Abstract: Embodiments of radio frequency (RF) systems include a power amplifier having a primary winding and a secondary winding. The primary winding can be biased in different states in transmit and receive modes such that a difference between center frequencies of the primary winding and the secondary winding are significantly different in the different modes.

Abstract: A composite electronic component includes a first and second electronic elements, and a joint material. The first electronic element includes a base member, and an upper surface conductor on an upper surface of the base member. The second electronic element includes an element body with a lower surface facing the upper surface of the base member, and a terminal conductor disposed on the lower surface of the element body. The joint material joins the upper surface conductor and the terminal conductor. The upper surface conductor includes a conductive layer in which a metal that is maximum in weight ratio is Ag. The lateral surface of the conductive layer is covered with conductive layers defining a protective metal film, and the metal that is maximum in weight ratio contained in the conductive layers defining a protective metal film is a metal other than Ag and Cu.

Abstract: The present disclosure relates to a flexible circuit board. The flexible circuit board includes a first conductive trace substrate and a third conductive layer, a second conductive post and a third conductive post. The first conductive trace substrate includes a first insulating layer, a first conductive layer and a second conductive layer formed two opposite surfaces of the first insulating layer. The first conductive layer includes a first signal line, the second conductive layer includes a second signal line, and the first signal line is parallel connected with the second signal line.

Abstract: Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures, and a power amplifier and switch can be integrated onto a single complementary metal oxide semiconductor die.

Abstract: A fuel injector for an internal combustion engine includes an injector body in which there are positioned an actuator, a control valve, and a needle guide. The actuator actuates the control valve, the control valve controlling an injection needle sliding the needle guide between an open position in which injection is permitted and a closed position in which the injection of fuel is prevented. The injector additionally includes a first electrical connection extending from the needle guide to a metal that are internal to the injector, and a metal extension extending from the metal ring to a connector pin accessible from the outside of the injector, so that an electrical signal indicative of the position of the needle can be transmitted from the needle guide for the needle to the connector pin.

Abstract: Methods of fastening a cage with a fastening system in an MRD. One method includes: assembling: a plurality of pole pieces; a plurality of side magnets, the side magnets substantially enclosing the pole pieces and thereby defining a magnetic envelope and enclosed volume therein; a plurality of side walls, the side walls substantially enclosing the side magnets; a plurality of face walls and a plurality of fastening rods; and passing a plurality of fastening rods through at least one of the side magnets and at least one of the pole pieces and fastening them in an effective measure, such that the rods physically interconnects at least one pair of side walls.

Abstract: The invention relates to a device (1) for measurement of an angle of an axis of rotation (10), comprising a magnet (12) with a magnet surface (14), which is pivotally assembled at the axis of rotation (10), and further comprising a sensor (16) for recognition of external magnetic flux lines of the magnet (12). According to the invention, the magnet (12) comprises at least a first magnet section (20) with a magnetic first orientation (22) and the magnet (12) further at least comprises a second magnet section (24) with a second magnetic orientation (26), wherein the first magnetic orientation (22) is displaced from the second magnetic orientation (26), whereby the magnet surface (14) comprises a different concentration of external magnetic flux lines.

Abstract: A choke coil module of a high power density DC-AC power inverter includes a bottom plate and a top plate. Two upright posts are secured between the bottom plate and the top plate. The upright posts are sleeved with choke coils, respectively. The choke coils and heat radiating holes of the bottom plate and the top plate are communicated with one another to form an air guide passage. When the power converter is actuated, the choke coils generate heat. Through a fan unit, the outside air is guided into a casing via air inlets of the casing, and the heat generated by the choke coils is expelled to the outside via the air guide passage and air outlets of the casing. The choke coil module mounted in the high power density casing is able to achieve an excellent heat radiation effect.

