Abstract: A coated abrasive article (1) comprises a backing (3) having an abrasive coating (5) on one side, an attachment layer (7) on the other side of the backing, and a line of weakness (9) that does not penetrate the front face of the abrasive coating (5). The line of weakness, which may be formed using a laser beam, comprises a through-cut (11) in the attachment layer (7) and perforations (13) in the backing (3), and permits one part of the abrasive article (1) to be separated from another part. Alternatively, the abrasive article can be used in its original form.

Abstract: The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.

Abstract: A polishing pad having a compressibility-aiding stripe buried therein is fabricated by assembling the compressibility-aiding stripe in a mold cavity, filling the mold cavity with a polymer material, and releasing the polishing pad from the mold. Embodiments include assembling a compressibility-aiding stripe comprising a solid pillar of material having a larger compressibility than that of the polishing pad body, and releasing a single layer polishing pad from the mold.

Abstract: Systems and methods for polishing a lens having a freeform design cut into a surface of the lens are provided. The system may include a lap blank having a substantial inverse of the freeform design cut into a surface of the lap blank, or a conformable lap blank having an inverse of the freeform design molded into a surface of the lap blank. The system also includes a deformable pad mounted on the surface of the lap blank. The surface of the lens is separated from the surface of the lap blank by the deformable pad, and the lens and the lap blank are arranged such that the freeform design of the surface of the lens is substantially aligned with the substantial inverse of the freeform design of the surface of the lap blank.

Abstract: Polishing pads with grooved foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a pattern of grooves disposed therein. A continuous polishing surface layer is attached to the pattern of grooves of the foundation layer. In another example, a polishing pad for polishing a substrate includes a foundation layer with a surface having a pattern of protrusions disposed thereon. Each protrusion has a top surface and sidewalls. A non-continuous polishing surface layer is attached to the foundation layer and includes discrete portions. Each discrete portion is attached to the top surface of a corresponding one of the protrusions of the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a grooved foundation layer are also described.

Abstract: To provide a polishing tool for a plastic lens, a method of polishing a plastic lens and a method of manufacturing a plastic lens, capable of suppressing a deterioration of a polishing efficiency while reducing a cost required for treating a polishing waste liquid generated during polishing applied to the plastic lens, wherein the polishing tool is used for adjusting and completing an optical surface of the plastic lens, and is composed of a single layer in which abrasive grains made of crystalline alumina are uniformly dispersed and fixed to a substance mainly composed of polyurethane resin having foamability.

Abstract: A universal abrasive sheet is provided for a sanding or polishing machine and includes segments defined by weakened regions that allow portions of the universal abrasive sheet to be removed in order to adapt the abrasive sheet to alternative platent configurations. Each of the different configurations of the universal abrasive sheet can be provided with an individualized tip portion which can be separated from a body portion and either repositioned or replaced in order to change the working point of the tip portion when it becomes worn out.

Abstract: An abrasive article includes a backing having first and second major surfaces, an abrasive layer overlying the first major surface, and a backsize layer overlying the second major surface. The backsize layer is formed from a formulation including a cationically polymerizable component, a radically polymerizable component, and at least 5% by weight of a nano-sized filler based on the weight of the formulation.

Abstract: Polishing systems, subsystems and pads adapted for use in conjunction with a polisher. A relatively incompressible backing pad is configured to be attached to a drive system of the polisher. The backing pad includes at least one substantially straight backing pad edge along a perimeter thereof. A relatively compressible polishing pad is configured to be attached to the backing pad, to be driven in contact with a surface to be polished. The polishing pad includes at least one substantially straight polishing pad edge along a perimeter thereof corresponding to the at least one substantially straight backing pad edge when the polishing pad is attached to the backing pad.

Abstract: A chemical mechanical polishing pad comprising an acrylate polyurethane polishing layer, wherein the polishing layer exhibits a tensile modulus of 65 to 500 MPa; an elongation to break of 50 to 250%; a storage modulus, G?, of 25 to 200 MPa; a Shore D hardness of 25 to 75; and a wet cut rate of 1 to 10 ?m/min.

Abstract: The present invention relates to an abrasive tool, of the type suitable to be mounted on a machine tool, comprising at least a bearing structure with abrasive material, the said bearing structure being provided with at least a grid (6) with abrasive material, the grid (6) partially protruding or emerging from a body (7) without abrasive material.

