Abstract: A power converter sub-assembly/module includes a power switching assemblage defining a cavity within which can be mounted a driver IC. The power switching assemblage includes a load inductor component stack attached to a power transistor block and an interconnect spacer block, defining a cavity between the two blocks. The power transistor block includes a high and low side FETs attached side-by-side to a switch-node metal carrier that includes an attach-surface opposite the FETs. The power switching assemblage is mountable to an interconnect surface that includes connection pads VIN, VOUT, GND, HG (high-side gate) and LG low-side gate). For a module configuration, the power switching assemblage is combined with a driver IC that provides high (HG) and low (LG) gate drive—the power switching assemblage and the driver IC are mounted to a module interconnect substrate, with the driver IC mounted within the cavity of the power switching assemblage.

Abstract: Data storage apparatus comprising a main housing containing an electric power supply, a panel supporting a plurality of electric connectors for connecting the power supply to other component parts of the apparatus and a plurality of units. Each of the units comprises a plurality of data storage elements and is mounted to slide from within the main housing to provide access to its data storage elements. The apparatus also comprises a plurality of cable modules each comprising a cable having a first connector at a first end connected to one of the units and a second connector at a second end connected to an electric connector on the panel. The cable modules also include a moveable rigid structure providing a barrier preventing manual access to the panel. The second connector is attached to the rigid structure such that movement of the rigid structure causes the second connector to be disconnected.

Abstract: The present invention provides for a protective enclosure comprising a base comprising a first continuous mating surface and at least one conveyance aperture, a cover comprising a second continuous mating surface, wherein the second continuous mating surface is configured to form a seal with the first continuous mating surface, and a clamp, wherein at least a portion of the clamp is coupleable to the base, wherein a mouth of the clamp is configured to be offset from the aperture when the clamp is coupled to the base, wherein the clamp comprises a first sealing layer, and wherein the clamp is configured to seal the aperture against contaminants. The protective enclosure may be configured for use in a remotely controllable model vehicle to protect a control module.

Abstract: A method and apparatus for an accessible equipment rack system. A mounting frame having a set of transport elements and a translation mechanism is connected to a translating equipment rack. The translation mechanism moves the translating equipment rack to enable access to said translating equipment rack from an exterior area.

Abstract: A circuit substrate includes a resin layer; and an inorganic insulating layer including a groove portion penetrating the inorganic insulating layer in a thickness direction thereof. A part of the resin layer is in the groove portion.

Abstract: There are provided an electronic device module capable of increasing a degree of integration by mounting electronic components on both surfaces of a board, and a manufacturing method thereof. The electronic device module includes a board having mounting electrodes formed on both surfaces thereof, a plurality of electronic devices mounted on the mounting electrodes, a molded portion sealing the electronic devices, at least one connection wire having one end bonded to one surface of the board and the other end exposed to the outside of the molded portion, and an external connection terminal coupled to the other end of the connection wire.

Abstract: A power module is provided. The power module includes a housing assembly and an electrical assembly. The electrical assembly includes an AC input assembly, a DC input assembly, a number of AC feeder layers, a number of DC feeder layers, a number of AC electrical components and a number of DC electrical components. Each AC feeder layer includes a generally planar body and an embedded conductor. Each DC feeder layer includes a generally planar body and an embedded conductor. Each AC feeder layer conductor is coupled to, and in electrical communication with, said AC input assembly. Each DC feeder layer conductor is coupled to, and in electrical communication with, said DC input assembly. Each AC electrical component is coupled to, and in electrical communication with, an AC feeder layer conductor. And, each DC electrical component is coupled to, and in electrical communication with, a DC feeder layer conductor.

Abstract: A connector is provided that is capable of high-speed transmission over a carrier wave of, for example, 30 GHz or higher. The connector includes a housing, a wireless communication module and a first magnet. The housing includes a planar face, and the wireless communication module is disposed in the housing and includes a wireless signal transmission IC and a wireless signal reception IC. The first magnet is disposed along the planar face.

