Abstract: A process and product made from the process is disclosed to minimize solder collapse during solder reflow. Predetermined bond pads on a layer or component have a solder paste such as Sn63 solder paste with a first lower reflow temperature applied and a spacer element such as an SAC solder ball or stud bump having a predetermined geometry with a second higher reflow temperature applied. The SAC solder balls or stud bumps act as spacing elements but do not interact with the solder paste such that the solder paste may be reflowed while precisely maintaining the space between the layers.

Abstract: A power module located on a conductive substrate including power conversion circuitry. The power conversion circuitry includes a magnetic device and at least one switch. The magnetic device includes a magnetic core having a surface facing the conductive substrate and a conductive clip facing a surface of the magnetic core with ends of the conductive clip electrically coupled to the conductive substrate to cooperatively form a winding therewith about the magnetic core. The power module also includes an encapsulant about the power conversion circuitry.

Abstract: An IC device includes a base plate, a plurality of terminal pins, a functional component such as an IC chip, and a resin package for protection of the functional component. The base plate is generally flat and formed with a plurality of through-holes into which the terminal pins are inserted. The functional component, disposed away from the base plate, is mounted on a printed circuit board to be electrically connected to at least one of the terminal pins. While enclosing the functional component, the resin package is held in contact with the upper surface of the base plate.

Abstract: A semiconductor module and a method. One embodiment provides a housing with a housing frame and a pluggable carrier which is plugged in the housing frame. The pluggable carrier is equipped with a lead which includes an internal portion which is arranged inside the housing, and an external portion which is arranged outside the housing. The internal portion is electrically coupled to an electric component of the power semiconductor module. The external portion allows for electrically coupling the power semiconductor module.

Abstract: An integral cable guide for an electronic module is provided. The electronic module includes a top housing with a ridge formed on one side. The top housing is configured to removably couple with a bottom housing to enclose electronic components. The electronic module further includes a receptacle within the top housing configured to receive a removable terminal block (RTB), such that a channel is formed between the ridge and the RTB when the RTB is placed within the receptacle. The channel guides cables coupled to the RTB to an outside edge of the module. The electronic module further includes at least one anchor that provides support for the cables.

Abstract: A display apparatus including a display module and a protection structure is provided. The display module has an image display region and a trace disposing region surrounding the image display region. The protection structure is disposed on the display module and includes a cover, a first electrode layer, a substrate, a second electrode layer and a display medium layer. The first electrode layer is disposed on the cover and the location of the first electrode layer at least shields the trace disposing region. The substrate is disposed between the cover and the display module. The second electrode layer is disposed on the substrate corresponding to the first electrode layer. The location of the second electrode layer at least shields the trace disposing region. The display medium layer is disposed between the first electrode layer and the second electrode layer, wherein the display medium layer substantially surrounds the image display region.

Abstract: Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board.

Abstract: A seal includes a housing with an exterior surface. The housing forms a cavity extending from the exterior surface into the housing and defines at least one slanted interior surface. The at least one slanted interior surface extends from the exterior surface of the housing and is in a substantially non-perpendicular and angled relation to the exterior surface of the housing. The seal also includes at least one electrical lead that extends through the housing and has a portion exposed across the cavity therein. The at least one electrical lead extends from the housing and is configured to be in electrical contact with at least one electrical component encased within the electronic control housing. The seal also includes an adhesive material that substantially fills the cavity and surrounds the exposed portion of the at least one electrical lead within the cavity.

Abstract: A modular computer includes a display with a docking station on its back side. A CPU module connects to the docking station. Peripheral modules connect with the resulting display/CPU assembly so that the peripheral modules contact the back side of the display screen.

Abstract: The present invention relates to a terminal structure and an electronic device having the terminal structure. The terminal structure includes: a terminal having: a conductor layer containing at least one metal selected from gold, silver, and copper; a first layer containing nickel and phosphorus, laid on the conductor layer; a second layer having a smaller atomic ratio of nickel to phosphorus than the first layer and containing Ni3P, laid on the first layer; and a third layer containing a first intermetallic compound of an Ni—Cu—Sn type, laid on the second layer; and a solder layer on the third layer of the terminal. A second intermetallic compound of an Ni—P—Sn type partly covers a surface of the second layer on the third layer side and a maximum thickness of the second intermetallic compound in a lamination direction is from 0.05 to 0.7 ?m.

