Abstract: A communication protocol interface module conceived to be applied to an electromechanical equipment (1) provided with an opening (3) for coupling the module (2) that is provided with an electronic board (11) inside same having a circuit for defining the communication protocols.

Abstract: Method for manufacturing a rigid power module with a layer that is electrically insulating and conducts well thermally and has been deposited as a coating, the structure having sprayed-on particles that are fused to each other, of at least one material that is electrically insulating and conducts well thermally, having the following steps: manufacturing a one-piece lead frame; populating the lead frame with semiconductor devices, possible passive components, and bonding corresponding connections, inserting the thus populated lead frame into a compression mould so that accessibility of part areas of the lead frame is ensured, pressing a thermosetting compression moulding compound into the mould while enclosing the populated lead frame, coating the underside of the thus populated lead frame by thermal spraying in at least the electrically conducting areas and overlapping also the predominant areas of the spaces, filled with mold compound.

Abstract: An exemplary display device (10) includes a display module (11), a frame (12), a porous material member (13), and a transparent protection plate (14). The frame has a receiving cavity (121). The display module is confined in the receiving cavity of the frame. The transparent protection plate is configured in front of the light output side of the display module. The porous material member is located between the front surface (122) of the frame and the transparent protection plate.

Abstract: A circuit arrangement includes a power module combined with a printed circuit board. The power module and the printed circuit board are disposed between a heat sink and a pressing device and are contact-connected to one another by pressure contact elements. The power module has at least one module board element and a housing formed with shafts for the pressure contact elements. The shafts open out from the housing base facing printed circuit board at opening orifices. The base is formed with orifice sealing ribs around the opening orifices. Moreover, the base of the housing may have a peripheral edge sealing rib along its outer edge. Furthermore, a sealing area element can be provided between the printed circuit board and the base of the housing.

Abstract: Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate.

Abstract: A memory stick for a USB connection to a computer may include a USB connection portion for the connection to the computer and a cap portion to cover the USB connection portion. The cap portion and the USB connection portion may form a logo, and the USB connection portion may include a electronic circuit. The electronic circuit may be enclosed by a metal casing, and the USB connection portion may include a front section. A memory stick for a USB connection to a computer may include A USB connection portion for the connection to the computer and a cap portion to cover the USB connection portion. The USB connection portion may form a mascot.

Abstract: A security coating on an electronic circuit assembly comprises a mesh coating that may have a unique signature pattern and comprise materials that easily produce an image of the signature so that it is possible to determine if reverse engineering has been attempted. Spaces in the mesh may include electrical components to erase circuit codes to destroy the functionality and value of the protected die if the mesh coated is disturbed. The voids may include compositions to enhance the mesh signature and abrade the circuit if tampering takes place.

Abstract: The high-frequency wiring board of the present invention is a wiring board that includes first coplanar lines and second coplanar lines formed on a different layer than the first coplanar lines; the first coplanar lines and second coplanar lines being connected at the line ends of each. The first coplanar lines are provided with a first signal line (10) and a first planar ground pattern (30a) formed on the same wiring layer as the first signal line (10). The second coplanar lines are provided with second signal line (11) formed on a wiring layer that differs from that of the first signal line (10), a second planar ground pattern 32 formed on the same wiring layer as the second signal line, and a first ground pattern (30b) formed on the same wiring layer as the first coplanar lines. The end of the first planar ground pattern (30a) and the end of the first ground pattern (30b) are connected and thus unified.

Abstract: A wiring board having an excellent electrical property and reliability or the like. The wiring board includes a core board, a capacitor and a resin filler. The core board includes an accommodation hole therein and a core board main surface side conductor disposed on the core main surface thereof. A capacitor main surface side electrode is disposed on a capacitor main surface of the capacitor. A gap between the capacitor accommodated in the accommodation hole and the core board is filled with the resin filler so that the capacitor is fixed to the core board. Further, the resin filler has a main surface side wiring forming portion on which a main surface side connecting conductor, which is connected to an end portion of a via conductor, is disposed so as to connect the core board main surface side conductor to the capacitor main surface side electrode.

