Abstract: A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a semiconductor device, forming a second insulating resin substrate, forming a recess extending to the metal layer of the first insulating resin substrate such that a surface of the metal layer is exposed, accommodating the semiconductor device in the recess such that the semiconductor device is mounted on the surface of the metal layer, and forming a resin insulating layer on the first insulating resin substrate such that the semiconductor device accommodated in the recess is covered.

Abstract: A touch panel includes an insulative substrate, a first adhesive layer, a first transparent conductive layer, a second adhesive layer, a second transparent conductive layer, a number of first electrodes, a first conductive trace, a number of second electrode, and a second conductive trace. The insulative substrate, the first adhesive layer, the first transparent conductive layer, the second adhesive layer, and the second transparent conductive layer are stacked with each other in that order. The first transparent conductive layer and the second transparent conductive layer are electrically insulated from each other only by the second adhesive layer. The second adhesive layer only covers part of the first transparent conductive layer so that the first transparent conductive layer has at least part exposed. A method for making the touch panel is also related.

Abstract: The described embodiments relate generally to use of an electrically conductive member, such as a grounding spring, used to electrically ground components on a printed circuit board as well as provide mechanical protection to the components. More particularly, a method and apparatus for attaching a grounding spring to multiple locations on the printed circuit board are disclosed. In one embodiment, the grounding spring can act as both a ground and a mechanical protection element for other surface mounted components disposed on the printed circuit board.

Abstract: An Intelligent Electronic Device (IED) includes a plurality of hardware modules including a pair of analog input modules (AIM) modules, a Power Supply Module (PSM), and a Binary Input/Output (BIO) module. Each module is configured for mounting in a first IED housing that has a first form factor. The PSM and BIO module are constructed and arranged to directly connect with electrical connections of the first housing. A second IED housing is provided that has a second form factor that is different from the first form factor. The AIM modules are mounted to a bottom panel of the second housing. The PSM and the BIO module are mounted in the second housing. Wiring electrically connects the AIM modules to connections on the second housing. Adaptor structure electrically connects the PSM and the BIO module with associated connections of the second housing.

Abstract: A component connection member, a mobile communication device comprising the same and a manufacturing method thereof include: a support structure, which is mounted on a substrate, formed to have at least one bent part; a first contact part connected to one end of the support structure and formed to come into contact with and be electrically connected to a first component disposed facing a first surface of the substrate; and a second contact part connected to the other end of the support structure and formed to come into contact with and be electrically connected to a second component disposed facing a second surface adjacent to the first surface of the substrate or a third surface opposite to the first surface of the substrate.

Abstract: A reel for a component mounting apparatus that pulls a carrier tape out of the reel and pitch-feeds and supplies the carrier tape by a tape feeder in a component supply part and picks up a supplied component and mounts the component in a substrate by a mounting head. The reel includes: a reel core part; and the carrier tape being wound and stored around the reel core part, wherein the carrier tape includes a distal end fixed to the reel core part, and a brittle part that is positioned in the vicinity of the distal end and is broken by action of longitudinal tension in excess of a prescribed strength on the carrier tape, and the pitch-feed separates the carrier tape from the reel core part at the brittle part.

Abstract: A first housing element is attached to an upper surface of a printed circuit board (PCB), and a second housing element is attached to a lower surface of the PCB. The first housing element receives a first electronic module, and includes a first signal wire that connects the first electronic module to a first trace on the PCB. The second housing element receives a second electronic module, which is vertically aligned with the first electronic module, and includes a second signal wire that connects the second electronic module to the first trace on the PCB. Alternately, a housing element attached to a PCB receives two or more electronic modules, and provides unique connections between the electronic modules and the PCB.

Abstract: There are provided an electronic component module in which electronic components are mounted on both surfaces of a substrate to increase integration density, and a method of manufacturing the same, the electronic component module including a first substrate; a plurality of electronic components mounted on both surfaces of the first substrate; a second substrate bonded to a lower surface of the first substrate; and a molded part formed on the lower surface of the first substrate and having the second substrate embedded therein.

Abstract: There is provided a method of manufacturing a wiring board, including the steps of: preparing an insulating layer 1a including a cavity formation region X, and a separable metallic foil M formed of first and second metallic foils M1 and M2; allowing the separable metallic foil M to adhere to at least a lower face side of the insulating layer 1a with the first metallic foil M1 serving as an adhering surface; forming a cavity 2 by digging the insulating layer 1a and the separable metallic foil M in a cavity formation region X from an upper surface side of the insulating layer 1a to a depth that does not penetrate the second metallic foil M2; inserting an electronic component D into the cavity 2, and fixing the electronic component D by a fixing resin J; and peeling off the second metallic foil M2.