Abstract: In a sanding block having two expansive sides and two adjacent sides, each adjacent side adjoins each expansive side at a given one of two opposite edges of that expansive side. The expansive and adjacent sides are abrasive. When viewed macroscopically before the sanding block becomes worn, the expansive sides between their opposite edges are planar and are parallel, a given one of the opposite edges of each expansive side is a curved edge, which defines a radius not less than about ? inch at any location on the curved edge, and the other one of the opposite edges of each expansive side is a sharp edge, which defines an acute angle in a range from about 55° to about 70°. The curved edges are intended to minimize gouging or scuffing due to uneven pressure being applied by a user holding the sanding block in one hand and to minimize damage when gouging or scuffing due thereto occurs.

Abstract: A polishing pad has structural parts embedded therein; sensors, a memory for storing detected information obtained by the sensors, and a communication unit driven by a power supply unit to communicate with outside in a non-contact manner. The polishing pad and a communication unit configured to communicate with the communication unit of the polishing pad in a non-contact manner constitute a polishing information management system. The polishing pad and a communication unit configured to transmit and receive the information to and from the communication unit of the polishing pad in a non-contact manner constitute a polishing apparatus.

Abstract: A polishing pad auxiliary plate including: a lower auxiliary plate overlapping a top surface of a rotating surface plate of a polishing device; a first adhering member adhering the lower auxiliary plate to the rotating surface plate; an upper auxiliary plate with a pad support surface on which the polishing pad is overlapped and adhered, while overlapping a top surface of the lower auxiliary plate; a second adhering member adhering the upper auxiliary plate to the lower auxiliary plate; and an alignment member for mutually aligning the lower and upper auxiliary plates and matching center axes thereof. By removing the upper auxiliary plate from the lower auxiliary plate, the polishing pad is removed from the rotating surface plate while being adhered to the pad support surface of the upper auxiliary plate, and the removed upper auxiliary plate is reattached and aligned to the lower auxiliary plate by the alignment member.

Abstract: A self-bonded foamed abrasive article and a method of machining using such an article. The machining method includes providing a workpiece having a worksurface and removing material from the worksurface by moving an abrasive relative to the worksurface, wherein the abrasive comprises a foamed abrasive body consisting of abrasive grains and a porosity of at least about 66 vol %.

Abstract: An object of the present invention is to provide a polishing pad having high planarization property and capable of making it possible to suppress the occurrence of scratches. A polishing pad of the present invention has a polishing layer having oval cells each with a long axis inclined by 5° to 45° with respect to the direction of the thickness of the polishing layer.

Abstract: A polishing pad, having a polishing layer comprising a thermoset polyurethane foam, wherein the polishing layer has an in-plane variation of 12 or less in microrubber A hardness, the variation being obtained by measuring the polishing layer from a polishing surface side of the layer, the thermoset polyurethane foam contains, as raw material components, an isocyanate component and active-hydrogen-containing compounds, and the active-hydrogen-containing compounds comprise a trifunctional polyol having at least one terminated hydroxyl group that is a secondary hydroxyl group, and having a hydroxyl group value of 150 to 1,000 mg KOH/g in an amount of 10 to 50 parts by weight for 100 parts by weight of the active-hydrogen-containing compounds.

Abstract: Abrasive articles containing solid abrasive particles (A) selected from the group consisting of inorganic particles, organic particles and inorganic-organic hybrid particles (a1) having an average primary particle size of from 1 to 500 nm as determined by laser light diffraction and having electron donor groups (a2) chemically bonded to their surface are provided. The said solid abrasive particles (A) are distributed throughout or on top of or throughout and on top of a solid matrix (B). A method for manufacturing abrasive articles and a method for processing substrates useful for fabricating electrical and optical devices are provided. The said methods make use of the said abrasive articles.

Abstract: A method of plastic restoration is disclosed. A plastic surface is scoured with an abrasive dust mixture and a scouring pad. The plastic surface is wiped to remove a residue of the abrasive dust mixture. A sealer is applied to the plastic surface. A kit for use in plastic restoration is also disclosed. The kit has an abrasive dust mixture. The abrasive dust mixture includes an abrasive, one or more aliphatic hydrocarbons, an emulsifier, and water. The kit also has a scouring pad for scouring a plastic surface with the abrasive dust mixture.

Abstract: Disclosed are a polishing pad used in a CMP process of a planar material such as a silicon wafer, plate glass for a display, etc. and a method for manufacturing the same. The polishing pad comprises a non-woven fabric consisting of ultrafine fibers and elastomeric polymer impregnated into the fabric, on which the ultrafine fibers are raised and arranged to simultaneously satisfy the following conditions (I) to (III) such that the ultrafine fibers are oriented in a longitudinal direction to a central axis: The polishing pad of the present invention includes ultrafine fibers, which are arranged at a relatively wide orientation angle and have pores formed therebetween without requiring alternative processes for forming the pores, thus, exhibits excellent polishing performance and low occurrence of scratches during a polishing process.

