Abstract: The invention proposes a new aeraulic cooling design for ARINC series 600 computers. Using a network of ducts (N) and holes (HM) on an intermediate plate (M) situated just above the bottom place (B) through which a stream of cool air (AF) is injected into said computer (C), the present invention makes it possible to effectively cool the dissipative areas and the identified hot spots on the electronic modules (E) that it contains.

Abstract: A thermal management system (101), comprising (a) a synthetic jet actuator (103), and (b) a processor (107) in communication with the synthetic jet actuator, the processor being adapted to receive programming instructions, and being further adapted to modify the operation of the synthetic jet actuator in response to the programming instructions.

Abstract: A network cabinet comprising an electronic component a duct positioned therein. The electronic component has at least one exhaust vent and the duct defines first and second openings. The first opening aligns with the exhaust vent such that the duct receives exhaust therefrom and the duct extends from the first opening toward a side of the network cabinet such that the second opening faces the side of the cabinet to direct the exhaust thereto.

Abstract: A method for thermal management is provided. The method includes providing thermal isolation between at least one high-power thermally tolerant electronic component and at least one low-power thermally sensitive electronic component housed within an electrical enclosure, providing a first conductive path from the at least one low-power electronic component to a first heatsink, providing a second conductive path from the at least one high-power electronic component to a second heatsink, dissipating heat generated by the at least one low-power thermally sensitive electronic component and dissipating heat generated by the at least one high-power thermally tolerant electronic component to an environment external to the electrical enclosure by channeling the heat generated by the at least one low-power thermally sensitive electronic component and the at least one high-power thermally tolerant electronic component along the first and second conductive path, respectively.

Abstract: A housing includes a main body defining a window and at least one glue injecting hole near the window. A screen guard covering the window, defines a slit between the main body and the screen guard. A glue layer located in the slit adheres the screen guard to the main body, wherein the at least one glue injecting hole communicates with the window. The glue layer is formed by injecting glue into the slit from at least one glue injecting hole.

Abstract: An AC photovoltaic module includes a DC photovoltaic module for converting solar energy to DC electrical power, and an inverter for converting DC electrical power to AC electrical power, the inverter being adapted for connection to a frame portion of the module and being sized and configured, and provided with arrangements of electrical components thereof, to dispense heat from the inverter, whereby to prolong operational life and reliability of the inverter.

Abstract: A high density switching platform arranges multiple circuit cards interconnected by a single backplane. A single backplane has three sets of circuit cards on one side. A shared ventilation chamber on the other side of the backplane draws ambient air through each of the three sets of circuit cards independently. The air flow also allows cooling of power modules that supply power to the circuit cards. The platform allows interconnection of its circuit cards with circuit cards in adjacent platforms.

Abstract: An electrical component disposed on the top of battery modules includes an electrical component case for accommodating an inverter and a DC/DC converter, and heat sink units attached to the electrical component case on the side of the electrical component case opposite to the side with the battery modules, and constituted of a heat radiating plate having a plurality of radiating fins. In addition, a cooling path has a first cooling path for cooling the battery modules using cooling wind, and a second cooling path for cooling the heat sink units using the cooling wind having passed through the first cooling path. With this arrangement, there is provided a cooling structure for a vehicle power source unit capable of cooling the battery and the electrical component including the inverter with a compact configuration.

Abstract: Settop box (STB) or other housing for use in protecting electronic components. The housing may include an interior portion for protecting the components. The housing may include feet on a bottom and side to facilitate stabilizing the STB in a vertical and horizontal position. The housing may include vents to facilitate air flow to the interior. The vents may be associated with blocking aspects to protect against blocking the vents.

Abstract: Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

Abstract: An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.

Abstract: A heat radiator capable of thermally connect to a heat element includes a pair of heat conducting plates conducting heat from one side surface to other side surface of the heat conducting plate, respectively, the pair of heat conducting plates having a space between each of the heat conducting plates; and a radiation fin arranged between the pair of heat conducting plates, having elastic characteristics between the pair of heat conducting plates, and radiating heat from the heat conducting plate to the space.

