Abstract: According to an aspect of the invention, there is provided a speaker apparatus including: a magnetic circuit; a vibrating plate vibrated by the magnetic circuit; a speaker frame holding the magnetic circuit and the vibrating plate, and a connecting portion connecting a portion of holding the vibrating plate and a portion of holding the magnetic circuit, an inclined face of the connecting portion being inclined relative to a direction of tangential line of circumference of the speaker frame, the connecting portion configured to flow air due to a vibration of the vibrating plate along the inclined face thereof.

Abstract: Mobile display apparatus and methods of operating mobile display apparatus are disclosed. Mobile display apparatus include a structure for attaching the display apparatus to a mobile structure and at least one display module coupled to the structure. The mobile display apparatus may include a ventilation feature. Methods of operating mobile display apparatus include disposing a plurality of removable display modules within a frame structure. A channel may be formed between the plurality of removable display modules and the frame structure and fluid may be forced through the channel and at least partially across the plurality of removable display modules.

Abstract: According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.

Abstract: A solid state relay having an internal heat sink for dissipating heat produced by a solid state switching device. The relay being enclosed within a nonmetallic housing and mountable on a DIN type rail system.

Abstract: An electronic device includes a circuit board, an extension card, a cooling device, and a connecting member. The extension card is coupled to the circuit board. The cooling device includes an outer casing and an inner casing received in the outer casing. The connecting member includes a fixing end and an engaging end opposite to the fixing end. The fixing end is fixedly mounted on the outer casing. The engaging end is configured for fastening the extension card on the circuit board. The outer casing moves between a first position where the engaging end fastens the extension card and a second position where the engaging end is separated from the extension card to unfasten the extension card.

Abstract: An exemplary embodiment of the present invention provides a computer system. The system includes an enclosure configured to house a plurality of electronic devices. The system also includes a fan coupled to the enclosure and configured to provide a flow of cooling air through the enclosure to cool the electronic devices. The system also includes a first airflow path configured to allow the cooling air to exit the enclosure and attenuate noise generated in the enclosure. The system also includes an auxiliary outlet configured to provide a second airflow path if the first airflow path is obstructed.

Abstract: An electronic device with a heat dissipation mechanism includes a main body, at least one supporting member, at least one driving device, a temperature sensor, and a controller. The main body defines a plurality of heat dissipation holes and at least one through hole. The heat dissipation holes are configured for dissipating heat of the electronic device. The supporting member passes through the through hole, and one end of the supporting member protrudes from the bottom of the main body. The driving device is configured for driving the supporting member to move along its axis, causing the electronic device to be kept in a flat state or in an inclined state. The temperature sensor is for sensing the temperature of the electronic device. The controller is for driving the driving device, causing the supporting member to move a predetermined distance along its axis, according to the sensed temperature.

Abstract: A cooling system for an outdoor electronic enclosure, with separate compartments for electronics and batteries, includes separate cooling devices for each compartment so that optimal temperatures are provided to each compartment. The batteries are cooled by a thermo-electric type air-conditioner, while the electronics are cooled by direct air cooling device or a heat exchanger.

Abstract: A circuit board case including: a cover that includes a cover front wall and a rise wall connected to the cover front wall, the cover being attachable to an attaching object at a position on the rise wall opposite the cover front wall; and a case that houses a circuit board and includes a case front wall and a first wall surface oriented toward a direction opposite the case front wall, the case being housed in the cover such that the case front wall opposes the cover front wall. A fitting that engages the first wall surface is formed in the rise wall of the cover so as to urge the case toward the cover front wall and thus hold the case within the cover.

Abstract: A display device of the present invention is a display device including a body unit; a display unit; and a supporting unit, arranged upright from the body unit, for supporting the display unit; the display device including a circuit substrate arranged inside the body unit and mounted with an electronic component; a radiator plate arranged facing the circuit substrate and directly or indirectly contacting a plurality of electronic components; a heat pipe arranged on the radiator plate; and a cooling fan attached to the radiator plate and connected with a terminating end of the heat pipe.

