Electromagnet, Transformer Or Inductor Patents (Class 29/602.1)
  • Patent number: 9799721
    Abstract: A method of forming a semiconductor device includes forming a lower coil segment in a first dielectric layer over a substrate, forming a second dielectric layer over the lower coil segment and the first dielectric layer, anisotropically etching a top portion of the second dielectric layer to form an opening over the lower coil segment, depositing magnetic material in the opening to form a magnetic core, forming a third dielectric layer over the magnetic core and the second dielectric layer, forming vias extending through the second dielectric layer and the third dielectric layer, and after forming the vias, forming an upper coil segment over the third dielectric layer and the magnetic core, wherein the vias connect the upper coil segment with the lower coil segment.
    Type: Grant
    Filed: April 17, 2015
    Date of Patent: October 24, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Tsung Kuo, Jiech-Fun Lu, Yen-Shuo Su
  • Patent number: 9779869
    Abstract: An integrated circuit transformer structure includes at least two conductor groups stacked in parallel in different layers. A first spiral track is formed in the at least two conductor groups, the first spiral track included first turns of a first radius within each of the at least two conductor groups, and second turns of a second radius within each of the at least two conductor groups, the first and second turns being electrically connected. A second spiral track is formed in the at least two conductor groups, the second spiral track including third turns of a third radius within each of the at least two conductor groups and disposed in a same plane between the first and second turns in each of the at least two conductor groups.
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: October 3, 2017
    Assignee: International Business Machines Corporation
    Inventors: Robert L. Barry, Robert A. Groves, Venkata Nr. Vanukuru
  • Patent number: 9767953
    Abstract: A common mode filter, comprising a winding core, and said winding core further includes a U-type heave portion, said U-type heave portion divides said winding core into a first winding portion, a second winding portion and a cross winding portion; the first winding wires, are wound on said first winding portion, said cross winding portion and said second winding portion in sequence; and the second winding wires, are wound on said first winding portion, said cross winding portion and said second winding portion in sequence. As a result, the common mode filter not only can reduce the effects of the existence capacitors of in high-frequency layers and the inherent functionality of parasitic capacitors in common mode filters with higher frequency characteristics, but also the overall structure is simple, fast assembly and easy operation.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: September 19, 2017
    Inventors: Liang-Fang Fan, Ming-Chien Hsiao, Tang-Kang Chen
  • Patent number: 9728319
    Abstract: There is to provide a coil part capable of reducing the number of fastening means such as screws and so on required when attaching it to a substrate. A coil part includes a transformer unit and a reactor unit, wherein the transformer unit includes: a primary winding part formed by winding a flat wire around a primary side hollow part; secondary winding parts, the secondary winding part being formed by winding a flat wire around a secondary side hollow part communicating with the primary side hollow part, arranged in pairs in a state of facing one side and another side of the primary winding part respectively; and a first core inserted into the primary side hollow part and the secondary side hollow part, and the reactor unit includes: a reactor winding part formed by extending one terminal side of the flat wire constituting the secondary winding part and winding the flat wire around a reactor side hollow part; and a second core inserted into the reactor side hollow part.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: August 8, 2017
    Inventors: Hiroshi Kawashima, Jun Muto, Takahiro Hirano
  • Patent number: 9712209
    Abstract: A planar spiral induction coil includes a strip-shaped coil having at least one turn. The at least one turn has a width that changes as a distance from a beginning of the strip-shaped coil increases in a length direction of the strip-shaped coil. Each turn of the at least one turn has a respective width that causes an equal current to flow through each turn of the at least one turn.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: July 18, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki Young Kim, Mikhail Makurin, Vladimir Parfenyev, Nikolay Olyunin, Keum Su Song
  • Patent number: 9705293