Abstract: Embodiments include devices and methods for manufacturing a module having a first shielded compartment and a second shielded compartment, wherein the first shielded compartment is electrically isolated from the second shielded compartment. Electrical conductivity is controlled in a manner in which current flow between shielded circuits is directed to reduce or eliminate energy from being coupled between one or more shielded compartments on the same module. Each module may have a plurality of individual shielded compartments, where each compartment has a dedicated ground plane. The shields for each compartment may be tied to the dedicated ground plane of the compartment. Because the dedicated ground planes are not tied together, each of the shielded compartments on the modules remains isolated from all the other shielded compartments on the modules. In some embodiments having a plurality of shielded compartments, there is at least one isolated shielded compartment depending upon the design needs of the module.

Abstract: The present invention relates to a terminal structure. The terminal structure includes: a terminal having: a conductor layer containing at least one metal selected from gold, silver, and copper; a first layer containing nickel and phosphorus, laid on the conductor layer; a second layer having a smaller atomic ratio of nickel to phosphorus than the first layer and containing Ni3P, laid on the first layer; a third layer containing a first intermetallic compound of an Ni—P—Sn type, laid on the second layer; and a fourth layer containing a second intermetallic compound of an Ni—Cu—Sn type, laid on the third layer; and a solder layer on the fourth layer of the terminal. Ra2 is larger than Ra1, where Ra1 is a surface roughness of the third layer on the second layer side and Ra2 is a surface roughness of the third layer on the fourth layer side.

Abstract: A reprogrammable subscriber terminal of a subscription television service which can have the control program code of its control processor modified by downloading new program code from the headend. The control processor stores a boot program in an internal read only memory. Upon start up and resets, the boot program determines whether the control program should be changed from a command sent from the headend. The command, termed a parameters transactions, includes the number of expected download program code transactions required to complete the control code modification, the memory space areas where the code is to be loaded, and the channel over which the download program code transactions are to be transmitted. The channel is tuned and when the boot program receives all the download program code transactions accurately and stores them, the boot program will cause the control program to be restarted at a selected address of the new or modified control program code which has been downloaded.

Abstract: A wiring board 10 includes a wiring board main body 11 having a semiconductor device attaching pad 21 on which a semiconductor device 14 is attached, a dielectric layer 22 provided with the semiconductor device attaching pad 21, and a semiconductor device attaching area A in which the semiconductor device 14 is attached, and a stiffener bonded to a surface 22A of the dielectric layer 22 on the side where the semiconductor device attaching pad 21 is formed and having a semiconductor device attaching through portion 12A to expose the semiconductor device attaching area A, characterized in that a notch portion 41 for exposing the surface 22A of the dielectric layer 22 in a part located outside the semiconductor device attaching area A is provided on the outer periphery of the stiffener 12.

Abstract: In one example embodiment, an electronic module comprises a plurality of components and flex circuit connectors each electrically connected to respective components of the electronic module. The electronic module may be an optical subassembly of an optical transceiver. Moreover, one of the flex circuit connectors may be physically connected to another of the flex circuit connectors.

Abstract: A display kiosk for housing a flat screen monitor and associated electronic equipment is disclosed. The display kiosk includes a lower unit assembly and an upper unit assembly. The display kiosk is assembled in two parts and provides easy access to the internal components for maintenance, repair and upgrades.

Abstract: In one example, a pluggable module comprises a shell, a module connector, and one or more thumbscrews. The shell defines a cavity within which a PCB and one or more components are disposed and includes a front, back, first side, and second side. The module connector is operatively connected to the PCB near the back of the shell and extends from within the cavity to outside the shell through an opening defined in the back of the shell. The module connector is configured to operatively couple the pluggable module to a host device. The thumbscrews are housed within one or more portions of the shell and are configured to threadably secure the pluggable module to the host device. Each of the thumbscrews comprises a torque limiter. The pluggable module can further comprise protecting means for protecting a portion of the module connector extending outside the cavity from damage.