Abstract: A docking plenum for a rack is disclosed. The docking plenum includes a pair of sides that are coupled to first and second panels at the top of the docking plenum. The panels at the top of the docking plenum are separated from one another by an aperture. The docking plenum includes a front opening and a rear opening between the two sides. Each of the front opening and the rear opening are sized to receive a rack. The placement of a first rack in the front opening and a second rack in the rear opening creates a heated air cavity that is formed by the racks, the floor of the docking plenum, and the panels at the top of the docking plenum. When the racks are placed in the opening, and when one or more fans in the computer systems are activated, the fans draw air from outside the plenum across the interior of the computer systems. Heated air exits the computer systems and enters the heated air cavity. The heated air exits the heated air cavity through the aperture in the top of the docking plenum.

Abstract: A heat dissipating system includes a chassis, a motherboard mounted in the chassis, a number of connectors mounted on the motherboard in parallel to form a passage between every two adjacent connectors, and a heat dissipating element mounted to the chassis and aligned with the passages. Each of the connectors includes a socket and an inserting portion. The socket defines a slot. The inserting portion includes a main body and a protrusion extending from the main body towards the slot. A cross-section of the protrusion is trapezoidal-shaped. A side surface of the protrusion is inclined to form an airflow guiding structure.

Abstract: An electronic assembly includes a casing structure defining an interior space for receiving at least one electronic component, an exterior space isolated from the interior space and a heat dissipating path along which heat generated by the electronic component is expelled from the interior space to the exterior space. The casing structure includes a first casing part and a would-be coupling unit. The first casing part includes an engagement unit having a bottom seat extending into the interior space and defining at least one flow passage along the heat dissipating path and a first coupling member projecting from the bottom seat. The would-be coupling unit includes a second coupling member coupled to the first coupling member within the interior space.

Abstract: An electronic device can be provided with a user interface component and a cooling component contained within a housing. The housing may include at least one surface having an opening formed therethrough, and the user interface may include one port formed therethrough. The user interface port may provide at least a first portion of a passageway between the housing opening and the cooling component. The passageway may allow fluids to be exchanged between the cooling component and the housing opening for cooling the electronic device.

Abstract: Electrical apparatus is provided including a housing for containing one or more electrical components therein. The housing has at least one connector means (29) for allowing the connection of at least one electrical cable thereto. Channel means (28) are provided adjacent the connector means for containing at least a part of the electrical cable adjacent a connection end thereof which is to be connected to the connector means on the housing in use.

Abstract: Described herein are various embodiments of a modified hexagonal perforated pattern and objects within which the pattern is formed. For example, according to one representative embodiment, an apparatus includes an object and a perforated pattern formed in the object. The perforated pattern includes a plurality of perforations through which matter is flowable. Each of the perforations includes a modified hexagonal shape including a hexagon having six rounded corners.

Abstract: With the storage control device of the present invention, it is possible to mount a larger number of storage devices and to cool them effectively. A plurality of sub-storage units are provided within one storage unit. Each sub-storage unit includes a plurality of hard disk drives, a plurality of enclosures, and a plurality of power supply devices. A cover is divided into a front cover which covers over the front side of a case, and a rear cover which covers over the rear side of the case. Shield portions are provided on the upper sides of the hard disk drives and the enclosures. By these shield portions contacting the adjacent modules (other disk drives and other enclosures), it is possible to reduce the negative influence upon cooling air draft passages within the case, even when a cover has been removed.

Abstract: An electronic apparatus that includes a circuit substrate being installed in a casing. The electronic apparatus has first and second groove portions that are formed on a first surface and a second surface of a heat sink, respectively. The heat sink discharges heat from a heat element on the circuit substrate to the outside of the casing. The electronic apparatus has a through-hole portion that is formed at an intersection point of the first groove portion formed on the first surface of the heat sink and the second groove portion formed on the second surface of the heat sink.

Abstract: In the disk array system, in the basic chassis, HDD modules are installed from a front surface in a front part of a backboard, and duplex CTL modules are installed up and down from a rear surface in a rear part, and duplex power source modules containing fans are installed in the left and right sides thereof. By the operation of the fans, in the rear part, the cooling air flows separately into each CTL module and into each power source module, and the cooling air having passed through the area of the duct by a block in the CTL module is drawn by the fans in the power source module through a ventilation hole and is then exhausted outside. The cooling air flow path to the plurality of ICs is divided by the block. The rotation speed of the fans is controlled by using a temperature sensor.

