Abstract: According to one embodiment, a pedestal canister includes a housing, one or more processing modules, and one or more aircraft interfaces. The housing is configured to be disposed within a pedestal aperture of a pedestal mounting block. The housing includes a mounting plate configured to couple the canister to the mounting block and a body coupled to the mounting plate. The one or more processing modules are disposed within the body and at least one processing module is configured to facilitate an operation of an associated aircraft instrument. The one or more aircraft interfaces include an aircraft interface configured to couple a processing module to the associated aircraft instrument.

Abstract: A system manages cables to connect to a device provided in a device chassis. The system includes a cable management boom connected to a top portion of the device chassis, cable management shelves connected to a side portion of the device chassis, and a cable management arm connected to and supported by the cable management shelves. The cable management arm is to retain the cables, pivot through an angle to provide access to the device provided in the device chassis, and route the cables from the device to the cable management boom. The cable management boom is to gather the cables, retain the cables, and route the cables above the device chassis.

Abstract: A power supply device (10) comprises a casing (26), a support structure (14) and driving means (42) for selectively rotating the casing (26) relative to the support structure (14). The casing (26) houses electrical equipment (36) and electrical sockets (30,32,34). The support structure (14) is attachable to the top (12) of an article of furniture and supports the casing (26) for rotation about an axis (28), parallel to the top (12). The casing (26) can be rotated by the driving means between an operative position in which the electrical sockets (30,32,34) face upwards and are accessible above the top (12), and a stowed position in which the electrical sockets (30,32,34) are not accessible from above the top (12). The casing (26) has a protuberance (40) that extends around the electrical sockets (30,32,34) and the protuberance (40) stands proud of the top (12) when the casing (26) is in its operative position.

Abstract: The present invention discloses a package module with EMI shielding and the method thereof. The package module has a substrate or a PCB with at least one ground pad. A variety of electronic components are mounted on the substrate. The dielectric layer overlays a selected area which covers some electronic components and ground pads. Openings are formed within the dielectric layer and above ground pads. The shielding layer with at least two metal layers covers the dielectric layer and is electrically coupled, via the openings, to the ground pad. In general, there is a protection layer to encapsulate the entire substrate. The package module of the present invention not only achieves the requirement of miniature packaging but also reduces EMI caused by high speed electronic devices.

Abstract: An expansion system for portable electronic devices is provided. A portable electronic device includes a main logic board and a battery component. The device includes a package for enclosing components of the device that is sealed to prevent ingress of foreign material from the surrounding environment. A mounting interface is provided that extends into the internal space of the package. The mounting interface mounts an expansion component that expands functionality of the device so that it is physically and mechanically spaced from the main logic board. The device may include an expansion interface mounted on the main logic board for logical communication between the main logic board and the expansion component.

Abstract: In a package structure, a stiffener ring is over and bonded to a top surface of a first package component. A second package component is over and bonded to the top surface of the first package component, and is encircled by the stiffener ring. A metal lid is over and bonded to the stiffener ring. The metal lid has a through-opening.

Abstract: An assembly for installing building systems engineering units includes a housing, which comprises a control device for carrying out an electronic function, and a base module which is designed for fastening the housing for a pre-determined installation situation. The housing and the base module are designed for fixed but removable connection so that the housing can be connected to a base module adapted to the respective installation situation in dependence on the installation situation. The modular sub-division of an installation unit into a base module and a housing, which comprises the control device for carrying out a defined function, can significantly reduce the diversity of variants.

Abstract: Affixed to a projection (111) of a glass substrate (110) included in a liquid crystal module (100) are a first ACF (150a), which has low surface tack strength but high connection reliability, and a second ACF (150b), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (130), electronic components (150), etc., are mounted on the glass substrate (110), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.

Abstract: An arrangement is described for receiving an electrical converter module for converting a first frequency of an electrical input signal into a second frequency of an electrical output signal. A rack includes input terminals for receiving the electrical input signal and output terminals for providing the electrical output signal. A slot receives the converter module in a first and second positions where in first position the converter module is electrically connected both to the input and output terminals and in the second position the converter module is electrically disconnected both from the input and output terminals. An actuator, which is mounted to the rack and which, in response to a disconnect trigger signal, is adapted to move the electrical converter module from the first position to the second position. A frequency converter system equipped with such an arrangement and a method for disconnecting a converter module are provided.

Abstract: A soft-switching converter includes three main reactors, three main reactor terminal blocks, three auxiliary reactors, and three auxiliary reactor terminal blocks. The main reactors and the main reactor terminal blocks are each arranged on a first line. Also, the auxiliary reactors are each arranged on a second line that is parallel to the first line. Each of the auxiliary reactor terminal blocks is arranged stacked on a corresponding one of the auxiliary reactors.

