Abstract: The present relates to pluggable electronic unit with transmission power adjustment capability such as for example small form-factor pluggable transceivers. The pluggable electronic unit with transmission power adjustment capability may comprise a power adjustment unit. By verifying the transmitted power is sufficient or could be reduced, it is possible to regulate transmission power of a transceiver autonomously within the pluggable electronic unit itself.

Abstract: An electronic module (100) includes a housing having a longitudinal body portion and a mounting portion extending rearward from the body portion, with a channel defined in a top or bottom section of the mounting portion; a slider member (61) accommodated in the channel of mounting portion; an actuator member (62) including a transversal beam (621) across the mounting portion and two leg portions (622) connected to opposite ends of the transversal beam and disposed outward of lateral sides of the mounting portion, said leg portions pivotally linked to the mounted portion of the housing and connected to the slider member; and a pull member (64) having two arm portions (641) spaced apart one another and an intermediate portion (642) connected to the arm portions, said two arm portions arranged under the transversal beam and engaged with the leg portions of the actuator member.

Abstract: A head up display (HUD) system includes a housing, a display assembly, and a mechanical guide system. The housing contains optical and electronic components that support a head up display function. The display assembly is captured by the housing. The display assembly has a display element for conveying head-up display information and a carrier that structurally supports the display element. The mechanical guide system moves and guide the display assembly to an in-use position, a storage position, and a service position. When in the service position, the display assembly is removable from the housing without disassembly of the housing. When not in said service position, the display assembly can be movable between an in-use position (in which the display element is substantially exposed outside the housing but is physically secured by the housing) and a storage position (in which the display assembly is substantially enclosed and protected by the housing).

Abstract: A power module includes a semiconductor device having a first and second arms, and gate driving circuit board. The first arm includes a first extending electrode, a first gate electrode of a first power device extending in a direction different from the first extending electrode, and a first output electrode extending in the different direction from the first gate electrode. The second arm stacked on the first arm includes a second extending electrode extending in the first extending electrode extending direction in an insulating state, a second gate electrode of a second power device, extending in the first gate electrode extending direction, and a second output electrode extending in the first output electrode extending direction with electrical connection thereto. The gate driving circuit board is disposed at the first and second gate electrodes extending side so as to face the semiconductor device.

Abstract: An integrated handle and stacking system for an inverter generator is provided. Each of a plurality of inverter generators may have a handle disposed at a top side of the inverter generator. Additionally, a mount may be disposed at a bottom side of the inverter generator. The handles may have recesses sized and configured to receive the mounts of an upper inverter generator so that the plurality of inverter generators may be stacked upon each other. Accordingly, the handles provide a convenient means for carrying or transporting the inverter generator from point A to point B and the recesses/mounts provide a convenient means of stacking the plurality of inverter generators. The handles and/or mounts may have dampening material to isolate vibration between stacked inverter generators.

Abstract: An enhanced patch panel indicia system includes a cover to receive a backing as the primary indicia receiver and to receive labels as auxiliary indicia receivers. The indicia system further includes an enhanced patch panel with a front face. The cover can include clip members to allow the cover to be snap-fitted onto the front face of the patch panel with the cover in juxtaposition with the front face, and in some implementations, the backing positioned therebetween.

Abstract: An electronic device may include wireless circuitry such as infrared sources that control external equipment such as televisions and set-top boxes. An infrared source may be mounted within an electronic device housing in a visually inconspicuous location such as in a connector port. A button may be provided with transparent structures that allow infrared light to pass through the button. A removable accessory port may be provided with an infrared transmitter accessory that allows an electronic device to serve as a remote control device. Portions of an electronic device housing may be provided with thin housing walls or holes that are too small to be noticeable to the naked eye to serve as windows for infrared light. An audio port may serve as an infrared light window. Gasket structures, bezel structures, and the edges of displays and other planar glass members may be used in transmitting infrared light.

Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Abstract: An electronic module is employed with at least one interiorly positioned fastener that at least partially secures a central region of the electronic module to an object to prevent bowing or warping. The module contains a base, at least two peripheral fasteners at opposed ends of the module, and the at least one interiorly positioned fastener, wherein the base is capable of accepting electronic components and further includes at least one layer, and wherein the at least one interiorly positioned fastener is interposed between the at least two peripheral fasteners.