Abstract: A transmission mechanism of a carving grinder and particularly to a transmission mechanism of a carving grinder capable of maintaining concentricity during rotation and enhancing stability to reduce transmission wobbling is provided. The mechanism includes a motor and a transmission tube coupled through a motor transmission member. The motor transmission member has a shaft and a driving member with an axle held by two bearings to improve steadiness during rotation of the shaft and axle. The axle has an integrated embossed key at one end to achieve concentricity. The transmission tube and motor transmission member and driving member are coupled through a square pin and a square hole to further enhance rotation steadiness.

Abstract: Embodiments herein provide polishing pads that produce high post-polish planarity, such as on a wafer substrate or other substrates. Exemplary pads include a bulk matrix and embedded polymer particles. Pads according to embodiments herein may be used to remove material over a composite substrate, comprised of two or more different materials, or a substrate comprised of a single material.

Abstract: A polishing pad having excellent planarization performance and wear resistance includes a polishing layer including a polyurethane foam having fine cells. The polyurethane foam is a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that is capable of reacting with 4,4?-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan ? peak temperature of 100° C. or more, (2) an isocyanate-terminated prepolymer (B) that is capable of reacting with 4,4?-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan ? peak temperature of 40° C. or less, and (3) 4,4?-methylenebis(o-chloroaniline), and the isocyanate-terminated prepolymers (A) and (B) are mixed in an (A)/(B) ratio of 50/50 to 90/10 (by wt%). The pad so made is used in the manufacture of semiconductor devices.

Abstract: A polishing pad generates very few scratches on a surface of a polishing object, and is excellent in planarization property. The polishing pad has a high polishing rate and is excellent in planarization property. The polishing pad grooves become very little clogged with abrasive grains or polishing swarf during polishing and, even when continuously used for a long period of time, the polishing rate is scarcely reduced.

Abstract: A polishing pad, comprising a mounting surface and an opposing polishing surface with a polishing pattern having at least one aperture thereon, is formed with an adhesive layer adhered to the mounting surface with uniform adhesive strength therebetween. Embodiments include applying an adhesive layer to the mounting surface with uniform pressure prior to forming the polishing pattern on the polishing surface. Embodiments also include forming the polishing pattern having at least one aperture, forming a fitter having a surface pattern opposite to the polishing pattern and having a projection, positioning the fitter on the polishing pattern so that the projection fills the aperture in the polishing pattern forming a composite having substantially parallel opposing surfaces, applying pressure to bond the adhesive layer to the mounting surface with substantially uniform adhesive strength therebetween, and removing the fitter.

Abstract: This disclosure is directed to a chemical mechanical polisher and a polishing pad component thereof. The chemical mechanical polisher comprises a polishing platen having a flat surface, and the polishing platen comprises: an electromagnet disposed under the flat surface and configured to fix a polishing pad base on the flat surface; and a switch configured to control the power-on and power-off of the electromagnet. The polishing pad component comprises a polishing pad base, and the polishing pad base is formed of a ferromagnetic material. The chemical mechanical polisher of this disclosure and the polishing pad component thereof can make polishing pad replacement easy, and can also save polishing pads and thus reduce the consumable cost of the chemical mechanical polishing.

Abstract: A metal polishing slurry includes a chemical solution and abrasives characterized by a bimodal or other multimodal distribution of particle sizes or a prevalence of two or more particle sizes or ranges of particle sizes. A method and system for using the slurry in a CMP polishing operation, are also provided.

Abstract: The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a cast polyurethane polymeric material formed with an isocyanate-terminated reaction product formed from a prepolymer reaction of a prepolymer polyol and a polyfunctional isocyanate. The isocyanate-terminated reaction product has 4.5 to 8.7 weight percent unreacted NCO; and the isocyanate-terminated reaction product is cured with a curative agent selected from the group comprising curative polyamines, curative polyols, curative alcoholamines and mixtures thereof. The polishing pad contains at least 0.1 volume percent filler or porosity.

Abstract: Provided is a flat-faced buffing pad that includes a plurality of apertures of variable size. The apertures are generally larger in the areas toward the center of the pad, while being generally smaller in the areas toward the periphery of the pad. Some embodiments further include apertures disposed along one or more concentric circular rings located along the front surface and generally symmetrical about the rotation axis. These configurations of apertures provide both superior cut performance and superior finish. Moreover, these configurations minimize several undesirable aspects in a polishing operation, such as slinging of the polishing compound, vibration, wobbling, and drag felt by the operator as the rotary pad slides across the surface to be polished.

