slurry flow over the upper polishing surface. The first and/or second set of grooves are provided in a predetermined pattern.

Abstract: The present invention relates to a method for manufacturing a flexible abrasive disc, and to such an abrasive disc. The abrasive disc comprises a backing with an upper side and a lower side. The upper side has an abrasive agent coating for forming a surface layer. In order to form a surface layer as specifically patterned as possible, the backing of each abrasive disc is coated separately. In this manufacturing method, the abrasive agent coating on the upper side of the backing is embossed with an embossing mold specially structured and to be pressed against the backing.

Abstract: A wafer edge trimming tool includes an abrasive tape and a holding module configured to hold the abrasive tape against portions of an edge of a rotating wafer during a wafer edge trimming process.

Abstract: A polishing pad generates very few scratches on a surface of a polishing object, and is excellent in planarization property. The polishing pad has a high polishing rate and is excellent in planarization property. The polishing pad grooves become very little clogged with abrasive grains or polishing swarf during polishing and, even when continuously used for a long period of time, the polishing rate is scarcely reduced.

Abstract: A method for producing a coated abrasive includes producing or providing an intermediate abrasive product that comprises a substrate, a plurality of abrasive grains that are bonded to the substrate, and at least one layer of an uncured size coat that at least partially covers the abrasive grains with the uppermost size coat being uncured. The method further includes applying at least one grinding additive to the uppermost, uncured size coat with the grinding additive applied to the size coat in dry form. The method also includes curing the uppermost size coat. A coated abrasive is produced by the method and the coated abrasive is used to process a surface.

Abstract: The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads.

Abstract: Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described.

Abstract: Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.

Abstract: A self-bonded foamed abrasive article and a method of machining using such an article. The machining method includes providing a workpiece having a worksurface and removing material from the worksurface by moving an abrasive relative to the worksurface, wherein the abrasive comprises a foamed abrasive body consisting of abrasive grains and a porosity of at least about 66 vol %.

Abstract: Described herein are methods for polishing sapphire surfaces using compositions comprising colloidal silica, wherein the colloidal silica has a broad particle size distribution.

Abstract: Described herein are methods for polishing sapphire surfaces using compositions comprising colloidal silica, wherein the colloidal silica has a broad particle size distribution.

Abstract: A surface polishing composition is provided that includes a polyhydric alcohol, and a base present to give the composition a pH of between 9 and 12, an oil, an abrasive, and the majority component of the composition being water. The composition is particularly effective at removing water spots from a surface without resort to acid that can damage the finish on the surface or induce corrosion in the substrate beneath the surface. A polishing composition is provided in a kit form with an applicator along with instructions for the respective use of the composition and applicator to remove water spots from the surface. A clay bar is particularly well suited as an applicator. A process provided for removing water spots from a surface that includes applying to the surface the composition and then simultaneously contacting the composition with the substrate and the applicator.

Abstract: It is an object of the present invention to provide a polishing pad that is resistant to scratching and also has excellent flattening performance. One aspect of the present invention is a polishing pad, comprising a fiber-entangled body formed from fiber bundles made up of ultrafine fibers in which the average cross sectional area is between 0.01 and 30 ?m2, and a macromolecular elastomer, wherein part of the macromolecular elastomer is present inside the fiber bundles, whereby the ultrafine fibers are bundled, the number of fiber bundles per unit of surface area present in a cross section in the thickness direction is at least 600 bundles per square millimeter, and the volumetric ratio of a portion excluding voids is between 55 and 95%.

Abstract: A polishing pad for polishing a semiconductor device and manufacturing method therefor, the polishing pad comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein an M-component of the polyurethane-polyurea resin foam has a spin-spin relaxation time T2 of 160 to 260 ?s, the polyurethane-polyurea resin foam has a storage elastic modulus E? of 1 to 30 MPa, the storage elastic modulus E? being measured at 40° C. with an initial load of 10 g, a strain range of 0.01 to 4%, and a measuring frequency of 0.2 Hz in a tensile mode, and the polyurethane-polyurea resin foam has a density D in a range from 0.30 to 0.60 g/cm3. The polishing pad remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and can be used for primary polishing or finish polishing.

Abstract: A coated abrasive product includes a particulate material containing green, unfired abrasive aggregates having a generally spheroidal or toroidal shape, the aggregates formed from a composition comprising abrasive grit particles and a nanoparticle binder. Free abrasive products, bonded abrasive products, and the particulate material also contain aggregates.

Abstract: Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Abstract: A coated abrasive article having a plurality of formed ceramic abrasive particles each having a surface feature. The plurality of formed ceramic abrasive particles attached to a flexible backing by a make coat comprising a resinous adhesive forming an abrasive layer. The surface feature having a specified z-direction rotational orientation, and the specified z-direction rotational orientation occurs more frequently in the abrasive layer than would occur by a random z-direction rotational orientation of the surface feature.