    Abstract: The invention relates to a corona ignition device, comprising a center electrode, an insulator surrounding the center electrode, a coil, which is connected to the center electrode, and a housing pipe, in which the coil is arranged. The housing pipe comprises a substrate layer and a conducting layer arranged radially inwardly of the substrate layer. The conducting layer is made of a material having a greater electrical conductivity than the material of the substrate layer. The conducting layer has a thickness of at least 0.1 mm. Also disclosed is a method for producing a corona ignition device, in which, to produce the housing pipe, an inner pipe is inserted into an outer pipe. The invention also relates to a corona ignition device of which the coil is surrounded by a soft-magnetic shielding.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: July 11, 2017
    Inventors: Tom Achtstätter, Timo Stifel, Felizitas Heilmann, Ganghua Ruan, Gerd Bräuchle
  • Patent number: 9696349
    Abstract: A detecting unit is presented. The detecting unit includes a flexible circuit having a first side and a second side opposite the first side. The flexible circuit includes a plurality of cells defined therein, each of the plurality of cells having a first side and a second side respectively corresponding to the first side and the second side of the flexible circuit. Moreover, the flexible circuit includes a plurality of conductive windings disposed on at least one of the first and second sides of the plurality of cells. Further, the flexible circuit includes a stress reduction feature between each of the plurality of cells. Also, the detecting unit includes a sealing element configured to secure the flexible circuit in a stacked configuration. A sensing system and a method of making a detecting unit are also presented.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: July 4, 2017
    Assignee: General Electric Company
    Inventors: Ruxi Wang, William Edward Burdick, Jr., Satish Prabhakaran, Raymond John Nicholas
  • Patent number: 9677523
    Abstract: A fuel injector includes an injection control valve having a stator core that is electrically isolated from surrounding parts such as a stator housing. The stator core includes a first annulated wall having an inner surface, a second annulated wall having an outer surface, a radially extending wall connecting the first and second annulated wall, and a radially extending slot extending through the first annulated wall, the radially extending wall, and the second annulated wall. The stator core may include a limited number of contact points with the stator housing. Alternatively or additionally, an electrically insulating material may be placed between the stator core and the stator housing.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: June 13, 2017
    Assignee: CUMMINS INC.
    Inventors: Edward B. Manring, Donald J. Benson, Martin W. Long, Michael W. Lucas
  • Patent number: 9671256
    Abstract: A proximity sensor includes a body, a coil, a cap being cylindrical and having a bottom, a hollow housing, and a ring-shaped sealing member. The body includes the coil bobbin at a first end. The coil is wound around the coil bobbin. The cap is to be placed to a body so as to cover a coil bobbin. The housing includes, at a fist end, a circular-cylinder portion having an opening. The housing is to be placed to the body in such a manner that the cap protrudes from the opening. The sealing member is disposed between the outer peripheral surface of the cap and the inner peripheral surface of the circular-cylinder portion of the housing.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: June 6, 2017
    Inventors: Takashi Suma, Yukinori Fujikawa, Nozomu Sakurai
  • Patent number: 9659705
    Abstract: A method of producing a surface-mount inductor including an external electrode having high fixing strength with respect to an element body even in a high-humidity environment. The method includes the steps of: winding an electrically-conductive wire to form a coil; forming a core using a sealant primarily containing a metal magnetic powder and a resin in such a manner as to encapsulate the coil in the sealant while allowing each of opposite ends of the coil to be at least partially exposed on a surface of the core; reducing smoothness of a surface of at least a part of a portion of the core on which an external electrode is formed as compared to a surface therearound; and forming the external electrode on the core in such a manner as to be electrically conducted with the coil.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: May 23, 2017
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Keita Muneuchi, Masaaki Totsuka, Chitoshi Sakai, Kunio Sasamori
  • Patent number: 9640604
    Abstract: An integrated circuit has a semiconductor die provided in a first IC layer and an inductor fabricated on a second IC layer. The inductor may have a winding and a magnetic core, which are oriented to conduct magnetic flux in a direction parallel to a surface of a semiconductor die. The semiconductor die may have active circuit components fabricated in a first layer of the die, provided under the inductor layer. The integrated circuit may include a flux conductor provided on a side of the die opposite the first layer. PCB connections to active elements on the semiconductor die may progress through the inductor layer as necessary.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: May 2, 2017
    Assignee: Analog Devices, Inc.