Abstract: A multiple electronic device power supply, battery charger, and USB docking system has a plurality of power ports for charging/powering electronic devices and a plurality of USB ports for coupling peripheral devices to a computer or large electronic device. Electronic devices which may be charged using the present invention can require current from less than 500 mA to approximately 6 A. Voltage setting resistors in specialized adapters serve to set the voltage needed for individual devices in order to manage current and voltage distribution throughout the present invention, particularly when large and mid-sized electronic devices are connected to the present multiple device charger and docking system. Default settings set the voltage output at 24 volts if not otherwise directed.

Abstract: A microelectronic unit includes a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can include a microelectronic element having a bottom surface adjacent the inner surface, a top surface remote from the bottom surface, and a plurality of contacts at the top surface. The microelectronic element can include terminals electrically connected with the contacts of the microelectronic element. The microelectronic unit can include a dielectric region contacting at least the top surface of the microelectronic element. The dielectric region can have a planar surface located coplanar with or above the front surface of the carrier structure. The terminals can be exposed at the surface of the dielectric region for interconnection with an external element.

Abstract: An apparatus (10) comprises a module (12); a chassis (30) into which the module (12) is able to be inserted; and a first resilient member (38). The resilient member (38) interposes between the module (12) and a weight bearing surface (32) of the chassis (30), when the module (12) is inserted into the chassis (30), so as to bear at least a portion of the weight of the module (12). When the first resilient member (38) bears at least a portion of the weight of the module (12), the module (12) is at a desired position inside the chassis (30).

Abstract: The invention is a modular assembly of modular objects for autonomously executing a variety of tasks. The modular assembly consists of a modular object called a platform, one or more modular objects called modules which are mounted to the platform in accordance with a modular assembly system, and a modular bus system for distributing electrical power and electrical signals among the modular objects in the modular assembly. The modular assembly system utilizes modular object fasteners (MOFs) and MOF-accommodating features of modular objects for facilitating the attachment of a plurality of modular objects to one another thereby creating a modular assembly in any one of a variety of configurations, an MOF being activatable when object attachment surfaces associated with two modular objects are superimposed and two object attachment points on the object attachment surfaces coincide.

Abstract: A circuit board unit of an ECU has an upper surface on which semiconductor elements are installed, a lower surface that is on the opposite side of the circuit board unit from the upper surface, and a cutout portion that is formed below the upper surface. A power module includes a conductive protruding and an electrically insulating main portion that holds the protruding piece. The conductive protruding piece is inserted in the cutout portion to support the circuit board unit, and is electrically connected to the semiconductor elements.

Abstract: A control unit for controlling an electromotive drive unit has a housing (16), which can be connected to the drive unit by a mechanical interface device, and a plug-in device (17) provided on the housing, for plugging in a cable (20) that is guided to the hosing from the outside, wherein contact pins (6) of the plug-in device are arranged in at least one slot (18) of the plug-in device (17) and are electrically connected to conductor tracks of a circuit board (8), which is arranged on the inside of the housing. The at least one slot (18) is arranged on the side (7) of the housing (16) facing away from the drive unit and is formed by a connector collar (5), which is configured as one piece with the housing (16) and made of the same polymer material.

Abstract: A method of producing an electronic device includes a holding of a circuit board and a decoration sheet in a cavity of a mold, and a filling and solidifying of thermosetting resin in the cavity. A casing is molded by the solidified thermosetting resin so as to seal electronic parts and a first face of the circuit board having the electronic parts. Further, the decoration sheet is integrated with the casing by the solidified thermosetting resin. An outer surface of the casing is defined by a second face of the circuit board opposite from the first face and the decoration sheet.