Abstract: Polishing systems, subsystems and pads adapted for use in conjunction with a polisher. A relatively incompressible backing pad is configured to be attached to a drive system of the polisher. The backing pad includes at least one substantially straight backing pad edge along a perimeter thereof. A relatively compressible polishing pad is configured to be attached to the backing pad, to be driven in contact with a surface to be polished. The polishing pad includes at least one substantially straight polishing pad edge along a perimeter thereof corresponding to the at least one substantially straight backing pad edge when the polishing pad is attached to the backing pad.

Abstract: Shaped abrasive particles comprising alpha alumina and having a first side, a second side, a maximum length along a longitudinal axis and a maximum width transverse to the longitudinal axis. The first side comprising a quadrilateral having four edges and four vertices with the quadrilateral selected from the group consisting of a rhombus, a rhomboid, a kite, or a superellipse. The shaped abrasive particles having an aspect ratio of the maximum length divided by the maximum width of 1.3 or greater.

Abstract: Bonded abrasive articles and in particular organic bonded depressed center wheels with one or more reinforcements have reduced stiffness in comparison to conventional counterparts. Techniques for producing and using such wheels are described. In one example, a method for reducing the stiffness of an organically bonded abrasive wheel includes applying to a raised hub region of a reinforced depressed center wheel a force effective to irreversibly decrease the stiffness of said wheel.

Abstract: The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. Silicate-containing regions distributed within each of the polymeric microelements coat less than 50 percent of the outer surface of the polymeric microelements. Less than 0.1 weight percent total of the polymeric microelements are associated with i) silicate particles having a particle size of greater than 5 ?m; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 ?m.

Abstract: The invention is directed to a method of polishing a surface of an object that includes aluminum. The method includes the step of contacting the surface of the object with a soft polishing pad and a polishing composition. The polishing composition includes abrasive particles, an agent that oxidizes aluminum, and a liquid carrier to polish the surface of the object. The polishing composition includes the abrasive particles suspended in the liquid carrier, and is applied at a pH above about 7.

Abstract: The present invention relates to a two-component urethane resin composition for a polishing pad including a base resin containing an isocyanate group-terminated urethane prepolymer (A) and a curing agent containing an isocyanate group reactive compound (B), and characterized in that the prepolymer (A) is a prepolymer having an isocyanate group equivalent of 250 to 700 and being produced by reacting a polyisocyanate (a1) with an aromatic polyester polyol (a2) and a polyether polyol (a3) which are used as polyol components in combination at a mass ratio of (a2)/(a3)=5/95 to 70/30, and the aromatic polyester polyol (a2) has 2 to 11 aromatic rings in its molecular chain, and also relates to a polyurethane polishing pad using the resin composition and a method for producing a polyurethane polishing pad.

Abstract: A polishing pad includes a first pad portion and a second pad portion disposed therearound, and each of the first and second pad portions is replaced individually. A CMP apparatus with the polishing pad (first and second pad portions) attached thereto conducts polishing of a semiconductor wafer. The second pad portion is replaced with a replacement second pad portion when the total polishing time reaches a predetermined period of time.

Abstract: Shape memory chemical mechanical polishing pads are provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided are methods of making the shape memory chemical mechanical polishing pads and for using them to polish substrates.

Abstract: The present invention relates to a CMP polishing pad and to a method for manufacturing same, characterized in that a light-absorbing material for forming pores is dispersed in the pad. Pores formed in the CMP polishing pad of the present invention are formed by means of the breakdown of the light-absorbing material which absorbs a laser beam irradiated on the polishing pad, enabling the pore size to be controlled by controlling the amount of the light-absorbing material, the intensity of the laser beam, etc., and enabling pore distribution to be freely controlled through the computer numerical control (CNC) technique. Accordingly, a CMP polishing pad can be provided that exhibits the highest polishing effectiveness in accordance with the material to be polished or the type of slurry.

Abstract: A method of producing a brush for carrying out surface roughing, polishing, lapping, and smoothing operations comprises a first molding operation of one or more mixes including one or more moldable synthetic materials so as to obtain a base portion (6; 160) and a plurality of bristle members (3; 130, 130a, 130b) projecting from a surface (6a; 160a) of the base portion (6; 160) and including at least one abrasive material. The invention also relates to a brush tool of synthetic material including one or more abrasive grain material in the bristle members (3; 130, 130a, 130b) thereof.

