Abstract: Systems and methods for manufacturing and packaging electronic devices with light absorptive thin film stacks are provided. In one embodiment, a light is applied to a light absorptive thin film stack disposed between a substrate and a backplate to seal the substrate to the backplate. In another embodiment, the light absorptive thin film stack includes a plurality of thin film layers. In yet another embodiment, the light absorptive thin film stack includes a spacer layer over a reflective layer and an absorber layer over the spacer layer. In still another embodiment, the light absorptive thin film stack is less than 200 nanometers thick. In yet a further embodiment, a light absorptive thin film stack is used to seal a substrate having glass, plastic, metal, or silicon to a backplate having glass, plastic, metal, or silicon. Thus, the light absorptive thin film stack is used to seal similar or dissimilar materials through a bonding process.

Abstract: The disclosed invention comprises a substrate having one or more conductive metal traces comprising one or more electrical access leads terminating on a lateral surface of the substrate. A layer or stack of layers comprising one or more integrated circuit chips having one or more access leads in electrical connection with one or more integrated circuit bond pads on the one or more integrated circuit chips is bonded to the substrate. The surface area of the layers is less than the surface area of the substrate so as to define one or more component surface areas on the substrate. The access leads of the layers are oriented to be substantially coplanar and in vertical registration with the access leads of the substrate access leads.

Abstract: A server chassis layout structure includes a chassis body, a partition plate, and a power backplane module. The chassis body includes a bottom plate, first and second top plates, and two side plates. The first and second top plates form a first opening therebetween. The side plates are mounted between the bottom and top plates. The partition plate includes at least one retaining portion and is perpendicularly fixed to the bottom plate below the first opening. The partition plate divides the chassis body into first and second sections. The power backplane module includes at least one lock portion and is vertically inserted into the chassis body via the first opening. The lock portion interferes with the retaining portion so as to assemble the power backplane module into the chassis body above the partition plate, and both the power backplane and the partition plate are exposed via the first opening.

Abstract: A surface mount crystal oscillator comprises a crystal blank, an IC chip having an oscillation circuit integrated thereon, and a hermetic package for accommodating the crystal blank and IC chip therein. The hermetic package comprises a substantially rectangular ceramic substrate formed with a metal film which makes a round on one main surface thereof, and a concave metal cover having an open end face bonded to the metal film. The IC chip is secured to the one main surface of the ceramic substrate through ultrasonic thermo-compression bonding using bumps, the crystal blank is disposed above the IC chip, and the ceramic substrate has the one main surface formed as a flat surface.

Abstract: A storage device transporter is provided for transporting a storage device and for mounting a storage device within a test slot. The storage device transporter includes a frame that is configured to receive and support a storage device. The storage device transporter also includes a conductive heating assembly that is associated with the frame. The conductive heating assembly is arranged to heat a storage device supported by the frame by way of thermal conduction.

Abstract: The present invention provides a device mounting structure and a device mounting method in which the short circuit can be prevented between a device lead part and a device ground part when the reflow process is executed. Thus, in the device mounting structure of the present invention, the device is contained in an aperture part provided in a wired board on a heat-radiating plate, a device main part of the device being fixed on the device ground part, a device lead part extending from opposing sides of the device main part is connected to a wiring part on the wired board, and an internal wall of the aperture part positioned just under the device lead part and the device ground part positioned on the heat-radiating plate are separated by a predetermined distance.

Abstract: High-frequency circuit components are disclosed in which parasitic capacitance between a high-frequency circuit element and a substrate is reduced and mechanical strength is improved. An exemplary component has a conductive substrate, a coil as the high-frequency circuit-element, a mounting board including a thin dielectric film on which the coil is mounted, and a support board that couples the mounting board to the substrate. The mounting board is coupled so that it floats relative to the substrate as a result of deliberate warping of the support board.

Abstract: An electrical device (100) having a first side (116) supported by a surface (202) and including: (a) a body (112) having the first side and a second side (117); (b) a stabilization structure (130) adjacent to the body and having at least one opening (134) therein; and (c) an electrical component (102) located at least partially within the body and having one or more first electrical connectors (120) at the second side.

