Physical Configuration Of Semiconductor (e.g., Mesa, Bevel, Groove, Etc.) Patents (Class 257/618)
- With low resistance ohmic connection means along exposed mesa edge (e.g., contact or heavily doped region along exposed mesa to reduce "skin effect" losses in microwave diode) (Class 257/624)
- Semiconductor body including mesa is intimately bonded to thick electrical and/or thermal conductor member of larger lateral extent than semiconductor body (e.g., "plated heat sink" microwave diode) (Class 257/625)
- Combined with passivating coating (Class 257/626)