Abstract: An optical transceiver module is provided that has a pivoting bail latching mechanism that is extremely stiff and locks via a cam locking configuration rather than relying on spring-loading forces to bias the latching mechanism to and maintain the latching mechanism in a desired position. The stiffness of the pivoting bail latching mechanism provided by the cam locking configuration better ensures that forces exerted the transceiver module will not cause the transceiver module to come out of the cage while latched.

Abstract: Interconnect substrate (1) that connects at least the first circuit board and the second circuit board. Interconnect substrate (1) includes housing (1) and connecting terminal electrodes for connecting the top and bottom faces of housing (10). Housing (10) has protrusion (11) on its outer periphery and opening (13) in its inner periphery.

Abstract: The invention relates to an electronic module (2) comprising: an electronic card (4) on which electronic components (10) are disposed, two covers (6, 8), disposed on either side of the card (4). The cover (6) facing the components (10) has a central part (22) extending at a distance from the card (4) and a flanged edge (24) turned toward the card (4), prolonging one of the two opposite sides of the central part (22). This flanged edge (24) is prolonged by a flat support (26), extending in a plane parallel to the plane of the electronic card (4), the card (4) being added onto the said support (26). The covers (6, 8) bear indexing means (34), the electronic card (4) having indexing holes (36) cooperating with the indexing means (34) during positioning of the card (4) between the covers (6, 8).

Abstract: An enclosure device of a wireless communication apparatus, which has a tubular structure with increased heat dissipation not unknown heretofore. A section of the enclosure device has a polygonal or circular shape, such as a substantially cylindrical structure, and the enclosure, which has a plurality of radiation fins arranged on an outer surface of the enclosure in a vertical direction, is formed integrally with the radiation fins by using a compression method. Various communication devices of the wire communication apparatus are mounted on the interior of the enclosure. The structure is preferably formed by the radiation fins and exhibits an increased radiation effect than that of a structure where radiation fins are arranged side by side on a flat plane.

Abstract: Embodiments of the present invention provide a semiconductor package which includes: a semiconductor chip to which one end of each of a plurality of wires is connected; and a board on which the semiconductor chip is fixed, and a plurality of board wires to which the plurality of corresponding wires are connected are disposed, wherein the board includes: a first wiring pair that includes a first pair of wires in parallel with each other and first two board wires connected to the corresponding wires, one of the wires connected to one of the board wires crossing the other board wire without contact with the other board wire, and a second wiring pair that is provided adjacent to the first wiring pair and includes a second pair of wires in parallel with each other and second two board wires connected to the corresponding wires without a crossing.

Abstract: A semiconductor package module including a self-assembled organic molecule layer and a method of manufacturing the semiconductor package module is provided. The semiconductor package module may include a module printed circuit board (PCB) having a plurality of metal line patterns and a plurality of mounting pads formed thereon. The semiconductor package may further include an insulation thin film self-assembled on at least one metal line pattern selected from among the plurality of metal line patterns. In order to manufacture the semiconductor package module, the insulation thin film is formed in a manner that the plurality of metal line patterns are formed on the module PCB wherein a plurality of via holes are formed, and then an organic compound is self-assembled on a surface of at least one metal line pattern selected from the plurality of metal line patterns.

Abstract: A storage device transporter is provided for transporting a storage device and for mounting a storage device within a test slot. The storage device transporter includes a frame that is configured to receive and support a storage device, and a clamping mechanism associated with the frame. The clamping mechanism is operable to apply a clamping force to a storage device supported by the frame The storage device transporter also includes a temperature sensor (e.g., a thermocouple). The clamping mechanism is operable to move the temperature sensor into contact with a storage device supported by the frame for measuring a temperature of the storage device.

Abstract: A power semiconductor module is disclosed including a housing for receiving at least one essentially board-type circuit carrier, the circuit carrier being provided with a metallization on at least one part of its surface and being populated with and electrically connected to at least one power semiconductor, rigid, integral and essentially straight load connection elements being applied on the metallized part of the metallized surface of the circuit carrier, which load connection elements are electrically and mechanically fixedly connected to the circuit carrier by one of their ends and project essentially perpendicularly into the housing interior, separate connection terminal elements for electrical conduct-making being placed onto the free end of the load connection elements.