Abstract: An arrangement is disclosed for a motor controller, the arrangement including a number of power semiconductors and cooling elements, the cooling elements being connected to the power semiconductors for cooling them. The power semiconductors and the cooling elements are disposed around a center axis of the arrangement in such a manner that they demark a channel around the center axis from at least three sides, to which channel cooling surfaces of the cooling elements extend and in which the cooling medium is able to flow in the direction of the center axis, and the power semiconductors extend from the connections between the power semiconductors and the cooling elements substantially away from the center axis. The arrangement can further include at least one choke disposed in the channel demarked around the center axis.

Abstract: A heat dissipating module includes a detecting component and a ventilation device. The ventilation device includes a housing whereon an opening is formed, at least one vane covering on the opening in a movable manner, and a driving unit electrically connected to the vane for driving the vane to move relative to the opening so as to adjust an aperture between the vane and the opening. The heat dissipating module further includes a fan for inhaling or exhaling airflow through the opening of the ventilation device, and a control unit electrically connected to the detecting component, the ventilation device, and the fan for controlling the driving unit to drive the fan to move relative to the opening according to a detecting result of the detecting component.

Abstract: A platform for a military radio with a vehicle adapter amplifier has been developed. The apparatus includes a base for supporting at least one SINCGARS RT-1523 radio. The platform has a first power supply that includes a DC power converter for converting 110/220 alternating current into +28 Volt direct current and a second power supply that converts +28 Volt direct current into +6.75 Volts direct current, +13 Volts direct current and +200 Volt direct current. The platform includes a vehicle adapter power amplifier that provides range extension to said SINCGARS RT-1523 radio.

Abstract: An electronic device includes a base and a sidewall attached to the base. The sidewall includes a heat dissipating area defining a plurality of vents, a sliding plate slidably coupled to an inner side of the sidewall, and a controlling arm made of metal material having high coefficient of thermal expansion. The controlling arm is connected between the sliding plate and the sidewall, for driving the sliding plate to slide to cover or uncover the vents of the heat dissipating area according to different interior temperature of the electronic device.

Abstract: There is provided a first accommodating chamber that accommodates a cooling unit frame that supports a cooling unit. The cooling unit includes a cooler that cools heat generated from a snubber circuit component and a semiconductor device utilizing cooling air from an air blower, a conductor bar that electrically connects the semiconductor device and a capacitor with each other, the snubber circuit component, and the semiconductor device. There is also provided a second accommodating chamber that accommodates the capacitor.

Abstract: An electronic system such as a computer system includes a casing defining an opening at a side thereof, a motherboard arranged in the casing, a hard disk located at a side of the motherboard and a heat dissipation structure covering the opening of the casing. The motherboard includes a printed circuit board facing toward the opening of the casing, first electronic components and second electronic components mounted on the printed circuit board and facing toward the opening. The heat dissipation structure includes a base engaging with the casing and fins extending from the base and outside of the casing. The base includes a first engaging portion contacting the first and second electronic components and a second engaging portion contacting the hard disk. The first engaging portion and the second engaging portion are in different levels from each other.

Abstract: An electronic device includes a first and a second air passages. A first and a second electronic components locate in the first and second air passages, respectively. A first heat sink includes a first heat dissipation portion contacting the first electronic component and located in the first air passage and a second heat dissipation portion located in the second air passage. A second heat sink includes a first heat dissipation portion contacting the second electronic component and located in the second air passage and a second heat dissipation portion located in the first air passage. The first heat dissipation portion of the first heat sink aligns with the second heat dissipation portion of the second heat sink and the second heat dissipation portion of the first heat sink aligns with the first heat dissipation portion of the second heat sink along a flowing direction of the t air passage.