Abstract: The deterioration of dielectric breakdown strength arising from an opening of a metal plate is prevented and the reliability as a circuit board is enhanced. A circuit board is provided with a metal plate, having openings, as core material. The opening is provided in a manner that the size of the opening gradually increases from a lower surface side toward an upper surface side of the metal plate. On both surface sides of the metal plate there are provided wiring patterns, respectively, via insulating layers. The insulating layer provided on an upper region of the opening and the corresponding wiring pattern are provided such that they have a recess on the upper surface of them. To electrically connect each wiring pattern, the circuit board further includes a conductor which penetrates the metal plate via the opening and which connects the wiring patterns with each other. An LSI chip is directly coupled to the upper surface side of the metal plate via a solder ball.

Abstract: Multi-functional container for electric and/or electronic apparatuses comprising a front face, with a first compartment, to house at least one component (16) of the electric and/or electronic apparatus. The container comprises an opposite rear face having first attachment means (34) suitable to attach the container on guide means of a standardized type (36) in a first installation configuration. The multi-functional container also comprises second attachment means (42), suitable to attach the container in a second installation configuration inserted, at least partly, in a housing seating with the front face disposed toward the inside of the housing seating, and a second compartment, suitable to house the component (16) and disposed on the rear face.

Abstract: A semiconductor module includes a base plate whose one surface is formed with a fin region in which a cooling fin is provided; a substrate that is disposed on the other surface of the base plate and provided with a switching device; and a case member having an internal space an opening formed in one wall of the case member so that the opening is smaller than the one surface of the base plate and larger than the fin region.

Abstract: A method for producing an electronic module, in that at least one first microelectronic component is provided and is electrically connected to a second microelectronic component by a first flip-chip method step; at least one dielectric component is provided which has at least one printed circuit trace, and at least one printed circuit trace of the dielectric component is electrically connected to the second microelectronic component; and the second microelectronic component is electrically connected by a second flip-chip method step to a printed circuit board by way of the printed circuit trace(s) of the dielectric component, in order to avoid vias through a microelectronic component; the invention also relates to a corresponding electronic module.

Abstract: Multimedia management devices comprise a plurality of multimedia management modules coupled together in an intermodular network. At least some of the multimedia management modules are adapted to distribute at least one of audio or video within an area. Each multimedia management module is configured to enable a distinct functionality to a multimedia management device. Each multimedia management module is sized and configured to be disposed at least partially within an electrical gang box.

Abstract: A module includes an electrical component having an inner enclosure which surrounds the electrical component and which has first electrical contact means at least on one outer side; having an outer enclosure in the interior of which the inner enclosure is situated, the outer enclosure having second electrical contact means, the second electrical contact means extending from the interior to at least one outer side of the outer enclosure. The first and second contact means are interconnected.

Abstract: Various embodiments of an electronic system and method for removing a power module from an electronic system are provided. The electronic system includes a power module that supplies power to a load and is movable along an axis from an enabling position to a disconnected position. The electronic system also includes a release control that restricts the movement of the power module along the axis when the power module is moved beyond a disabling position located between the enabling position and the disconnected position.

Abstract: A modular computer includes a display with a docking station on its back side. A CPU module connects to the docking station. Peripheral modules connect with the resulting display/CPU assembly so that the peripheral modules contact the back side of the display screen.

Abstract: Disclosed are an electronic component, an assembly of an electronic component and an electronic carrier substrate, and a method of connecting the electronic component to the carrier substrate. The carrier substrate has a first coefficient of thermal expansion (CTE), and the electronic component has a second CTE. The assembly further comprises a conductive material on the carrier substrate for connecting the electronic component to the carrier substrate, and the electrical component is connected to the carrier substrate by heating and then cooling this conductive material. The electronic component includes an expansion joint to allow the electronic component to expand and contract relative to the carrier substrate during the heating and cooling of the conductive material.