Abstract: A junction box is affixed to, and electrically coupled with, a solar panel. The junction box is configured to releaseably engage and disengage accessory modules, thereby allowing accessory modules to be replaced or exchanged easily. Accessory modules are electrically coupled with other accessory modules in the solar panel string. The furthest downstream accessory module is connected to a wire harness, which is connected to a central combiner box.

Abstract: An electronic device including a main chassis, an electronic module and an electromagnetic interference shielding structure is provided. The electronic module is disposed in the main chassis. The electromagnetic interference shielding structure includes a conductive plate and a plurality of conductive elastic pieces. The conductive plate is assembled to the main chassis. The conductive elastic pieces are connected to the conductive plate and arranged along a first direction. Each of the conductive elastic pieces extends along a second direction perpendicular to the first direction. Each of the conductive elastic pieces has an arc contacting surface, and the arc contacting surface of at least one of the conductive elastic pieces contacts the electronic module. An electromagnetic wave emitted from the electronic module passes through the corresponding conductive elastic piece and the conductive plate in sequence to be transmitted to the main chassis.

Abstract: An electronic device locking/unlocking mechanism assembled with an electronic device. The locking/unlocking mechanism includes a connection arm movable between a first position and a second position. The connection arm has a first end and a second end. An elastic unit is disposed at the first end of the connection arm to normally apply an elastic force to the connection arm for keeping the connection arm positioned in the first position. A locking section is disposed at the second end of the connection arm. The locking section is held in a dent formed on the electronic device. When the connection arm is moved to the second position, the locking section is released from the held state, whereby a pivot pin is unstressed to automatically bound open the electronic device. This eliminates the problem existing in the conventional mechanism that the electronic device is uneasy to open.

Abstract: A system comprising modules. Each module includes: a presentation system including one or more of a speaker and a video screen; and a port. In use, if the presentation system includes the speaker, the system produces sounds derived from data obtained via the port. If the presentation system includes the screen, the system displays images derived from data obtained via the port. The module can also include connectors and the system can also include actuators. Each actuator, in use, can be coupled without soldering to a connector, and the presentation system of each module can operate in response to the actuator or actuators coupled to said each module. The system can also include data storage devices, each adapted to be releasably coupled to a respective port, and the port can be selected from: microchip socket and USB port. The system can be used as part of a method.

Abstract: A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield.

Abstract: A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench.

Abstract: There is provided a circuit module including a circuit substrate being a wiring substrate having a mount surface, a surface wiring layer disposed on the mount surface, and an inner wiring layer formed within the substrate, a first mount component mounted on the mount surface, a second mount component mounted on the mount surface, and electrically connected to the first mount component via the inner wiring layer, a sealing body formed on the mount surface, covering the first mount component and the second mount component and having a trench formed from a main surface of the sealing body to the surface wiring layer between the first mount component and the second mount component, and a shield having an inner shield section formed within the trench that abuts on the surface wiring layer and an outer shield section covering the sealing body and the inner shield section.

Abstract: There is provided a circuit module and a method of producing the same where interlayer wirings of a circuit substrate are prevented from damaging by laser irradiation, and a shield is assuredly electrically connected to the superficial conductor of the circuit substrate. The circuit substrate includes mount components, a sealing body, and a shield. The circuit substrate is a multi-layer substrate on which interlayer wirings are formed, and includes a mount surface on which a superficial conductor is disposed. The mount components are mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench including a first trench section reaching the superficial conductor and a second trench section not reaching the superficial conductor. The shield has an outer shield section and an inner shield section.

Abstract: According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mould compound and comprises surface structures.

Abstract: A device having a self-winding element is described. The self-winding element is built on a flexible membrane; it has an extended form and a retracted form. Stiffness in the extended form may be provided using membrane curvature, or a retractable support member may be used, or both. Transitions between the extended form and the retracted form are preferably accomplished using sequential activation of tensile members that are configured in segments of the membrane. Activation of the tensile elements is preferably implemented using a processor or controller that activates tri-state drivers in a predetermined sequence in order to pass a current through each element when heating is desired. A preferred material used for the tensile elements is thin film NITINOL.