Abstract: A surge protector includes a housing with connectors for passing through an electrical lead that is to be protected, whereby a surge voltage discharge device is located inside the housing and a mounting base for placement on a mounting rail is located on the outside of the housing. The mounting base on the housing exhibits a power surge proof discharge contact for contacting the mounting rail with the discharge contact being connected to the discharge connector of the surge protector. An attachment is connected in a removeable fashion to the mounting base which includes a contact component which contacts the discharge contact of the mounting base and is connected in an electrically conducting manner with a lead that exits the attachment.

Abstract: Provided are a pin module and a universal serial bus (USB) device. The USB device includes: a substrate including a first side and a second side, the second side opposite to the first side; at least one memory chip mounted on the first side of the substrate; at least one controller chip mounted on the first side of the substrate; a plurality of first planar electrodes formed on the second side of the substrate; a plurality of second planar electrodes formed on the second side of the substrate; and a sealing material housing the memory chip, the controller chip, the first planar electrodes, and the second planar electrodes, wherein the sealing material exposes one sides of the first planar electrodes and the second planar electrodes.

Abstract: A three-dimensional SoC structure formed by stacking multiple chip modules is provided. The three-dimensional SoC structure includes at least two vertical SoC modules and at least one connector module, wherein each connector module electrically connects two vertical SoC modules. Each vertical SoC module is constructed by stacking at least two chip modules vertically. Each chip module includes a module circuit board and at least one preset element. A recess is formed in each module circuit board and provided with a first connecting interface for electrically connecting with the corresponding at least one preset element. The at least two vertical SoC modules are connected by the connector module to form a three-dimensional SoC structure with multiple functions. Besides, the recesses formed in the module circuit boards provide effective heat dissipation paths for the preset elements.

Abstract: A housing assembly includes a main body, a protecting cover, a connecting rod, a first elastic element, and a second elastic element. The main body has a receiving groove. At least one interface is mounted on a bottom surface of the receiving groove. The first elastic element provides a force for driving a portion of the protecting cover away from the main body. The second elastic element provides a force for driving the connecting rod to move in the direction of pressing the connecting rod.

Abstract: A motherboard for a computer box having internal circuitry and communication ports comprises a portable motherboard having a connector for connection to an externally accessible connector of said computer box; wherein, connection of said portable motherboard connector to said externally accessible computer box connector enables said computer box to perform computing operations. The inventive motherboard is portably configured to serve one or more computers, preferably a personal computer or laptop. The portable motherboard provides a computer box with a brain. Alternatively, where a computer with a brain is slow, the portable motherboard may be used to boost the brainpower of the slow computer. Whether the portable motherboard brings life to a computer box or boosts the microprocessor power of a computer containing an internal microprocessor, the portable motherboard is a powerful invention that makes microprocessor power more efficient and ubiquitous.

Abstract: An imaging device includes a lens module and a printed circuit board. The lens module includes a substrate with a lens unit and an imaging sensor mounted on a same side thereof. The substrate defines a groove therein. The printed circuit board defines a recessed portion accommodating the substrate therein, and includes a locking member engaging in the groove to detachably secure the lens module thereto.

Abstract: A connecting module includes: a main section in which an electronic circuit is housed; a plate section that is rotatably supported by the main section, and that is adapted to lie in front of the main section, and that is rotatable between a flat position in which an electronic device is laid on a first face representing a top face and a standing position in which the electronic device is leaned against a second face representing a back face opposite to the first face; and a first connector that couples with the electronic device laid on the plate section when the plate section is in the flat position so as to connect the electronic device to the electronic circuit in the main section.