Abstract: There are provided an electronic device module capable of increasing a degree of integration by mounting electronic components on both surfaces of a board, and a manufacturing method thereof. The electronic device module includes a board having mounting electrodes formed on both surfaces thereof, a plurality of electronic devices mounted on the mounting electrodes, a molded portion sealing the electronic devices, at least one connection wire having one end bonded to one surface of the board and the other end exposed to the outside of the molded portion, and an external connection terminal coupled to the other end of the connection wire.

Abstract: A circuit module includes a wiring substrate having a mount surface that has first, second, and third areas; a plurality of electronic components mounted on the areas; an insulating sealing layer that has a main surface and a side surface and covers the plurality of electronic components, the main surface having a trench that is sequentially formed along a boundary between the areas to be diverged en route and has a tapered shape toward the mount surface, the side surface being formed around the main surface; and a conductive shield that has first and second shield portions and includes conductive resin, the first shield portion covering the side surface of the sealing layer and having a first thickness, the second shield portion being provided in the trench and having a second thickness larger than the first thickness at a height of half the total height of the second shield portion.

Abstract: A manufacturing method for a protection circuit module of a secondary battery is disclosed. The method includes mounting a die type circuit device to an FPCB. The mounting of the circuit device includes bonding the circuit device to the FPCB by wire bonding. The method may further include forming a protective layer on the FPCB to cover the circuit device. The protective layer may be formed by coating insulation resin on the FPCB.

Abstract: A method of fabricating a cavity capacitor embedded in a printed circuit board including two conductive layers to be used as a power layer and a ground layer, respectively, and a first dielectric layer, placed between the two conductive layers, the method including: removing an upper conductive layer and the first dielectric layer excluding a lower conductive layer of the two conductive layers to allow a cavity to be formed between the two conductive layers, the lower conductive layer being supposed to be used as any one of electrodes of the cavity capacitor; stacking a dielectric material on the cavity to allow a second dielectric layer having a lower stepped portion than the first dielectric layer to be formed in the cavity; and stacking a conductive material on an upper part of the second dielectric layer and side parts of the cavity to allow the upper conductive layer to be used as the other electrode of the cavity capacitor.

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.

Abstract: The invention relates to a method for manufacturing an arrangement with a component on a carrier substrate, wherein the method encompasses the following steps: Manufacturing spacer elements on the rear side of a cover substrate, arranging a component on a cover surface of a carrier substrate, and arranging the spacer elements formed on the carrier substrate so as to situate the component in the at least one hollow space and close the latter. In addition, the invention relates to an arrangement, a method for manufacturing a semi-finished product for a component arrangement, as well as a semi-finished product for a component arrangement.

Abstract: [Problem] A carrier assembly apparatus which is able to be streamlined in structure is provided. [Solution] The carrier assembly apparatus 1 comprises: an assembly table 31 which supports a base member 70 on which a die 90 is placed, a holding head 46 which holds a cover member 80, a pressure reduction head 44 which has a pressure reduction chamber 443 accommodating the cover member 80 and having an opening part 444 and which abuts against the assembly table 31 so as to form a sealed space, a first elevating actuator 43 which simultaneously move the holding head 46 and the pressure reduction head 44 to the assembly table 31, and a second elevating actuator 47 which moves the holding head 46 relative to the pressure reduction head 44.

Abstract: A portable electronic device, a peripheral expansion module and methods for assembling a peripheral expansion module onto a portable electronic device are provided herein. The portable electronic device may comprise a main housing unit having a front cover and a back cover which, when coupled together, enclose internal components of the portable electronic device. The peripheral expansion module, comprising one or more peripheral devices coupled within or on a peripheral module housing, may be securely integrated with the portable electronic device. A majority of the peripheral expansion module may be positioned outside of the main housing unit along one side of the portable electronic device. In some embodiments, the peripheral expansion module includes a pair of rails, which extend out from within an interior of the module housing for attachment via one or more mechanical fasteners to an interior surface of the main housing unit of the portable electronic device.

Abstract: A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A subminiature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.