    Inventor: Baoxing Chen
  • Patent number: 9640602
    Abstract: A semiconductor device includes a first coil that is monolithically integrated in a first portion of a semiconductor body and that includes a first winding wrapping around a first core structure. A second coil is monolithically integrated in a second portion of the semiconductor body and includes a second winding wrapping around the second core structure. The first and second coils are magnetically coupled with each other. An insulator frame in the semiconductor body surrounds the first portion and excludes the second portion. High dielectric strength between the first and the second coils is achieved without patterning a backside metallization for connecting the turns of the windings and without being restricted to thin substrates.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: May 2, 2017
    Assignee: Infineon Technologies Austria AG
    Inventors: Joachim Weyers, Kevni Bueyuektas, Franz Hirler, Anton Mauder
  • Patent number: 9601933
    Abstract: A system for inductive power transmission includes at least one interface surface and a plurality of triangular coil elements positioned underneath the interface surface such that at least one edge of the respective triangular coil element is adjacent to an edge of at least one other of the triangular coil elements. Each of the triangular coil elements may be operable to inductively transmit power to at least one coil of at least one electronic device and/or inductively receive power from the coil of the electronic device. Each triangular coil element may be operable to detect the proximity of one or more inductive coils of one or more electronic devices and inductively transmit power upon such detection at different frequencies, power levels, and/or other inductive power transmission characteristics.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: March 21, 2017
    Assignee: Apple Inc.
    Inventor: Christopher S. Graham
  • Patent number: 9588081
    Abstract: An ion filter and a method of manufacturing an ion filter. The method including providing a monolithic structure; selectively removing regions of the structure, to form a pair of electrodes defining at least one ion channel therebetween. The electrodes are preferably mechanically connected at one or more locations by a portion of the structure; wherein the connecting portion of the structure provides a higher electrical impedance than the filter would provide without such a mechanical connection, to thereby electrically separate the electrodes.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: March 7, 2017
    Assignee: Ownstone Medical Limited
    Inventors: Matthew Hart, Andrew H. Koehl
  • Patent number: 9576718
    Abstract: An inductor structure includes a first set of traces corresponding to a first layer of an inductor, a second set of traces corresponding to a second layer of the inductor, and a third set of traces corresponding to a third layer of the inductor that is positioned between the first layer and the second layer. The first set of traces includes a first trace and a second trace that is parallel to the first trace. A dimension of the first trace is different from a corresponding dimension of the second trace. The second set of traces is coupled to the first set of traces. The second set of traces includes a third trace that is coupled to the first trace and to the second trace. The third set of traces is coupled to the first set of traces.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: February 21, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Uei-Ming Jow, Young Kyu Song, Jong-Hoon Lee, Jung Ho Yoon, Sangjo Choi, Xiaonan Zhang
  • Patent number: 9548151
    Abstract: A magnetic field generator (G1) for a magnetocaloric thermal device which comprises first (SM11) and second (SM21) identical magnetizing structures mounted head-to-tail, on either side of a central plane (P) and defining two air gaps (E1, E2). Each magnetizing structure (SMM11, SM12) comprises first (AM1) and second (AM2) magnetizing assemblies, whose induction vectors are oriented in opposite directions, and mounted on a support (SUP1). Each magnetizing assembly (AM1, AM2) has a permanent magnet structure (API, APC) which comprises a passive side (FP1, FP2) and an active side (FA1, FA2), delimiting the air gaps (E1, E2). The induction vectors of the first (AM1, AM19) and the second (AM2, AM29) magnetizing assemblies, form inside the generator, a single circulation loop of a magnetic field through the supports (SUP1) and the air gaps (E1, E2, E3, E4).
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: January 17, 2017
    Assignee: Cooltech Applications S.A.S.