Abstract: Methodologies and structure are provided for use in a communications line that transmit data without plain old telephone service (POTS), or splits the POTS service from the data service, to inhibit oxidation of electrical connections within the physical communications line between the central office of a service provider and a subscriber premises and/or subscriber equipment. A direct current load is drawn by a sealing current terminator circuit that is electrically coupled across the communications line at a convenient location proximate or within the subscriber's location so as to assist in providing oxidation reducing direct current flow along a portion of the communications loop coupling the service provider with the subscriber.

Abstract: A module having a stacked magnetic device and semiconductor device, and method of forming the same. In one embodiment, the module includes a printed wiring board including a patterned conductor formed on an upper surface thereof. The module also includes a magnetic core mounted on the upper surface of the printed wiring board proximate the patterned conductor and a semiconductor device mounted on an upper surface of the magnetic core.

Abstract: Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

Abstract: An electronic module, comprising: a conductive-pattern layer; an insulating-material layer supporting the conductive-pattern layer; at least one component inside the insulating-material layer, the at least one component comprising a first surface and contact zones on the first surface; a first hardened adhesive layer on the first surface of the at least one component; a second hardened adhesive layer in contact with the conductive-pattern layer and the first hardened adhesive layer; holes in the first and second hardened adhesive layer at the locations of the contact zones; and conductive material in the holes and in electrical connection with the contact zones of the component and the conductive-pattern layer.

Abstract: The document describes a circuit board and an electronic module, comprising a conductor-pattern layer, an insulating-material layer supporting the conductor-pattern layer, and at least one component inside the insulating-material layer. The component has a plurality of contact areas and the circuit board or electronic module comprises contact elements between the conductor-pattern layer and contact areas for electrically connecting the conductor-pattern layer and the at least one component such that at least two of the contact elements are in direct contact with a common contact area.

Abstract: The invention relates to a joint which can be subjected to the temperature influences of an external medium (20) and joins an especially ceramic component (2) to an especially metallic component (1). Said joint consists of a first adhesive joint (14) between the metallic component and the ceramic component, and a second adhesive joint (22), the adhesive (16) of the second joint having a higher elasticity than that (10) of the first adhesive joint (14), and the second joint being arranged in such a way that it prevents direct contact between the first adhesive joint (14) and an external medium (20). The inventive joint can preferably be used, for example, preferably in a sensor module of a measuring appliance which can be introduced into a medium to be analyzed.

Abstract: A method for manufacturing an electronic device and a device manufactured according to this method including an assembly of at least two insulating sheets, at least one electronic element, a first insulating sheet including at least one window in which the electronic element is at least partially lodged. One face of the electronic element flushes with the external surface of said first insulating sheet. The device may further include an internal module located between the two insulating sheets, a layer of filling material, an adhesive protection film extending over a region covering at least the outline of the window, said protection film being situated between the first insulating sheet and the layer of filling material covering the protection film and the internal module, conductive connection areas electrically linked to the internal module through an opening of the protection film and positioned on an internal face opposite to the external face of the electronic element.

Abstract: A memory module assembly (100) includes a memory card (200) having a right side surface (240) and a left side surface (220), a heat sink (400) and a heat pipe (500). The heat sink includes a base member (420) attached to the left side surface of the memory card and a shell (440) attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion (422) attached to the left side surface of the memory card and a support portion (424) extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator (520) in thermal engagement with one of the shell and the substrate portion and a condenser (540) in thermal engagement with the support portion.

Abstract: The electronic module (BG) incorporates a specified separation edge (SAK, SAK1, SAK2, SAK3) for the mechanical, irreversible separation of a separable part (AT, AT1, AT2, AT3) of the module (BG) from the remainder of the module (BGR), both the separable part (AT, AT1, AT2, AT3) and the module remainder (BGR) incorporating essentially interacting circuit components (ST1, ST2) for an intended electrotechnical operation of the module (BG). By separating the separable part (AT, AT1, AT2, AT3) the electrotechnical operation of the module (BG) can be permanently deactivated.

