Abstract: Methods for monitoring one or more load currents corresponding with one or more voltage regulators used during operation of a semiconductor memory are described. The one or more load currents may be due to the biasing of memory cells within a memory array or due to the presence of shorts between lines in the memory array. A plurality of load currents corresponding with a plurality of voltage regulators may be monitored in real-time before and during biasing of one or more memory arrays. The plurality of load currents may be monitored using a configurable load current monitoring circuit that uses a current summation technique. The ability to monitor the plurality of load currents before performing a programming operation on a memory array allows for remapping of defective portions of the memory array and modification of programming bandwidth prior to the programming operation.

Abstract: A precharge circuit includes a precharge unit configured to apply a voltage of a precharge voltage terminal to a data line during a precharge operation, and a sensing unit configured to disable the precharge unit by sensing the voltage of the precharge voltage terminal. The precharge circuit may control a precharge operation by sensing a change in the voltage level of the precharge voltage terminal.

Abstract: A nonvolatile semiconductor memory device of an embodiment includes a p-type semiconductor substrate, a first P-well formed in the semiconductor substrate, and on which a plurality of memory cells is formed, an first N-well surrounding the first P-well and electrically separating the first P-well from the semiconductor substrate, a first negative voltage generation unit configured to generate a first negative voltage, a boost unit configured to boost a voltage and generate a boosted voltage, and a well voltage transmission unit connected to the first negative voltage generation unit, the boost unit, and the first P-well, and configured to switch a voltage between the first negative voltage and the boosted voltage, the voltage being applied to the first P-well.

Abstract: In aspects of the invention, an auxiliary memory circuit includes a shift register wherein a plurality of flip-flops are cascade-connected and a plurality of inversion circuits that invert and output outputs of each D flip-flop. A main memory circuit includes a switch, which acts in accordance with a signal from the auxiliary memory circuit, and an EPROM connected in series to the switch and driven by a writing voltage. A variable resistance circuit includes a switch, which acts in accordance with a signal from the auxiliary memory circuit, and a resistor connected in series to the switch. With aspects of the invention, it is possible for terminals of the writing voltage and a writing voltage to be commonized. Also, it is possible to provide a low-cost semiconductor physical quantity sensor device that can carry out electrical trimming with the voltage when writing into the EPROM kept constant.

Abstract: The disclosure is directed to a system and method for nominal read voltage variations of a flash device. N reads are performed, each at a selected voltage offset from an initial read voltage. An N bit digital pattern associated with the selected voltage offsets is generated for the N reads. The N bit digital pattern generated by the N reads is mapped to a signed representation. A voltage adjustment based upon the signed representation is applied to at least partially compensate for a variation of the nominal read voltage to reduce bit error rate of the flash device.

Abstract: A nonvolatile semiconductor memory device having a plurality of electrically rewritable nonvolatile memory cells connected in series together includes a select gate transistor connected in series to the serial combination of memory cells. A certain one of the memory cells which is located adjacent to the select gets transistor is for use as a dummy cell. This dummy cell is not used for data storage. During data erasing, the dummy cell is applied with the same bias voltage as that for the other memory cells.

Abstract: An interconnection matrix consists of a plurality of semiconductor Non-Volatile Memory (NVM) forming an M×N array. Semiconductor NVM devices in the array are either programmed to a high threshold voltage state or erased to a low threshold voltage state according to a specific interconnection configuration. Applied with a gate voltage bias higher than the low threshold voltage and lower than the high threshold voltage to the control gates of the entire semiconductor NVM devices in the array, the configured interconnection network is formed. The disclosed interconnection matrix can be applied to configuring circuit routing in Integrated Circuit (IC).

Abstract: Embodiments are provided that include a method including providing a first pulsed gate signal to a selected memory cell, wherein the pulsed gate signal alternates between a first voltage level and a second voltage level during a time period and sensing a data line response to determine data stored on the selected memory of cells. Further embodiments provide a system including a memory device, having a regulator circuit coupled to a plurality of access lines of a NAND memory cell, and a switching circuit configured to sequentially bias at least one of the plurality of the access lines between a first voltage level and a second voltage level based on an input signal.