    Inventor: Christian Muller
  • Patent number: 9521751
    Abstract: A substrate package includes a woven fabric having electrically non-conductive strands woven between electrically conductive strands including wire strands, co-axial strands, and/or an inductor pattern of strands. The package may be formed by an inexpensive and high throughput process that first weaves the non-conductive strands (e.g., glass) between the conductive strands to form a circuit board pattern of conductive strands in a woven fabric. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planarized. Planarizing segments and exposes ends of the wire, co-axial, and inductor pattern strands. Since the conductive strands were formed integrally within the planarized woven fabric, the substrate has a high mechanical stability and provides conductor strand based electrical components built in situ in the substrate package.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: December 13, 2016
    Assignee: Intel Corporation
    Inventors: Mihir K. Roy, Mathew J. Manusharow
  • Patent number: 9514878
    Abstract: A coil includes a coil unit provided with a wire and a self-melting layer formed on surfaces of the wire, and a resin member affixed to the wire. The wire is adhered and affixed to the resin member by the self-melting layer.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: December 6, 2016
    Assignee: TAMURA Corporation
    Inventors: Ryo Nakatsu, Toshikazu Ninomiya, Kensuke Maeno, Masashi Yamada, Ryotaro Tanaka
  • Patent number: 9481037
    Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
    Type: Grant
    Filed: October 7, 2014
    Date of Patent: November 1, 2016
    Assignee: CYNTEC Co., Ltd.
    Inventors: Wen-Hsiung Liao, Roger Hsieh, Hideo Ikuta, Yueh-Lang Chen
  • Patent number: 9460844
    Abstract: A planar intrinsically safe transducer having a vertical extension and a horizontal extension having a layer structure with a plurality of circuits, wherein a first circuit and a second circuit are galvanically isolated from one another. Further, the transducer has a magnetic core 4, which at least partially encompasses the layer structure and acts at least on the first circuit and on the second circuit, wherein the first circuit and the second circuit lie in one plane and form a layer of the layer structure.
    Type: Grant
    Filed: February 18, 2013
    Date of Patent: October 4, 2016
    Assignee: Phoenix Contact GmbH & Co. KG
    Inventor: Peter-Dominik Scholz
  • Patent number: 9368270
    Abstract: A planar transformer assembly, for use in charging capacitors of an ICD, includes windings arranged to minimize voltage across intervening dielectric layers. Each secondary winding of a preferred plurality of secondary windings is arranged relative to a primary winding, in a hierarchical fashion, such that the DC voltage, with respect to ground, of a first secondary winding, of the plurality of secondary windings, is lower than that of a second secondary winding, with respect to ground, wherein the first secondary winding is in closest proximity to the primary winding. The primary winding and each secondary winding are preferably formed on a corresponding plurality of dielectric layers.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: June 14, 2016
    Assignee: Medtronic, Inc.
    Inventor: Mark R Boone
  • Patent number: 9355769
    Abstract: A method in accordance with an embodiment comprises forming a feature on a substrate, disposing a first conductive pattern on the substrate and the feature, disposing a permeability material within the feature, disposing a substrate material on the substrate and the feature to facilitate substantial enclosure of the permeability material between the substrate and the substrate material, and disposing a second conductive pattern on the substrate material. The first conductive pattern and the second conductive pattern define at least one electrical circuit operable for coupling to a current source so as to cooperate to be capable of facilitating a magnetic field about the permeability material.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: May 31, 2016
    Inventor: James E. Quilici
  • Patent number: 9330827
    Abstract: A process of making inductors for integrated circuit packages may involve forming an inductor upon a magnetic film on a package substrate. Conductors coupled either to a die or a voltage converter extend perpendicularly through the film to conductive plates, defining current paths through and across the film.