Abstract: A tray-type structure device includes a side plate, a front plate attached to a forward end of the side plate, having the functions of opening and closing, and positioned on the front side of a housing, a top plate attached to an upper end of the side plate, with a plurality of openings formed therein, and having the function of variably setting a ventilation resistance, a bottom plate attached to a lower end of the side plate, with a plurality of openings formed therein, and having the function of variably setting a ventilation resistance, and a back plate attached to a rearward end of the side plate, having the functions of opening and closing, and positioned on a side of the housing toward a backboard. The device has a tray structure having a tray-like shape formed by the front plate, top plate, bottom plate, side plate and back plate.

Abstract: An acoustically absorptive apparatus is provided which includes an acoustically absorptive panel and an attachment mechanism. The acoustically absorptive panel is configured to reside along a side of an electronics rack, and includes a multilayer structure to attenuate noise. The attachment mechanism slidably mounts the acoustically absorptive panel to the electronics rack and facilitates sliding of the panel relative to the rack between retracted and extended positions. In the refracted position, the panel is disposed along the side of the rack, and in the extended position, the panel extends beyond a front or back edge of the electronics rack to facilitate attenuating noise emanating from the rack or an aisle alongside a row of multiple racks. In addition, the acoustically absorptive panel hingedly couples along a vertical edge to the attachment mechanism such that the panel is also rotatable outward away from the side of the electronics rack.

Abstract: Some embodiments of a method, apparatus and computer system are described for inverted vortex generator enhanced cooling. In various embodiments an apparatus may comprise a first surface comprising at least one heated component, a second surface in proximity to the first surface, the second surface comprising a non-heated surface, and one or more inverted vortex generators attached to the non-heated surface, a portion of the one or more inverted vortex generators in proximity to and configured to dissipate heat from the at least one heated component. Other embodiments are described.

Abstract: A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape.

Abstract: The electric module includes a sealed enclosure (104), at least one item of electrical equipment (106) arranged in the sealed enclosure (104) and which, in operation, heats the atmosphere, and a secondary cooling circuit. The secondary circuit includes a guiding channel (108) arranged in the sealed enclosure (104) so as to guide the atmosphere which has been heated by the item or items of electrical equipment (106) towards its top opening (108B), and a passage (109) for the atmosphere delimited, at least partly, by the sealed enclosure (104) in order to enable a cooling of the atmosphere upon contact with the sealed enclosure (104). The guiding channel (108) is thermally isolated from the sealed enclosure (104).

Abstract: A housing structure for a vehicle electronic control unit (“ECU”) includes an ECU case, a mounting bracket, and a seal ring. The ECU case is for housing a vehicle ECU and includes a ventilation opening. The mounting bracket connects with the ECU case and is configured to connect with an associated vehicle frame for mounting the ECU case to the associated vehicle frame. The seal ring surrounds the ventilation opening and seals against both the ECU case and the mounting bracket. A method for mounting an electronic control unit (“ECU”) case to a vehicle frame is also disclosed.

Abstract: A protection sheet (PS) deforms into a shape of protecting a metal terminal (11P) of an inverter transformer (11) exposed from a gap between an inverter substrate (12) and a backlight chassis (43) at a temperature below the deforming temperature. At a temperature above the deforming temperature, the protection sheet (PS) deforms into a shape of removing from the metal terminal (11P) of the inverter transformer (11) exposed from the gap between the inverter substrate (12) and the backlight chassis (43).

Abstract: A computer system including an enclosure having a plurality of components; a first chamber including a first set of components; and a second chamber including a second set of components, the second chamber located adjacent to the first chamber and the first set of components being different than the second set of components; wherein air flow is prevented from flowing between the first chamber and the second chamber; and wherein the first chamber includes a first set of cooling devices and the second chamber includes a second set of cooling devices.

Abstract: A device (1) is provided with a configuration of two walls (3a; 5a) confining a substantially closed gap-like space (7) containing a gaseous medium. For cooling purposes the device is further provided with a synthetic jet generator (9) for generating a gaseous synthetic jet, wherein the generator is fluidically coupled to the gas-like space.