Abstract: An electronic device includes a main body, an expansion card holder, and a protective cover assembly. The main body defines an opening. The expansion card holder is located in the main body adjacent to the opening. The expansion card holder defines a bay facing the opening to receive an expansion card. The protective cover assembly includes a rotary shaft unit, and a metallic cover rotatably connected to the main body via the rotary shaft unit. The metallic cover includes a cover portion covering the opening, and a resisting portion extending from the cover portion and resisting the main body. The resisting portion provides resilient force impelling the cover portion to cover the opening automatically.

Abstract: According to one embodiment, a power module includes a metal base, a ceramic substrate, a semiconductor chip, a nut holder housing a nut, an electrode terminal and a casing. The ceramic substrate is connected to an upper surface of the metal base via a lower electrode. The semiconductor chip is located on a first major surface of the ceramic substrate. The electrode terminal includes a bent portion surrounding a nut holder. The electrode terminal includes a first connecting portion extending perpendicularly to the bent portion from one end of the bent portion, and being located on the first major surface via an upper electrode, and electrically connected to the semiconductor chip. A casing is bonded to the metal base to enclose the semiconductor chip and the electrode terminal. An upper end portion of the bent portion of the electrode terminal is exposed to outside of the casing through the opening.

Abstract: The problem of damage on an antenna or a circuit (electrostatic breakdown) due to discharge of electric charge accumulated in an insulator is solved; and the problem of NAKANUKE failure is solved. A pair of conductive layers, a pair of insulators provided between the pair of conductive layers, and a chip which is provided between the pair of insulators and includes an antenna, an analog circuit, and a digital circuit are provided, in which an opening is provided for at least one of the pair of conductive layers, and the opening is provided at a position which overlaps at least the analog circuit.

Abstract: an electrical device that includes a first electrode and a second electrode that are separated from one another so as to form a gap structure. A layer of protective material spans the gap structure to contact the first electrode and the second electrode. A dimension of the gap structure, corresponding to a separation distance between the first electrode and the second electrode, is varied and includes a minimum separation distance that coincides with a critical path of the layer of protective material between the first electrode and the second electrode.

Abstract: A mobile power system comprises a plurality of energy sources, wherein at least one energy source is a solar powered generating device and at least one energy source is a wind powered generating device; a plurality of electronic and telecommunications components configured to receive the power generated by the plurality of energy sources and/or convert the power generated to direct current power; a plurality of batteries configured to store the direct current power; and one or more transportable housings configured to hold the plurality of energy sources, the plurality of electronic and telecommunications, and the plurality of batteries during transport of the housing, and wherein the at least one solar powered energy device and the at least one wind powered generating device are disposed remotely from the housing when the mobile power system is in operation.

Abstract: The present invention provides a power module in which a first semiconductor device disposed on a first substrate and a second semiconductor device disposed on a second substrate are disposed at symmetrical positions with a third substrate interposed therebetween.

Abstract: A method of fabricating a substrate core structure, and a substrate core structure formed according to the method. The method includes: laser drilling a first set of via openings through a starting insulating layer; filling the first set of via openings with a conductive material to provide a first set of conductive vias; providing first and second patterned conductive layers on opposite sides of the starting insulating layer; providing a supplemental insulating layer onto the first patterned conductive layer; laser drilling a second set of via openings through the supplemental insulating layer; filling the second set of via openings with a conductive material to provide a second set of conductive vias; and providing a supplemental patterned conductive layer onto an exposed side of the supplemental insulating layer, the second set of conductive vias contacting the first patterned conductive layer and the supplemental patterned conductive layer at opposite sides thereof.

Abstract: A highly integrated miniature RF module includes a dielectric base board with opposing top and bottom metal layers and having interconnects traces, radio frequency (RF) circuits and semiconductor chips at the top metal layer and ground and signal pads at the bottom metal layer. Metalized vias extending through the dielectric material connect the top and bottom layers. A top cover made out of laminate material, such as FR-4, with opposing top and bottom metal layers and having machined compartments and channels, surrounded with arrays of metal plated vias extending through the laminate material, protects the RF circuits and chips and provide the required isolation and wave propagation.