Abstract: A multilayer electronic component includes a multilayer body having a structure in which a plurality of insulation layers are stacked, and having first and second end surfaces opposing each other and first and second side surfaces connecting the first and second end surfaces to each other. An internal coil disposed in the multilayer body includes a plurality of internal coil patterns exposed to the first and second side surfaces of the multilayer body and vias penetrating through the insulation layers connecting the plurality of internal coil patterns to each other. First and second side parts cover at least portions of the first and second side surfaces of the multilayer body, respectively.

Abstract: An ion filter and a method of manufacturing an ion filter. The method including providing a monolithic structure; selectively removing regions of the structure, to form a pair of electrodes defining at least one ion channel therebetween. The electrodes are preferably mechanically connected at one or more locations by a portion of the structure; wherein the connecting portion of the structure provides a higher electrical impedance than the filter would provide without such a mechanical connection, to thereby electrically separate the electrodes.

Abstract: Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures. A compensation circuit can act to protect the receive path during an RF transmit mode.

Abstract: A method for manufacturing a powder magnetic core using a soft magnetic material powder, wherein the method has: a first step of mixing the soft magnetic material powder with a binder, a second step of subjecting a mixture obtained through the first step to pressure forming, and a third step of subjecting a formed body obtained through the second step to heat treatment. The soft magnetic material powder is an Fe—Cr—Al based alloy powder comprising Fe, Cr and Al. An oxide layer is formed on a surface of the soft magnetic material powder by the heat treatment. The oxide layer has a higher ratio by mass of Al to the sum of Fe, Cr and Al than an alloy phase inside the powder.

Abstract: In a particular embodiment, a device includes a low-loss substrate, a first inductor structure, and an air-gap. The first inductor structure is between the low-loss substrate and a second inductor structure. The first inductor structure is aligned with the second inductor structure to form a transformer. The air-gap is between the first inductor structure and the second inductor structure.

Abstract: A superconducting air core cyclotron that replaces the iron core flutter field structure with an active superconducting wire structure with a superconducting main coil generating an isochronous field, and superconducting compensation coils generating the magnetic shield for the magnetic structure.

Abstract: An electronic component includes a substantially helix-shaped inductor including inductive conductor layers on insulator layers including a first inductive conductor layer and a second inductive conductor layer adjacent to the first inductive conductor layer on the upper layer side. Each of the first and second inductive conductor layers has a contact portion and a linear portion. The contact portion is, when viewed in the laminating direction, overlapped by an inductive conductor layer adjacent thereto on the lower or upper layer side. The linear portion is not overlapped by inductive conductor layers adjacent thereto on the lower and upper layer sides. The lower surface of the linear portion of the second inductive conductor layer is positioned higher than that of the first inductive conductor layer, and is positioned lower than the upper surface of the linear portion of the first inductive conductor layer.

Abstract: A coil is provided at a multilayer body including insulating layers stacked on one another. The coil includes linear conductors connected by via conductors to make a looped track when viewed from a layer stacking direction. The linear conductors include a first linear conductor contacting with an external electrode provided on the surface of the multilayer body, and a second linear conductor forming a half of the looped track. The first linear conductor includes a coil portion forming a part of the looped track. The second linear conductor is adjacent to the first linear conductor with one of the insulating layers in-between, and a first end of the second linear conductor is connected to a first end of the first linear conductor by a first via conductor. A second end of the second linear conductor does not overlap the first linear conductor when viewed from the layer stacking direction.

Abstract: A coil component includes a component main body, a coil conductor, first and second external terminal electrodes and first and second extended conductor layers The first and second extended conductor layers are extended in directions toward the first main surface from one end portions of the first and second external terminal electrodes in a state of forming uniform and edges, and connect the one end and the other end of the coil conductor and the first and second external terminal electrodes, respectively, with distances larger than distances extending in normal line directions of outer peripheral edges of the circulating conductor layers and equal to or smaller than distances extending in tangent line directions of the outer peripheral edges of the circulating conductor layers.