Abstract: An electronic package with two circuitized substrates which sandwich an interposer therebetween, the interposer electrically interconnecting the substrates and also including an opening therein in which is positioned at least one electrical component, such as a semiconductor chip, coupled to the lower or base substrate. A second component may also be mounted on and electrically coupled to the upper surface of the top or cover circuitized substrate. A method of making such a package is also provided.

Abstract: A power supply includes a casing, an electronic module and a filler having a solid insulating substance, and the casing has a cavity for installing the electronic module, and a filling space reserved from an internal wall of the casing, and the filler having the solid insulating substance is filled into the filling space, such that the consumption of potting can be reduced to lower the cost of the potting and meet the application requirements of the power supply.

Abstract: A module IC package structure with electrical shield function includes a substrate unit, an electronic unit, a conductive unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate having at least one grounding pad. The electronic unit includes a plurality of electronic elements electrically connected to the circuit substrate. The conductive unit includes at least one conductive element disposed on the circuit substrate, and the conductive element has a first end portion electrically connected to the grounding pad. The package unit includes a package resin body disposed on the circuit substrate to cover the electronic elements and one part of the conductive element, and the conductive element has a second end portion is exposed from the package resin body. The shielding unit includes a metal shielding layer formed on the outer surface of the package resin body to electrically contact the second end portion.

Abstract: A display device includes a display module, an outer housing, a glass cover and a strength-enhanced member. The display module is installed within the outer housing, and the outer housing has a support portion. The glass cover is attached to the support portion. The strength-enhanced member is located within the outer housing, and the strength-enhanced member is disposed closer to a corresponding corner of the outer housing than a corresponding corner of the glass cover is.

Abstract: In order to simplify submount manufacture, and increase the manufacturing efficiency thereof, a first electrode layer (12) is formed as a layer on the surface of a submount substrate (11); a side surface (122) of the first electrode layer (12) is formed on substantially the same plane as a side surface (112) of the submount substrate (11); and the side surface (122) of the first electrode layer (12) is a connection surface for creating an electrical connection with the first electrode layer (12). By making the first electrode layer (12) sufficiently thick, the surface area of the side surface (122) can be made sufficiently large. This allows, for example, wire bonding using this side surface (122). Further, components such as an optical element (14) can be protected by a sealing material (16).

Abstract: The disclosure provides an electronic device having back-up power during battery replacement. The electronic device includes a body, a printed circuit board (PCB) mounted in the body, and an electrode assembly connected to the PCB. The body defines an accommodating space. The electrode assembly may rotate relative to the body and further comprises at least two groups of contacts aligned in different rotation orientations. The accommodating space is configured to accommodate a first battery. A first group of the at least two groups of contacts is engaged with the first battery, the at least two groups of contacts are connected in parallel to the PCB, when the first battery is being replaced by a second battery, the first group of contacts is kept engaged with the first battery, and a second group of the at least two groups of contacts is engaged with the second battery.

Abstract: A module receptacle having a main frame arranged to hold a mountable functioning module in a specified position with respect to a covering frame. The covering frame can be attached by means of at least one fastening element to the main frame. The covering frame is at least large enough to cover the main frame.

Abstract: An output architecture of a power supply is disclosed, wherein the power supply includes an input portion to obtain input power and a conversion circuit board connecting to the input portion to convert the input power into output power of different voltage potential. The conversion circuit board includes plural power output areas with different preset output voltages, and after selecting the output standard, the power output areas connect to at least one power extension board via plural electrical conductive elements, so as to provide the power extension board the output power, and the power extension board has plural output wires connected to a load. Through the architecture described above, the corresponding output wires can be selected after the output standard is selected for connecting to the power extension board, and then, the power extension board is connected to the conversion circuit board.

Abstract: A power module for an inverter which includes a base which has a plurality of slots are formed thereto, a plurality of building blocks inserted into the slots and power cables interconnecting the building blocks. Further, each of these building blocks is provided with a power element which corresponds to one phase. Thus, each building block in the power module may be replaced individually without having to replace the entire power module in case of a failure in a single power element of the power module.

Abstract: A small wireless communication module and a GSM multiband wireless communication module that can achieve high radiation efficiency in predetermined frequency bands regardless of apparatus on which the module is mounted. The wireless communication module is obtained by integrating wireless communication units such as a radio frequency circuit and an antenna having communication functions to perform wireless communications into one module, and a module substrate is accommodated within a module casing. A planar conductor is placed on an outer circumferential surface of the module casing, and a grounding terminal and a driven element are provided on an end on a side of a connecting terminal.