Abstract: The invention relates to a control box for arranging in a rotor hub of a wind turbine that can be rotated about a rotational axis. Such control boxes receive electrical components such as relays, inverters, sensors and the like, in the inner region thereof, which is defined by a wall, said components being required for the control of sheet displacement systems, also called pitch systems. Spurious particles can find their way into the control box during maintenance or even via air inlets and outlets. Especially dangerous parts are electro-conductive spurious parts that can trigger a short circuit (wires, cable parts, washers, screws etc.) and mechanically relevant bodies that can block ventilators, for example. Wind turbines are also known from prior art, wherein magnets are provided in the control boxes in the rotor hub, and ferro-magnetic spurious particles can thereby be fixed inside the control box.

Abstract: In an active heat sink, a heat sink comprises a plurality of heat sink fins and multiple fans configured in a redundant arrangement coupled to the heat sink.

Abstract: An electronic equipment cabinet configured to support electronic equipment is provided and may include a shelf positioned in the cabinet separating the cabinet into a first zone and a second zone. The first and second zones may be in fluid communication with a cool air source. In some examples, the first zone may receive cool air directly from a cool air source and the second zone may receive cool air from a duct in fluid communication with the cool air source. In another example, both the first and second zones may receive cool air from the cool air source through a duct. In yet other examples, the cabinet may include a baffle between the cool air source and one of the first zones and the second zones to selectively control a quantity of cool air provided to the one of the first and second zones.

Abstract: An electronic unit housing includes (i) a receiving space for receiving a printed circuit board, (ii) at least one foot, which is designed to fasten the electronic unit housing onto a base, and is disposed to the side of the receiving space relative to a projection of the receiving space onto the base, and (iii) a venting device, which opens on the underside of the electronic unit housing facing the base.

Abstract: An air volume control module for use with a vehicular air conditioning apparatus includes a circuit board including a control circuit for controlling the rotational speed of the blower of the vehicular air conditioning apparatus, a heat sink connected to the circuit board and including a fin for radiating heat generated by the circuit board, and a base housing surrounding the circuit board, the heat sink being inserted in the base housing with the fin projecting from the base housing. The base housing is mounted on the heat sink only by a locking finger. Either one of the base housing and the fin of the heat sink has a protective projection having a heightwise dimension greater than that of the locking finger.

Abstract: Airflow intake systems for use with computer cabinet air conditioning systems are disclosed herein. In one embodiment, a computer system includes a plurality of computer modules and an associated air mover positioned in an interior portion of a computer cabinet. The computer cabinet includes an opening that provides access to the interior portion. In this embodiment, a door or other panel is positioned in front of the opening and is at least partially offset from the opening to define a gap between the panel and the cabinet. Operation of the air mover draws cooling air into the cabinet through the gap, and then drives the cooling air through the cabinet to cool the computer modules.

Abstract: Electronic device enclosures providing improved heat dissipation are described herein. An example enclosure for holding an electronic circuit board includes a housing having a first portion coupled to a second portion to form a cavity to hold the electronic circuit board. Each of the first and second portions comprises openings to direct convention airflow across opposing faces of the electronic circuit board at the same time. A baffle is coupled to the housing to substantially visually obscure the openings and to define a gap between the housing and the baffle to direct the convection airflow across the opposing faces of the electronic circuit board.

Abstract: A heat dissipation device of electronic circuit modules has a substrate, a heat dissipation element and a housing. The housing is hollow and has an airflow passage therein. Heat generated when electronic components of the substrate is operated is conducted to the heat dissipation element and is guided out of the device by heat convection generated inside the housing by the design of the airflow passage.

Abstract: According to one embodiment, a data center comprises a first data center section comprising one or more equipment element elements. Each computer element has one or more heat generating sources. A second data center section comprises a heat exchanger, the second data center section being substantially segregated from the first section. A heat transfer element is thermally coupled to at least some of the heat generating sources and is further thermally coupled to the heat exchanger.

Abstract: Temperature variation among electronic apparatuses installed in the data center is reduced, enhancement in reliability of the electronic apparatuses, and increase in service life are achieved, and efficient cooling of an electronic apparatus group is realized. Further, an electronic apparatus with low noise is provided. A front cover is provided on a front surface of an electronic apparatus, and a back cover is provided on a rear surface of it. A supplied air opening is formed at a lower side of the front cover, and an exhaust air opening is formed at an upper side of the back cover. The supplied air opening is connected to a blowing in opening from below the floor level, and the exhaust air opening is connected to a ceiling air duct. The ceiling air duct is provided with a heat exchanger, and indirect heat exchange is performed with external air.