Abstract: A semiconductor package includes a semiconductor die comprising a control transistor and a sync transistor, an integrated output inductor comprising a winding around a core, and coupled to the semiconductor die. The winding comprises a plurality of conductive clips situated above a printed circuit board (PCB) and connected to a plurality of conductive segments in the PCB. The control transistor and the sync transistor are configured as a half-bridge. The integrated output inductor is coupled to a switched node of the half-bridge. At least one of the plurality of conductive clips includes a partially etched portion and a non-etched portion. The semiconductor die is attached to the integrated output inductor by a die attach material. The semiconductor die and the integrated output inductor are encapsulated in a molding compound.

Abstract: A linear motion assembly including a component having a longitudinal axis and adapted to translate along the longitudinal axis, and a bearing comprising a spiral body including a substrate and a low friction material, wherein the bearing extends around the component and provides a low friction interface for translation of the component, and wherein the bearing is adapted to prevent longitudinal translation of the component in a locked condition and permit longitudinal translation of the component in an unlocked condition. In an embodiment, the bearing is adapted to transition between the locked and unlocked conditions upon circumferential translation of an axial end of the spiral body, longitudinal translation of an axial end of the spiral body, or a combination thereof.

Abstract: A common mode filter is manufactured to include a coil part including an insulation layer and a conductor pattern formed in the insulation layer; and a magnetic substrate coupled to one surface or both surfaces of the coil part. The magnetic substrate includes: an electrostatic absorbing layer made of an electrostatic absorbing material; a magnetic layer provided on one surface or both surfaces of the electrostatic absorbing layer and made of a magnetic material; and an electrode provided between the magnetic layer and the electrostatic absorbing layer and made of a conductive material. Therefore, common mode filter may maintain high efficiency characteristics while preventing an electrostatic discharge phenomenon.

Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: a core substrate having a conductive pattern on the surface and a magnetic layer for covering the core substrate not to expose the conductive pattern, wherein the magnetic layer is made of a metal-polymer composite and has a multilayer structure.

Abstract: A coil structure includes a conductor band and a first insulating plate. The conductor band turns around a coil axis in such a manner that the conductor band folds at a plurality of portions which form a plurality of folded portions. The first insulating plate includes a first edge portion which abuts along at least one of the plurality of folded portions. At least part of the conductor band is wound around the first insulating plate.

Abstract: An antenna device includes a first coil and a second coil whose winding axes are parallel or substantially parallel, are disposed so as to be insulated from each other, and that magnetically couple with each other; a first capacitance that is connected in parallel to the first coil and defines a first resonance circuit with the first coil; a second capacitance that is connected in parallel to the second coil and defines a second resonance circuit with the second coil; a third capacitance connected between at least one set of ends of the first coil and the second coil; and a power supply terminal connected to the first coil.

Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

Abstract: A coil component capable of matching characteristic impedance (Zo) includes an insulating layer in which coil conductors are embedded; a first magnetic member disposed to be in contact with one surface of the insulating layer; and a second magnetic member having permeability lower than that of the first magnetic member and disposed to be in contact with the other surface of the insulating layer. An interval L1 between the second magnetic member and the coil conductors depends on an intended impedance value.

Abstract: A method of forming a semiconductor device includes forming a lower coil segment in a first dielectric layer over a substrate, forming a second dielectric layer over the lower coil segment and the first dielectric layer, anisotropically etching a top portion of the second dielectric layer to form an opening over the lower coil segment, depositing magnetic material in the opening to form a magnetic core, forming a third dielectric layer over the magnetic core and the second dielectric layer, forming vias extending through the second dielectric layer and the third dielectric layer, and after forming the vias, forming an upper coil segment over the third dielectric layer and the magnetic core, wherein the vias connect the upper coil segment with the lower coil segment.