Abstract: A power conversion device according to the present invention includes: a power module (300) that converts DC power into AC power and supplies the AC power to a motor; an electronic circuit board (22), placed above the power module (300), that drives the power module (300); and a housing (12) that includes a power module mounting surface on which the power module (300) is mounted, and houses the power module (300) and the electronic circuit board (12), wherein: the power module (300) includes a first protruding section (350) that is formed to protrude towards the electronic circuit board (22), and is engaged with a recess or a hole (352) formed on the electronic circuit board (22); and a second protruding section (351) that is formed to protrude towards the housing (12), and is engaged with a recess or a hole (354) formed on the housing (12), wherein: the first protruding section (350) and the second protruding section (351) are aligned in a substantially vertical direction of the power module mounting surface

Abstract: A module, in particular a sensor module, has a module housing, a carrier element, a connection element, and at least one component, the module housing completely enclosing the at least one component and being situated on the carrier element, and the at least one component also being mounted on the connection element and being situated between the connection element and the carrier element.

Abstract: An improved smoke detector device comprising a base for mounting to a place on a ceiling or a wall via a mounting means; and a ring for removably attaching to the base, the ring comprising at least two modules that removably connect together via a connecting means to form the ring, wherein each module comprises an inner chamber and a door, the inner chamber of each module can hold an item, the door of each module can move between an open position and a closed position for respectively allowing and preventing access to the inner chamber of the module.

Abstract: An electronic controller that is adapted to cooperate with a decorative wall plate is provided. In one illustrative embodiment, the electronic controller may be adapted to be mounted in a junction box, with a user interface having a shape and size to fit within one or more apertures in a wall plate. The wall plate may be secured relative to the electronic controller and/or junction box such that the user interface extends at least partially through the one or more aperture in the wall plate.

Abstract: A display module including an electronic component and a panel module is provided. The electronic component is installed inside the display module. The panel module includes a first side and a second side, and the first side includes a glass module having an electro-conductive material and a display region, wherein the glass module includes an electronic component projection area and the electronic component projection area does not contain the electro-conductive material to prevent affecting the performance of the electronic component. The electronic component projection area is an area where the electronic component is projected on the panel module along a normal direction of the display region. According to a design requirement of the product, the electronic component may be fixed to a frame combined with the panel module or located in the glass module.

Abstract: A device includes: a wiring board having first and second surfaces opposing each other; and a plurality of memory packages on the first surface. The wiring board includes: a first set of terminals on the first surface; a plurality of second sets of terminals on the first surface; and a plurality of first signal lines. The terminals of the first set receive respective ones of a plurality of first signals supplied from a control device. Each of the second sets is provided for a corresponding one of the memory packages. The terminals of each of the second sets contact the corresponding one of the memory packages. The first signal lines extend from respective ones of the terminals of the first set while coupling respective ones of the terminals of each of the second sets. The first signal lines extend on the first surface without extending in the wiring board.

Abstract: One example includes a capacitor case sealed to retain electrolyte, electrolyte disposed in the capacitor case, a capacitor electrode disposed in the capacitor case, an electronic component mounted to the capacitor electrode and disposed in the capacitor case, the electronic component including two contacts, with a first contact mounted onto the capacitor electrode and with a second contact mounted onto a terminal disposed on an exterior of the capacitor case and sealingly extending through the capacitor case, the first and second contacts electrically isolated from one another, a additional capacitor electrode disposed in the capacitor case, a separator disposed between the capacitor electrode and the additional capacitor electrode and a additional terminal disposed on the exterior of the capacitor case and in electrical communication with the additional capacitor electrode, with the terminal and the additional terminal electrically isolated from one another.

Abstract: A connection port and a circuit board module employing such a connection port are provided. The circuit board module includes a circuit board, a plurality of electronic components, a switch, a control unit connected to the switch, and a connection port. The electronic components, the switch, the control unit and the connection port are disposed on the circuit board. The connection port is adapted for connecting with a connector. The connection port includes a body, a plurality of first connection terminals for connecting with the connector, and a detection terminal. Each of the first connection terminals has one end connected to the control unit via the switch. The detection terminal has one end connected with the switch of the circuit board module. When another end of the detection terminal gets in contact with the connector, the switch electrically conducts the first connection terminals with the control unit.

Abstract: A lighting apparatus is provided including an array of light emitting diodes (LEDs) disposed on a base. The base is configured to move heat away from the array of LEDs to other portions of the base and further to the atmosphere or an adjacent housing. In one embodiment, a native oxide on the base electrically insulates the base from the LEDs. In another embodiment, a cover is removably disposed over the array of LEDs, and removal of the cover prevents electrical energization of the LEDs.