Abstract: The present disclosure includes apparatuses and methods for determining soft data for combinations of memory cells. A number of embodiments include an array of memory cells, wherein the array includes a first memory cell and a second memory cell, wherein the first and second memory cells are each programmable to one of a number of program states, and wherein a combination of the program states of the first and second memory cells corresponds to one of a number of data states. A number of embodiments also include a buffer and/or a controller coupled to the array and configured to determine soft data associated with the program states of the first and second memory cells and determine soft data associated with the data state that corresponds to the combination of the program states of the first and second memory cells based, at least in part, on the soft data associated with the program state of the first memory cell and the soft data associated with the program state of the second memory cell.

Abstract: Embodiments of the present invention provide a flash memory which has high operating efficiency and a longer service life, and relate to the field of electronic technologies. The flash memory includes a control circuit and a plurality of memory cells, where the memory cell is a floating-gate MOS transistor which includes a source, a gate, a drain, and a substrate; the control circuit is separately connected to the source, the gate, the drain, and the substrate and configured to output a control signal to them, so as to implement a bitwise overwrite operation on the memory cell; and the control circuit is further configured to generate a control signal when data stored by any one of the memory cells is 0, so that the memory cell overwrites the data stored by the memory cell from 0 to 1 according to the control signal.

Abstract: The present invention provides a row decoder of a semiconductor storage device that prevents an increase in a circuit area while maintaining a high operation speed. Namely, the row decoder of the semiconductor storage device includes a word line selection circuit that has voltage application MOS transistors for each of plural word lines, the voltage application MOS transistors applying a normal voltage to the word lines corresponding to memory cells selected among plural memory cells positioned at a portion where the plural word lines intersect plural bit lines in a predetermined normal operation, and applying a high voltage in a predetermined high voltage operation; and a level shift circuit that outputs the normal voltage or a ground voltage lower than the normal voltage in the normal operation, and that outputs the normal voltage or the high voltage in the high voltage operation, to the voltage application MOS transistor.

Abstract: A nonvolatile semiconductor storage device according to an embodiment includes: a memory cell array including plural memory cells; and a control circuit that repeatedly performs a write loop including a program operation and a verify operation in data write performed to the memory cell, the verify operation including a preverify step to check whether a threshold voltage of the memory cell transitions to a preverify voltage, and a real verify step to check whether the threshold voltage of the memory cell transitions to the real verify voltage, the write loop including one or at least two verify operations corresponding to pieces of the data, the control circuit performing the write loop in which the preverify step of the verify operation corresponding to a first data is omitted after obtaining a first condition.

Abstract: A semiconductor memory device is provided. The semiconductor memory device includes memory cells having first to fourth middle states corresponding to different threshold voltage distributions. The semiconductor memory device also includes a peripheral circuit configured to perform a first program operation to program memory cells having the third and the fourth middle states to have four upper states and perform a second program operation to program memory cells having the first and the second middle states to have another four upper states.

Abstract: Provided are erase methods for a memory device which includes a substrate and multiple cell strings provided on the substrate, each cell string including multiple cell transistors stacked in a direction perpendicular to the substrate. The erase method includes applying a ground voltage to a ground selection line connected with ground selection transistors of the cell strings; applying a ground voltage to string selection lines connected with selection transistors of the cell strings; applying a word line erase voltage to word lines connected with memory cells of the cell strings; applying an erase voltage to the substrate; controlling a voltage of the ground selection line in response to applying of the erase voltage; and controlling voltages of the string selection lines in response to the applying of the erase voltage.

Abstract: An operation method of a memory includes the following steps: determining the number of memory units required to update the content stored therein when the memory is performing a program operation based on the N-bit input data and accordingly generate a first determination result; and providing (N?M) number of loads to a source line decoder of the memory if the first determination result indicates that there are M number of memory units required to update the content stored therein, and thereby coupling the (N?M) number of the provided loads to a transmission path of a power supply voltage in parallel, wherein N and M are natural numbers. A memory is also provided.

Abstract: Apparatuses, systems, and methods are disclosed to manage non-volatile media. A method includes determining a configuration parameter for a set of storage cells of a non-volatile recording medium. A method includes reading data from a set of storage cells using a determined configuration parameter. A method includes adjusting a configuration parameter based on read data.

