Abstract: An apparatus includes a thermally conductive section with a side facing approximately parallel to an axis and adapted to be thermally coupled to a circuit component, and includes a fluid supply section which directs a fluid flow along the axis toward an opposite side of the thermally conductive section. The thermally conductive section splits the fluid flow into a plurality of flow portions which each flow through the thermally conductive section in a direction approximately parallel to a plane perpendicular to the axis, the flow portions exiting the thermally conductive section at a plurality of respective locations disposed along a substantial portion of the periphery of the thermally conductive section.

Abstract: A chassis including a slot configured to receive a printed circuit board having a baffle position pin and electronic components mounted thereon, a guide mechanism mounted within the slot, and a carriage moveably mounted within the slot and biased toward a slot opening by the guide mechanism, the carriage including a baffle suitable to manipulate a flow of air through the slot, the carriage configured to be driven away from the slot opening and to be oriented relative to the electronic components on the printed circuit board by the baffle position pin when the printed circuit board is loaded into the slot such that the baffle directs the flow of air over the electronic components.

Abstract: A computer system includes a computer case, a cover, and an air duct. The computer case includes a display, a housing connected to the display, a motherboard attached to the housing, and a fan module. The motherboard includes a heat generating component. An input opening and an output opening are defined in the cover. The output opening corresponds to the fan module. The air duct is mounted over the heat generating component. The air duct includes a top plate substantially parallel to the motherboard and a first side plate extending from the top plate. The first side plate is substantially perpendicular to the top plate. The first side plate defines a plurality of first airflow holes corresponding to the input opening. The top plate defines a plurality of through holes corresponding to the heat generating component.

Abstract: An electric connection box according to the present invention can include a circuit board having a first surface capable of mounting an electronic component, and a second surface defining a non-mounting surface, a case housing the circuit board, the circuit board oriented in a substantially vertical direction, a vertical inner wall surface of the case formed opposite the non-mounting surface of said circuit board, the vertical inner wall and the non-mounting surface of said circuit board defining a substantially vertical air ventilation path, a suction port positioned in the case and in communication with the ventilation path, an exhaust port positioned in the case above said suction port and in communication with the ventilation path, and a heat generating component in communication with the ventilation path.

Abstract: A system for managing heat generated by electronic equipment in an electronic equipment enclosure is provided. The system includes a duct adapted to receive a first portion of the electronic equipment. The first portion of the electronic equipment includes an air intake opening. The duct forms a barrier between the first portion of the electronic equipment and a second portion of the electronic equipment. The second portion of the electronic equipment includes an air exhaust opening. The barrier separates cooled air entering the air intake opening and heated air exiting the air exhaust opening.

Abstract: A display apparatus includes a display section, a control section, and a cooling section including a first ceiling section, a second ceiling section, a first connecting section and an air stream generating section. The first ceiling section is formed such that a distance of the first ceiling section from a non-display surface of the display section is shorter than that of the second ceiling section, and a ventilating area of a first ventilating passage is smaller than that of a second ventilating passage. The air stream generating section is configured such that an air stream is generated from the second ventilating passage toward the first ventilating passage so as to take the air out of the first ventilating passage and the second ventilating passage, and replenish the taken air with the ambient air. The control section is provided on a control section mounting surface of the first ceiling section.

Abstract: An electronic apparatus includes a housing and an airflow regulating device. The housing defines an accommodating space therein, and an air inlet that places the accommodating space in fluid communication with the external environment. The airflow regulating device includes a cover panel for covering and uncovering the air inlet, and an actuating mechanism coupled to the cover panel and driving movement of the cover panel to adjust the degree of opening of the air inlet in response to a change in temperature in the accommodating space.