    Type: Grant
    Filed: February 14, 2011
    Date of Patent: May 3, 2016
    Assignee: Intel Corporation
    Inventors: Donald Gardner, Gerhard Schrom, Fabrice Paillet, Shamala Chickamenahalli
  • Patent number: 9312059
    Abstract: An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. In a variant, mixed mode coupling techniques are utilized in order to extend the underlying operating bandwidth of the substrate inductive device. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: April 12, 2016
    Inventors: Thuyen Dinh, Mohammad Saboori, Mark Greene, Hamlet Abedmamoore
  • Patent number: 9287344
    Abstract: Providing for a monolithic magnetic induction device having low DC resistance and small surface area is described herein. By way of example, the magnetic induction device can comprise a substrate (e.g., a semiconductor substrate) having trenches formed in a bottom layer of the substrate, and holes formed in the substrate between the trenches and an upper layer of the substrate. Additionally, the magnetic induction device can comprise a conductive coil embedded or deposited within the trenches. The magnetic induction device can further comprise a set of conductive vias formed in the holes that electrically connect the bottom layer of the substrate with the upper layer. Further, one or more integrated circuit components, such as active devices, can be formed in the upper layer, at least in part above the conductive coil. The vias can be utilized to connect to integrated circuit components with the conductive coil, where suitable.
    Type: Grant
    Filed: August 23, 2011
    Date of Patent: March 15, 2016
    Inventors: Johnny Kin On Sin, Rongxiang Wu, Ron Shu Yuen Hui
  • Patent number: 9287034
    Abstract: A printed wiring board has a core base having an opening portion, an inductor component accommodated in the opening portion, and a filler resin filling gap between the component and a side wall of the opening portion. The component has a support layer, a first conductive pattern on the support, an interlayer insulation layer on the support and first pattern, a second conductive pattern on the insulation layer, and a via conductor in the insulation layer and connecting the first and second patterns, the insulation layer includes a magnetic layer and a resin layer covering the magnetic layer, the magnetic layer includes magnetic material and resin material and has a first hole, the insulation layer has a second hole penetrating through the resin layer such that the second hole passes through the first hole and extends to the first pattern, and the via conductor is formed in the second hole.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: March 15, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Yasuhiko Mano, Kazuhiro Yoshikawa, Takashi Kariya
  • Patent number: 9275780
    Abstract: A method for manufacturing a coil for generating an intense magnetic field when an electric current passes through it. Turns are formed in a cylindrical tube made of conducting or superconducting material. At least one indentation is formed in an edge of at least one turn. Insulating material is positioned between the turn including the indentation and an adjacent turn. The recess forms with the insulating material a channel between the interior and the exterior of the tube when the coil is stressed.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: March 1, 2016
    Inventors: Francois Debray, Jean Dumas, Rolf Pfister, Christophe Trophime, Jean-Marc Tudela, Nadine Vidal
  • Patent number: 9227858
    Abstract: An electrical purification apparatus and methods of making same are disclosed. The electrical purification apparatus may provide for increases in operation efficiencies, for example, with respect to current efficiencies and membrane utilization.
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: January 5, 2016
    Assignee: Evoqua Water Technologies Pte Ltd.
    Inventors: Li-Shiang Liang, Joseph D. Gifford, John K. Chan, Lawrence J. Salvo
  • Patent number: 9214917
    Abstract: A stack type common mode filter (CMF) for high frequency may improve high frequency characteristics, like removing an impedance difference between terminals by not overlapping terminal portions of multiple stack structures with upper and lower magnetic substances, and removing noise in a common mode and removing a signal distortion in a differential mode by removing an unnecessary parasitic impedance from terminal portions, and thus the stack type CMF for high frequency may be applicable at a high frequency compared to a conventional CMF.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: December 15, 2015
    Assignees: Joinset Co., Ltd.
    Inventor: Sun-Ki Kim
  • Patent number: 9190318
    Abstract: A method including forming a first dielectric layer above a conductive pad and above a metallic structure, the conductive pad and the metallic structure are each located within an interconnect level above a substrate, forming a first opening and a second opening in the first dielectric layer, the first opening is aligned with and exposes the conductive pad and the second opening is aligned with and exposes the metallic structure, and forming a metallic liner on the conductive pad, on the metallic structure, and above the first dielectric layer. The method may further include forming a second dielectric layer above the metallic liner, and forming a third dielectric layer above the second dielectric layer, the third dielectric layer is thicker than either the first dielectric layer or the second dielectric layer.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: November 17, 2015
    Inventors: Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter
  • Patent number: 9177713
    Abstract: There is provided a winding structure, a coil winding, a coil part, and a coil winding manufacturing method, which are capable of preventing occurrence of an extra space due to existence of a connecting wire part when two winding parts and a connecting wire part connecting the winding parts are formed.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: November 3, 2015
    Inventor: Hiroshi Kawashima
  • Patent number: 9177712
    Abstract: A transformer includes a first planar coil having two input ends, with a distance being between the two input ends; and a second planar coil, having two output ends. The two input ends correspond to two points on relative positions of the second planar coil, and a coil path distance of the two points on the second planar coil is equal to the distance.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: November 3, 2015
    Assignee: MStar Semiconductor, Inc.
