Abstract: Embodiments herein provide polishing pads that produce high post-polish planarity, such as on a wafer substrate or other substrates. Exemplary pads include a bulk matrix and embedded polymer particles. Pads according to embodiments herein may be used to remove material over a composite substrate, comprised of two or more different materials, or a substrate comprised of a single material.

Abstract: A chemical mechanical polishing pad used for chemical mechanical polishing comprises a polishing surface, a non-polishing surface that is provided opposite to the polishing surface, a side surface that connects an outer edge of the polishing surface and an outer edge of the non-polishing surface, and a plurality of grooves formed in the polishing surface. The side surface has a slope surface that is connected to the polishing surface, and a depth of the grooves is equal to or smaller than a height of the slope surface.

Abstract: A backing plate for a buffing pad is comprised of a substantially circular disc having first and second surfaces that are adapted to be connected to the nonworking faces of first and second buffing media to form a two-sided buffing pad. The disc has a central hub with an axial opening therein that is adapted to connect the plate to a shaft of a power buffer. The opening is essentially hexagonally shaped in that it is formed of six straight walls. The ends of adjacent walls are spaced apart from each other by circular recesses and do not directly connect to each other.

Abstract: A mix head assembly for use in the manufacture of chemical mechanical polishing pad polishing layers is provided, wherein inclusions of entrained gas inclusion defects are minimized.

Abstract: The invention pertains to a novel scraper assembly having a plurality of interchangeable scraper heads and handles and corresponding method for use. The scraper assembly further comprises a plurality of abrasive mechanisms, namely spring bristles, coiled springs, chainmail abraders and wire cloth abraders capable of effectively cleaning a surface without scoring or otherwise damaging the surface. The invention may be particularly useful for cleaning grills and ovens. Additionally, the invention may also be useful for shaping, adding texture to, stripping materials from or otherwise preparing a surface, including wood, metal or ceramic surfaces.

Abstract: The invention pertains to a novel scraper assembly having a plurality of interchangeable scraper heads and handles and corresponding method for use. The scraper assembly further comprises a plurality of abrasive mechanisms, namely spring bristles, coiled springs, chainmail abraders and wire cloth abraders capable of effectively cleaning a surface without scoring or otherwise damaging the surface. The invention may be particularly useful for cleaning grills and ovens. Additionally, the invention may also be useful for shaping, adding texture to, stripping materials from or otherwise preparing a surface, including wood, metal or ceramic surfaces.

Abstract: A system for preparing a microcellular polyurethane material, includes a froth, prepared, for instance, by inert gas frothing a urethane prepolymer, preferably an aliphatic isocyanate polyether prepolymer, in the presence of a surfactant; a filler soluble in a CMP slurry; and a curative, preferably including an aromatic diamine and a triol. To produce the microcellular material, the froth can be combined with the filler, e.g., PVP, followed by curing the resulting mixture. The microcellular material has a low rebound and can dissipate irregular energy and stabilize polishing to yield improved uniformity and less dishing. CMP pads using the microcellular material have pores created by inert gas frothing throughout the pad polymer body and additional surface pores created by dissolution of fillers during polishing, providing flexibility in surface softness and pad stiffness.

Abstract: Abrasive articles, and methods of making abrasive articles that include a supersize coating or component, such as one configured to inhibit the collection of dust and/or swarf on the abrasive coating. The supersize component can be applied to the abrasive coating after converting the abrasive article with a laser or other conversion mechanism, whether non-contact or mechanical contact. In some embodiments, no fresh or exposed abrasive or backing surfaces exist; that is, the supersize component covers all surfaces.

Abstract: The invention is directed to a method of polishing a surface of a substrate comprising aluminum, comprising contacting a surface of the substrate with a polishing pad and a polishing composition comprising an abrasive, an agent that oxidizes aluminum, and a liquid carrier, and abrading at least a portion of the surface to remove at least some aluminum from the substrate and to polish the surface of the substrate, wherein the abrasive is in particulate form and is suspended in the liquid carrier.