Abstract: A fan box is provided with, in addition to an intake port in the front face, a second intake port at a wall surface position upstream of a fan. An Input/output unit disposed above or below the fan box comprises an exhaust notch that is aligned with the second intake port of the fan box, as well as an intake notch that is provided further to the rear than the exhaust notch. The intake notch is in communication with an air duct that opens in the front face of the processor and that leads to a unit box. The fan discharges through an exhaust port cooling wind that has flowed into the first intake port via an operation unit, as well as cooling wind that has flowed into the second intake port via the Input/output unit.

Abstract: An electronic device includes a housing. A motherboard is arranged in a first end of the housing. A hard disk drive area is arranged at a second end of the housing. A cooling module is arranged at the housing between the motherboard and the hard disk drive area. The cooling module includes a chassis and a semiconductor chilling plate received in the chassis. An outside airflow flows through the hard disk drive area, and then flows through the semiconductor chilling plate to be cooled. The cooled airflow is driven to flow through the motherboard.

Abstract: An internal device arrangement for a passenger cabin, for example of an aircraft, is provided. The device has an internal device element which is selected from a group including wall paneling, window panel, side panel, ceiling paneling and luggage compartment. The device has an electrical apparatus fitted in or on the internal device element; and at least one line for supplying power to the electrical apparatus. Furthermore, a heat dissipation device in the form of an integral component part of the internal device element, the electrical apparatus and/or the at least one line is provided. Such a heat dissipation device makes it possible to dispense with an additional heat sink for temperature management and thus save installation space and weight.

Abstract: In an electronic unit accommodated in a containing device so as to be adjacent to another electronic unit accommodated in the containing device, the electronic unit includes: a housing that is formed into a tub shape, that is provided with a plate comprising an air blowing hole, and that is closed by said another electronic unit when the electronic unit and the other electronic unit are accommodated in the containing device; and an interrupting portion that interrupts power supply to the electronic unit when said another electronic unit is detached from the containing device and the housing of the electronic unit is opened.

Abstract: A data center includes one or more racks, one or more computing devices coupled to at least one of the racks, and one or more air moving devices. The computing devices include heat producing components. The computing devices may be inclined in the rack such that the lower ends of the computing devices are at a lower elevation than the higher ends of the computing devices. The air moving devices can move air from the lower end of the inclined computing devices to the higher end of the inclined computing devices such that heat is removed from heat producing components in the inclined computing devices.

Abstract: An air cooled switching unit for a motor drive includes a forced air cooling chamber and a convective cooling chamber separate from the forced air cooling chamber. An exhaust port of the forced cooling chamber is configured to direct exhaust air across an outlet of the convective cooling chamber to induce an increased air flow through the convective cooling chamber thereby increasing the cooling capacity of the convective cooling chamber.

Abstract: A premises power source accessory panel for an outdoor unit, a method of adapting an outdoor unit with a premises power source accessory panel and an outdoor unit incorporating the panel or the method. In one embodiment, the panel includes: (1) a bracket having at least one electrical conduit aperture and (2) a circuit protection element mounted to the bracket and configured to be coupled to a premises power source, the bracket removably couplable to the outdoor unit in lieu of a conventional electrical conduit panel.

Abstract: An airflow segregation panel is disclosed for directing air flow. The airflow segregation panel includes a first connection end, an airflow direction portion and a hinge. The hinge is positioned between the first connection end and the air flow direction portion such that the air flow direction portion is selectively pivotable with respect to the first connection end. The airflow direction portion may be configured with a selectively adjustable length.

Abstract: Heat is conducted from a primary component to a thermal dissipation structure. An airflow removes from the thermal dissipation structure. An air channel associated with the thermal dissipation structure diverts a portion of the airflow to a secondary component, thereby providing cooling to the secondary component.

Abstract: A power supply device comprising: a plurality of battery units each having a protective unit, an output voltage from the plurality of battery units being configured to energize an electric power tool; and a drive-limiting unit provided in a current path of the battery unit of each row, wherein each protective unit stops energization from the battery unit of its row by the drive-limiting unit provided in the current path of the battery unit of its row, when the battery unit of its row has an error.