Abstract: A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni.

Abstract: A modular system comprises multiple hosts, each having a common service interface, multiple consumer electronic devices, each having a service interface that is different from each other and from the common service interface of the hosts, and multiple adapters, each corresponding to one of the consumer electronic devices, to couple the service interfaces of the host and the corresponding consumer electronic device to supply at least one service between the host and the corresponding consumer electronic device.

Abstract: Providing an electrical assembly, which can protect electric components provided at the electrical assembly from damage, and minimize output amount of recycle material and waste material, a functional module as the electric assembly includes a lamp and a switch as the electric components. The lamp extends from a center area of a bottom wall of a housing so as to slant toward an outside of the housing according to going apart from the bottom wall. The switch extends vertically from one end of the bottom wall. Ends of the lamp and the switch far from the bottom wall project out of the housing. When the functional modules are transported to an assembling line, the pair of functional modules is stacked on each other so as to arrange the lamp face to each other in parallel, and fixed to each other.

Abstract: The invention provides an electronic component and a manufacturing method thereof that can achieve an improved adhesion strength when the electronic component is solder-mounted onto an external substrate and can thereby obtain considerably improved electric properties and reliabilities, etc. An electronic component, which is a capacitor 1, has: a circuit element 5a formed on a substrate 2; an electrode layer 5b connected to the circuit element 5a; passivation layers 6 and 8 that cover the electrode layer 5b; and terminal electrodes 9a and 9b connected to the electrode layer 5b via via-conductors Va and Vb formed through the passivation layers 6 and 8, the terminal electrodes 9a and 9b being formed to cover the side wall of the passivation layers 6 and 8.

Abstract: On a case member of a semiconductor device, a screw block terminal or the like for connection to external equipment is attached. The screw block terminal or the like arranged on a region inside a base plate is attached to a terminal attachment member. Terminal attachment member has wall-like bodies, similar to wall-like bodies formed on a sidewall portion, formed along the direction of extension of terminal attachment member. On one end of terminal attachment member in the direction of extension, a side fitting portion is formed that corresponds to the wall-like body, and by fitting the side fitting portion to a space between sidewall portion and the wall-like body, terminal attachment member is fixed on case member. Thus, a semiconductor device is provided that allows high degree of freedom with simpler structure, as to the position of attaching a screw block terminal or a pin terminal to the case member.

Abstract: A connection module that mounts to a frame includes a housing and electrical contacts positioned on different ends of the housing. A first fixing member defines a channel sized to receive at least a portion of a frame. A second fixing member is moveable relative to the first fixing member to extend at least partially across the channel of the first fixing member.

Abstract: A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, the packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.

Abstract: An electrical connection arrangement includes an IC package, and a PCB having a plurality of receiving holes for receiving a plurality of contacts therein. The contact having a contacting portion engaged with the IC package that seated upon the PCB. A retaining device is provided for securing the IC package onto the PCB. Since there is no socket utilized in the present invention, the total profile of the arrangement and the cost are effectively reduced.

Abstract: The invention relates to the collective fabrication of n 3D modules. A batch of n wafers I are fabricated on one and the same plate. This step is repeated K times. The K plates are stacked. Plated-through holes are formed in the thickness of the stack. These holes are intended for connecting the slices together. The stack is cut in order to obtain the n 3D modules. The plate 10, which comprises silicon, is covered on one face 11 with an electrically insulating layer forming the insulating substrate. This face has grooves 20 that define n geometrical features, which are provided with an electronic component 1 connected to electrical connection pads 2? placed on said face.

Abstract: There are provided a circuit board module that can ease adverse effect due to radiation developing between a fragile circuit vulnerable to unwanted radiation and other circuits and that can diminish overall radiation to the outside of the module and an electronic device having the circuit board module.