Abstract: A manual method and apparatus for removing scratches from automotive paint finishes by using a diamond abrasive compound applied to a handheld polishing disk/pad which effectively “scrubs” away the scratches. First, a first soft polishing pad is attached to a handgrip; second, an amount of a first diamond abrasive polishing paste is applied to the first soft polishing pad; next one manually polishes the metal trim or paint finish in situ without removing the metal trim from the vehicle by rubbing the metal trim or paint finish with the first soft polishing pad bearing the first diamond abrasive polishing paste. Thereafter, one removes the first soft pad from the hand grip and replaces it with a second soft polishing pad and applies an amount of a second diamond abrasive paste to the second soft polishing pad, the second diamond abrasive paste having a finer grit than the first diamond abrasive paste.

Abstract: The present invention relates to polishing pads, including at least 60 to 99 parts by weight of a polymer matrix (A) having 1,2-polybutadiene; and 1 to 40 parts by weight of component (B) having a copolymer having a polyether block, where the total amount of the polishing pad is 100 parts by mass, polymer matrix (A) includes 1,2-polybutadiene in an amount of at least 60 parts by weight, relative to 100 parts by mass of the polishing pad, component (B) includes the copolymer having a polyether block in an amount of at most 40 parts by weight relative to 100 parts by mass of the polishing pad, and the polishing pads have a surface resistivity of 2.6×107 to 9.9×1013?.

Abstract: A system for preparing a microcellular polyurethane material, includes a froth, prepared, for instance, by inert gas frothing a urethane prepolymer, preferably an aliphatic isocyanate polyether prepolymer, in the presence of a surfactant; a filler soluble in a CMP slurry; and a curative, preferably including an aromatic diamine and a triol. To produce the microcellular material, the froth can be combined with the filler, e.g., PVP, followed by curing the resulting mixture. The microcellular material has a low rebound and can dissipate irregular energy and stabilize polishing to yield improved uniformity and less dishing. CMP pads using the microcellular material have pores created by inert gas frothing throughout the pad polymer body and additional surface pores created by dissolution of fillers during polishing, providing flexibility in surface softness and pad stiffness.

Abstract: A method for producing a metal mask for screen printing is provided, in which dross that is deposited at the time a boring operation is conducted via a laser beam is removed, without causing warpage or bending. The method for producing a metal mask for screen printing includes steps of: forming openings in the metal plate by melting the metal plate at positions irradiated by the laser beam; and ejecting an abrasive onto the other surface of the metal plate after the openings are formed. The abrasive ejected in the abrasive ejection step is one having a predetermined flat shape (plate-shaped abrasive), so as to form a plate shape having a flat surface, or an elastically deformable abrasive, with an average grain diameter of a dispersed or carried abrasive grain being 1 mm to 0.1 ?m, and which is ejected at an incident angle of equal to or less than 80 degrees with respect to the other surface of the metal plate, and at an ejection pressure of 0.01 MPa to 0.

Abstract: An object of the invention is to provide a polishing pad that achieves a high polishing rate and has high thickness precision so that the break-in time (dummy polishing time) can be shortened, and to provide a method for producing same. The invention is directed to a polishing pad including a base material layer and a polishing layer provided on the base material layer, wherein the polishing layer includes a thermoset polyurethane foam having roughly spherical interconnected cells with an average cell diameter of 35 to 200 ?m, and the polishing layer has a storage modulus E? (40° C.) of 130 to 400 MPa at 40° C., a ratio of storage modulus E? (30° C.) at 30° C. to storage modulus E? (60° C.) at 60° C. [E?(30° C.)/E?(60° C.)] of 1 to less than 2.5, and a ratio of storage modulus E? (30° C.) at 30° C. to storage modulus E? (90° C.) at 90° C. [E?(30° C.)/E?(90° C.)] of 15 to 130.