    Inventor: Min-Chiao Chen
  • Patent number: 9093208
    Abstract: A magnetic field generator (1) comprising first (2) and second (3) identical magnetizing structures mounted opposite and parallel to one another, head-to-tail, and defining at least two air gaps (42, 43). Each magnetizing structure (2) comprises first (4) and second (5) diametrically opposite structurally identical magnetizing assemblies which are arranged on either end of a ferromagnetic central part (6). Each magnetizing assembly (4, 5) comprises a polygonal, uniformly magnetized central magnet (7, 14) and laterally surrounded by a uniformly magnetized magnetic belt (13, 20). The magnetic flux, generated by the generator (1), forms a single loop concentrated through the air gaps (42, 43).
    Type: Grant
    Filed: February 21, 2013
    Date of Patent: July 28, 2015
    Assignee: Cooltech Applications, S.A.S.
    Inventors: Christian Muller, Magali Chaussin
  • Patent number: 9053853
    Abstract: Embodiments of the present invention relate to a method of forming a magnetics package. The method includes providing a primary coil configured to conduct a current flow; providing a substrate having a surface and a secondary coil extending from the surface, the secondary coil configured to conduct a current flow; encapsulating the secondary coil in a secondary mold compound; removing the substrate from the secondary coil, thereby leaving the secondary coil embedded in the secondary mold compound; and inductively coupling the secondary coil to the primary coil through a magnetic core, the secondary coil is electrically isolated from the primary coil, wherein a current flow in the primary coil produces a magnetic field in the magnetic core, and the magnetic field in the magnetic core induces a current flow in the secondary coil.
    Type: Grant
    Filed: November 23, 2012
    Date of Patent: June 9, 2015
    Assignee: Flextronics AP, LLC
    Inventor: Rajeev Joshi
  • Publication number: 20150145635
    Abstract: A wireless charging coil is provided herein. More specifically, provided herein is a wireless charging coil comprising a first stamped coil having a first spiral trace, the first spiral trace defining a first space between windings, and a second stamped coil having a second spiral trace, the second spiral trace defining a second space between windings, the first stamped coil and second stamped coil in co-planar relation, the first stamped coil positioned within the second space of the second stamped coil, and the second stamped coil positioned within the first space of the first stamped coil, the first and second coils electronically connected and an adhesive covering and surrounding the first stamped coil and the second stamped coil to bond the coils together and to insulate the coils.
    Type: Application
    Filed: November 25, 2014
    Publication date: May 28, 2015
    Applicant: A.K. Stamping Company, Inc.
    Inventors: Arthur Kurz, Bernard Duetsch, Joshua Kurz
  • Patent number: 9042106
    Abstract: Disclosed herein is a thin film type chip device, including: a plurality of unit circuit structures laminated on a substrate; and an adhesive layer adhering the unit circuit structures to each other.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: May 26, 2015
    Inventors: Geon Se Chang, Sung Kwon Wi, Yong Suk Kim
  • Patent number: 9041505
    Abstract: In accordance with an embodiment, a transformer includes a first coil disposed in a first conductive layer on a first side of a first dielectric layer, and a second coil disposed in a second conductive layer on a second side of the first dielectric layer. Each coil has a first end disposed inside its respective coil and a second end disposed at an outer perimeter of its respective coil. A first crossover disposed in the second conductive layer is directly connected to the first end of the first coil and extends past the outer perimeter of the first coil. In addition, a second crossover disposed in the first conductive layer is directly connected to the first end of the second coil and extends past the outer perimeter of the second coil.