Abstract: A control circuit is configured to execute an erasing operation on a selected cell unit in a selected memory block. In the erasing operation, the control circuit raises the voltage of the bodies of the first memory transistors included in the selected cell unit to a first voltage, sets the voltage of the bodies of the first memory transistors included in the non-selected cell unit to a second voltage lower than the first voltage, and applies a third voltage equal to or lower than the second voltage to the gates of the first memory transistors included in the selected cell unit and the non-selected cell unit.

Abstract: The present disclosure relates to a semiconductor memory device and a method of operation the semiconductor memory device, which sets an encoding value by sequentially defining ranges used for recognizing distribution of memory cells based on a middle range and then performing a read operation in an order from the middle ranges to an outermost range, thereby capable of using infinite ranges for recognizing the distribution of the memory cells without addition of a circuit to an inside of the semiconductor memory device.

Abstract: Device selection schemes in multi-chip package NAND flash memory systems are provided. A memory system is provided that has a memory controller, and a number of memory devices connected to the controller via a common bus with a multi-drop connection. The memory controller performs device selection by command. A corresponding memory controller is provided which performs device selection by command. Alternatively, device selection is performed by address. A memory device is provided use in memory system comprising a memory controller, and a number of memory devices inclusive of the memory device connected to the controller via a common bus with a multi-drop connection. The memory device has a register containing a device identifier, and a device identifier comparator that compares selected bits of a received input address to contents of the register to determine if there is a match. The memory device is selected if the device identifier comparator determines there is a match.

Abstract: A method for storing data. The method includes providing an addressable memory including a memory space, wherein the memory space includes a plurality of memory cells. The method includes configuring the addressable memory such that a majority of the plurality of memory cells in the memory space stores internal data values in a preferred bias condition when a first external data state of one or more external data states is written to the memory space, wherein the first external data state is opposite the preferred bias condition.

Abstract: A data programming method of a semiconductor memory device is provided which includes randomizing write data using a randomization method selected from among a plurality of randomization methods according to whether the write data is programmed in one of a plurality of nonvolatile memories; and programming the randomized write data in at least one of the plurality of nonvolatile memories, wherein the plurality of nonvolatile memories has different types from one another.

Abstract: A first non-selected word line including a word line adjacent to a selected word line is applied with a first write pass voltage. Furthermore, a second non-selected word line which is a non-selected word line excluding the first non-selected word line is applied with a second write pass voltage smaller than a program voltage. A control circuit, in the write operation, raises the first write pass voltage toward a first target value by executing a voltage raising operation having a first voltage rise width, X times, and raises the second write pass voltage toward a second target value by executing a voltage raising operation having a second voltage rise width, Y times. The first voltage rise width is larger than the second voltage rise width, and X times is fewer than Y times.

Abstract: Subject matter disclosed herein relates to a memory device, and more particularly to a nonvolatile memory device having a recess structure and methods of fabricating same.

Abstract: A method for performing memory access management includes: with regard to a same Flash cell of a Flash memory, receiving a first digital value outputted by the Flash memory, requesting the Flash memory to output at least one second digital value, wherein the first digital value and the at least one second digital value are utilized for determining information of a same bit stored in the Flash cell, and a number of various possible states of the Flash cell correspond to a possible number of bit(s) stored in the Flash cell; based upon the second digital value, generating/obtaining soft information of the Flash cell, for use of performing soft decoding; and controlling the Flash memory to perform sensing operations by respectively utilizing a plurality of sensing voltages that are not all the same, in order to generate the first digital value and the second digital value.

Abstract: Disclosed is a flash memory device and programming method that includes; receiving buffer data and determining between a high-speed mode and a reliability mode for buffer data, and upon determining the reliability mode storing the buffer data in a first buffer region, and upon determining the high-speed mode storing the buffer data in a second buffer region. The memory cell array of the flash memory including a main region and a separately designated buffer region divided into the first buffer region and second buffer region.