Abstract: A polyurethane foam backing suitable for making a coated abrasive article is disclosed. The polyurethane foam backing has a textured surface bearing an array of raised features and land areas. The array's geometry is designed such that a 90 degree peel force to remove a production tooling having a contacting surface bearing a plurality of microreplicated mold cavities from the textured surface is accept able.

Abstract: Provided is a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad. In one embodiment, the polishing pad comprises a polishing layer produced by applying to the subpad a hardenable fluid. In another embodiment, the subpad is coated with a barrier before coating with the hardenable fluid. In each embodiment, the depth of penetration of the polishing layer and/or barrier is substantially uniform. Also provided is a method of producing a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad.

Abstract: A universal abrasive sheet is provided for a sanding or polishing machine and includes segments defined by weakened regions that allow portions of the universal abrasive sheet to be removed in order to adapt the abrasive sheet to alternative platent configurations. Each of the different configurations of the universal abrasive sheet can be provided with an individualized tip portion which can be separated from a body portion and either repositioned or replaced in order to change the working point of the tip portion when it becomes worn out.

Abstract: A chemical mechanical polishing pad includes a polishing layer that is formed of a composition that includes a polyurethane, the polishing layer having a specific gravity of 1.1 to 1.3 and a thermal conductivity of 0.2 W/m·K or more.

Abstract: A lens pad for use in surfacing a lens work piece, one side of which pad provides a working surface and the other side of which pad provides micro formations spread out substantially uniformly over that other side of the pad. When the lens pad is in use, it is attached to a surface of a lens surfacing tool. The latter surface provides micro formations spread substantially uniformly over that surface of the lens surfacing tool. The micro formations of the pad interengage or interlock with those of such a surface of such a lens surfacing tool when the pad is in use. Also, such a lens surfacing tool, a combination of such a pad attached to such a tool, and a lens surfacing machine having such a tool, or such a combination.

Abstract: The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. The polishing pad includes a polymeric matrix, the polymeric matrix having a polishing surface. In addition, polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. The polymeric microelements have an outer surface and being fluid-filled for creating texture at the polishing surface. And alkaline-earth metal oxide-containing regions are distributed within each of the polymeric microelements paced to coat less than 50 percent of the outer surface of the polymeric microelements.

Abstract: An abrasive brush includes a securing element and a plurality of abrasive filaments secured to the securing element to form a brush. Each abrasive filament includes a matrix of thermoplastic polymer and a plurality of alumina abrasive particles interspersed throughout at least a portion of the matrix. The abrasive particles comprising a polycrystalline alpha alumina having a fine crystalline microstructure characterized by an alpha alumina average domain size not greater than 500 nm. The alumina abrasive particles further include a pinning agent comprising a dispersed phase in the polycrystalline alpha alumina.

Abstract: An abrasive article is provided that includes a flexible backing having opposed first and second major surfaces. The first major surface includes a plurality of abrasive particles in at least one binder disposed thereon. The second major surface includes replicated microstructures having recesses. The abrasive article also includes adhesive contained substantially in the recesses of the replicated microstructures. A rigid substrate can be in contact with at least a portion of the replicated microstructures. Also provide is a method of polishing a work-piece that uses the provided articles.

Abstract: An abrasive article having a multi-directional abrasion protrusion according to an exemplary embodiment of the present invention includes a flexible base substrate, and a plurality of abrasion protrusions integrally molded with the base substrate and having at least three sides forming a triangle, in which a plurality of abrasion protrusions has a directional property by grouping. According to this constitution, loading resistance and durability are excellent, there are no attachment materials attached to an abraded surface in the case where a flat surface is abraded, abrasion can be efficiently and evenly performed in a predetermined shape even though abrasion particles are not enlarged to perform abrasion or abrasion is not repeated several times by using particulates, and abrasion performance can be improved.

Abstract: The invention provides a polishing pad that contains at least one light-transmitting region and optionally a polishing pad body. The light-transmitting region is composed of a material comprising (a) a polymeric resin and (b) at least one light-absorbing compound, and the light-transmitting region has a total light transmittance of about 25% or more at one or more wavelengths in a range of 250 nm to 395 nm.

Abstract: A sharpening device with an abrasive material, a polishing coat encapsulating the abrasive material and an instruction card coupled to the polishing coat. The abrasive material having a property of conforming to the shape of a pointed article penetrating the abrasive material and a property of applying resistance pressure to the pointed article. The sharpening pad may be used in the sharpening and polishing of conically and other shaped points as found on various articles such as machine and hand sewing needles, quilting needles, pins, darts, miscellaneous tools, barb-less fishhooks and the like, including various fine pointed articles.

Abstract: A method for making a polishing pad includes rotating a cylinder about a central axis. The cylinder encloses in an interior space a polymer precursor. The method also includes forming the polishing pad from at least some of a polymer formed after the polymer precursor has cured. The rotating of the cylinder may be continued until the polymer has cured. The method may include forming at least two distinct layers in the polishing pad by casting and curing sequentially at least two different polymer precursors. A system for manufacturing a polishing pad includes a centrifugal caster adapted to rotate. A polishing pad made by a method is provided.