Abstract: The present invention pertains to a cage for thermal management and housing an electric module comprising a cage housing and having a top, bottom and side walls joined to form an interior cavity and the side walls defining a width of the interior cavity. The top wall may have an air inlet port and an air outlet port and the air inlet and outlet ports spaced apart by a length. The length may be most or all of the width, so that air entering the inlet port will travel over a portion of a side of an electronic module mounted in the cavity prior to exiting the outlet port.

Abstract: A cooling system cools an electrically rechargeable portable device accommodated in a docking station. The cooling system includes a docking station having a non-forced air active cooling unit and a housing. The cooling unit maintains a first heatsink surface at a temperature below an ambient temperature and a second heatsink surface at a temperature exceeding said first heatsink surface temperature. The housing accommodates an electrically re-chargeable portable device. The housing re-charges said portable device and seats said portable device in a position providing thermal contact between said docking station first heatsink surface and a heat spreader of said portable device while re-charging of said portable device.

Abstract: An open frame chassis has a top opening and a bottom opening permitting ambient air flow there through. A plurality of modules, each enclosing electrical components which are in thermal contact with a heat sink area of their corresponding module, and each of which can be inserted to an inserted position in the open frame chassis. When the modules are inserted into the open frame chassis, ambient air may flow from the bottom opening of the chassis across the heat sink area of each module to the top opening in order to passively cool the modules and the electrical components enclosed therein. The heat sink area has fins which are separated by a distance of 9 mm to 12 mm and have a height 10 mm to 20 mm. Key pins are associated with the electrical connectors of the chassis to guide the modules into place and prevent incorrect insertion of a different type of electrical module not corresponding to the electrical connection of the chassis for that slot.

Abstract: Disclosed is a system for cooling an electronics package. The system includes a fluid pump and a microcooler assembly. The system utilizes one or more cooling layers interspersed with layers of electronics in the electronics package. Each cooling layer has an array of cooling channels formed in a substrate, an input manifold through which cooling fluid is provided for distribution through the array of cooling channels, and an output manifold which collects fluid from the array of cooling channels. The elements of the cooling system are integrated by conduits including a package conduit for passage of fluid from the fluid pump to the electronics package, a cooler conduit for passage of fluid from the electronics package to the microcooler assembly, and a pump conduit for passage of fluid from the microcooler assembly to the fluid pump. Also disclosed is a method for cooling the electronics package.

Abstract: According to one embodiment, an equipment enclosure includes a plurality of equipment elements, each element having one or more heat generating sources. A heat exchanger is mounted towards the top of the equipment enclosure. The heat exchanger is thermally coupled to at least some of the heat generating sources. The enclosure includes an exhaust vent through which air heated by the heat exchanger may be evacuated, and an inlet vent through which air from outside the equipment enclosure may be drawn into the equipment enclosure to cool the heat exchanger by stack effect ventilation.

Abstract: A method for manufacturing synthetic jets is described. The method includes forming a hole extending through a portion of a first printed circuit board (PCB), wherein the hole defines a portion the synthetic jet assembly, and wherein the hole is positioned to enable the synthetic jet assembly to facilitate cooling a component coupled to a second PCB.

Abstract: A shield can includes a frame having a hole in the top wall thereof, and an enclosure attached to the frame and covering the hole. The frame and the enclosure are formed by punching a metallic piece, the enclosure corresponds to the hole in shape and size, the enclosure is fixed to the upper surface of the top wall. The invention also discloses the method for fabricating the shield can.

Abstract: An illustrative power-efficient data center is described for operating in an uncontrolled environment in one scenario. The data center includes an air moving system that applies unconditioned air to its resource items. The resource items are stripped down to provide a substantially minimum set of components for performing the data center's core functions. Various illustrative techniques for managing a power-efficient data center are also described.