Abstract: An integrated circuit includes at least one memory array and at least one capacitor array over a substrate. The at least one capacitor array includes a plurality of capacitor cell structures. The capacitor cell structures of the plurality of cell structures comprise a first capacitor electrode over the substrate. A second capacitor electrode is over the first capacitor electrode. A third capacitor electrode is adjacent to first sidewalls of the first and second capacitor electrodes. A fourth capacitor electrode is adjacent to second sidewalls of the first and second capacitor electrodes. A fifth capacitor electrode is over the substrate and adjacent to the fourth capacitor electrode.

Abstract: A data storage device and fabrication and control methods thereof are disclosed. The data storage device includes a first-first sub-block of memory cells, a second-first sub-block of memory cells, a first well switch, a second well switch and a first group of word lines. The first well switch is operative to convey a first well bias to bias the first-first sub-block of memory cells. The second well switch is operative to convey a second well bias to bias the second-first sub-block of memory cells. Further, the first-first and the second-first sub-blocks both are activated according to the first group of word lines.

Abstract: A Flash memory device operable under a single-bit or multiple-bit serial protocol is provided with a capability to determine the address boundary condition of an application from the address field of an address boundary configurable (“ABC”) read command. Based on the identified address boundary condition, the Flash memory device may perform multiple sensing of the memory array as required by the ABC read command using optimal internal sense times for each sensing. The number of dummy bytes may be specified for the read command in advance by the user, based on the address boundary of the application and the desired frequency of operation of the Flash memory device. Therefore, Flash memory device read performance is improved both by minimizing the number of dummy bytes in the read command and by optimizing the internal sense times for the read operation.

Abstract: A nonvolatile memory device includes a memory cell array having multiple memory blocks. Each memory block includes memory cells arranged at intersections of multiple word lines and multiple bit lines. At least one word line of the multiple word lines is included in an upper word line group and at least one other word line of the multiple word lines is included in a lower word line group. The number of data bits stored in memory cells connected to the at least one word line included in the upper word line group is different from the number of data bits stored in memory cells connected to the at least one other word line included in the lower word line group.

Abstract: Techniques are provided for programming and erasing of select gate transistors in connection with the programming or erasing of a set of memory cells. In response to a program command to program memory cells, the select gate transistors are read to determine whether their Vth is below an acceptable range, in which case the select gate transistors are programmed before the memory cells. Or, a decision can be made to program the select gate transistors based on a count of program-erase cycles, whether a specified time period has elapsed and/or a temperature history of the non-volatile storage device. When an erase command is made to erase memory cells, the select gate transistors are read to determine whether their Vth is above an acceptable range. If their Vth is above the acceptable range, the select gate transistors can be erased concurrently with the erasing of the memory cells.

Abstract: An integrated circuit device. The device includes an address input(s) configured to receive address information from an address stream from an address command bus coupled to a host controller and an address output(s) configured to drive address information, and is coupled to a plurality of memory (DRAM) devices provided on a DIMM. The device has an address match table comprising a non-volatile memory device configured to store at least a revised address corresponding to a spare memory location and a bad address of at least one of the plurality of memory (DRAM) devices. The device has a control module configured to process and determine whether each address matches with a stored address in the address match table to identify the bad address and configured to replace the bad address with the revised address of the spare memory location.

Abstract: According to an embodiment, an interface circuit is provided with an output buffer which generates an output waveform on the basis of the ON/OFF operation of a transistor and a driver circuit which drives the transistor and is capable of independently changing a turn-ON speed and a turn-OFF speed of the transistor.

Abstract: A method of programming a memory is provided. The memory has a first cell, having a first S/D region and a second S/D region shared with a second cell. The second cell has a third S/D region opposite to the second S/D region. When programming the first cell, a first voltage is applied to a control gate of the first cell, a second voltage is applied to a control gate of the second cell to slightly turn on a channel of the second cell, a third and a fourth voltage are respectively applied to the first and the third S/D regions, and the second S/D region is floating. A carrier flows from the third S/D region to the first S/D region, and is injected into a charge storage layer of the first cell by source-side injection.