    Type: Grant
    Filed: September 11, 2013
    Date of Patent: May 26, 2015
    Assignee: Infineon Technologies AG
    Inventors: Gottfried Beer, Urs Elrod, Christiane Brunner, Thomas Kilger
  • Patent number: 9038263
    Abstract: Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: May 26, 2015
    Assignee: Delaware Capital Formation, Inc.
    Inventors: Derek Wayne Puccio, Errol P. EerNisse
  • Publication number: 20150141811
    Abstract: A field generator for use in a surgical targeting system is disclosed. The field generator includes a mounting structure including elements that are configured to receive components of an electromagnetic field generator. The elements are disposed on the mounting structure at locations and orientations relative to each other. The field generator includes at least one covering formed over the mounting structure, wherein, in use, the locations and orientations of the elements relative to each other remain substantially unaltered after exposure to one or more sterilization processes.
    Type: Application
    Filed: December 23, 2014
    Publication date: May 21, 2015
    Applicant: SMITH & NEPHEW, INC.
    Inventors: Nicholas S. Ritchey, Hoa La Wilhelm, Nathaniel Kelley Grusin
  • Publication number: 20150137931
    Abstract: A printed wiring board includes an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding a circumference of the magnetic core structure. The magnetic core structure and the inductor pattern of the conductor layer form an inductor device.
    Type: Application
    Filed: January 23, 2015
    Publication date: May 21, 2015
    Applicant: IBIDEN Co., Ltd.
    Inventors: Yasuhiko MANO, Kazuhiro YOSHIKAWA, Haruhiko MORITA
  • Publication number: 20150137921
    Abstract: A conductor assembly and method for constructing an assembly of the type which, when conducting current, generates a magnetic field or which, in the presence of a changing magnetic field, induces a voltage. In one embodiment the method provides a first insulative layer tubular in shape and including a surface along which a conductor segment may be positioned. A channel formed in the surface of the insulative layer defines a first conductor path and includes a surface of first contour in cross section along a first plane transverse to the conductor path. A segment of conductor having a surface of second contour in cross section is positioned at least partly in the channel and extends along the conductor path. Along the first plane, contact between the conductor surface of second contour and the channel surface of first contour includes at least two separate regions of contact.
    Type: Application
    Filed: November 26, 2014
    Publication date: May 21, 2015
    Inventors: Gerald Stelzer, Rainer Meinke, Mark Senti
  • Publication number: 20150137933
    Abstract: The invention relates to an apparatus for providing vehicles with energy by magnetic induction. The apparatus has a primary side electric conductor and a field shaping layer. The invention also relates to a composite layer for shaping magnetic field lines of an electromagnetic field generated by an electric conductor. The composite layer includes a continuous supporting layer and a plurality of elements made of magnetizable material. Finally, the invention relates to a method of generating an apparatus for providing vehicles with energy by magnetic induction.
    Type: Application
    Filed: May 14, 2013
    Publication date: May 21, 2015
    Inventor: Robert Czainski
  • Publication number: 20150137642
    Abstract: Magnetic bearing that is provided with a radial actuator part and an axial actuator part, whereby the aforementioned radial actuator part comprises a laminated stator stack that is provided with a stator yoke, wherein the stator yoke is linked to a closed ferromagnetic structure that surrounds the stator yoke.
    Type: Application
    Filed: May 3, 2013
    Publication date: May 21, 2015
    Applicant: Atlas Copco Airpower, Naamloze Vennootschap
    Inventor: Hans Vande Sande
  • Publication number: 20150129664
    Abstract: Disclosed herein are systems and methods for an implantable device comprising a ferromagnetic mass at least partially disposed near a coil, said coil formed of electrically conducting material and having electrical leads, a resonator circuit coupled to the leads and operable to resonate on application of energy from said leads. Some embodiments include an antenna coupled to said resonator circuit, wherein when either the ferromagnetic mass or the coil moves, power is supplied to the resonator circuit. In certain embodiments the device further includes a modulator coupled to said resonator circuit and operable to modulate the output of the resonator circuit where either the ferromagnetic mass or the coil is disposed in an animal such as a human. some embodiments allow for disposing multiple devices in an animal for characterizing different animal motions.