Abstract: An electronic device includes a main body, a cover rotatably connected to the main body, at least one locking mechanism for fastening the cover to the main body, and a switch. The locking mechanism defines a locking hole in the main body and includes a locking member fixed to the cover. The locking member includes a magnetic member, an electromagnet, a compressed spring, and a locking pin. The electromagnet is electrically connected to the switch, and is operable to be powered off via switching the switch. The spring is disposed between the magnetic member and the electromagnet, and moves one of the magnetic member and the electromagnet when the electromagnet is powered off. The locking pin is inserted into the locking hole when the cover covers the main body and the electromagnet is powered off.

Abstract: An embodiment of a package for Micro-Electro-Mechanical Systems of the MEMS type comprising a base for the assembly of said MEMS and a protective envelope, for containing the MEMS. The base is a multi-layer structure with at least one layer of composite material to make a substrate and at least one flexible wing projecting from the substrate, such base being a monolithic element suitable for being connected to external connection tracks.

Abstract: A computer system is provided that includes a chassis, a system board coupled to the chassis, and a first connector extending from the system board at a first height and configured to receive a first printed circuit board, wherein the first printed circuit board is configured to be parallel to the system board when received by the first connector, and a second connector extending from the system board at a second height and configured to receive a second printed circuit board, wherein the second printed circuit board is configured to be parallel to the system board when received by the second connector. Other computer systems are provided that include a first mezzanine card and a second mezzanine card or multiple connectors and a plurality of printed circuit boards.

Abstract: An interference shielded, for example a RFI and/or EMI shielded, for an electronics module which forms a contact with at least one edge zone of a circuit board, is provided. The contact functions in the electronics module as a ground. The circuit board includes an outermost electrically conductive layer providing the interference shield of the electronics module; at least one circuit card layer unit comprising electronics components and a wiring pattern embedded into a filling material of the circuit board layer; and encapsulating activation material layer. The activation material layer is advantageously a substrate layer or a resin layer, and which overlays above the topmost circuit board layer, and which is arranged into a space between the outermost layer and topmost circuit board layer to be therein conformingly against the inner surface of the outermost layer for isolating the electronic components and the wiring pattern from outermost layer.

Abstract: Disclosed herein is an apparatus. The apparatus includes a first body, a second body, and an electronic circuit. The first body includes a first end, a second end, and a middle section. The first body further includes a first conductor receiving area and a recessed cavity. The first receiving area extends from the first end to the second end. The cavity is at the middle section. The second body is adapted to be removably connected to the first body. The second body includes a first end, a second end, and a second conductor receiving area. The second conductor receiving area extends from the first end to the second end. The apparatus is adapted to receive an electrical conductor between the first receiving area and the second receiving area. The electronic circuit is at the cavity. The electronic circuit is configured to receive reference information corresponding to the electrical conductor.

Abstract: With the objective of improving an energy storage device comprising a transducer unit and a capacitor module which interacts with the transducer unit so it can be inserted as a physical device into a motor vehicle in particular, it is proposed to provide a housing to accommodate the capacitor cells of the capacitor module, for the housing to comprise a capacitor chamber accommodating the capacitor cells, and for the capacitor chamber to have a gas-tight seal.

Abstract: A power supply assembly includes a housing having side walls, end walls, and a bottom wall defining a rectangular box with an interior space and an open top. A first dividing wall and a second dividing wall are positioned in the interior space of the housing which divides the interior space into first, second, and third compartments. A method of manufacturing a power supply with the above power supply assembly includes installing a printed circuit board in the second compartment and positioning the first wire set to terminate in the first compartment and the second wire set to terminate in the third compartment.