Abstract: An erase operation for a 3D stacked memory device adjusts a start time of an erase period and/or a duration of the erase period for each storage element based on a position of the storage element. A voltage is applied to one or both drive ends of a NAND string to pre-charge a channel to a level which is sufficient to create gate-induced drain leakage at the select gate transistors. With timing based on a storage element's distance from the driven end, the control gate voltage is lowered to encourage tunneling of holes into a charge trapping layer in the erase period. The lowered control gate voltage results in a channel-to-control gate voltage which is sufficiently high to encourage tunneling. The duration of the erase period is also increased when the distance from the driven end is greater. As a result, a narrow erase distribution can be achieved.

Abstract: Techniques are disclosed herein for performing an Internal Data Load (IDL) to sense non-volatile storage elements. Read pass voltages that are applied to the two neighbor word lines to a selected word line may be adjusted to result in a more accurate IDL. The read pass voltage for one neighbor may be increased by some delta voltage, whereas the read pass voltage for the other neighbor may be decreased by the same delta voltage. In one aspect, programming of an upper page of data into a word line that neighbors a target word line is halted to allow lower page data in the target memory cells to be read using an IDL and preserved in data latches while programming the upper page in the neighbor word completes. Preservation of the lower page data provides for a cleaner lower page when later programming the upper page into the target memory cells.

Abstract: A cache programming method for a non-volatile memory device includes programming data for a current programming operation into a memory cell array, determining whether the current programming operation has been performed to a threshold point of program completion, and receiving a data for a next programming operation when the current programming operation has been performed to the threshold point of program completion.

Abstract: A method of operating a nonvolatile memory device comprises receiving a read command from a memory controller, determining a read mode of the nonvolatile memory device, selecting a read voltage based on the read mode, and performing a read operation on memory cells of a selected page of the nonvolatile memory device using the selected read voltage.

Abstract: A semiconductor storage device has a nonvolatile storage region, a voltage generating circuit that generates an operational voltage for the storage region, and a control circuit that sends the voltage generated by the voltage generating circuit to the storage region. The voltage generating circuit has a transistor, a first resistance element, a second resistance element, and a comparator. The first resistance element and the second resistance element have wiring structure for resistance. The resistance wiring in the wiring structure has the same line width as the finest line width in the wiring formed in the storage region.

Abstract: Memory devices and methods are disclosed. An embodiment of one such method includes programming a first memory cell to a first program level by applying a first series of programming pulses to a control gate of the first memory cell, where the programming pulses of the first series have voltages that sequentially increase by a certain first voltage; and programming a second memory cell to a second program level that is higher than the first program level by applying a second series of programming pulses to a control gate of the second memory cell, where the programming pulses of the second series have voltages that sequentially increase by a certain second voltage less than the certain first voltage.

Abstract: A method of programming a memory system by selectively applying a program voltage to a selected wordline connected to a memory transistor to be programmed. A first bias voltage is applied to a first wordline adjacent to the source side of the selected wordline. The first bias voltage is also applied to a second wordline adjacent to the drain side of the selected wordline. A second bias voltage is applied to a third wordline adjacent to the drain side of the second wordline. A third bias voltage is applied to a fourth wordline adjacent to the source side of the first wordline. A pass voltage is also applied to the remaining wordlines that do not have one of a bias voltage and a program voltage applied, the pass voltage a selected voltage level.

Abstract: A semiconductor device is operated by, inter alia: programming selected memory cells by applying a first program voltage which is increased by a first step voltage to a selected word line and by applying a first pass voltage having a constant level to unselected word lines, and when a voltage difference between the first program voltage and the first pass voltage reaches a predetermined voltage difference, programming the selected memory cells by applying a second program voltage which is increased by a second step voltage lower than the first step voltage to the selected word line and by applying a second pass voltage which is increased in proportion to the second program voltage to first unselected word lines adjacent to the selected word line among the unselected word lines.

Abstract: Circuitry for generating voltage levels operative to perform data operations on non-volatile re-writeable memory arrays are disclosed. In some embodiments an integrated circuit includes a substrate and a base layer formed on the substrate to include active devices configured to operate within a first voltage range. Further, the integrated circuit can include a cross-point memory array formed above the base layer and including re-writable two-terminal memory cells that are configured to operate, for example, within a second voltage range that is greater than the first voltage range. Conductive array lines in the cross-point memory array are electrically coupled with the active devices in the base layer. The integrated circuit also can include X-line decoders and Y-line decoders that include devices that operate in the first voltage range. The active devices can include other active circuitry such as sense amps for reading data from the memory cells, for example.