Abstract: A flexible sanding composite in accordance with the principles of the invention includes about 10% to about 70% by weight liquid component, such as polybutene and/or oleic acid; about 30% to about 80% by weight abrasive material including calcium carbonate and aluminum oxide; and about 0% to about 5% by weight synthetic rubber. The invention also includes a method of removing dirt or contamination from a surface, or flattening surface irregularities, which includes rubbing the flexible sanding composite against the surface repeatedly until the dirt or contamination is diminished.

Abstract: A method and apparatus for releasably attaching flexible abrasive disks to a flat-surfaced platen that floats in three-point abrading contact with three rigid equal-height flat-surfaced rotatable fixed-position workpiece spindles that are mounted on a precision-flat abrading machine base where the spindle surfaces are in a common plane that is co-planar with the base surface. The three spindles are positioned to form a triangle of platen supports where the rotational-centers of each of the spindles are positioned at the center of the annular width of the platen abrading surface. Flat surfaced workpieces are attached to the spindles and the rotating floating-platen abrasive surface contacts all three rotating workpieces to perform single-sided abrading. The platen abrasive surface can be re-flattened by attaching equal-thickness abrasive disks to the three spindles that are rotated while in abrading contact with the rotating platen abrasive. There is no wear of the abrasive-disk protected platen surface.

Abstract: A polishing pad and fabricating method thereof includes a polishing pad body and at least a compressibility-aiding stripe. The compressibility-aiding stripe is buried in the polishing pad body and has a larger compressibility than that of the polishing pad body.

Abstract: A chemical mechanical polishing apparatus includes a platen configured to support and rotate a wafer, and a polishing pad facing the platen. The polishing pad includes a body having a groove with a rotational symmetric pattern.

Abstract: A carrier head that has a base assembly, a retaining ring assembly, a carrier ring, and a flexible membrane is described. The flexible membrane has a main portion and an outer annular portion, wherein a junction between the main portion and the outer annular portion comprises a peripheral edge hinge and an annular recess above the hinge along the outer wall of the outer annular portion.

Abstract: The disclosure is directed to polishing pads with floating polishing elements bonded to a support layer, for example by thermal bonding, and to methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pad includes a multiplicity of polishing elements, at least some of which may be porous, each polishing element affixed to a major surface of a support layer so as to restrict lateral movement of the polishing elements with respect to one or more of the other polishing elements, but remaining moveable in an axis substantially normal to the support layer. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer opposite the polishing elements, and optionally, a polishing composition distribution layer. In some embodiments using porous polishing elements, the pores are distributed substantially at a polishing surface of the polishing elements.

Abstract: A polishing pad is disclosed which is less likely to cause scratches, and has an excellent planarization performance and polishing stability. In one aspect, the invention provides a polishing pad comprising an ultrafine fiber-entangled body formed of ultrafine fibers having an average fineness of 0.01 to 0.8 dtex, and a polymeric elastomer. The polymeric elastomer has a glass transition temperature of ?10° C. or below, storage moduli at 23° C. and 50° C. of 90 to 900 MPa, and a water absorption ratio, when saturated with water at 50° C., of 0.2 to 5 mass %.

Abstract: A finger adhesible abrasive pad that comprises an abrasive layer, a substantially planar substrate for the abrasive layer which is made of flexible material, an adhesive layer applied to the underside of the substrate, and a peelable layer applied to the adhesive layer. The abrasive pad is attachable to a fingertip by means of the adhesive layer prior to the commencement of a sanding operation.

Abstract: Flexible, sheet-like substrates having an abrasive surface, which are obtainable by applying an aqueous solution or dispersion of at least one precondensate of a heat-curable resin to the top and/or bottom of a flexible, sheet-like substrate in an amount in the range from 0.1 to 90% by weight, based on the uncoated, dry substrate, crosslinking the precondensate and drying the treated substrate, wherein the aqueous solution or dispersion of at least one precondensate of a heat-curable resin comprises (i) a polymeric thickener selected from the group consisting of biopolymers, associative thickeners and wholly synthetic thickeners in an amount ranging from 0.01% by weight to 10% by weight and optionally (ii) a curative that catalyzes further condensation of the heat-curable resin at from about 60° C.