Abstract: A display apparatus includes an accommodation chamber having a sealed structure, a display panel accommodated in the accommodation chamber, a cooling part which cools the air inside the accommodation chamber, a drain pipe extending from a bottom part of the accommodation chamber, and a check valve provided in the drain pipe.

Abstract: In one embodiment, a tag includes a substantially flat portion having two faces and a length and a height, wherein the length is between about 1 inch and about 2½ inches. The height is between about ? inch and about 1 inch. The tag also includes at least one first member coupled to the flat portion and extending away therefrom at an angle of between about 45° and about 135° to a plane normal to a plane of the flat portion, the at least one first member being adapted for mounting in an opening of a surface of an electronics system thereby creating a removable coupling between the at least one first member and the surface of an electronics system when mounted.

Abstract: An electronic equipment enclosure system with a side-to-side airflow control system includes an enclosure, having a front, a rear, a top, a bottom and two sides, and a side-to-side airflow control system. The airflow control system includes a side wall disposed adjacent one side of the enclosure, and a manifold disposed adjacent the other side of the enclosure. Electronic equipment having a front, a rear, a top, a bottom and two sides is disposed between the side wall and the manifold. Cooling air is routed into a first of the two sides of the electronic equipment, and heated exhaust air is routed out of a second side of the two sides of the electronic equipment and into the manifold. The side wall prevents the heated exhaust air from mixing with the cooling air at the first side of the electronic equipment.

Abstract: The present invention aims to appropriately cool an operation unit and to suppress power consumption and noise according to the configuration and the operation state in a computer system of an enclosure. A plurality of system cooling fans for cooling the operation unit of the computer system installed in the enclosure and an enclosure management module for controlling the rotation of each system cooling fan are arranged, where the enclosure management module stores in advance the supply cooling amount which is to be supplied to the operation unit by each system cooling fan, acquires information related to a temperature of the operation unit and calculates a necessary cooling amount which is to be required in the operation unit based on the information, and determines the rotation number of each system cooling fan based on the supply cooling amount and the necessary cooling amount.

Abstract: Provided is a printed circuit board having air vents and a semiconductor package that uses the printed circuit board having the air vents. The printed circuit board includes a substrate layer having a circuit pattern and a protection layer formed on the substrate layer, a molding region on which at least one semiconductor chip is mounted and for which a molding for the semiconductor chip is performed, and a plurality of air vents extending towards edges of the printed circuit board from the molding region.

Abstract: There is disclosed a self-contained electronic apparatus containing at least some power-dissipating components which may require cooling. The self-contained electronic apparatus may also include a removable and replaceable energy storage module. The removable and replaceable energy storage module may include a power element to provide electrical energy for the self-contained electronic apparatus and a cooling element to cool at least a portion of the power dissipating components.

Abstract: An enclosure arrangement, with protection against touch, of a power electronics appliance, more particularly of a frequency converter (31, 51) and its additional devices (12, 13), which solution contains an enclosed power electronics appliance and one or more enclosed additional devices installed in connection with it, which enclosed power electronics appliance and additional devices are modules, which can be fitted to be installed in combination one above the other such that the protection against touch of the appliance entity formed is as great as or higher than the protection against touch of the separate appliances.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: An electronic device is directly disposed on a lamp base and is powered by the lamp base. The electronic device includes a connection base matching with a specification of the lamp base, and an air-flow generator. The connection base may be directly screwed into the lamp base to power the air-flow generator, so that the air-flow generator operates to generate an air flow.

Abstract: A system for managing air flow through a body of an information handling system is disclosed. The disclosure provides a blank including a blank base plate and a blank ridge extending from the blank base plate. The blank base plate may be configured to match an architecture of both a processor socket and a bank of memory chip sockets. The blank may be configured to provide an impedance to air flow substantially similar to a total impedance provided by a processor and associated heat sink disposed in the processor socket and a bank of memory chips disposed in the bank of memory chip sockets.