Abstract: An exemplary embodiment of an electronic device includes a cover including a first hole, and a heat dissipating assembly. The heat dissipating assembly includes a movable board including a second hole and slidably connected to the cover, and a heat magnifying device received inside the cover and adjacent to a heat element. The heat magnifying device includes a moving end secured with the movable board. When the heat element is maintained room temperature, the first hole and the second hole are staggered from each other to seal the cover. When heat generated by the heat element heats the heat magnifying device and causes the moving end of the heat magnifying device to move under thermal expansion and drive the movable board to slide relatively to the cover, and the first hole of the cover and the second hole of the movable board are communicated with each other.

Abstract: An electronic module includes a shell, a circuit board, and a connector. The shell defines a receiving slot. The circuit board includes a main body and an extension body connected to the main body. The main body of the circuit board is received in the shell, and the extension body of the circuit board extends out of the shell via the receiving slot. The connector is fixed in place by being attached to the extension body of the circuit board.

Abstract: A heat management system may include a generally planar printed circuit board extending in a first plane, heat-generating electrical components mounted on a first side of the PCB, and an air baffle coupled to the PCB and configured to direct air flow across some of the components. The air baffle may include a generally planar air baffle body extending in a second plane parallel to and offset from the first plane of the PCB such that at least one of the components is located in an area between the air baffle body and the PCB, an opening in the generally planar body, and a generally planar wing coupled to the air baffle body at a first side of the opening and extending toward the PCB at an askew angle relative to the first plane of the air baffle body, the wing being configured to facilitate air flow through the opening.

Abstract: A chassis extension module includes an extension housing structure and a support structure. The extension housing structure is to be attached to a housing structure of another module. Attachment of the extension housing structure to the housing structure of the other module expands an inner volume of an assembly.

Abstract: A power converting apparatus includes a housing, a self-standing cable, and a grommet securing member. The housing includes a housing base, a main body, and an air duct. The housing base includes a through hole. The main body includes a plurality of electronic components on a first surface of the housing base. The air duct is disposed on a second surface of the housing base. The self-standing cable is disposed through the through hole so as to be wired between the main body and the air duct. The self-standing cable stands on itself in a direction approximately orthogonal to the housing base. The grommet securing member is disposed in the air duct or the main body so as to secure a grommet to the through hole. The grommet securing member is not integral with the housing base.

Abstract: An electronic device includes a chassis, a number of electronic components, and at least one block. The at least one block is fitted between two of the electronic components. At least one air flow passage is defined under the at least one block to direct air flow to enter between the two electronic components.

Abstract: An air-cooling apparatus which cools an imaging unit with a plurality of LCD panels and a polarizer assembly includes a cooling fan, and a cooling duct which directs air expelled from the cooling fan onto the plurality of LCD panels and the polarizer assembly, and the cooling duct includes a plurality of channels corresponding to the plurality of LCD panels, and at least two channels from among the plurality of channels are bent in a vertical direction.

Abstract: A data room air circulation system has adjacent racks located. The racks have a front, a rear, and a first and second side. A computer system component is mounted in at least one of the racks. A cold aisle, containing cold air, is located at the front of the racks. As the cold air passes through the component, hot air is formed and discharged to a hot aisle located at the rear of the racks. A baffle, having a front end, a rear end, and a hot air side is located between the racks. The front baffle end is attached to the front of one of the racks, and the rear end is attached to the rear of the other of the racks. The baffle separates the cold aisle from the hot aisle for at least the height of the baffle.

Abstract: A wall mounting structure for wall-mounted electronic device includes a device shell having a coupling structure disposed in an accommodation open chamber therein at two opposite lateral sides, a circuit board mounted in the accommodation open chamber, a cover plate having sliding coupling rods respectively extended from two side flanges thereof and detachably coupled to the coupling structure of the device shell and a bottom flange attached to the bottom side of the device shell to support the device shell, and two mounting brackets affixed to the cover plate at two opposite lateral sides for fastening to a wall of an external object.