Abstract: An electronic device that includes a cabinet having a top face, an undersurface, and a side that completely surrounds the top face and the undersurface by connecting the outer edge of the top face and the outer edge of the undersurface together; and an electronic part disposed inside the cabinet, wherein the cabinet has an exhaust hole provided in the undersurface of the cabinet, at a position distant from the side of the cabinet; a fan disposed inside the cabinet, which blows air inside the cabinet from the exhaust hole; and at least one protrusion disposed at the back of the undersurface of the cabinet, protruding from the undersurface of the cabinet and holding the cabinet placed on a flat plate in a state of being lifted.

Abstract: Embodiments disclosed herein include an apparatus that includes an component capable of generating heat, an external wall with an interior surface, an air mover to be positioned to generate airflow between the interior surface of the external wall and the component. A vent may then be formed within the external wall to provide for a volume of air for the air mover to create airflow between the interior surface and the component. In some embodiments, the vent may be positioned in relation to the air mover to deflect at least a portion of the heat from the component from reaching the external wall. In some embodiments, a louvered portion may be included; and may be formed on the air mover or at the vent in the external wall. Other embodiments are described.

Abstract: A gap filler member apparatus for blocking air flow through a gap existing between an edge of a first electronics board and a surface of a second electronics board that is disposed generally perpendicular to the first electronics board, where the first and second electronics boards are coupled by at least one pair of connectors and disposed within an electronics equipment enclosure, to block air flow through the gap. The apparatus has at least one rib extending therefrom, with the base portion being secureable to the surface of the second electronics board. A rib extends away from the base portion and has a height approximately equal to a height of the gap, and a length at least as long as a length of the gap so that the rib at least substantially blocks air flow through the gap.

Abstract: An electronic equipment enclosure system with a side-to-side airflow control system includes an enclosure, having a front, a rear, a top, a bottom and two sides, and a side-to-side airflow control system. The airflow control system includes a side wall disposed adjacent one side of the enclosure, and a manifold disposed adjacent the other side of the enclosure. Electronic equipment having a front, a rear, a top, a bottom and two sides is disposed between the side wall and the manifold. Cooling air is routed into a first of the two sides of the electronic equipment, and heated exhaust air is routed out of a second side of the two sides of the electronic equipment and into the manifold. The side wall prevents the heated exhaust air from mixing with the cooling air at the first side of the electronic equipment.

Abstract: An arc-resistant enclosure for electrical switchgear which includes solid front and back walls, a pair of solid side walls joined to the front and back walls, a ventilated roof joined to the side walls and the front and back walls, and a ventilated base joined to the side walls and the front and back walls. Internal partitions divide the space enclosed by the front, back, side, top and bottom walls into multiple compartments for housing different types of components. The ventilated base forms air-intake ports for admitting ambient air into a plurality of the compartments, and the ventilated roof forms air-exhaust ports for allowing air to be exhausted from the compartments. As air inside the enclosure is heated by the switchgear, the hot air rises through the switchgear compartments and is exhausted through the top air-exhaust ports, and replacement ambient air is drawn into the bottoms of the compartments through the air-intake ports.

Abstract: A computer enclosure includes a casing defining a ventilation hole at one side thereof, a power supply and a cooling fan received in the casing. Heat generated by the power supply is taken out by an airflow generated by the cooling fan to an outside of the casing via the ventilation hole. At least one cover sheet covers the ventilation hole of the casing. One side of the cover sheet is pivotally connected to the casing so that the cover sheet is rotatable with respect to the casing. When the cooling fan works, an airflow produced by the cooling fan flows to the ventilation hole and pushes the cover sheet to rotate with respect to the casing, and thus the ventilation hole is exposed; when the cooling fan ceases to work, the cover sheet falls off due to a weight thereof and the cover sheet fully covers the ventilation hole.

Abstract: An electronic device includes a printed circuit board and a heat dissipation module. The printed circuit board has a first heat-generating electronic component and a number of second heat-generating electronic components. The heat dissipation module includes a heat sink thermally engaging on the first heat-generating electronic component and an enclosure enclosing the printed circuit board. The heat sink includes a number of fins. The enclosure extends an inner casing to envelop the fins of the heat sink. The enclosure defines a number of slots letting the casing communicate with an exterior of the enclosure. The casing separates the fins from the second heat-generating electronic component.