Abstract: A heat dissipation assembly for a central processing unit includes a heat radiator adapted to contact the central processing unit from above and a base adapted to support the central processing unit from below. The base includes at least a snap-on fastening mechanism adapted to snap into a through hole formed in a supporting substrate of the central processing unit. The heat radiator includes at least a fastener receiving portion for receiving an elongated fastener and aligning the elongated fastener with a matching engaging element of the snap-on fastening mechanism.

Abstract: Provided is a disk array device or an electronic device having an enhanced cooling performance with lower noises. The disk array device has doors in the front side and in the rear side of the device, each of the doors is formed with outside openings which are louver-like or bend-like, the louver- or bend-like openings in the doors being directed in directions which are opposite to each other between the door on the suction side and the door on the exhaust side.

Abstract: There is provided a heat dissipating device. An exemplary heat dissipating device comprises a thermally conductive plate that is adapted to be disposed adjacent to at least one heat generating device. The thermally conductive plate has surface features configured to promote turbulent airflow over the thermally conductive plate, the thickness of the surface features being approximately equal to or less than the thickness of the plate.

Abstract: Assembling a power converter for a multiple phase electric drive propulsion system in a machine includes arranging a plurality of rectangular capacitor units of a capacitor subassembly for conditioning electrical power in the power converter in a first packaging arrangement. In the first packaging arrangement, major capacitor axes of each one of the capacitor units are co-linear with one another and minor capacitor axes of each one of the capacitor units are oriented parallel but not co-linear with one another. Assembling the power converter further includes arranging a plurality of IGBT modules of a transistor subassembly for power switching in the power converter in a second packaging arrangement. In the second packaging arrangement major module axes of each one of the IGBT modules are oriented parallel but not co-linear with one another and minor module axes of each one of the IGBT modules are co-linear with one another.

Abstract: This rack (1) houses rackable electronic gear modules (2, 3) and has cooling by natural convection thanks to ventilation orifices (20, 21) provided in its bottom (10) and top (11) walls and forced air cooling thanks to internal air distribution ramps (30) fed with air under pressure through the intermediary of a distribution box (31) connected to a forced air circulation duct (37). The use of internal distribution ramps for the forced air makes it possible to produce a pulsed air circulation providing only a slight obstacle to the air circulation obtained by natural convection. Compared to usual configurations, this makes it possible to lower the operating temperature reached by the equipment in the event of loss of the forced ventilation.

Abstract: A portable high-voltage test instrument comprises an electronic unit having means for producing a test voltage located in the kV range, a control area cooperating with the electronic unit, at least one terminal for the component or cable to be tested and for an external voltage supply, a housing for permanently accommodating the electronic unit and a cooling system, disposed inside the housing, for cooling the electronic unit, the cooling system comprising an air-cooled assembly having an air inlet and an air outlet. This housing is provided with a lid part that can be moved between an open and a closed position, such that all terminals, the control area and the air inlet and air outlet are covered in closed position thereof, whereas all terminals, the control area and the air inlet and air outlet are unobstructed in open position thereof.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: In one embodiment, a power cell chamber for a drive system includes moveable and fixed portions. The moveable portion includes a rectifier stage to rectify an input signal received from a secondary winding of a transformer to provide a rectified signal and an inverter stage having a plurality of switching devices to receive a DC signal and output an AC signal. This moveable portion can be slidably adapted within a cabinet of the drive system. In turn, the fixed portion includes a DC link having at least one capacitor to receive the rectified signal and provide the DC signal to the inverter stage.

Abstract: An energy storage pack cooling system including upper and lower respective terminal heat sinks thermally connected to respective upper and lower terminals of energy storage cells above and below upper and lower ends of an enclosure of an energy storage cell pack; and a blower and cooling assembly that circulates a heat transfer fluid past the upper and lower respective terminal heat sinks outside of the enclosure to cool the energy storage cells without circulating the heat transfer fluid past energy storage cell bodies of the energy storage cells enclosed within the enclosure.

Abstract: The invention relates to an electronic device operating in difficult environments. The electronic device comprises at least one printed circuit board supporting heat-dissipating electronic components, a heat sink, a first side of which is in contact with electronic components on a first side of the printed circuit board, and a second side of which is designed to evacuate heat by convection, characterized in that it also comprises a cover delimiting a channel in which a coolant circulates to ensure convection, the cover being joined to the heat sink and the printed circuit board, and in that the channel prevents the coolant from coming into contact with the electronic components.