Abstract: A drywall sander includes a replaceable sanding pad having a layer of resilient material, and an abrasive surface. The sanding pad includes one or more edge portions that project beyond the edges of a sander head. The edges of the sanding pad can be deformed during use when the sander is used in a corner or the like to thereby prevent scuffing or other damage to adjacent orthogonal surfaces.

Abstract: A method for manufacturing chemical mechanical polishing pad polishing layers that minimizes entrained gas inclusion defects is provided. Also provided is a mix head assembly for use in the manufacture of chemical mechanical polishing pad polishing layers, wherein inclusions of entrained gas inclusion defects are minimized.

Abstract: Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first opening in the top surface and a second opening in the bottom surface. The top surface is a polishing surface. The pad includes a window that includes a first portion made of soft plastic and a crystalline or glass like second portion. The window is transparent to white light. The window is situated in the aperture so that the first portion plugs the aperture and the second portion is on a bottom side of the first portion, wherein the first portion acts a slurry-tight barrier.

Abstract: A tool for polishing optical surfaces including a rigid base having a spherical surface which carries a resilient cushion with a polishing face. The diameter of the rigid base is between 50 and 65 mm, the radius of curvature of the spherical surface is between 54 and 60 mm, the thickness of the resilient cushion is between 13 and 16 mm and the resistance to compression of the resilient cushion is substantially between 0.08 and 0.15 bar at 10% compression and substantially between 0.55 and 0.8 bar at 70% compression. The tool can be used for polishing an optical surface, particularly an ophthalmic lens, and more particularly a free-form lens.

Abstract: A tool for removing fusion bonded epoxy coating from the surface of a pipe has an elongate rotatable shaft suitable for being received in a rotating tool holder of a machine. Extending radially outward of the distal end of the shaft are a plurality of fingers, the outer ends of which are spaced apart. Each of the fingers is made of a spring metal, and at the distal end of each finger is an abrasive pad having diamond particles embedded in soft metal. Spring force is independently applied by each spring finger to its associated abrasive pad.

Abstract: The SCF in its design and function provides the user with the ability to efficiently achieve an attractive and functional finish when caulking. The SCF's ability to be used to clean, paint trim, and sand add to its value of ownership.

Abstract: A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side). A method for manufacturing a semiconductor device includes a process of polishing the surface of a semiconductor wafer with this polishing pad. The polishing pad has a polishing layer containing a polishing region and a light-transmitting region, wherein the light-transmitting region includes a polyurethane resin having an aromatic ring density of 2 wt % or less, and the light transmittance of the light-transmitting region is 30% or more in the overall range of wavelengths of 300 to 400 nm.

Abstract: There are provided a polishing pad which exhibits excellent polishing stability and excellent slurry retainability during polishing and even after dressing, can prevent a reduction in polishing rate effectively and is also excellent in an ability to flatten an substrate to be polished, and a method for producing the polishing pad. The method comprises dispersing water-soluble particles such as ?-cyclodextrin into a crosslinking agent such as a polypropylene glycol so as to obtain a dispersion, mixing the dispersion with a polyisocyanate such as 4,4?-diphenylmethane diisocyanate and/or an isocyanate terminated urethane prepolymer, and reacting the mixed solution so as to obtain a polishing pad having the water-soluble particles dispersed in the matrix.

Abstract: A polishing pad assembly for a chemical mechanical polishing apparatus includes a polishing pad having a polishing surface and a surface opposite the polishing surface for attachment to a platen, and a solid light-transmissive window formed in the polishing pad. The light-transmissive window is more transmissive to light than the polishing pad. The light-transmissive window has a light-diffusing bottom surface.