Abstract: An electronic component module includes a circuit substrate including surface mount components mounted thereon, a resin layer embedding the surface mount components, and a conductor layer provided on a surface of the resin layer, wherein a conductive post is provided on the surface mount component, and an external electrode having a ground potential provided on the surface mount component is conductively connected to the conductor layer through the conductive post, whereby the conductor layer defines a shielding layer.

Abstract: A capacitor module is provided with a plurality of capacitor cells each having a capacitor and a capacitor case provided with a first closed-bottomed screw hole with an opening on a bottom surface for housing the capacitor, a metallic cell-fixing body having a through-hole in communication with the first screw hole to which the capacitor cells are fixed by inserting a cell screw in the through-hole and the first screw hole, an insulator made of a thermally conductive insulating material and provided between the capacitor cells and the cell-fixing body for insulating the capacitor cells from the cell fixing body, and a metallic heat-dissipating body having a second closed-bottomed screw hole in which a cell-fixing body screw is inserted and having a flow passage for causing a cooling medium to flow on a rear surface side of a surface on which the second screw hole is provided.

Abstract: The connection between the terminals of three-phase electric parts used in a matrix converter is simplified to thereby reduce the inductance between conductors. An AC capacitor and an IGBT are disposed such that the linearly arranged terminals of the AC capacitor and the linearly arranged input terminals of the IGBT are parallel to each other, and also that the three terminals of the AC capacitor and the three input terminals of the IGBT are situated close to each other. A bus bar is formed as a laminate bus bar which can be provided by laminating three plate-shaped bus bars on top of each other. In the respective plate-shaped bus bars, there are provided internal terminals for connecting together the mutually adjoining ones of the three-portion terminals of the AC capacitor and the three-portion input terminals of the IGBT, and the mutually adjoining terminals are connected together through the internal terminals.

Abstract: A housing structure for pluggable transceiver module includes a case being internally provided with a plurality of vertical partitioning plates, and having first protrusions provided on an upper and a lower side of a free edge at an open end of the case, and second protrusions provided on two opposite sides of a free end of each of the partitioning plates at the open end of the case; a plurality of first elastic-leaf members being clamped to the free edge of the case and having retaining holes engaged with the first protrusions; and a plurality of second elastic-leaf members being clamped to the free ends of the partitioning plates and having retaining holes engaged with the second protrusions. Therefore, the first and second elastic-leaf members are easily and securely assembled to the case and the partitioning plates via the first and second protrusions, respectively, without the need of spot welding.

Abstract: A modular system comprises an appliance and an adaptive adapter configured to alternately couple two consumer electronic devices to the appliance and to supply a different electrical service between the appliance and the consumer electronic devices depending on the device selected. The adaptive adapter supplies a first category of electrical service to a first consumer electronic device and a second category of electrical service to a second consumer electronic device. The appliance may comprise a refrigeration appliance and the adaptive adapter can couple the consumer electronic devices to the appliance.

Abstract: An apparatus including: an intermediate chassis configured to move in at least a first direction and configured to define a reaction surface; a movable chassis configured to move in at least a second direction orthogonal to the first direction and configured to define a follower wherein the reaction surface and follower interact to convert movement of the intermediate chassis and reaction surface in the first direction to movement of the follower and movable chassis in the second direction. Also, an apparatus including a first movable housing portion having side faces including one or more interface components; and a second housing portion; wherein the first movable housing portion is movable relative to the second housing portion between a compact configuration in which the one or more interface components are obscured by the second housing portion and an expanded configuration in which the one or more interface components are exposed.

Abstract: A protocol analyzer for analyzing traffic on a bus. A tap card is used to tap into a bidirectional bus. The tap provides a pass through connection from the card to the host and taps off of the bus. While tapping off the bus, stubs lengths are minimized and input capacitance is minimized. A repeater that preferably has no internal termination provides a differential input and a differential output or a single ended output. The bus lines are input to one of the inputs in the differential inputs and a reference voltage is provided to the other differential input. The reference voltage enables the tap to determine if the data is high or low. A jumper is also included in the tap such that the reference voltage can be selected from the host or from the pod.