Abstract: According to one embodiment, an electronic device is provided with a casing including a module receiving portion which receives a module and includes a module supporting wall and a module surrounding wall. The module supporting wall includes a module support portion, and an opening provided between the support portion and the module surrounding wall.

Abstract: In one embodiment of the invention, a flash memory dual inline memory module (FMDIMM) is disclosed. The FMDIMM includes a printed circuit board (PCB) with an edge connector; a first plurality of multi-chip packaged flash memory/support application specific integrated circuit (ASIC) parts mounted to the printed circuit board and electrically coupled to the edge connector; and a first address device mounted to the PCB and electrically coupled to the edge connector and the first plurality of multi-chip packaged flash memory/support ASIC parts. Each of the first plurality of multi-chip packaged flash memory/support ASIC parts includes one or more randomly accessible flash memory die to periodically store data in a non-volatile manner.

Abstract: A multi-chip module is disclosed to include a pin frame, an electric power switch chip, and a battery protection chip. The pin frame has a chip placement region and six pins. The second pin and the fifth pin are electrically connected at the chip placement region, and the other pins are set electrically isolated from each other. A bottom surface of the electric power switch chip is electrically connected at the chip placement region, and a top surface thereof is electrically connected to the first pin and the third pin. A bottom surface of the battery protection chip is disposed at the top surface of the electric power switch chip in an electrically isolated fashion. A top surface of the battery protection chip is electrically connected to the top surface of the electric power switch chip, the first pin, the fourth pin, and the sixth pin.

Abstract: The present invention may be deployed in a system comprising a security module housed on a chip card and a host device comprising a chip card reader. The host device is comprised in a housing with a slot for the chip card. The housing is shielded to reduce the amount of electromagnetic radiation generated by the security module and/or the host device from penetrating to the exterior of the housing. Similarly, the shielding is adapted to reduce the effects of electromagnetic radiation generated outside of the host device on the components within the housing. The slot is also shielded by a flap made of an electrically conductive epoxy material or an electrically conductive resin.

Abstract: A module housing having an inner housing, an outer housing and a connection element is provided, the inner housing having at least one component and being completely enclosed by the outer housing in a form-locking manner, and the connection element being enclosed in a first subsection by the inner housing in a form-locking manner, wherein the connection element has electrical plug contacts in a third subsection.

Abstract: A modular control device comprises a control board, a sub-module and a housing cover, with a microcomputer mounted on the control board. The sub-module has a sub-module case provided with a wiring layer that is mounted into a wall of the sub-module case. Electronic parts are mounted in the sub-module case to electrically connect to the control board through the wiring layer. A housing cover accommodates the control board and the sub-module. A housing base is joined with the housing cover. The accommodation portion has a shape corresponding to a shape of each of the electronic parts is arranged in the housing cover. The sub-module is mounted to the housing cover with a heat radiation adhesive between the accommodation portion and each of the electronic parts.

Abstract: An electro-optic device includes an electro-optic panel and a holding member provided with a heat emitting portion on the side opposite to a surface to which the electro-optic panel is adhered by an adhesive. In the electro-optic device, a groove portion to be filled up with the adhesive is provided in a portion of the holding member to which the electro-optic panel is adhered.

Abstract: A micro grid apparatus and associated method of formation. At least one tier in a printed circuit board is formed. Each tier includes complex shapes interconnected by bridge modules. Each complex shape includes a central area and at least three radial arms external to and integral with the central area. Each radial arm extends radially outward from the central area. Each pair of adjacent radial arms defines a docking bay. Each complex shape is either a power hub whose central area includes rechargeable batteries or a processor hub whose central area includes processors. A bridge unit of a bridge module is latched in at least one docking bay of each complex shape. Each docking bay not latching a bridge unit of any bridge module latches an irregular shaped module. An irregular shaped module is latched in at least one docking bay in at least two complex shapes.

Abstract: According to one embodiment, an electronic device includes a casing including a cover, an input portion provided on the cover and configured to receive an external input, a circuit board contained in the casing and including a switch configured to be operated by the input portion, a support member configured to permit the circuit board to be supported by the cover, and an engagement portion integral with the support member and configured to hold the circuit board in cooperation with the support member.

Abstract: A molded housing for an electronic circuit, for installation in electronic devices and/or sensors or pick-ups includes at least one force-fit zone, and a force-fit component assigned each of said at least one force-fit zone. The force-fit component is mounted by welding on a die pad of the molded housing.