Abstract: An integrated circuit transformer structure includes at least two conductor groups stacked in parallel in different layers. A first spiral track is formed in the at least two conductor groups, the first spiral track included first turns of a first radius within each of the at least two conductor groups, and second turns of a second radius within each of the at least two conductor groups, the first and second turns being electrically connected. A second spiral track is formed in the at least two conductor groups, the second spiral track including third turns of a third radius within each of the at least two conductor groups and disposed in a same plane between the first and second turns in each of the at least two conductor groups.

Abstract: A common mode filter, comprising a winding core, and said winding core further includes a U-type heave portion, said U-type heave portion divides said winding core into a first winding portion, a second winding portion and a cross winding portion; the first winding wires, are wound on said first winding portion, said cross winding portion and said second winding portion in sequence; and the second winding wires, are wound on said first winding portion, said cross winding portion and said second winding portion in sequence. As a result, the common mode filter not only can reduce the effects of the existence capacitors of in high-frequency layers and the inherent functionality of parasitic capacitors in common mode filters with higher frequency characteristics, but also the overall structure is simple, fast assembly and easy operation.

Abstract: There is to provide a coil part capable of reducing the number of fastening means such as screws and so on required when attaching it to a substrate. A coil part includes a transformer unit and a reactor unit, wherein the transformer unit includes: a primary winding part formed by winding a flat wire around a primary side hollow part; secondary winding parts, the secondary winding part being formed by winding a flat wire around a secondary side hollow part communicating with the primary side hollow part, arranged in pairs in a state of facing one side and another side of the primary winding part respectively; and a first core inserted into the primary side hollow part and the secondary side hollow part, and the reactor unit includes: a reactor winding part formed by extending one terminal side of the flat wire constituting the secondary winding part and winding the flat wire around a reactor side hollow part; and a second core inserted into the reactor side hollow part.

Abstract: A planar spiral induction coil includes a strip-shaped coil having at least one turn. The at least one turn has a width that changes as a distance from a beginning of the strip-shaped coil increases in a length direction of the strip-shaped coil. Each turn of the at least one turn has a respective width that causes an equal current to flow through each turn of the at least one turn.

Abstract: The invention relates to a corona ignition device, comprising a center electrode, an insulator surrounding the center electrode, a coil, which is connected to the center electrode, and a housing pipe, in which the coil is arranged. The housing pipe comprises a substrate layer and a conducting layer arranged radially inwardly of the substrate layer. The conducting layer is made of a material having a greater electrical conductivity than the material of the substrate layer. The conducting layer has a thickness of at least 0.1 mm. Also disclosed is a method for producing a corona ignition device, in which, to produce the housing pipe, an inner pipe is inserted into an outer pipe. The invention also relates to a corona ignition device of which the coil is surrounded by a soft-magnetic shielding.

Abstract: A detecting unit is presented. The detecting unit includes a flexible circuit having a first side and a second side opposite the first side. The flexible circuit includes a plurality of cells defined therein, each of the plurality of cells having a first side and a second side respectively corresponding to the first side and the second side of the flexible circuit. Moreover, the flexible circuit includes a plurality of conductive windings disposed on at least one of the first and second sides of the plurality of cells. Further, the flexible circuit includes a stress reduction feature between each of the plurality of cells. Also, the detecting unit includes a sealing element configured to secure the flexible circuit in a stacked configuration. A sensing system and a method of making a detecting unit are also presented.

Abstract: A fuel injector includes an injection control valve having a stator core that is electrically isolated from surrounding parts such as a stator housing. The stator core includes a first annulated wall having an inner surface, a second annulated wall having an outer surface, a radially extending wall connecting the first and second annulated wall, and a radially extending slot extending through the first annulated wall, the radially extending wall, and the second annulated wall. The stator core may include a limited number of contact points with the stator housing. Alternatively or additionally, an electrically insulating material may be placed between the stator core and the stator housing.