Abstract: Provided is an electronic controller which enables an opening direction of a connector to be set along an electronic circuit board. The electronic controller includes first guiding projections (7a) and second guiding projections (7b) formed on a cover (2), and first guiding grooves (8a) to be brought into engagement with the first guiding projections (7a) and second guiding grooves (8b) to be brought into engagement with the second guiding projections (7b), which are formed on pin headers (4). The first guiding projections (7a) and the second guiding projections (7b) move respectively along the first guiding grooves (8a) and the second guiding grooves (8b). As a result, the pin headers (4) turn to be assembled to housings (14).

Abstract: In the component mounting method, it is determined whether a component shortage simultaneous occurrence in which predicted component shortage timings belong to the same time zone in component mounting apparatuses and component replenishment is necessary in the same time zone with respect to the component mounting apparatuses is present or not. When the component shortage simultaneous occurrence is determined to be present, the component shortage timing is moved up by a predetermined move-up time in any one of the component mounting apparatuses relating to the component shortage simultaneous occurrence and notified.

Abstract: A method of manufacturing a core substrate having an electronic component, including providing a core substrate having a first surface and a second surface on an opposite side of the first surface, forming a through hole extending from the first surface to the second surface in the core substrate, attaching an adhesive tape to the second surface of the core substrate such that the through hole formed in the core substrate is closed on the second surface, attaching an electronic component to the adhesive tape inside the through hole, filling the through hole with a filler, and removing the adhesive tape from the second surface of the core substrate.

Abstract: Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.

Abstract: A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring.

Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Abstract: There is provided a method of manufacturing liquid transporting apparatus including: providing a channel unit; providing a piezoelectric actuator having a first and second active portion corresponding to a central portion and an outer periphery portion of the pressure chamber, respectively. The first and second active portions are sandwiched between an upper electrode and an intermediate electrode, and between the upper electrode and a lower electrode, respectively. The method further includes joining the channel unit and the piezoelectric actuator by positioning such that the intermediate electrode overlaps the central portion of the pressure chamber. Accordingly, since it is possible to make the first active portion overlap the central portion of the pressure chamber, it is possible to apply a appropriate pressure to the liquid in the pressure chamber without excessively small deformation of the first active portion.

Abstract: A method of manufacturing a polymer electrode is provided. The method includes adhering a shadow mask onto a substrate, forming a hydrophilic electrode pattern on the substrate, coating the hydrophilic electrode pattern of the substrate with a conductive polymer water solution, removing the shadow mask, and drying the conductive polymer water solution, thus forming the polymer electrode.

Abstract: In one embodiment, a shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.

Abstract: Disclosed herein are a method for manufacturing an electronic component embedding substrate and an electronic component embedding substrate. The method for manufacturing an electronic component embedding substrate includes: inserting an electronic component into a cavity formed in a core substrate; stacking a first insulating layer on one side of the core substrate into which the electronic component is inserted; performing surface treatment on the other side of the core substrate opposite to a direction in which the first insulating layer is stacked to improve a surface roughness of at least an exposed surface of the first insulating layer; and stacking a second insulating layer on the other side of the core substrate so as to be bonded to the exposed surface of the first insulating layer of which the surface roughness is improved. In addition, disclosed herein is the electronic component embedding substrate.

Abstract: One embodiment of a light emitting diode (LED) lighting device comprises multiple LED light sources disposed on multiple elongated circuit boards, with each LED light source being electrically connected to one of the circuit boards. The elongated circuit boards are electrically coupled using electrical passageways to provide power to the circuit boards at intervals along the length of the elongated circuit boards, and the light sources disposed on the circuit boards emit light in the same direction perpendicular to the elongated circuit boards. The electrical passageways can be wires or groups of wires.

Abstract: A resonant pressure sensor includes a first substrate including a diaphragm and at least one projection disposed on the diaphragm, and at least one resonator disposed in the first substrate, at least a part of the resonator being included in the projection, and the resonator being disposed between a top of the projection and an intermediate level of the first substrate.

Abstract: A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.

Abstract: A method of assembling a lighting device that has a base, an optic defining an optical chamber, a driver circuit positioned in electrical communication with the base, and a flexible circuit board positioned within the optical chamber along and generally circumscribing a longitudinal axis of the optical chamber and in electrical communication with the driver circuit. The flexible circuit board may comprise a plurality of longitudinal sections. Each longitudinal section may comprise a first inclined section, a second inclined section, and a plurality of light-emitting diodes (LEDs). The first inclined section may be positioned in the direction of the base relative to the second inclined section. The lighting device may further include a longitudinal translation device to translate longitudinally part of the flexible circuit board.