Abstract: An adhesive sheet comprising a sheetlike base material and, superimposed on one major surface thereof, an adhesive layer, wherein the average surface roughness on one major surface of the base material is in the range of 0.1 to 3.5 ?m and on the other major surface thereof is in the range of 0.05 to 0.7 ?m. In this structure, the average surface roughness values on both the major surfaces of the base material as a constituent of the adhesive sheet are regulated so as to fall within respective specified ranges, so that not only can any blocking occurring in backwinding of reeled adhesive sheet be inhibited but also any occurrence of minute unevenness (waving) on the wafer surface after grinding can be inhibited, and further that the transparency of the adhesive sheet can be maintained.

Abstract: Embodiments of the present invention generally relate to an improved sanding apparatus for minimizing scoring of drywall and other sensitive finishes. In one embodiment of the present invention, a sanding apparatus comprises a flexible, resilient core having a top and bottom sanding surface, a first and second side sanding surface, and a first and second non-sanding surface, each disposed at an angle with respect to the top sanding surface and bottom sanding surface, respectively, and an abrasive aggregate composition disposed on the top sanding surface, bottom sanding surface and the first and second side sanding surfaces, wherein each of the first and second non-sanding surfaces are free of an abrasive aggregate composition.

Abstract: A rotary tool for surface machining has a disk having an elastomeric outer periphery, an array of angularly spaced elastomeric teeth projecting radially and each having a formation forming a hinge so that the tooth can flex at the hinge.

Abstract: A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conductive portions of a substrate by controlling an electrical bias profile across a processing area, thereby controlling processing rates between two or more conductive portions of the substrate.

Abstract: A multi-layer surface treating pad is disclosed. It has an upper layer suitable to serve as one part of a hook/loop type fastener system, a bottom layer which comprises an abrasive or polishing material, and a cleaning or other surface treating formulation positioned between the upper and bottom layer in the form of a bump which is positioned mostly in a central region of the pad. The bump of the formulation causes the upper layer to bulge upwardly so as to provide a visual indication as to where one optimally should attach a motorized device thereto.

Abstract: Composition, apparatus, and methods of composition and apparatus manufacture, for sharpening a paper shredder blade. Composition includes grinding powder, thickening agent, and additive. The thickening agent may be a white oil, an animal oil, an vegetable oil, or a stearine wax. The additive may be an antirust powder, an antiwear powder, an antistatic powder, or an antioxidation powder. The grinding composition is dispensed into a polyethylene film, and sealed to form the grinding apparatus, as a grinding sheet or a grinding packet. A method for forming a grinding sheet includes selecting the constituent materials for a grinding composition; stirring the constituent grinding composition materials; heating the constituent materials to melting; mixing the constituent materials, while melting and intermixing; cooling and packaging the grinding composition to form a grinding sheet or packet.

Abstract: A grinding composition for sharpening shredder blades of a shredder includes, based on total weight of the grinding composition, from 51 to 65 wt % of a grinding powder; from 5 to 35 wt % of a viscous grease agent; and from 3 to 30 wt % of at least one functional additive. A grinding sheet formed from the composition is used as a grinding product alone or in a bag. The composition is sealed in a bag and used as a grinding product. A process for manufacturing the latter grinding product employs an automatic form-fill-seal packaging machine. The shredder blades of a paper shredder are sharpened satisfactorily by the grinding composition as the grinding sheet or grinding product is shredded. The useful life of shredders is cost effectively extended while providing convenience in use that saves time and labor.

Abstract: A polishing pad may include a base and a plurality of polishing protrusions on a surface of the base. Each polishing protrusion may include a sidewall defining an opening in a surface of the polishing protrusion opposite the base. In addition, portions of the sidewall opposite the base may define a contact surface.

Abstract: An electrodeposited wire tool has a core wire extending in a longitudinal direction, a plating layer provided on an outer peripheral surface of the core wire, superabrasive grains held by the plating layer and coating layers covering the outer peripheral surfaces of the superabrasive grains. The coating layers are constituted of electroless Ni—P platings. The coating layers are heat-treated, and the electroless Ni—P platings are partially or entirely crystallized.

Abstract: A polishing cloth used in the chemical mechanical polishing treatment comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g.