Abstract: A low-noise flip-chip package, comprising: a carrier substrate having first and second opposing main faces; and a flip-chip substrate connected in a face-down manner onto the first main face of the carrier substrate via a connection array, wherein: the flip-chip substrate comprises at least first and second circuitry portions spaced apart from one another; the flip-chip substrate comprises a substrate-contact boundary located between the first and second circuitry portions; and each of the first circuitry portion, the second circuitry portion and the substrate-contact boundary has its own separate signal-reference connection extending via a respective connection of the connection array through the carrier substrate to a respective electrical contact at the second main face of the carrier substrate for connection to a common signal-reference element in an external circuit.

Abstract: According to one embodiment, a display device includes a base, a display module, and an connection portion. The display module includes a display screen that stands upright. The connection portion includes an extending portion that extends above the base. The connection portion is connected to the display module and is supported by the base to be rotatable about a rotation axis that extends vertically. The rotation axis is located on the display screen side with respect to the center axis of the extending portion extending along the vertical direction.

Abstract: A navigation tool holder for a mobile device can include a top holder, a bottom holder, and a cover layered on top of the top holder. The top holder defines an opening for receiving a navigation tool. The bottom holder is configured to matingly engage the top holder. A navigation tool housed between the top holder and the bottom holder. The navigation tool includes a top portion protruding through the opening of the top holder and a flexible circuit communicatively coupling the navigation tool to a circuit board of the mobile device. The cover layer on the top holder can surround the top portion of the navigation tool so that the cover maintains an alignment of the navigation tool with a housing of the mobile device.

Abstract: A power semiconductor module includes a module housing with a sealing ring on its top side. The sealing ring, in co-operation with the module housing and a printed circuit board attached to the power semiconductor module, hermetically seals feed-through locations at the top side of the module housing for feeding through electric terminals of the power semiconductor module. On the bottom side of the module housing a sealing ring hermetically seals the bottom side of the module housing.

Abstract: An electronics module has a flexible substrate having conductors, an array of functional components on the substrate, the functional components arranged to contact at least one conductor, and perforations in the flexible substrate, the perforations arranged to increase stretchability of the flexible substrate, the conductor arranged around the perforation and the functional components arranged to one of reside between the perforations or partially cover the perforations. A method of manufacturing a flexible electronics module involves mounting at least two functional components onto a flexible substrate, forming electrical interconnects configured to provide connection between the two functional components, and perforating the flexible substrate with cuts configured to increase stretchability of the substrate.

Abstract: A latch assembly for a pluggable electronic module matable with a receptacle assembly includes a lever actuatable between a latched position and an unlatched position, a yoke assembly operatively coupled to the lever, and a latch element coupled to the latch end of the yoke assembly. The yoke assembly has a latch end rotatable between a latched position and an unlatched position. The latch element is movable between an engaged position and an unengaged position as the latch end is rotated between the latched and unlatched positions, respectively. The latch element is configured to engage the receptacle assembly to lock the pluggable electronic module within the receptacle assembly when the latch element is in the engaged position.

Abstract: A protector for a card-shaped peripheral device for insertion into a slot of objective equipment, includes: a first wall hating a first guide surface for guiding insertion of the peripheral device; a second wall parallel with and opposite to at least part of the first wall, and having a second guide surface for guiding insertion movement of the peripheral device in cooperation with at least part of the first guide surface; and a pair of side walls parallel with an insertion direction of the peripheral device, and connecting end portions of the first and second walls in a width-wise direction thereof perpendicular to the insertion direction. First and second end surfaces perpendicular to the insertion direction are formed respectively at end portions in the insertion direction of the first and second walls. Each of the side walls has a protrusion protruding in the insertion direction from the first and second end surfaces, respectively.

Abstract: A system includes a communications device and power supply units detachably installable thereon. On an outer surface of the communications device there is an aperture arranged to enable the insertion of different power supply units in different sections of the volume inside the communications device. The volume is continuous so that instead of separate power supply units it is possible to insert, through the aperture, in the volume a physically larger power supply unit which, when installed in the volume, extends into more than one section of the volume. The communications device can be flexibly equipped e.g. with power supply units functioning as back-ups for each other, each taking up part of the volume, or with a single power supply unit, larger than the above-mentioned, taking up the volume. Therefore the volume inside the communications device can be utilized in connection with power supply units of various types.

Abstract: A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.