Abstract: A structured substrate for optical fiber alignment is produced at least in part by forming a substrate with a plurality of buried conductive features and a plurality of top level conductive features. At least one of the plurality of top level conductive features defines a bond pad. A groove is then patterned in the substrate utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop. At least a portion of an optical fiber is placed into the groove.

Abstract: Integrated Microelectromechanical System (“MEMS”) devices and methods for making the same. The MEMS devices comprise a substrate (200) and a MEMS filter device (100) mechanically suspended above a major surface of the substrate. A first gas gap (202) exists between the major surface of the substrate and the MEMS filter device. An isolation platform (500) is provided to absorb vibrations from an external environment prior to reaching the MEMS filter device. In this regard, the isolation platform comprises: a frame structure (510) framing a periphery of the MEMS filter device; and at least one resilient component (512-518) coupled between the frame structure and the MEMS filter device. The frame structure is mechanically connected to the substrate. Electronic circuitry is connected to the MEMS filter device via a resilient interconnection (204, 206) that is movable in at least one direction of the vibrations.

Abstract: A compliant printed circuit semiconductor package including a compliant printed circuit with at least a first dielectric layer selectively printed on a substrate with first recesses. A conductive material is printed in the first recesses to form contact members accessible along a first surface of the compliant printed circuit. At least one semiconductor device is located proximate the first surface of the compliant printed circuit. Wirebonds electrically couple terminals on the semiconductor device to the contact members. Overmolding material seals the semiconductor device and the wirebonds to the first surface of the compliant printed circuit. Contact pads on a second surface of the compliant printed circuit are electrically coupled to the contact members.

Abstract: A package substrate includes a core layer, a first dielectric layer, a second circuit pattern, a first solder mask and an insulating layer. A first circuit pattern is disposed on a first surface of the core layer. The first dielectric layer covers the first circuit pattern. The second circuit pattern is located on the first dielectric layer and the second circuit pattern includes an interconnection circuit pattern within a chip mounting area. The first solder mask covers a portion of the second circuit pattern outside the chip mounting area. The insulating layer covers the chip mounting area and the interconnection circuit pattern. A plurality of embedded pads are located on an upper surface of the insulating layer.

Abstract: A method of forming an interconnect assembly including forming a substrate with a plurality of through holes extending from a first major surface to a second major surface. A plurality of recesses are formed in the second major surface of the substrate that at least partially overlap with the plurality of through holes. The recesses have a cross-sectional area greater than a cross-sectional area of the through holes. At least one discrete contact member is inserted in a plurality of the through holes. The contact members include proximal ends extending into the recesses, distal ends extending above the first major surface, and intermediate portions engaged with an engagement region of the substrate located between the first major surface and the recesses. Retention members at least partially deposited in the recesses bond to the proximal ends to retain the contact members in the through holes.

Abstract: In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having one or more open channels, sealed channels, and/or a sealed chamber exposing an active surface of the microfluidic sensor. The molded panel portions and mask portions are configured to allow a material to dynamically or statically contact the microfluidic sensor for analysis.

Abstract: A circuit module includes a wiring substrate having a mount surface and a conductor pattern, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, an outermost layer of the conductor pattern including Au or Ag; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer formed along the boundary, the insulating sealing layer having a trench with a depth such that at least a part of the outermost layer of the conductor pattern is exposed, the insulating sealing layer covering the electronic components; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being formed at the trench, the second shield portion being electrically connected to the conductor pattern.

Abstract: There is provided a circuit module and a method of producing the same where interlayer wirings of a circuit substrate are prevented from damaging by laser irradiation, and a shield is assuredly electrically connected to the superficial conductor of the circuit substrate. The circuit substrate includes mount components, a sealing body, and a shield. The circuit substrate is a multi-layer substrate on which interlayer wirings are formed, and includes a mount surface on which a superficial conductor is disposed. The mount components are mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench including a first trench section reaching the superficial conductor and a second trench section not reaching the superficial conductor. The shield has an outer shield section and an inner shield section.

Abstract: A dielectric layer is directly applied onto the surface of a heat sink part. For example, the composition for making the dielectric layer may be made into a paste or ink and then printed as a paste or ink, or applied with some other equivalent method, such as a lamination technique. The electrical circuit traces are then printed in a similar fashion onto the dielectric layer in the required pattern for whatever circuitry is to be applied. That circuitry (e.g., circuit elements) is then attached to the electrical traces as needed for the particular application.