Abstract: A nonvolatile semiconductor memory device comprises multiple memory strings each including a plurality of first and second groups of serially connected memory cells, and a back gate transistor serially connected between the first and second groups of memory cells, a plurality of word lines, each word line being connected to a control gate of a different memory cell in each of the memory strings, a voltage generating circuit configured to generate control voltages of different voltage levels, and a control circuit configured to control application of control voltages to the word lines and the back gate line. A control voltage applied to the back gate line may be varied depending on how far a selected word line is from the back gate line, and a control voltage applied to unselected word lines may be varied depending on how far the unselected word line is from the selected word line.

Abstract: Inter-cell interference cancellation is provided for flash memory devices. Data from a flash memory device is processed by obtaining one or more quantized threshold voltage values for at least one target cell of the flash memory device; obtaining one or more hard decision read values for at least one aggressor cell of the target cell; determining an aggressor state of the at least one aggressor cell; determining an interference amount based on the aggressor state; determining an adjustment to the quantized threshold voltage values based on the determined interference amount; and adjusting the quantized threshold voltage values based on the determined adjustment. The quantized threshold voltage values for at least one target cell are optionally re-used from a previous soft read retry operation. The adjusted quantized threshold voltage values are optionally used to determine reliability values and are optionally applied to a soft decision decoder and/or a buffer.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array and a controller. The controller is configured to perform a verify operation using a first verification voltage and a second verification voltage (first verification voltage<second verification voltage) when first value data is stored in a first memory cell. The controller is configured to determine whether a write operation to the first memory cell is completed or continued based on write data of a second memory cell adjacent to the first memory cell when a threshold voltage of the first memory cell is greater than or equal to the first verification voltage and less than the second verification voltage.

Abstract: A method of 4-bit MLC programming a nonvolatile memory device includes inputting an mth program operation command and sequentially executing first to fourth logical page program operations according to first to fourth logical page program start voltages, each stored in first to fourth logical page program start voltage storage units, wherein a program voltage, which is applied at a time point at which a memory cell programmed higher than a lowest verify voltage while a program operation of each logical page is performed occurs for a first time, is updated to each logical page program start voltage.

Abstract: A flash memory device and reading method of the flash memory device. The reading method includes determining a read voltage set of memory cells corresponding to a first word line from at least one of flag cell data of the first word line and flag cell data of a second word line adjacent to the first word line, and reading the memory cells corresponding to the first word line according to the determined read voltage set.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for configuring storage cells. A method includes detecting a shift in a read voltage level past a read voltage threshold for a set of memory cells of a non-volatile memory medium. A method includes adjusting a read voltage threshold for the set of memory cells by an amount based at least in part on one or more characteristics of the set of memory cells in response to the shift in the read voltage level. A method includes configuring the set of memory cells to use the adjusted read voltage threshold.

Abstract: Disclosed herein are techniques for providing a programming voltage to a selected word line in a non-volatile memory array. This may be a 3D NAND, 2D NAND, or another type of memory array. The programming voltage may be quickly ramped up on the selected word line, without the need for adding a stronger charge pump to the memory device. The voltage on the selected word line may be ramped up to a target voltage during a channel pre-charge phase. The target voltage may be limited in magnitude so that program disturb does not occur. Next, during a channel boosting phase, the unselected word lines are increased to a boosting voltage. The voltage on the selected word line is also increased during the boosting phase to a second target level. Then, the voltage on the selected word line is charged up from the second target level to a program voltage.

Abstract: A memory device multi-chip package containing conventional parallel bus flash memory dies interfacing to an external parallel bus having the same format and protocol. A bridge chip within the memory device interfaces internally over one or more internal parallel bus interfaces to the flash dies within the package. The bridge chip presents a single load on the external bus interface so that several memory device multi-chip packages (MCPs) can be connected to a controller, thereby increasing the number of flash dies supported by a single controller channel operating at full performance.