Abstract: A semiconductor mounting board 80 is prepared by electrically joining an IC chip 70 via an interposer 60 of high rigidity to external pads 41 and internal pads 43, which are formed on the uppermost surface of a build-up layer 30. When the IC chip 70 generates heat, since pads 41 are positioned away from the center, a large shearing stress is applied to the portions at which pads 41 are joined to the interposer 60 in comparison to the portions at which pads 43 are joined to the interposer 60. Here, pads 41 are formed at substantially flat wiring portions and thus when joined to the interposer 60 by means of solder bumps 51, voids and angled portions, at which stress tends to concentrate, are not formed in the interiors of solder bumps 51. The joining reliability is thus high.

Abstract: A tower includes an outer portion forming an outer covering for the wind turbine tower and an inner portion disposed within the outer portion. The inner portion includes a preassembled power module including an upwardly extending support and electrical components that extend outwardly beyond the upwardly extending support and guide supports coupled at a first end to the upwardly extending supports and extending outwardly beyond the electrical components.

Abstract: A box for an electronics module for controlling a machine, in particular an engine, wherein the box comprises: a portion co-operating with at least one harness for connecting the box mechanically and electrically to the machine; and a bottom, two lateral sides, and a transverse side defining a housing for receiving the electronics module, and connector means of the electronics module.

Abstract: In a module base unit (1) for a module (30) for a data carrier, two connection plates (2, 3) are provided, which comprise electrically conductive material and which each have a direction of extent (4, 5) and which are separated from each other by a gap (16) transverse to the two directions of extent (4, 5), and at least one strain relief member (34) is connected to the two connection plates (2, 3), which strain relief member (34) is constructed to absorb tensile forces occurring parallel to the directions of extent (4, 5) and acting on the connection plates (2, 3).

Abstract: This publication discloses an electronics module and a method for manufacturing it. The electronics module includes at least one component (6) embedded in an insulating-material layer (1), which has a first contacting surface, in which there are first contact terminals (7), from which the component (6) is connected electrically to the conductor structures contained in the electronics module. In addition, the component (6) has a second contacting surface opposite to the first contacting surface, in which there is at least one second contact terminal (7?), from which the component (6) is connected electrically to the conductor structures contained in the electronics module. With the aid of the invention, it is possible to achieve an electronic-module construction that saves space compared to the prior art.

Abstract: An accessory system for a vehicle includes a windshield that has a mounting element adhesively attached to its inner surface, an interior rearview mirror assembly, and an accessory support adapted for mounting to and demounting from the mounting element. The accessory support includes an accessory receiving portion configured to receive an accessory. The accessory support may comprise part of the interior rearview mirror assembly or may include a mirror mounting element with the interior rearview mirror assembly adapted for mounting to the mirror mounting element of the accessory support. The accessory comprises an imaging sensor and the accessory receiving portion is configured to receive the imaging sensor in a manner that compensates for the windshield angle of the windshield so that the imaging sensor has a more generally horizontal forward field of view through the windshield when the accessory support is mounted to the mounting element.

Abstract: An apparatus includes a case including a surface, a bottom face and a first hole arranged on the bottom face; a first connector on the bottom face of the case; and a guide pin arranged in the first hole and being capable of moving in the first hole.

Abstract: A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of the base substrate to expose the backside of the package level contacts. Accordingly, an essentially true chip scale package is formed. Multi-chip modules are formed by filling gaps between the chips with an encapsulant. In an embodiment, chips are interconnected by electrical connections between package level contacts in the base substrate. In an embodiment, substrates each having chips are adhered back-to-back with through vias formed in aligned saw streets to interconnect the back-to-back chip assembly.

Abstract: A flash drive and a housing assembly thereof is provided. The housing assembly comprises a housing, a base and a rotating mechanism. The housing has a first opening, a second opening, and a space, the first opening is situated at a side surface of the housing, and the second opening is situated on a top surface of the housing. The base is used for accommodating a storage device which has a connecting member, the base is movably disposed in the space and has a slot facing the second opening. The rotating mechanism is disposed at the second opening and mounted to the housing, the rotating mechanism has a protrusion portion movably engaged in the slot. When the rotating mechanism rotates relative to the housing, the protrusion portion moves along the slot and drives the base to reciprocate between a first position and a second position.