Abstract: A proximity sensor includes a body, a coil, a cap being cylindrical and having a bottom, a hollow housing, and a ring-shaped sealing member. The body includes the coil bobbin at a first end. The coil is wound around the coil bobbin. The cap is to be placed to a body so as to cover a coil bobbin. The housing includes, at a fist end, a circular-cylinder portion having an opening. The housing is to be placed to the body in such a manner that the cap protrudes from the opening. The sealing member is disposed between the outer peripheral surface of the cap and the inner peripheral surface of the circular-cylinder portion of the housing.

Abstract: A method of producing a surface-mount inductor including an external electrode having high fixing strength with respect to an element body even in a high-humidity environment. The method includes the steps of: winding an electrically-conductive wire to form a coil; forming a core using a sealant primarily containing a metal magnetic powder and a resin in such a manner as to encapsulate the coil in the sealant while allowing each of opposite ends of the coil to be at least partially exposed on a surface of the core; reducing smoothness of a surface of at least a part of a portion of the core on which an external electrode is formed as compared to a surface therearound; and forming the external electrode on the core in such a manner as to be electrically conducted with the coil.

Abstract: A semiconductor device includes a first coil that is monolithically integrated in a first portion of a semiconductor body and that includes a first winding wrapping around a first core structure. A second coil is monolithically integrated in a second portion of the semiconductor body and includes a second winding wrapping around the second core structure. The first and second coils are magnetically coupled with each other. An insulator frame in the semiconductor body surrounds the first portion and excludes the second portion. High dielectric strength between the first and the second coils is achieved without patterning a backside metallization for connecting the turns of the windings and without being restricted to thin substrates.

Abstract: An integrated circuit has a semiconductor die provided in a first IC layer and an inductor fabricated on a second IC layer. The inductor may have a winding and a magnetic core, which are oriented to conduct magnetic flux in a direction parallel to a surface of a semiconductor die. The semiconductor die may have active circuit components fabricated in a first layer of the die, provided under the inductor layer. The integrated circuit may include a flux conductor provided on a side of the die opposite the first layer. PCB connections to active elements on the semiconductor die may progress through the inductor layer as necessary.

Abstract: A system for inductive power transmission includes at least one interface surface and a plurality of triangular coil elements positioned underneath the interface surface such that at least one edge of the respective triangular coil element is adjacent to an edge of at least one other of the triangular coil elements. Each of the triangular coil elements may be operable to inductively transmit power to at least one coil of at least one electronic device and/or inductively receive power from the coil of the electronic device. Each triangular coil element may be operable to detect the proximity of one or more inductive coils of one or more electronic devices and inductively transmit power upon such detection at different frequencies, power levels, and/or other inductive power transmission characteristics.

Abstract: An ion filter and a method of manufacturing an ion filter. The method including providing a monolithic structure; selectively removing regions of the structure, to form a pair of electrodes defining at least one ion channel therebetween. The electrodes are preferably mechanically connected at one or more locations by a portion of the structure; wherein the connecting portion of the structure provides a higher electrical impedance than the filter would provide without such a mechanical connection, to thereby electrically separate the electrodes.

Abstract: An inductor structure includes a first set of traces corresponding to a first layer of an inductor, a second set of traces corresponding to a second layer of the inductor, and a third set of traces corresponding to a third layer of the inductor that is positioned between the first layer and the second layer. The first set of traces includes a first trace and a second trace that is parallel to the first trace. A dimension of the first trace is different from a corresponding dimension of the second trace. The second set of traces is coupled to the first set of traces. The second set of traces includes a third trace that is coupled to the first trace and to the second trace. The third set of traces is coupled to the first set of traces.