Abstract: A card device capable of improving mechanical strength of a mounting substrate with a simple structure is provided. A memory card includes the mounting substrate and a semiconductor package in a package. An electronic component such as a communication component on the mounting substrate is covered with a protective member having an electromagnetic shield function. The protective member is formed by drawing process of a sheet metal, has a containable space by a ceiling section and a side wall, and has a curve section at a joint section between an all rim of the ceiling section and the side wall. A flange is provided on the bottom end of the side wall, and the flange is solder-jointed with a ground region of the mounting substrate. In the protective member having the foregoing structure, stress hardly concentrates locally. Thus, its mechanical strength is large, and rigidity of the mounting substrate is increased.

Abstract: An electronics module for automotive vehicles includes a housing; an electrical connector having a commercial standard electrical connector footprint mounted on the housing; and an electronics assembly including commercial standard communication bus electronics contained in the housing, the electronics assembly being electrically connected to the electrical connector. The electronics module is adapted to be plugged into a power distribution unit of an automotive vehicle in order to control power distribution components of the unit.

Abstract: According to an embodiment of the present invention, a thermal management system for electronic components includes a plurality of spacers disposed between a first flexible substrate and a second flexible substrate to form a plurality of heat transfer regions each having a plurality of capillary pumping regions, a two-phase fluid disposed between at least one pair of adjacent spacers, and a plurality of electronic components coupled to a mounting surface of the first flexible substrate.

Abstract: An electrical field device for use in industrial control with a housing, with at least one input, at least one output and an electronic circuit with a microcontroller, a memory and a circuit board. The electrical field device is easily adapted to different functions and conditions of use in that an opening is formed on one side of the housing for insertion of an electronic expansion module which has at least one circuit board, and in that the circuit board has a contact region with contacts for mechanical and electrical contact-making with mating contacts connected to the circuit board of the expansion, module and a circuit board recess formed such that an inserted expansion module does not have any conductive connection to the field device except in the contact region so that reliable electrical isolation between the interior of the device and the user is ensured.

Abstract: A harness routing structure comprises: a battery case that defines an internal space which houses a battery and an electric appliance on a hybrid motor vehicle, and that is formed of a first member; a reinforcement that is provided in the battery case, and that is formed of a second member having a greater strength than the first member and that reinforces the battery case; and a harness routed at a position along the reinforcement.

Abstract: According to one embodiment, an electronic device includes: a device main body, a first engage portion; an operation element; and a disengage mechanism. The device main body includes component container detachably housing a component. The first engage portion is provided to the device main body and facing inside the component container, and when the component is housed in the component container, engaged with a second engage portion provided to the component. The operation element is provided on a rear wall of the device main body, the rear wall being a side wall of the device main body provided at a further side of the device main body and extended in a width direction of the device main body. The disengage mechanism moves the first engage portion in accordance with an operation of the operation element to disengage the first engage portion and the second engage portion from each other.

Abstract: A semiconductor device for mounting on a wiring board includes: a container for containing a semiconductor chip; and a plurality of leads, each of the plurality of leads includes a mount connection portion at one end for the semiconductor device to be connected to the wiring board, wherein the plurality of leads includes first leads and second leads, a signal transmission rate of the first leads is higher than that of the second leads, and the mount connection portion of each of the first leads is smaller than that of each of the second leads.

Abstract: An intelligent electronic device for a Substation Automation or Distribution Automation system as well as to a method and computer program product for providing it. The device has a structuring of its own functionality according to a communication standard and includes mechanically separable, replaceable hardware modules interconnected via an inter-module bus). The modules implement functionality related to function related elements of the standard and include a communication module and I/O modules. The device includes elements of the communication standard comprising one device related element and replaceable function related elements of all the functions provided by the modules. The communication module includes the device related element and function elements associated with the function of the communication module as well as functions provided by all the I/O modules.

Abstract: The invention relates to a modular rear wall for a switching system module, in particular an insertion module. Said modular rear wall comprises a measuring device which is integrated therein and which forms an integral component of the switching system module. The invention also relates to a switching circuit module which comprises said type of modular rear wall, in addition to a switching system comprising at least one switching system module having a modular rear wall.

Abstract: In a preferred embodiment of the invention, a high density interconnect structure is provided comprised of a dielectric structure and one or more compressible conductive member for the electrical connection of a plurality of inputs and outputs of a three-dimensional module to external circuitry using a compression frame and a flex connector. The compression frame has a surface equal to or less than the surface area of the module surface upon which it is mounted and permits a plurality of modules to be “butted” together to provide, for instance, a buttable focal plane array module comprising a mosaic of buttable focal plane arrays.