Abstract: A cable organization unit includes a housing. A tray is attached to the housing by at least one slide, and is movable between a first position and a second position relative to the housing. A hood is removably secured to the tray. A user may remove the hood from the tray to access adapters attached to a bulkhead on the tray. The tray may include a latch for securing the tray to the housing in the first position, and the hood may be removed from the tray while the tray is in the first or second positions. A retainer is optionally attached to the housing. The retainer includes an adjustable opening which may be reduced in size such that edges of the opening frictionally engage and hold a jacket of a cable passing therethrough.

Abstract: A power bank with a replaceable battery core includes a box and an electric power unit. The electric power unit includes one or more battery core and a power management module. A circuit protection module is disposed on a side of the battery core, and a first connecting unit is disposed between the power management module and the circuit protection module. The connecting unit is provided for connecting the power management module to the circuit protection module separately, such that the battery core can be separated from the power management module for a replacement easily when the battery core is damaged or failed.

Abstract: A power module includes a power switching device and a flexible circuit with first and second traces electrically connected to the switching device, the first and second traces serving as an input signal carrier and an output signal carrier for the switching device.

Abstract: A mounting system for a member to a support structure. The member includes ends and sides. A hinge may be attached to one of the ends of the member. Hinges may be attached to both ends along the same side of the member. The hinge may include an arm from which a tab extends. The ends may include securing means. The support structure includes a mounting aperture that is configured to interact with the hinge of the member. In some embodiments, the support structure may have multiple mounting apertures. The mounting aperture is configured to prevent the hinge of the member from disengaging from the support structure. In some embodiments, the mounting aperture is configured to pivotally retain the hinge of the member.

Abstract: A memory device is disclosed including at least one surface pre-treated to roughen the surface for better adhesion of ink on the surface. The surface of the memory device may be pre-treated by scoring lines in the surface with a laser or by forming discrete deformations with a particle blaster. The surface may also be roughened by providing a roughened pattern on a mold plate during an encapsulation process. In further examples, the surface may be chemically pre-treated to roughen the surface and/or increase the adhesion energy of the surface.

Abstract: In a dielectric element, the angle ? made by either the top face or the bottom face and the side faces is either 0°<?<89°, or is 91°<?<180°, and is an angle other than 89°???91°. By this means, the area of contact of the side faces of the dielectric element with a glass epoxy resin substrate and with insulating material is increased, adhesion with the resin substrates is improved, and strength and reliability can be enhanced when buried between the two resin substrates.

Abstract: A method of producing an electronic module having an electronic part and a mounting part for mounting the electric module to an external apparatus, includes a step of disposing the electronic part in a cavity of a die, a step of disposing the mounting part in the die with a first portion of the mounting part being positioned in the cavity and a second portion of the mounting part being outside of the cavity, a step of supplying a resin into the cavity of the die, a step of curing the resin while the electronic part and the first portion of the mounting part are immersed in the resin in the cavity of the die, and a step of extracting the resin from the cavity after the resin is cured in the step of curing.

Abstract: In various embodiments, a chip module may include a substrate; electronic components, the electronic components being arranged on a first side of the substrate; and an insulating layer, which is applied to the first side of the substrate and to the electronic components, contact openings being arranged in the insulating layer which permit electrical contacting of the electronic components; and an electrically conducting layer being arranged on the insulating layer and in the contact openings, which connects the electronic components electrically to one another.

Abstract: A memory system includes; a main board having memory bus with a wiring line communicating a signal from a memory controller mounted on the main board, first and second module sockets mounted on the main board and connecting the wiring line to first and second memory modules respectively inserted into the first and second module sockets, where the first memory module includes a first electrode connected to the wiring line and the second memory module includes a second electrode connected to the wiring line, and first and second stub resistors disposed on the main board and arranged as primary dual-branching stub resistors forming a T-branch connection structure between the first and second electrodes and a branching node connected to the wiring line.

Abstract: A process and product made from the process is disclosed to minimize solder collapse during solder reflow. Predetermined bond pads on a layer or component have a solder paste such as Sn63 solder paste with a first lower reflow temperature applied and a spacer element such as an SAC solder ball or stud bump having a predetermined geometry with a second higher reflow temperature applied. The SAC solder balls or stud bumps act as spacing elements but do not interact with the solder paste such that the solder paste may be reflowed while precisely maintaining the space between the layers.

Abstract: A power module located on a conductive substrate including power conversion circuitry. The power conversion circuitry includes a magnetic device and at least one switch. The magnetic device includes a magnetic core having a surface facing the conductive substrate and a conductive clip facing a surface of the magnetic core with ends of the conductive clip electrically coupled to the conductive substrate to cooperatively form a winding therewith about the magnetic core. The power module also includes an encapsulant about the power conversion circuitry.