Abstract: A microelectronic package can include a substrate having first and second opposed surfaces, and first and second microelectronic elements having front surfaces facing the first surface. The substrate can have a plurality of substrate contacts at the first surface and a plurality of terminals at the second surface. Each microelectronic element can have a plurality of element contacts at the front surface thereof. The element contacts can be joined with corresponding ones of the substrate contacts. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto. The element contacts of the first microelectronic element can be arranged in an area array and are flip-chip bonded with a first set of the substrate contacts. The element contacts of the second microelectronic element can be joined with a second set of the substrate contacts by conductive masses.

Abstract: A semiconductor control device is provided with: a plurality of semiconductor modules each having a cooling member and a semiconductor element; a circuit board mounted with a control element that controls the plurality of semiconductor modules; and a case in which the plurality of semiconductor modules and the circuit board are respectively mounted. The case is provided with a cylindrical sidewall that forms an internal space within the case, and on both ends of the sidewall, a first opening and a second opening are correspondingly formed to be opposite to each other. The plurality of semiconductor modules include a first semiconductor module mounted on the sidewall on a side of the first opening, and a second semiconductor module mounted on the sidewall on a side of the second opening. The circuit board is positioned between the first semiconductor module and the second semiconductor module, in the internal space.

Abstract: A package-integrated EMI compartment shielding structure includes an encapsulating member disposed on a mounting surface of a substrate. The substrate has a ground pad exposedly arranged thereon. The encapsulating member, who defines a peripheral surface, covers the ground pad and encapsulates at least one electronic element. A compartment structure is disposed in the encapsulating member, electrically connecting the ground pad and substantially dividing the encapsulating member into at least two package compartments. The terminal portions of the compartment structure are arranged within the encapsulating member proximal to yet without compromising the peripheral surface. A notch is disposed into the encapsulating member from the peripheral surface corresponding to the location of the terminal portions of the compartment structure to expose the lateral surface thereof across the thickness of the encapsulating member.

Abstract: Disclosed are a flexible printed circuit board and a mobile terminal using the same. The mobile terminal includes a printed circuit board (PCB), and a flexible printed circuit board (FPCB) connected to the printed circuit board. The flexible printed circuit board includes a branch extending from one side of the flexible printed circuit board, at least one switch provided on the branch and acquiring a key input signal, and a connector provided on an end portion of the branch and coupled to the flexible printed circuit board.

Abstract: There is provided a multilayer wiring substrate, including: a trench produced at one surface of an insulation layer, the trench having a depth shallower than a thickness of the insulation layer; and a copper plating applied to the trench. Also, there are provided a method of producing the multilayer wiring substrate, and a semiconductor product including the multilayer wiring substrate.

Abstract: A seal structure for an electronic control device having a circuit board housed in a watertight space a housing that is formed by fitting a plurality of fitting members together, has first and second seal portions which are formed at a fitting surface portion between the fitting members that are fitted together. One side of a pair of the fitting members of each of the first and second seal portions is provided with a seal groove, the other side is provided with a protruding line. An auxiliary seal groove and an auxiliary protruding line are formed on opposing surfaces of the seal groove and the protruding line at a merged part where the first and second seal portions meet each other. The auxiliary seal groove and the auxiliary protruding line continuously extend from the seal groove up to an end surface of the protruding line.

Abstract: A method for creating laboratory-scale reactive distillation apparatus from provided modular components is described. At least two types of modular distillation column stages are provided. A first type of modular stage comprises two physical interfaces for connection with a respective physical interface of another modular stage. A second type modular stage comprises one such physical interface. At least one type of tray is provided for insertion into the first type of modular stage. A clamping arrangement is provided for joining together two modular stages at their respective physical interfaces for connection to form a joint. The invention provides for at least three modular stages can be joined. At least one sensor or sensor array can be inserted into each modular stage. At least one controllable element can be inserted into each modular stage. The invention provides for study of traditional, advanced, and photochemical types of reactive distillation.