Abstract: An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor.

Abstract: An electronic component package including an electronic component having a circuit surface, a block of resin partially surrounding the electronic component, and a multi-layer interconnection in contact with said circuit surface, wherein the multi-layer interconnection is connected to bond-pads having a pitch lower than 50 ?m, and the block of resin is made of injection-molding resin.

Abstract: Wiring system which comprises: a flexible printed circuit board (1) with a surface (2) in turn comprising one or more electrical circuits formed by conductive strips (4) and a plurality of electronic components (5) connected to said conductive strips (4) and with at least one extension or branch (6) extending directly from said surface (2) and also comprising conductive strips (7); characterized in that it further comprised: at least one flexible flat cable (8) joined to said at least one extension or branch (6), such that an electrical connection is formed between said flexible flat cable (8) and said extension or branch (6). A vehicle door which internally comprises this wiring system.

Abstract: An RF package includes a substrate mountable on a base plate, a non-conductive cover overlying the substrate, and quasi-serpentine stepped source leads attached to an upper surface of the substrate and extending from at least one of a pair of opposite sides of the upper surface of the substrate to tapered lower surfaces of the cover. The cover includes a recess to receive the substrate. The recess includes stress distribution surface areas to engage and press outer edge portions of opposite sides of the substrate against a base plate or heat sink. The tapered lower surfaces of the cover engage with and press against the stepped source leads when securing the RF package to the base plate or heat sink using one or more fasteners or bolts. The cover includes structural features to improve preferential deformation when a mounting force is applied.

Abstract: In a rotatable positioning pivot structure and a driver having the pivot structure, the pivot structure includes a casing and a cover movably assembled with the casing. The casing is provided with an opening. One side of the opening is provided with a positioning shaft. The positioning shaft is provided with a positioning portion. One side of the cover is provided with an elastic piece. The elastic piece is provided with a through trough, and an elastic arm is formed in the through trough. The positioning shaft of the casing penetrates the through trough of the cover and is located inside the elastic arm. The inside of the elastic arm is provided with at least one positioning slot to be engaged with the positioning portion of the positioning shaft. With the above arrangement, the rotation of the cover can be positioned. Further, the pivot structure is arranged in the driver.

Abstract: A flash memory device includes one or two panels that are attached solely by a thermal bond adhesive to either a frame or integrated circuits (e.g., flash memory devices) disposed on a PCBA. The frame is disposed around the PCBA and supports peripheral edges of the panels. The thermal bond adhesive is either heat-activated or heat-cured, and is applied to either the memory devices, the frame or the panels, and then compressed between the panels and flash memory devices/frame using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. An optional insulating layer is disposed between the panels and the ICs. An optional conforming coating layer is formed over the ICs for preventing oxidation of integrated circuit leads or soldering area, covering or protecting extreme temperature exposure either cold or hot, and waterproofing for certain military or industrial applications.

Abstract: The present invention relates, generally, to electrical power conversion devices and to the universal packaging of those devices for a wide range of applications yielding cost efficient inventory management of product lines consisting of a group of power conversion devices each with minor variations. More specifically, the present invention relates to a universal mounting frame for receiving a printed circuit board in a switch mode power supply. The universal frame is adapted for receiving an open frame or printed circuit board and securing the open frame within a plurality of known packaging configurations. To this end, only a single size printed circuit board is necessary for any type of switch mode power supply configurations, thereby, reducing costs associated with manufacture and testing.

Abstract: A storage device transporter is provided for transporting a storage device and for mounting a storage device within a test slot. The storage device transporter includes a frame that is configured to receive and support a storage device, and a clamping mechanism associated with the frame. The clamping mechanism is operable to apply a clamping force to a storage device supported by the frame The storage device transporter also includes a temperature sensor (e.g., a thermocouple). The clamping mechanism is operable to move the temperature sensor into contact with a storage device supported by the frame for measuring a temperature of the storage device.