    Type: Application
    Filed: October 17, 2014
    Publication date: May 14, 2015
    Inventor: Gurbinder S. Brar
  • Publication number: 20150130579
    Abstract: An apparatus includes a multi spiral inductor that includes a first spiral and a second spiral. The first spiral includes a first turn, a second turn, and a third turn. The first turn is adjacent to and separated from the second turn by first spacing. The second turn is adjacent to and separated from the third turn by second spacing. The first spacing is different from the second spacing.
    Type: Application
    Filed: November 12, 2013
    Publication date: May 14, 2015
    Applicant: Qualcomm Incorporated
    Inventors: Daeik Daniel Kim, Jonghae Kim, Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo
  • Patent number: 9027229
    Abstract: Coil assembly (1) comprising a planar coil (2) comprising a plurality of turns (15) arranged in a trench (10) in a first magnetic core plate (3) and a second magnetic core plate (8), where the first magnetic core plate (3) and second magnetic core plate (8) are in direct contact with each other or separated by an electrically insulating insulator layer (5) with a thickness (t) equal to or less than 50 ?m and least one tap (6) extends from the coil (2) in a respective via hole (11) through the first magnetic core plate (3) to a respective contact pad (7), wherein the coil (2) and the tap (6) are integrally formed.
    Type: Grant
    Filed: January 4, 2012
    Date of Patent: May 12, 2015
    Assignee: ÅAC Microtec AB
    Inventor: Robert Thorslund
  • Patent number: 9027228
    Abstract: Methods for the manufacture of an electromagnetic coil assembly are provided. In one embodiment, the method includes joining a first end portion of a braided lead wire to a coiled magnet wire. A dielectric-containing material is applied in a wet-state over the coiled magnet wire and over the first end portion of the braided lead wire. The dielectric-containing material is cured to produce an electrically-insulative body in which the coiled magnet wire and the first end portion of the braided lead wire are at least partially embedded. Prior to application of the dielectric-containing material, the braided lead wire is at least partially impregnated with a masking material deterring wicking of the dielectric-containing material into an intermediate portion of the braided lead wire. In certain cases, the masking material may be removed from the braided lead wire after curing, and the electrically-insulative body may be sealed within a canister.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: May 12, 2015
    Assignee: Honeywell International Inc.
    Inventors: James Piascik, Eric Passman, Robert Franconi
  • Patent number: 9027232
    Abstract: A cylindrical magnet assembly has at least one coil mounted on a former, assembled to a bore tube by a number of inserts within holes formed in a material of the former. Each insert can bear on a dished radially outer extremity of a radially-outwardly directed protrusion or each insert can bear on a radially outer concave surface of a radially-inwardly directed protrusion.
    Type: Grant
    Filed: June 3, 2013
    Date of Patent: May 12, 2015
    Assignee: Siemens Plc.
    Inventor: Russell Peter Gore
  • Publication number: 20150115939
    Abstract: The present disclosure provides a magnetic medium, a magnetic encoder, and a method for manufacturing a magnetic medium with high reliability that can obtain the sufficient signal output, while reducing the hysteresis error.
    Type: Application
    Filed: October 24, 2014
    Publication date: April 30, 2015
    Applicant: HITACHI METALS, LTD.
    Inventors: Yasunori ABE, Makoto KAWAKAMI
  • Patent number: 9019061
    Abstract: A magnetic device formed with U-shaped core pieces employable in a power converter, and a method of forming the same. In one embodiment, the magnetic device includes a rectilinear core piece formed of a magnetic material, and first and second U-shaped core pieces positioned on the rectilinear core piece. The magnetic device also includes first and second conductive windings formed about the first and second U-shaped core pieces, respectively.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: April 28, 2015
    Assignee: Power Systems Technologies, Ltd.
    Inventor: Sriram Chandrasekaran