Abstract: An electric vehicle supply equipment may include a first cover element including a well portion to accommodate a first circuitry, wherein the first circuitry includes a chimney stack that couples to a venting hole. Also, the electric vehicle supply equipment may include a second cover element including a recess portion to accommodate a second circuitry, wherein the second circuitry includes a charcoal filter that couples to the chimney stack to absorb impurities generated by the first circuitry and the second circuitry. Further, the electric vehicle supply equipment may include a universal/serial connection port to couple to peripheral devices, wherein the universal/serial connection port is an optical coupled connection.

Abstract: A control unit is proposed which makes it possible to prevent connection problems between a package box and a backboard and prevent damage to the connector of the backboard. The control unit comprises a unit cover in which a first package box, which comprises a predetermined function and on the rear side of which a first connector is provided, is inserted into the corresponding spatial area so as to move over a shelf from an open end [of the unit cover]; and a backboard which is disposed inside the unit cover and on which a second connector is provided in a position where the first package box, inserted in the corresponding spatial area, mates with the first connector, wherein the shelf is provided with a protrusion which rotatably supports the first package box in a fan direction.

Abstract: A robot control device that controls operation of a robot having an actuator includes a casing, an actuator driver, a drive-control board, a main control board, a main power supply board, a vent passage, a cooling fan, and a holding member.

Abstract: The present invention relates to a heat radiating structure in all-in-one computers, comprising a pedestal, mainframe module and back cover. The mainframe module is contained in a containing stand behind the pedestal, and a motherboard is included in the containing space in front of a mainframe module base. The motherboard's CPU sticks through a radiator to a heat radiating aluminum plate in the rear of the containing space, while the hard disk drive is close to the heat radiating aluminum plate, and the pedestal is covered by the back cover on the back. With the heat radiating aluminum plate to quickly conduct heat and its multiple heat radiating holes, heat dispersing holes behind the containing stand and hollowed grooves on the back cover to convect hot air.

Abstract: A structure for storing and cooling electronics comprising a frame support, an internal equipment chamber mounted to the frame support, wherein the internal equipment chamber comprises a tubelike structure defining openings in a front and a back of the internal equipment chamber, and wherein the internal equipment chamber is configured to support electronic equipment such that the weight of the electronic equipment is born by the frame support and not the internal equipment chamber, and a plurality of removable panels disposed around the frame such that a gap is formed between the exterior of the internal equipment chamber and the plurality of removable panels, wherein air may circulate in the gap between the internal equipment chamber and the plurality of removable panels to help regulate a temperature within the internal equipment chamber.

Abstract: Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, heat generated by the processor may be expelled from the computing device using a fan. The fan may include an air intake over an impeller or blades which move air through an impeller portion and an air duct and out of a housing of the fan. The components of the fan may be configured in the housing to increase the area of an air intake which is not obstructed by features such as keyboards or displays in the computing device.

Abstract: Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

Abstract: A method of converting power using a power semiconductor module includes conducting power to power semiconductor devices; converting the conducted power with the power semiconductor devices; conducting heat generated by the power conversion from the power semiconductor devices first through a conductive circuit layer, then through an insulating substrate, to a baseplate; and removing the heat from the baseplate. The conductive circuit layer and the baseplate are formed of a material with a coefficient of thermal expansion less than about 8.0×10=6/° C. and a density less than about 4 g/cm3.

Abstract: The electronic device pertaining to an embodiment comprises a housing that holds an optical disk. The housing comprises a holding space holding an optical disk, a first internal space being apart from the holding space and in which a first electronic component controlling a pickup is disposed, an intake channel leading from the first internal space to the holding space, and an exhaust channel leading from the holding space to a specific space being distinct from the first internal space.