Abstract: A configurable modular communication device is composed of an information delivery module and an information input module that are matable to each other. The information delivery module is a single base unit that can work with a touchscreen keypad or a number of modular keypad or other information input attachments. The information input module enables a user to change the look of the modular communication device according to personal taste and enhances its functionality to fit the exact occasion and mode of use. The information delivery module acts on its own as the navigation key and provides on its display screen menu (including an on-screen touch sensing keypad) user access to all functionality including telephone, PDA (personal digital assistant), camera, clock, GPS, and MP3 music player. User-controlled navigation takes place on or in the vicinity of the display screen, whether by hard or soft key actuation.

Abstract: In general, an improved handle assembly in accordance with the present invention is configured to be removably attached to a printed circuit board (PCB), such as a vehicle detector PCB. The handle assembly includes a faceplate, a handle extending outward from the front surface of the faceplate, and an enclosure extending from the back surface of the faceplate, wherein the enclosure has an open side configured to interface with the printed circuit board, and an external surface configured to accept printed indicia (e.g., operating instructions relating to functionality of the printed circuit board). In a preferred embodiment, the handle assembly is an integral, plastic (e.g., polycarbonate) structure, and is configured to cover one or more temperature-sensitive components attached to the board.

Abstract: An electronic element packaging module including a lead frame, an insulating layer and at least one electronic element is provided. The lead frame is a patterned metal sheet and has a first surface, a second surface opposite thereto and a through trench passing from the first surface to the second surface. A substrate portion and a plurality of lead portions around the substrate portion of the lead frame are defined by the through trench. The second surface of the lead frame is exposed outside the electronic element packaging module. The insulating layer disposed in the through trench has a third surface and a forth surface substantially coplanar with the first and the second surfaces, respectively. The electronic element disposed on the first surface is coupled to the lead frame.

Abstract: A support element arrangement for an electronic component includes a first support element and a second support element, the first support element being configured perpendicularly to the second support element and having a first main extension plane, and, in addition, the first support element having a first recess, the first recess at least partially surrounding the second support element in the first main extension plane.

Abstract: The invention relates to a power semiconductor module including a module housing and at least one substrate populated with at least one power semiconductor chip. The module housing has a bottom side and a top side spaced away from the bottom side in a positive vertical direction. In addition, the substrate has a bottom side facing away from an interior of the module housing. The substrate is arranged in an opening of the module housing configured in its bottom side and attached to the module housing by a resilient bonding agent for freedom of movement of the substrate parallel to the vertical direction in relation to the module housing. In the non-mounted condition of the power semiconductor module, the substrate assumes a resting position in relation to the module housing. To deflect the substrate from the resting position parallel to the vertical direction, a deflection force of 0.1 N to 100 N per mm is applied.

Abstract: A power bank with a replaceable battery core includes a box and an electric power unit. The electric power unit includes one or more battery core and a power management module. A circuit protection module is disposed on a side of the battery core, and a first connecting unit is disposed between the power management module and the circuit protection module. The connecting unit is provided for connecting the power management module to the circuit protection module separately, such that the battery core can be separated from the power management module for a replacement easily when the battery core is damaged or failed.

Abstract: A vertical device for mounting to a host having a horizontal surface with an upwardly oriented host service interface providing a mechanical service and at least one electrical service as well as an adapter for mounting a vertical device to a host of this type. The device or adapter has a main body with a horizontal portion and a vertical portion extending generally downwardly from the horizontal portion. A device service interface extends downwardly from the horizontal portion for engagement with the host service interface. At least one functionality is provided on the vertical portion of the vertical device or the adapter.

Abstract: A configurable memory subsystem includes a memory module with a circuit board having a first and a second memory-containing device (MCD) pair mounted thereto. Each MCD pair has a first MCD in communication with a second MCD. Each MCD has an input port, an output port, and a memory each communicating with a bridge. In response to a command, the bridge transfers at least one of a portion of a data packet from the input port to the output port or to the memory, or transfers a portion of a memory packet from the memory to the output port. A loop-back device receives the command and the data packet form the first MCD pair and transmits the command and data packet to the second MCD pair.