Abstract: An electronics component assembly for cooling high power density components including a fluid cooled module cover. In one embodiment, the electronics component assembly includes a module cover that is configured to make thermal contact with heat-generating electronic components of a module. The module cover includes an inlet, an outlet and at least one fluid passageway between the inlet and the outlet. The fluid passageway permits fluid to flow through the module cover, thereby allowing the module cover to act as a heat sink.

Abstract: An electronic device includes a display unit and a main unit; and the main unit includes a separable module and a base. The separable module is provided along two opposite shorter edges with a plurality of hooking elements, and has at least one carrier member located on one side of the separable module. The base includes a plurality of retaining slots corresponding to the hooking elements, and at least one magnetic element located on one side of the base facing toward the carrier member. To cover the separable module onto the base, first cause the carrier member to be magnetically attracted to the at least one magnetic element and align the hooking elements with the retaining slots, and then move the separable module for the hooking elements to engage with the retaining slots, so that the separable module is held to the base.

Abstract: An electrical power module (2) to be mounted on a printed circuit board (1), comprising a first side (21) to be mounted on a surface of a heat sink (3), wherein, in a mounted position of the electrical power module (2) on the heat sink (3), the first side (21) is arranged substantially parallel to the heat sink (3), and a second side (22) provided with electrical connection elements (23), wherein the electrical connection elements (23) are adapted to electrically connect the electrical power module (2) to the printed circuit board (1).

Abstract: A stacked semiconductor package includes a first semiconductor package having a first semiconductor chip having a first pad and a through-hole passing through a the portion corresponding to the pad; a second semiconductor package disposed over the first semiconductor package, and including a second semiconductor chip having a second pad disposed at a portion corresponding to the first pad and blocking the through-hole; and a through-electrode disposed within the through-hole, and having a pillar shaped core supported by the second pad, a through-electrode unit disposed over a surface of the core and electrically connected with the second pad, a first metal layer interposed between the core and the through electrode unit, and a second metal layer interposed between an inner surface of the first semiconductor chip formed by the through-hole and the through-electrode unit.

Abstract: A power module operable to sense current, such as but not limited to a power module operable within a vehicle to sense current while rectifying an AC input to a DC output. The power module may include a shunt disposed relative an output of the power module to facilitate the current measurement.

Abstract: A module receptacle having a main frame arranged to hold a mountable functioning module in a specified position with respect to a covering frame. The covering frame can be attached by means of at least one fastening element to the main frame. The covering frame is at least large enough to cover the main frame.

Abstract: A semiconductor module is provided, which is capable of suppressing the deterioration of reliability and improving heat radiation. The semiconductor module includes: a semiconductor substrate in which electrodes of a circuit element are formed on its surface; a re-wiring pattern connected to the electrodes to ensure large pitch of the electrodes; an electrode integrally formed with the re-wiring pattern; an insulating layer formed on a rear surface of the semiconductor substrate; a radiator formed on the insulating layer; and projections integrally formed with the radiator and penetrating the insulating layer to connect to the rear surface of the semiconductor substrate.

Abstract: An electronic module (10) includes a housing having a longitudinal body portion and a mounting portion extending rearward from the body portion, with a channel (1221) defined in a top or bottom section of the mounting portion; an ejector mechanism including a slider member (61) accommodated in the channel of mounting portion and an actuator member (62) pivotally engaged with the mounting portion, said actuator member further linked to the slider member for pushing the slider member forwardly moving along the channel; and a spring member (8) arranged between the slider member and the mounting portion and capable of pushing the slider member rearward moving along the channel.

Abstract: An edge connector includes, a multilayer printed board having an inner layer and a connector edge, an electronic circuit disposed on the multilayer printed board, an electrical terminal on the multilayer printed board and spaced by a predetermined clearance from the connector edge, an electrical conductor on the multilayer printed board and connected between the electronic circuit and the electrical terminal, a via connected to the electrical terminal and extending to the inner layer of the multilayer printed board, and a lead conductor on the inner layer of the multilayer printed board and connected at one end to the via, another end of the lead conductor being exposed at the connector edge. The electrical terminal is plated. The sum of the length of the via and the length of the lead conductor is less than one-sixth of the wavelength of an electrical signal transmitted.