Abstract: An electrical power supply device for a motor vehicle, which includes a tray made of a heat-conducting material, in which there is positioned at least one ultra-high capacity energy storage unit liable to emit heat, the tray including at least one housing to accommodate at least one electrical energy storage unit with the presence of a heat-conducting layer made of a heat conducting adhesive or a heat-conducting resin interposed without clearance between the storage unit and the interior face of the wall of the associated housing so as to conduct the heat emitted by the unit.

Abstract: A cooling structure (10A) for an electronic device includes: a housing provided with an air inlet and an air outlet; a fan; and a circuit board (2) disposed in the housing. A heat generating component (3) is mounted on one surface of the circuit board (2). A heat release member (4) having fins (45) and a heat transfer plate (41) is disposed between the one surface of the circuit board (2) and an opposite wall (12) of the housing. The heat release member (4) extends, in an arrangement direction of the fins (45), beyond both sides of the heat generating component (3). For example, in an intermediate zone, a resistant layer (8) for suppressing heat transfer from the fins (45) to the opposite wall (12) is formed between the opposite wall (12) and the fins (45).

Abstract: A system and method of reducing consumption of electricity used to cool electronic computer data center, networking, and telecommunications equipment, and to reduce the incidence of thermal failure of electronic components, includes provision of one or more partitions to reduce the volume of the cooled environment supplying coldest possible cooled air from air conditioning systems to a chamber adjacent to racks containing the electronic components, preventing dilution of the supplied cooling airflow by warmer air from outside of the reduced volume environment, and controlling the delivery of cooling air flow through the reduced volume of the cooled environment.

Abstract: An electronic device includes a circuit board with a number of expansion slots arranged on the circuit board for connecting a number of expansion cards, and a guiding member inserted in one idle expansion slot of the expansion slots for guiding airflow to the expansion cards at opposite sides of the idle expansion slot.

Abstract: An electronic apparatus includes a first chamber in which a heat generator is arranged and a second chamber separated with a partition from the first chamber. The electronic apparatus is provided with a first cabinet having the partition and an isolation wall that encloses to seal the first chamber, a second cabinet enclosing the second chamber and having an intake port and an exhaust port, a thermoconductive member arranged in the first chamber and connected thermally to the heat generator and to the partition, a heat collecting-radiating member arranged in the second chamber and connected thermally to the partition, and an air blower arranged in the second chamber so as to circulate the air in the second chamber.

Abstract: Certain embodiments of the present invention provide a system for managing heat generated by electronic equipment in an electronic equipment enclosure. The electronic equipment enclosure includes a first pair of equipment rails and a second pair of equipment rails spaced apart from the first pair of equipment rails. The system includes a duct connected to the first pair of equipment rails and a bracket connected to the second pair of equipment rails and spaced apart from the duct. The duct is adapted to receive a first portion of the electronic equipment and the bracket is adapted to receive a second portion of the electronic equipment. The first portion of the electronic equipment includes an air intake opening and the second portion of the electronic equipment includes an air exhaust opening. The duct forms a barrier between the air intake opening and the air exhaust opening for separating cooled air entering the electronic equipment and heated air exiting the electronic equipment.

Abstract: Modular data centers with modular components suitable for use with rack or shelf mount computing systems, for example, are disclosed. The modular center generally includes a modular computing module including an intermodal shipping container and computing systems mounted within the container and configured to be shipped and operated within the container and a temperature control system for maintaining the air temperature surrounding the computing systems. The intermodal shipping container may be configured in accordance to International Organization for Standardization (ISO) container manufacturing standards or otherwise configured with respect to height, length, width, weight, and/or lifting points of the container for transport via an intermodal transport infrastructure. The modular design enables the modules to be cost effectively built at a factory and easily transported to and deployed at a data center site.

Abstract: An electronic device includes an air dam module. The air dam module includes a frame and a rotating member. The frame defines a vent. The rotating member is received in the vent and includes a pivot rotatably connected to midpoints of opposite sides of the frame, a first shield plate extending up from a top side of the pivot, to vertically block an upper half of the vent. In addition, a second shield plate heavier than the first shield plate and extending down from a bottom side of the pivot, to vertically block a lower half of the vent by gravity.