Abstract: The present invention relates to a method for manufacturing a flexible abrasive disc, and to such an abrasive disc. The abrasive disc comprises a backing with an upper side and a lower side. The upper side has an abrasive agent coating for forming a surface layer. In order to form a surface layer as specifically patterned as possible, the backing of each abrasive disc is coated separately. In this manufacturing method, the abrasive agent coating on the upper side of the backing is embossed with an embossing mold specially structured and to be pressed against the backing.

Abstract: The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. Silicate-containing regions distributed within each of the polymeric microelements coat less than 50 percent of the outer surface of the polymeric microelements. Less than 0.1 weight percent total of the polymeric microelements are associated with i) silicate particles having a particle size of greater than 5 ?m; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 ?m.

Abstract: Polishing pads for use in chemical mechanical planarization (CMP) or polishing elements/surfaces of such pads are made from a combination of immiscible polymers, for example polyurethane and polyolefin. The polymers are selected on the basis of interfacial interaction, melt index and ratios of melt indices between the polymer phases—a matrix phase and a dispersed phase. By selecting the polymer system such that the two polymers are immiscible in one another and preferentially form separate domains, the dispersed phase can be removed when conditioning or polishing processes expose it. The melt index of individual polymers and the ratio of melt indices determines dispersability of a smaller phase into the matrix, hence the phase size.

Abstract: A hand held drum sander is disclosed. The sander is a self-contained power driven device having a novel method of driving and supporting the sanding drum and retaining the sanding substrate. The present invention relates to a device for the finishing of irregular shape objects by using a drum sander.

Abstract: A method for manufacturing a polishing pad, which may be laminated, with a small number of manufacturing steps, high productivity and no peeling between a polishing layer and a cushion layer includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition onto a face material, while feeding the face material; laminating another face material on the cell-dispersed urethane composition; curing the cell-dispersed urethane composition, while controlling its thickness to be uniform, so that a polishing layer including a polyurethane foam is formed; cutting the polishing layer parallel to the face into two pieces so that two long polishing layers each including the polishing layer and the face material are simultaneously formed; and cutting the long polishing layers to produce the polishing pad.

Abstract: A polishing pad capable of improving an affinity to polishing liquid and stabilizing polishing performance is provided. A polishing pad 10 is equipped with a urethane sheet 2. The urethane sheet 2 has a polishing surface P for polishing an object to be polished. The urethane sheet 2 is formed by a dry molding method and is formed by slicing a polyurethane foamed body which is obtained by reacting and curing mixed liquid in which an isocyanate-group containing compound, water, a foam control agent and a polyamine compound are mixed. Foams 3 are dispersed approximately uniformly inside the urethane sheet 2. Opened pores 4 which are opened parts of the foams 3 are formed at the polishing surface P. Inside the urethane sheet 2, the foams 3 formed adjacently to each other are communicated by communication holes 9, and the communication holes 9 are formed at a ratio of 800 holes/cm2 or more when observed from a side of the polishing surface P. Polishing liquid moves via the communication holes 9 and the foams 3.

Abstract: Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Abstract: Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Abstract: An abrasive brush includes a securing element and a plurality of abrasive filaments secured to the securing element to form a brush. Each abrasive filament includes a matrix of thermoplastic polymer and a plurality of alumina abrasive particles interspersed throughout at least a portion of the matrix. The abrasive particles comprising a polycrystalline alpha alumina having a fine crystalline microstructure characterized by an alpha alumina average domain size not greater than 500 nm. The alumina abrasive particles further include a pinning agent comprising a dispersed phase in the polycrystalline alpha alumina.

Abstract: The present invention provides: a method of polishing an object to be polished for processing a surface of the object to be polished into a concave or convex state with a high degree of accuracy; and a polishing pad. An object to be polished 20 is placed on a polishing pad 10 over the boundary between the first polishing region 11 and the second polishing region 12, the first polishing region 11 has grooves and the second polishing region 12 has grooves different from those of the first polishing region 11, and either one of the two regions being formed on a region on the center side, and the other on the outer side in a radial direction on the surface of the polishing pad; and the object to be polished 20 is polished by rotating the polishing pad 10 and the object to be polished 20.

Abstract: A buffing pad is comprised of a hub with a central opening for attaching the same to a power buffer. The pad includes a layer of tufted wool or other fibrous buffing medium spaced from but surrounding the hub and a block of material such as a cylindrical block of foam positioned between the fibrous buffing medium and the hub. The block of material includes an aperture therethrough that is in alignment with the central opening in the hub. The dimensions of the block of material are such as to prevent tufts of the fibrous buffing medium from entering the central opening of the hub and interfering with the ability of the buffing pad to be attached to the power buffer.