Abstract: An electronic module (100) includes a housing having an outer surface and a metallic gasket (5) attached to the housing and substantially covering the outer surface. The gasket (5) includes an outer configuration with a plurality of elastic detents (52) and a unitary inner configuration with a seamless sheet (51).

Abstract: An arrangement is described for receiving an electrical converter module for converting a first frequency of an electrical input signal into a second frequency of an electrical output signal. A rack includes input terminals for receiving the electrical input signal and output terminals for providing the electrical output signal. A slot receives the converter module in a first and second positions where in first position the converter module is electrically connected both to the input and output terminals and in the second position the converter module is electrically disconnected both from the input and output terminals. An actuator, which is mounted to the rack and which, in response to a disconnect trigger signal, is adapted to move the electrical converter module from the first position to the second position.

Abstract: An integrated circuit module with temperature compensation crystal oscillator (TCXO) applying to an electronic device comprises: one substrate having one top surface; one temperature compensation crystal oscillator (TCXO) disposed on the top surface; at least one chip disposed on the top surface; one encapsulating piece formed on the top surface for covering the TCXO and the chip. As above-described structure, TCXO is prevented from exchanging heat due to the temperature difference so that the stability of the TCXO is improved.

Abstract: There is provided a camera module package including: a housing having an optical system; a board bonded to a bottom end of the housing and mounting an image sensor on a top surface thereof; a contact part integrally formed in the housing to electrically connect a sensor bonding pad of the image sensor with a board bonding pad of the board each other when the housing is engaged with the board. In the camera module package, a process of bonding the housing and the board together is performed at the same time as a process of electrically connecting the image sensor and the board to each other. This simplifies an assembly process and enhances productivity. Also, the camera module package is fundamentally free from contamination of external contact terminals caused by an overflowing bonding material when the board and the housing are bonded together.

Abstract: A carrier for supporting an expansion card is disclosed herein. The expansion card is configured for connection to a server. The carrier includes a module that is configured to receive and removably retain the expansion card. The module is further configured to support the expansion card in a position that aligns the expansion card with a receiver in the server. The module is further configured to move with respect to the receiver to facilitate connection of the expansion card to the receiver.

Abstract: A power converter which can attain a reliable electric connection with electrodes of a power module by facilitating positioning of conductors connected to the electrodes of the power module. The power converter includes the power module having the plurality of electrodes in the form of plate-shaped conductors within a casing having a lid, and also includes a plurality of plate-shaped conductors connected to the electrodes of the power module. Male screws are embedded in ones of the electrodes of the power module provided at least on the side of the lid to be projected therefrom, the plate-shaped conductors connected to the electrodes having the male screws are formed therein with holes at locations corresponding to the male screws, the male screws being inserted in the corresponding holes, and electrically connected with the electrodes with nuts fastened to the male screws.

Abstract: An intelligent electronic device and a method for activating a function in an intelligent electronic device; the device includes an inter-module bus, a first interface and a number of hardware modules connected to each other via the inter-module bus. The modules include a process control module including a control unit that senses the types of hardware modules connected to the inter-module bus, that obtains set-up data from an external portable data carrier, where the set-up data includes configuration data and verification data, where the verification data includes hardware type data related to the modules in the device, that compares the obtained verification data with own verification data including data regarding the sensed hardware type, and that activates a protection function only if there is a match between all verification data being compared.

Abstract: A method and apparatus for providing an alternative power source for a graphics card are disclosed. Specifically, one embodiment of the present invention sets forth a method, which includes the steps of laying a set of gold fingers on a printed circuit board according to an industrial standard bus interface, positioning a wire in a middle layer of the printed circuit board, attaching a first end of the wire to a specific gold finger, and attaching the alternative power source to a second end of the wire, wherein the second end of the wire is an electroplated contact protruded external to the printed circuit board.