Abstract: An enclosure of an electronic device includes a chassis, a sliding plate slidably disposed on the chassis, and a pivot member. A number of vent holes and a location hole are defined in the chassis. A number of teeth are formed on a sidewall bounding the location hole. A through slot is defined in the sliding plate. A toothed rack is formed on a sidewall bounding the through slot. The pivot member extends through the through slot and the location hole. The pivot member includes a toothed portion engaging with the toothed rack and the teeth, and a smooth neck. When the toothed portion disengages from the teeth, the neck is pivotably received in the location hole, the pivot member is pivoted to drive the sliding member to slide relative to the chassis by the toothed portion rolling on the toothed rack, thereby exposing or covering the vent holes.

Abstract: Disclosed herein is a card-type peripheral apparatus including: a case body configured to accommodate an electronic package including a circuit board between a first surface and a second surface that are opposite to each other; a first electronic package including a memory mounted on the circuit board; a second electronic package including an electronic part for controlling the memory mounted on the circuit board; a first thermal conductive material arranged inside the case body, the first thermal conductive material in contact with a surface of at least one of the first electronic package and the second electronic package; and a second thermal conductive material formed with the first surface and the second surface of the case body, wherein the first thermal conductive material and the second thermal conductive material are in contact with each other inside the case body.

Abstract: A cooling structure of a capacitor includes a snubber capacitor in which lead terminals are joined to external electrodes of a laminated ceramic electronic component; a circuit board which is for mounting the snubber capacitor and semiconductor switching elements; and a heat dissipation plate which is made of metal that dissipates the heat generated in the circuit board. The cooling structure of the capacitor is configured such that an insulating member having a high coefficient of thermal conductivity intervenes between the snubber capacitor and the heat dissipation plate.

Abstract: An electronic apparatus includes a housing and an airflow regulating device. The housing defines an accommodating space therein, and an air inlet that places the accommodating space in fluid communication with the external environment. The airflow regulating device includes a cover panel for covering and uncovering the air inlet, and an actuating mechanism coupled to the cover panel and driving movement of the cover panel to adjust the degree of opening of the air inlet in response to a change in temperature in the accommodating space.

Abstract: This housing comprises rackable electronic equipment modules (2) housed in a bay. A module (2) has both internal (12, 13) and external (45) thermal radiators cooled by natural and forced ventilation. The internal thermal radiators (12, 13) are placed in thermal contact with the hot spots of the electronic equipment placed in the module (2) via hear collectors (40, 41) connected by heat pipe (42, 43) to the external thermal radiators (45) arranged outside on the edge (44) of the module (2). The internal thermal radiators (12, 13) are sized to be sufficient to cool the electric equipment when the forced ventilation is functioning normally. The external thermal radiators (45) are sized to complement the cooling provided by the internal radiators (12, 13) should the forced ventilation be lost.

Abstract: A heat-dissipating casing for a communication apparatus accommodates a circuit board having a power element and includes an insulating case, a lid coupled to the insulating case, and a thermally conductive metal member. The insulating case has a receiving space, a first opening, and a second opening. The first and second openings communicate with the receiving space. The thermally conductive metal member is fixed to the inside of the insulating case, seals the second opening, and dissipates heat generated by the power element. The heat-dissipating casing is effective in dissipating heat, characterized by its low weight and low production costs, and conducive to protection and dust prevention.

Abstract: Distribution and coupling of waste heat from planar non-concentration photovoltaic cells and semiconductor electrical devices is enhanced by forming dielectric relief structures and thermal conductive and emissive coatings on the cover and/or backing plate. The composite relief structures of layers, voids, and fins on the back surface mitigate the differential thermal expansion of dissimilar material and optimize convective heat transfer and radiant heat transfer with respect to costs. This leads to higher performance of the photovoltaic and semiconductor cells, a stronger and lighter backing plate components, and lower cost per watt for mounted devices.