Abstract: Mobile display apparatus and methods of operating mobile display apparatus are disclosed. Mobile display apparatus include a structure for attaching the display apparatus to a mobile structure and at least one display module coupled to the structure. The mobile display apparatus may include a ventilation feature. Methods of operating mobile display apparatus include disposing a plurality of removable display modules within a frame structure. A channel may be formed between the plurality of removable display modules and the frame structure and fluid may be forced through the channel and at least partially across the plurality of removable display modules.

Abstract: A housing for holding electronic plug-in assemblies having a component installation space open toward the front side of the housing for the plug-in assemblies and a fan space arranged above the component installation space with a cover plate and a lateral air outlet. The fan space contains at least one axial fan with an air outlet on the top side of the fan. The axial fan is arranged in the fan space such that air is drawn out from the component installation space. An air-guiding plate that runs in the direction of the air outlet of the fan space is positioned between the top side of the fan and the cover plate of the fan space.

Abstract: An electronic apparatus includes a chassis and a heat sink. The heat sink forms one side wall of the chassis. The heat sink has inner and outer wall surfaces corresponding to inner and outer surfaces of the chassis. The heat sink has a guide portion guiding a drop of water initially adhered to the heat sink along the outer wall surface of the heat sink.

Abstract: An electronic device includes a first and a second air passages. A first and a second electronic components locate in the first and second air passages, respectively. A first heat sink includes a first heat dissipation portion contacting the first electronic component and located in the first air passage and a second heat dissipation portion located in the second air passage. A second heat sink includes a first heat dissipation portion contacting the second electronic component and located in the second air passage and a second heat dissipation portion located in the first air passage. The first heat dissipation portion of the first heat sink aligns with the second heat dissipation portion of the second heat sink and the second heat dissipation portion of the first heat sink aligns with the first heat dissipation portion of the second heat sink along a flowing direction of the t air passage.

Abstract: A heat dissipation structure of an electronic apparatus includes a bendable vapor chamber with a large area. A small section of the vapor chamber is arranged to contact with the heat source of the electronic apparatus and a large remaining section of the vapor chamber contacts with an internal wall of the chassis of the electronic apparatus through appropriate bending. The working fluid in the vapor chamber absorbs the heat generated by the heat source and vaporizes. The heat-carrying vapor spreads within the vapor chamber to condense on a large condensation zone. The released heat is then dissipated to the atmosphere via the large area of the chassis and the heat dissipating fin structure thereon. Therefore, the heat dissipation structure provides efficient passive heat dissipation.

Abstract: The present invention discloses a cooling fin assembly for Photo Voltaic Solar (PVS) panels providing an improved passive cooling of the PVS panels. Cooling fins as such do provide a good local cooling effect underneath the contacting surface of the fins. However, due to uneven air streams around the cooling fins, the temperature difference across a transversal direction relative to the direction of the fins may be high. This causes a severe degradation of the cooling systems effectiveness, and the resulting output form the PVS panel. According to the disclosure of this invention, an arrangement of transversal heat conducting materials provides a heat bridge providing a thermal relaxation time below a predefined threshold across the whole back side of the PVS panel, thereby improving the overall cooling effect of the PVS panel.

Abstract: An electronic device includes a casing, a thermal generating element, and a heat sink. The thermal generating element is disposed within the casing and operates to produce thermal energy. The heat sink includes a thermal transfer plate and a plurality of movable thermal transfer members. The thermal transfer plate contacts the thermal generating element and includes a plurality of recesses. Each of the movable thermal transfer members has a weight end and a free end. The weight end is accommodated in the recess. The thermal energy produced by the thermal generating element is conducted to the movable thermal transfer members via the thermal transfer plate. When the casing is tilted by a certain angle, the movable thermal transfer member swings relative to the thermal transfer plate, such that the free end thereof points to a direction opposite to that of an acceleration of gravity under a normal state.