Abstract: In one example embodiment, a pluggable optoelectronic module includes a shell with a front, back, and first and second sides. A first guiderail protrudes from the first side and extends from the front of the shell to the back of the shell. A second guiderail protrudes from the second side and also extends from the front of the shell to the back of the shell. A first thumbscrew runs the length of the module and is housed within the first guiderail. A second thumbscrew also runs the length of the module and is housed within the second guiderail. The two thumbscrews are configured to secure the module to a host device when the module is plugged into the host device.

Abstract: A connecting module includes a housing, electric contacts for connecting wires and/or cables, and at least one fastening element that allows the connecting module to be fixed to an assembly frame. The fastening element is embodied at least in two parts, encompassing a first fastening piece and a second fastening piece. The connecting module can be put on the assembly frame by means of the first fastening piece and can be locked on the assembly frame with the aid of the second fastening piece.

Abstract: A manufacturing method and an electronic module manufactured according to the method including an assembly with two insulating sheets and an electronic element. A first insulating sheet constituting one of the faces of the module including at least one window in which the electronic element is housed, one face of said element levelling the surface of said first sheet and appearing on the exterior face of the module. The second insulating sheet constitutes the other face of the module. The module includes an adhesive film which extends over a region covering at least the outline of the window of the element and is situated in a region situated between the first sheet and the second sheet. The module can also include at least one electronic circuit placed between the two insulating sheets and connected to the element on the conductive connection areas located on the interior face of the element.

Abstract: A microelectronic assembly and a method for forming a microelectronic assembly are provided. First and second substrates (32, 68) are provided. Each substrate has first and second opposing sides. The first substrate (32) has a first microelectronic device formed on the first side (46) thereof, and the second substrate (68) has a second microelectronic device formed on the first side (82) thereof. The first and second substrates (32, 68) are interconnected with at least one support member (100) such that the at least one support member (100) is positioned between the second side (48) of the first substrate (32) and the first side (82) of the second substrate (68). At least one conductive member (98) is provided that electrically connects the first microelectronic device to the second microelectronic device.

Abstract: A connection port and a circuit board module employing such a connection port are provided. The circuit board module includes a circuit board, a plurality of electronic components, a switch, a control unit connected to the switch, and a connection port. The electronic components, the switch, the control unit and the connection port are disposed on the circuit board. The connection port is adapted for connecting with a connector. The connection port includes a body, a plurality of first connection terminals for connecting with the connector, and a detection terminal. Each of the first connection terminals has one end connected to the control unit via the switch. The detection terminal has one end connected with the switch of the circuit board module. When another end of the detection terminal gets in contact with the connector, the switch electrically conducts the first connection terminals with the control unit.

Abstract: An electronic module includes a printed circuit board with a heat producing electrical component assembled in an insulating housing. The component is adjacent a thermally conducting heat sink with a thermally conductive material disposed therebetween. Integral with the heat sink is a thermally conductive runner, partially encased in the housing wall, connecting the heat sink to a thermally conductive port. The port is coupled to a base structure when the housing is attached to the base, forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.

Abstract: An outside plant fiber distribution apparatus includes a frame member and a plurality of fiber optic modules mounted to the frame member. The frame member includes upper and lower module mounting brackets. Each module includes a front and two mounting flanges, each mountable to one of the upper and lower module mounting brackets. At least one of the modules is configured as a connection module including a plurality of connection locations disposed along the front of the module. A rear of the module includes a cable notch region for receipt of a cable. At least one of the modules defines a storage module including first and second spools. In an interconnect system, the storage module includes a cable clamp for holding a second cable, the cables are connected through the connection locations of the connection module. In a cross-connect system, two connection modules are provided, and patch cords are used to connect the fronts of the connection modules.