Abstract: A circuit module includes a wiring substrate, an electronic component, a sealing layer, and a conductive shield. The wiring substrate has a mount surface. The electronic component is mounted on the mount surface. The sealing layer is formed of an insulating material, covers the electronic component, and has a first surface and a second surface, the first surface being opposite to the mount surface and having a first sealing area and a second sealing area, the second sealing area projecting from the first sealing area to an opposite side of the mount surface, the second surface being connected to the mount surface and the first surface. The conductive shield covers at least the second surface and the first sealing area of the first surface.

Abstract: A heads-up-display assembly includes a display module and a circuit board. The display module is configured to display an image on a display surface, remote to the display module. The display module includes a housing, a visual display, and one or more retention members. The circuit board controls the visual display and is coupled to the display module by a first wire. The circuit board is movable between a first configuration in which the circuit board is free to hang from the display module by the first wire, and a second configuration in which the circuit board is removably retained to the housing by the one or more retention members and not free to hang by the first wire.

Abstract: A portable power source includes a housing and a support member. The housing has a power supply module. The support member includes a main body detachably mounted in the housing and the housing has the appearance of being notched when the support member is inserted therein. A notch is defined on the main body to provide support for the electronic device for viewing or other purposes.

Abstract: A computer cart has segregated computer storage areas and adapter/cord management areas. This enables the adapters and cords to be stored in an orderly fashion and also prevents the cords and adapters from being accessed or removed from the cart when the computers are being accessed. In one embodiment, extensions of shelves on which the computers are stored extend through a dividing panel into a rear compartment of the cart to create AC adapter shelves for storage of the AC adapters. In another embodiment, the AC adapters are stored in bins in a separate compartment and cords from the AC adapters extend through a dividing panel to an area designed to hold the computers, to enable the computers to be plugged in to be charted while stored in the cart.

Abstract: A casing to support a solid state device SSD therein and super capacitors therein to be electronically connected together.

Abstract: A display device includes: a display module; a window disposed on the display module; and an adhesive layer disposed between the display module and the window, where the adhesive layer includes a pressure sensitive adhesive including an impregnation region impregnated with a fiber, and a density of the fiber in the adhesive layer is predetermined based on a position thereof in the impregnation region or a part of the display device corresponding thereto.

Abstract: An electronics module docking system includes docking member removably coupled to a photovoltaic module. The docking system includes a first connector port electrically coupled to one or more photovoltaic cells of the photovoltaic module. The photovoltaic module is selectively coupleable to the docking member. The docking system includes a housing to enclose an electronics module. The housing may include second connector port that is selectively engageable to the power electronics module. The power electronics module and the photovoltaic cells are electrically coupled to one another upon selective engagement of the connector ports. The inverter housing is receivable by and removably coupleable to the docking member allowing the inverter housing to be removably coupleable to the photovoltaic module.

Abstract: A module carrier unit comprises a plurality of passenger interface modules that perform different functions, the functions including at least one of inputting and outputting information, the modules having a common size, shape, and interface; an outer case portion comprising a plurality of receptacles, each having a common size, shape, and interface designed to receive one of the modules, the plurality of receptacles being such that a first module having a first function is operable in a first receptacle, and a second module having a second function is operable in the first receptacle, the modules being removably connected to the receptacles; and a communications interface that performs at least one of transmitting and receiving data to and from a processor located near a seat of a passenger in the vehicle.

Abstract: An inverter module converts a DC current generated by a photovoltaic panel to an AC current. The inverter module includes a housing and a PCB. The housing has a through hole. The PCB is received within the housing. An inverter circuit and a connection circuit are welded on a side of the PCB. The connection circuit includes a plurality of conductive terminals and a plurality of diodes. The conductive terminals are arranged in a row and adjacent to the through hole. Each of the conductive terminals is electrically connected to the inverter circuit. Each of the diodes is disposed between and electrically connected to the two neighboring conductive terminals thereof. By means of the integration of the inverter circuit, conductive terminals, and diodes, the space occupied by the inverter module can be reduced.