Abstract: The present invention provides a polishing pad. The polishing pad comprises a transparent part and a high molecular weight layer. The transparent part has an uneven side surface and the profile of the uneven side surface is selected from a group consisting of a serrated shape, a wavy shape and a toothed shape. The high molecular weight layer encircles the transparent part.

Abstract: A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side) and is capable of preventing a slurry from leaking from the boundary between a polishing region and a light-transmitting region. The polishing pad includes at least a transparent support film laminated on one side of a polishing layer including a polishing region and a light-transmitting region; the light transmittance of an optical detection region containing at least the light-transmitting region and the transparent support film is 40% or more in the overall range of wavelengths of 300 to 400 nm.

Abstract: A semiconductor wafer is polished, wherein in a first step, the rear side of the wafer is polished by a polishing pad comprising fixedly bonded abrasives having a grain size of 0.1-1.0 ?m, while supplying a polishing agent free of solid materials having a pH of at least 11.8, and, in a second step, the front side of the semiconductor wafer is polished, wherein a polishing agent having a pH of less than 11.8 is supplied. A polishing pad for use in apparatuses for polishing semiconductor wafers, has a layer containing abrasives, a layer composed of a stiff plastic and also a compliant, non-woven layer, wherein the layers are bonded to one another by means of pressure-sensitive adhesive layers.

Abstract: A buffing pad primarily for automobiles includes a foam layer and filaments of textile material interspersed throughout the foam layer and extending passed or exposed at the working surface of the pad. The filaments are needle punched through the foam layer. The filaments may be felt fiber such as wool fiber, cotton fiber, or the like.

Abstract: Provided is a polyurethane polishing pad. More specifically, the present invention provides a polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer with a polyurethane matrix via radical polymerization and having no pores and gas bubbles. The polyurethane polishing pad having an interpenetrating network structure of a vinyl polymer exhibits uniform dispersibility and reduced changes in hardness of the urethane pad due to heat and slurry, thereby resulting in no deterioration of polishing efficiency due to abrasion heat and solubility in the slurry upon polishing, and also enables a high-temperature polishing operation. Further, according to the present invention, the interpenetrating network structure leads to an improved polishing rate and abrasion performance, thereby significantly increasing the service life of the polishing pad.

Abstract: The invention concerns a sanding element with a succession of overlapping lamellas (3, 4) comprising sanding grains (9), characterized in that these lamellas (3, 4) are alternately formed of sanding lamellas (3) and compressible lamellas (4), whereby each sanding lamella (3) rests on a compressible lamella (4).

Abstract: The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a plurality of polishing elements (402, 502, 602, 702). The polishing elements (402, 502, 602, 702) are aligned in a vertical direction and having a first and a second end. A plurality of junctions (404, 510, 610, 710) connects the first and second ends of the polishing elements (402, 502, 602, 702) with at least three polishing elements at each of the plurality of junctions (404, 510, 610, 710) for forming a tier. Each tier representing a thickness in the vertical direction between the first and second ends of the polishing elements (402, 502, 602, 702). And an interconnected lattice structure (400, 600) forms from connecting sequential tiers of the plurality of junctions (404, 504) that connect the polishing elements (402, 502, 602, 702).

Abstract: The surface(s) of a polishing pad for polishing an object has a first portion including hydrophilic material and a second portion including hydrophobic material. The first portion of the polishing surface is located in a first region of the polishing pad and the second portion of the polishing surface is located in a second region of the polishing pad juxtaposed with the first region in the radial direction of the pad. The hydrophilic material may be a polymer resin that contains hydrophilic functional groups having OH and/or ?O at bonding sites of the polymer. The hydrophobic material may be a polymer resin that contains hydrophobic functional groups having H and/or F at bonding sites of the polymer. The polishing pad is manufactured by extruding respective lines of the hydrophilic and hydrophobic materials. The extruders and a backing are moved relative to each other such that the lines form concentric rings of the hydrophilic and hydrophobic materials.