Abstract: A handheld computing device includes an electronic component assembly including at least one user interface component, and an enclosure formed from an extruded tube. The extruded tube defines an internal lumen between open ends, and has a substantially uniform cross section along a longitudinal axis thereof. The extruded tube includes a front face, a back face, side portions connecting the front face and the back face, at least one access opening provided on the front face, and a pair of guide rails formed in the lumen along the side portions in parallel with the longitudinal axis, the guide rails slidably guiding and receiving the electronic component assembly. The guide rails support the electronic component assembly and provide a reference surface for positioning the electronic component assembly relative to the front face such that the user interface is placed right behind the access opening to provide user access therethrough.

Abstract: An electronic module. The electronic module includes a chassis and a locking member connected to the chassis. The locking member includes a handle portion, a curved portion, and a tab portion. The curved portion is adjacent the handle portion. The tab portion is opposite the curved portion.

Abstract: A modular sensor mote, comprising an electronic board having two connector portions with associated connectors, a wireless communication management portion, a power management portion and a sensor receiving portion adapted for receiving a sensor element.

Abstract: The invention relates to a power semiconductor module including a module underside, a module housing, and at least two substrates spaced from each other. Each substrate has a topside facing an interior of the module housing and an underside facing away from the interior of the module housing. The underside of each substrate includes at least one portion simultaneously forming a portion of the module underside. At least one mounting means disposed between two adjacent substrates enables the power semiconductor module to be secured to a heatsink.

Abstract: A system includes a supporting substrate and at least one semiconductor substrate. The semiconductor component includes a semiconductor substrate having a circuit side with integrated circuits and substrate contacts and a back side, a plurality of through interconnects in the substrate, and redistribution conductors on the back side of the substrate. Each through interconnect includes a via aligned with a substrate contact, and a conductive layer at least partially lining the via in physical and electrical contact with the substrate contact. Each redistribution conductor is formed by a portion of the conductive layer.

Abstract: A communication protocol interface module conceived to be applied to an electromechanical equipment (1) provided with an opening (3) for coupling the module (2) that is provided with an electronic board (11) inside same having a circuit for defining the communication protocols.

Abstract: Method for manufacturing a rigid power module with a layer that is electrically insulating and conducts well thermally and has been deposited as a coating, the structure having sprayed-on particles that are fused to each other, of at least one material that is electrically insulating and conducts well thermally, having the following steps: manufacturing a one-piece lead frame; populating the lead frame with semiconductor devices, possible passive components, and bonding corresponding connections, inserting the thus populated lead frame into a compression mould so that accessibility of part areas of the lead frame is ensured, pressing a thermosetting compression moulding compound into the mould while enclosing the populated lead frame, coating the underside of the thus populated lead frame by thermal spraying in at least the electrically conducting areas and overlapping also the predominant areas of the spaces, filled with mold compound.

Abstract: An exemplary display device (10) includes a display module (11), a frame (12), a porous material member (13), and a transparent protection plate (14). The frame has a receiving cavity (121). The display module is confined in the receiving cavity of the frame. The transparent protection plate is configured in front of the light output side of the display module. The porous material member is located between the front surface (122) of the frame and the transparent protection plate.

Abstract: An outside plant fiber distribution apparatus includes a frame member and a plurality of fiber optic modules mounted to the frame member. The frame member includes upper and lower module mounting brackets. Each module includes a front and two mounting flanges, each mountable to one of the upper and lower module mounting brackets. At least one of the modules is configured as a connection module including a plurality of connection locations disposed along the front of the module. A rear of the module includes a cable notch region for receipt of a cable. At least one of the modules defines a storage module including first and second spools. In an interconnect system, the storage module includes a cable clamp for holding a second cable, the cables are connected through the connection locations of the connection module. In a cross-connect system, two connection modules are provided, and patch cords are used to connect the fronts of the connection modules.