Abstract: An insulation film that strongly adheres to a power semiconductor module having a resin sealer and a conductor plate and has high thermal conductivity is provided. An insulation layer 700 is provided between a power semiconductor module 302 and a heat dissipation portion 307B. The power semiconductor module 302 includes a resin sealer 348, which covers a circumferential side surface of a conductor plate 315, and a plurality of recesses 348D are provided in the resin sealer 348. The insulation layer 700 is formed of a spray coated film 710, an insulation film 720, and a resin layer 730, and the spray coated film 710 is formed on the surface of the resin sealer 348 including recesses 348D to form a seamless flat surface. The planar size of each of the recesses 348D is greater than the planar size of each flat portion 711, which forms the spray coated film 710.

Abstract: A fiber panel system includes a chassis and at least blades configured to mount to the chassis. Each blade is moveable relative to the chassis between a retracted (closed) position and at least one extended position. Cable slack is managed at the front and/or rear of each chassis to facilitate movement of the blades without pulling or bending the cables beyond a maximum bend limit. Each blade may be locked into one or more positions relative to the chassis.

Abstract: An integral solar module power conditioning system includes one or more solar module support frames. Each frame includes a plurality of plug-and-play electrical connectors integrated therewith. A microinverter or microinverter connector is also integrated with each frame. Each frame is configured to receive a respective solar electric module and to carry electrical power through a plurality of solar electric modules and corresponding microinverters connected together via a plurality of solar module support frames connected together via the plurality of integrated plug-and-play electrical connectors.

Abstract: Electronic equipment includes: a first substrate; a second substrate; and a harness that connects the first substrate and the second substrate with other. The first substrate includes: a conversion unit that outputs converted power converted from supply of power supplied by a power source, and a control unit that outputs a control signal used to control output of the supply of power to the second substrate. The second substrate includes: a semiconductor circuit operated by the supply of power and the converted power, and a connector that outputs the control signal to the power source. The harness includes a signal line of the control signal and a power line through which the converted power is supplied from the first substrate to the second substrate.

Abstract: An electronic device includes a housing, a chip card received in the housing, and a chip card protecting cover assembly. The chip card protecting cover assembly includes a housing, a first magnet and a second magnet. The magnetic force between the first magnet and the second magnet drives the protecting cover to rotate relative to the housing, thereby covering or exposing the chip card.

Abstract: A protecting cover for an electronic device is provided, the protecting cover including a front cover portion positioned on a front surface of the electronic device, a back cover portion connected with the front cover portion and positioned on a back surface of the electronic device, an auxiliary display unit provided on the front cover portion, and a module configured to control transmission and reception of data and power supply depending on opening and closing of the front cover portion.

Abstract: An electronic device includes a casing, a circuit board, a connector and a waterproof component. The casing includes an opening structure. The circuit board is disposed inside the casing. The connector includes a first joint, a second joint and a soft cable. The first joint pierces through the opening structure. The second joint is disposed on the circuit board. The soft cable is electrically connected to the first joint and the second joint in a curvedly deformable manner. a length of the soft cable is substantially greater than an amount of vibration amplitude and a distance between the first joint and the second joint. The waterproof component is disposed between the first joint and the opening structure. Vibration from the casing can be transmitted toward the soft cable via the first joint, and is decayed by structural deformation of the soft cable.

Abstract: A frame module is adapted to be disposed in a housing of a computer for fixing first and second electronic devices. The computer includes a motherboard unit with a socket connector. The frame module includes a frame body having top and bottom surfaces adapted to be connected respectively to the first and electronic devices. An adaptor board includes a board body connected transversely to a rear edge of the frame body and having an edge connector adapted to be inserted into the socket connector, and first and second electrical connectors for electrical connection with the first and second electronic devices, respectively.