Abstract: The invention relates to a LED lamp (1) shaped as a slim conventional luminous tube, the LED lamp (1) comprising an elongated tubular glass casing (9), a socket (11, 11?) arranged at both ends, a LED unit (3) comprising a plurality of LED circuits (5) arranged on an elongated circuit board (7), and at least one conductor (18, 27, 31), the LED unit (3) being fixated against the first side of a support structure (35), the support structure (35) serving, in the operation of the LED lamp (1), to conduct heat away from the LED circuits (5). The support structure comprises a second side, abutment surface (40) opposite the first side, of the support structure (35), which abuts against the inside (10) of the glass casing (9), the support (35) extending in the longitudinal direction of the LED lamp (1) such that a distance (a) is attained between the support structure (35) and the socket (11, 11?).

Abstract: A method for manufacturing a wiring board with a built-in electronic component includes positioning an electronic component in a cavity of a substrate, forming intermediate structures each including an intermediate insulation layer and an intermediate wiring-pattern layer on upper and lower surfaces of the substrate, respectively, such that a component-accommodating substrate is formed, attaching a support sheet to a first surface of the component-accommodating substrate, forming a connection layer including insulation layers and wiring-pattern layers on a second surface of the component-accommodating substrate on the opposite side with respect to the first surface of the component-accommodating substrate, removing the support sheet from the component-accommodating substrate such that an intermediate laminate structure having the connection layer laminated on the second surface of the component-accommodating substrate is formed, and forming upper-layer structures each including an insulation layer and a wirin

Abstract: A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench.

Abstract: A device for converting thermal power into electric power includes many conversion cells arranged inside and on top of a substrate. Each conversion cell includes a curved bimetal strip and first and second diodes coupled to the bimetal strip. The diodes are arranged in a semiconductor region of the substrate.

Abstract: In a component mounting device (1) which has a first mounting lane (L1) and a second mounting lane (L2) and which is structured so as to be able to select either an independence mounting mode or an alternation mounting mode, when device type changing operation is performed with change of the type of boards which are the mounted objects, if a tape feeder float detecting sensor (17) that is provided in proximity of an opening (19) through which a part of the body or the foreign object enters in the component supplying part is, detects a part of the body such as a finger (26) of the operator or the foreign object, operation of the component mounting mechanism which belong to the mounting lane opposite to the mounting lane to which the component supplying part, in which the optical sensor is provided, belongs is stopped.

Abstract: A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure has a first side defined by a first layer of bio-compatible material, a second side defined by a second layer of bio-compatible material, an electronic component, and a conductive pattern that defines sensor electrodes. A portion of the second layer of bio-compatible material is removed by etching to create at least one opening in the second side in which the sensor electrodes are exposed. The etching further removes a portion of the first layer of bio-compatible material so as to create at least one opening in the first side that is connected to the at least opening in the second side. With this arrangement of openings, analytes can reach the sensor electrodes from either the first side or the second side of the bio-compatible structure.

Abstract: A combination component handling and connecting device connectable to a multi-axis robot for use in moving and connecting components and subassemblies includes a housing and an actuator fixedly connected to the housing. The actuator includes an actuating link movable from a first position to a second position. Connected to the actuating link is an end effector for concurrent movement with the actuating link. The component handling and connecting device includes a clamp having a first jaw and a second jaw. The second jaw is connected to the actuating link for selectively moving the second jaw toward the first jaw operative to engage a component.

Abstract: In the tape attaching method of cutting a tape member into conductive tape pieces and attaching the conductive tape pieces onto a plurality of attachment regions which are formed at a side edge part of a board, an attaching step in which the conductive tape pieces is attached onto the attachment region of a first press position, and a moving step, in which by driving a tape sending mechanism to perform the operation of sending the tape member while a press bonding head and a peeling unit are integrally moved relative to the board, the press bonding head is aligned with the attachment region of a second press position, and a separator is peeled from the tape member attached onto the first press position by the peeling unit during the relative movement, are repeated.

Abstract: An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, the first and second sealing frames being composed of a Ni film. A bonding section constituted by a Ni—Bi alloy is formed between the first and second sealing frames. For example, a Bi layer is formed on the first sealing frame, and then the first sealing frame and the second sealing frame are heated at a temperature of 300° C. for at least 10 seconds while applying pressure in the direction in which the first sealing frame and the second sealing frame are in close contact with each other, and thus the bonding section, which bonds the first sealing frame to the second sealing frame, is formed.