Abstract: A magnetic field generator (G1) for a magnetocaloric thermal device which comprises first (SM11) and second (SM21) identical magnetizing structures mounted head-to-tail, on either side of a central plane (P) and defining two air gaps (E1, E2). Each magnetizing structure (SMM11, SM12) comprises first (AM1) and second (AM2) magnetizing assemblies, whose induction vectors are oriented in opposite directions, and mounted on a support (SUP1). Each magnetizing assembly (AM1, AM2) has a permanent magnet structure (API, APC) which comprises a passive side (FP1, FP2) and an active side (FA1, FA2), delimiting the air gaps (E1, E2). The induction vectors of the first (AM1, AM19) and the second (AM2, AM29) magnetizing assemblies, form inside the generator, a single circulation loop of a magnetic field through the supports (SUP1) and the air gaps (E1, E2, E3, E4).

Abstract: A substrate package includes a woven fabric having electrically non-conductive strands woven between electrically conductive strands including wire strands, co-axial strands, and/or an inductor pattern of strands. The package may be formed by an inexpensive and high throughput process that first weaves the non-conductive strands (e.g., glass) between the conductive strands to form a circuit board pattern of conductive strands in a woven fabric. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planarized. Planarizing segments and exposes ends of the wire, co-axial, and inductor pattern strands. Since the conductive strands were formed integrally within the planarized woven fabric, the substrate has a high mechanical stability and provides conductor strand based electrical components built in situ in the substrate package.

Abstract: A coil includes a coil unit provided with a wire and a self-melting layer formed on surfaces of the wire, and a resin member affixed to the wire. The wire is adhered and affixed to the resin member by the self-melting layer.

Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.

Abstract: A planar intrinsically safe transducer having a vertical extension and a horizontal extension having a layer structure with a plurality of circuits, wherein a first circuit and a second circuit are galvanically isolated from one another. Further, the transducer has a magnetic core 4, which at least partially encompasses the layer structure and acts at least on the first circuit and on the second circuit, wherein the first circuit and the second circuit lie in one plane and form a layer of the layer structure.

Abstract: A planar transformer assembly, for use in charging capacitors of an ICD, includes windings arranged to minimize voltage across intervening dielectric layers. Each secondary winding of a preferred plurality of secondary windings is arranged relative to a primary winding, in a hierarchical fashion, such that the DC voltage, with respect to ground, of a first secondary winding, of the plurality of secondary windings, is lower than that of a second secondary winding, with respect to ground, wherein the first secondary winding is in closest proximity to the primary winding. The primary winding and each secondary winding are preferably formed on a corresponding plurality of dielectric layers.

Abstract: A method in accordance with an embodiment comprises forming a feature on a substrate, disposing a first conductive pattern on the substrate and the feature, disposing a permeability material within the feature, disposing a substrate material on the substrate and the feature to facilitate substantial enclosure of the permeability material between the substrate and the substrate material, and disposing a second conductive pattern on the substrate material. The first conductive pattern and the second conductive pattern define at least one electrical circuit operable for coupling to a current source so as to cooperate to be capable of facilitating a magnetic field about the permeability material.

Abstract: A process of making inductors for integrated circuit packages may involve forming an inductor upon a magnetic film on a package substrate. Conductors coupled either to a die or a voltage converter extend perpendicularly through the film to conductive plates, defining current paths through and across the film.

Abstract: An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. In a variant, mixed mode coupling techniques are utilized in order to extend the underlying operating bandwidth of the substrate inductive device. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.

Abstract: Providing for a monolithic magnetic induction device having low DC resistance and small surface area is described herein. By way of example, the magnetic induction device can comprise a substrate (e.g., a semiconductor substrate) having trenches formed in a bottom layer of the substrate, and holes formed in the substrate between the trenches and an upper layer of the substrate. Additionally, the magnetic induction device can comprise a conductive coil embedded or deposited within the trenches. The magnetic induction device can further comprise a set of conductive vias formed in the holes that electrically connect the bottom layer of the substrate with the upper layer. Further, one or more integrated circuit components, such as active devices, can be formed in the upper layer, at least in part above the conductive coil. The vias can be utilized to connect to integrated circuit components with the conductive coil, where suitable.