Abstract: The present invention can facilitate the coupling between electrical components and a circuit board after the circuit board is inserted into a housing of an electronic device. An electrical component can be integrated with a flexible circuit of another electrical component. The flexible circuit can be electrically and mechanically coupled to the circuit board after the circuit board is inserted into the housing. Alternatively, electrical contacts can be disposed on a body of the electrical component and a complementary set of electrical contacts can be disposed on the circuit board. When the circuit board is disposed within a receptacle of the electrical component, the electrical contacts on the electrical component are coupled directly to the electrical contacts on the circuit board.

Abstract: A system and method are provided for coordinating the installation and removal a motor control center subunit with the power connection and interruption thereof. A system of interlocks and indicators causes an operator to install a motor control center subunit into a motor control center, and connect supply and control power thereto, in a particular order. Embodiments of the invention may prevent actuation of line contacts of the bucket, and shield the line contacts, until the bucket is fully installed in the motor control center. Other embodiments also prevent circuit breaker closure until the line contacts are engaged with a bus of the motor control center.

Abstract: A semiconductor device includes a semiconductor module that has an electrode terminal projecting externally; a substrate that has a through hole or a cut-out for inserting the electrode terminal; and a guide member that is provided between the semiconductor module and the substrate and guides the electrode terminal in such a manner that the electrode terminal is inserted into the through hole or the cut-out. The guide member becomes out of contact with the electrode terminal after the electrode terminal is inserted into the through hole or the cut-out.

Abstract: Disclosed is an image display device which is provided with an image display panel (1), and a housing (2) which houses the image display panel (1). On the rear wall (22) of the housing (2), a socket (6), wherein the plug (71) of a power supply code (7) for supplying the image display panel (1) with power is to be fitted, is provided. On the rear wall (22) of the housing (2), a housing section (3) for housing the socket (6) is provided, and the housing section (3) is configured by bonding together a recessed section (4) provided in the rear wall (22) of the housing (2), and a cover body (5) that covers the opening (40) of the recessed section (4).

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features. Wide cuts may be made in the molds after encapsulation reducing thermal stresses. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations.

Abstract: Disclosed is an electrochemical capacitor that can be reflow soldered, and wherein film package is used on the capacitor body. The container (20) of the electrochemical capacitor (ECC) stores the film package (11) of the capacitor body (10) within a storage space (SR) such that sealing sections (11a-11c) do not contact the inner surface of the storage space (SR). Inner material (30), which cover the sealing sections (11a-11c) and rear edge of the film package 11 and are adhered to the inner surface of the storage space (SR), affixing the film package (11) within the storage space (SR), are provided in a rectangular framework to the regions in the storage space (SR) of the container (20) that correspond to said sealing sections (11a-11c) and rear edge.

Abstract: An image display device which is provided with an image display panel, and a housing which houses the image display panel. In the front wall of the housing, an image display window makes the screen of the image display panel viewable from the outside. In the rear wall of the housing are two housing sections, each being configured by connecting together a recessed section provided in the rear wall, and a cover which covers the opening of the recessed section. On the recessed section-side connecting surface from the surfaces on which the recessed section and the cover of each housing section are connected, screw members are screwed at a plurality of areas along the inner circumference of the connecting surface by penetrating the cover. The distances between the adjacent screw members in the two housing sections are different from each other.

Abstract: An electronics module for a vehicle includes a plate element, a circuit carrier element, and a cover element. The electronics module further includes an inner region and an outer region. The plate element is configured to provide at least one conductive connection between the inner region and the outer region in order to electrically connect the circuit carrier element. The circuit carrier element is positioned on the cover element, and at least one electrical connection element is positioned between the circuit carrier element and the plate element. The at least one electrical connection element is an automatic connection element which is configured to automatically provide an electrically conductive connection between the circuit carrier element and the conductive connection of the plate element when the cover element and the plate element are fitted.