Abstract: Off-the-shelf electronic packages eliminate the much of the need for hardware redesign for each product. The base unit has a base plastic housing and a power/communication board. The component module is comprised of a mid-section plastic housing, a common board, a component board, panels with connectors and a housing cover. The component board is unique board to each platform and could be, for example, a fluid control module, a low power temperature control module, a gateway module, a USB module, etc.

Abstract: A power semiconductor module in which a substrate is provided with at least one power semiconductor and has first and second contact areas, wherein a first load connection element with first contact elements provided thereon is supported on the first contact areas and a second load connection element with second contact elements provided thereon is supported on the second contact areas. Wherein at least one spring element is provided for producing a pressure contact between the contact elements and the contact areas. To reduce the structural size of the module, the pressure contact between the contact elements and the contact areas is exerted by at least one electrical component arranged between the spring element and one of the load connection elements.

Abstract: A module (1) includes a first functional device (2) and a second functional device (3). The first functional device (2) includes a base electrode, an emitter electrode and a collector electrode. The second functional device (3) includes at least one electrode. The module (1) further includes a conductive frame (4). One of the base electrode, the emitter electrode, and the collector electrode of the first functional device (2) is directly connected to the frame (4). The electrode of the second functional device (3) is also directly connected to the frame (4). The frame (4) includes a portion serving as a terminal for external connection.

Abstract: An oscillator assembly which, in one embodiment, is an ovenized crystal oscillator assembly including an enclosure defined by a base and a lid which is seated on the base. The components of the oscillator assembly are supported by the base and located under the lid. The base and the lid together define an interior oven and are both preferably made of an insulative thermoplastic material to maximize the heat retention and oven performance of the oscillator assembly. In one embodiment, the lid and the base incorporate a clip for securing the lid to the base.

Abstract: Disclosed is an expansion module for a mobile device including, a first section at which the mobile device is mounted, the first section obscured by one surface of the mobile device, a second section having a function unit configured to provide functions relating to the mobile device, the second section rotatably connected to the first section, a magnet mounted at the first section and configured to apply a magnetic force to a magnetic member coupled to the mobile device, and an alignment mechanism configured to align the first section, having the mobile device mounted thereat, in a direction intersecting with the second section in a first state.

Abstract: A semiconductor module is provided which includes a beat heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. At least one of the electrically conductive leads is common to both of the semiconductors. The semiconductor module also includes a termination resistor electrically coupled to at least one of the semiconductors. A method of making a semiconductor module is also taught, whereby a plurality of electrically conductive leads are provided. At least two semiconductors are electrically coupled to the plurality of electrically conductive leads, where at least one of the electrically conductive leads is common to both of the semiconductors. The semiconductors are then thermally coupled to a heat spreader. Subsequently, a termination resistor is electrically coupled to at least one of the semiconductors.

Abstract: A multi-chip module (MCM) provides power circuitry on a computer motherboard in a package of reduced size without sacrificing performance. The MCM co-packages essential power circuit components on a ball grid array (BGA) substrate. Two power MOSFETs disposed on the BGA substrate are connected in a half-bridge arrangement between an input voltage and ground. A MOSFET gate driver is electrically connected to respective gate inputs of the two power MOSFETs for alternately switching the power MOSFETs to generate an alternating output voltage at a common output node between the power MOSFETs. At least one Schottky diode is disposed on the BGA substrate and connected between the common output node and ground to minimize losses during deadtime conduction periods. The input capacitor of the circuit is contained within the MCM housing and is located close to the MOSFETs, reducing stray inductance in the circuit. The MCM package is thin and has dimensions of about 1 cm by 1 cm or less.

Abstract: A semiconductor module is provided which includes a beat heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. At least one of the electrically conductive leads is common to both of the semiconductors The semiconductor module also includes a termination resistor electrically coupled to at least one of the semiconductors. A method of making a semiconductor module is also taught, whereby a plurality of electrically conductive leads are provided. At least two semiconductors are electrically coupled to the plurality of electrically conductive leads, where at least one of the electrically conductive leads is common to both of the semiconductors. The semiconductors are then thermally coupled to a heat spreader. Subsequently, a termination resistor is electrically coupled to at least one of the semiconductors.