Abstract: In a programming operation of a 3D stacked non-volatile memory device, the channel of an inhibited NAND string is pre-charged by gate-induced drain leakage (GIDL) to achieve a high level of boosting which prevents program disturb in inhibited storage elements. In a program-verify iteration, prior to applying a program pulse, the drain-side select gate transistor is reverse biased to generate GIDL, causing the channel to be boosted to a pre-charge level such as 1.5V. Subsequently, when the program pulse is applied to a selected word line and pass voltages are applied to unselected word lines, the channel is boosted higher from the pre-charge level due to capacitive coupling. The pre-charge is effective even for a NAND string that is partially programmed because it does not rely on directly driving the channel from the bit line end.

Abstract: Embodiments of the present invention provide a memory array of macro cells. Each macro cell comprises a storage element and a calibration element. The storage element and its corresponding calibration element are part of a common memory array within an integrated circuit, and therefore, are in close proximity to each other. The calibration element may store a parameter used to modify the threshold voltage of the storage element.

Abstract: Different back bias (or body bias) conditions are applied to a non-volatile storage system during different program verify operations of a programming operation. A back bias may be applied during verify of an intermediate state (e.g., a lower page, middle page). The intermediate state is a state that exists during a program operation, but is not one of the final states. A lower back bias or no back bias is applied during verify of a final state (e.g., an upper page). Thus, a different back bias may be used when verifying an intermediate state than the back bias used when verifying a final state. Using the back bias makes it easier to verify a low VTH, such as a negative VTH. Also, using the back bias is effective at dealing with sense amplifier headroom issues.

Abstract: Methods for operating a non-volatile storage system in which cross-coupling effects are utilized to extend the effective threshold voltage window of a memory cell and to embed additional information within the extended threshold voltage window are described. In some cases, additional information may be embedded within a memory cell storing the highest programming state if the memory cell is in a high boosting environment by splitting the highest programming state into two substates and programming the memory cell to one of the two substates based on the additional information. A memory cell may be in a high boosting environment if its neighboring memory cells are in a high programmed state. Additional information may also be embedded within a memory cell storing the lowest programming state if the memory cell is in a low boosting environment. The additional information may include error correction information.

Abstract: A nonvolatile memory cell array is divided into first and second cell arrays, the page buffer circuit is arranged between the first and second cell arrays, a second latch circuit is arranged by the outside edge section of the first cell array, and the page buffer circuit is connected to the second latch circuit via a global bit line of the first cell array. The data writing to the first or second cell array is controlled by transmitting the writing data to the page buffer circuit via the global bit line from the second latch circuit, after the writing data is latched in the second latch circuit. The data reading of outputting the data read from the first or second cell array to the external circuit is controlled by transmitting data to the second latch circuit from the page buffer circuit via the global bit line.

Abstract: A nonvolatile memory device includes a voltage generator that sequentially provides a first setup voltage and second setup voltage to a word line of a memory cell array, and control logic including a time control unit that determines a word line setup time for the word line in relation to the second setup voltage based on a difference between the first and second setup voltages.

Abstract: Disclosed herein are 3D stacked memory devices having WL select gates. The 3D stacked memory device could have NAND strings. The WL select gates may be located adjacent to a word line hookup area of a word line plate. The word line plate may be driven by a word line plate driver and may have many word lines. The WL select gates may select individual word lines or groups of word lines. Therefore, smaller units that the entire block may be selected. This may reduce capacitive loading. The WL select gates may include thin film transistors. 3D decoding may be provided in a 3D stacked memory device using the WL select gates.

Abstract: According to one embodiment, a semiconductor memory device includes: a memory cell array; a first data latch; a second data latch; a first data bus; a second data bus; a first temporary latch; a second temporary latch; and a control unit. The first and the second data latches are electrically connected to the memory cell array. The first data bus is electrically connected to the first data latch. The second data bus is electrically connected to the second data latch. The first temporary latch is electrically connected to the first data bus. The second temporary latch is electrically connected to the second data bus. The control unit is configured to write data on the first temporary latch and transfer data retained in the first temporary latch to the first data latch while writing data on the second temporary latch.

Abstract: An apparatus, a method, and a system are disclosed. The apparatus includes a string of memory cells coupled to a select gate drain transistor that has a front control gate and a back control gate. The front and back control gates can be coupled together such that they are biased at the same voltage or separate such that they can be biased at different voltages.

Abstract: A first bit position of a cell in solid state storage is read where a sorting bit is obtained using the read of the first bit position. A second bit position of the cell is read for a first time, including by setting a first read threshold associated with the second bit position to a first value and setting a second read threshold associated with the second bit position to a second value. The second bit position of the cell is read for a second time, including by setting the first read threshold to a third value and setting the second read threshold to a fourth value. A new value for the first read threshold and for the second read threshold is generated using the sorting bit, the first read, and the second read.

Abstract: A non-volatile semiconductor memory device includes an electrically data rewritable non-volatile semiconductor memory cell and a write circuit for writing data in the memory cell, the write circuit writing a data in the memory cells by supplying a write voltage Vpgm and a write control voltage VBL to the memory cell, continuing the writing of the data in the memory cell by changing the value of the write control voltage VBL in response to an advent of a first write state of the memory cell and inhibiting any operation of writing a data to the memory cell by further changing the value of the write control voltage VBL to Vdd in response to an advent of a second write state of the memory cell.

Abstract: A nonvolatile semiconductor memory device includes a memory string that includes a plurality of first memory cells, a plurality of second memory cells, and a transistor electrically connected between the plurality of first memory cells and the plurality of second memory cells, and a control circuit that performs a program operation by applying a program voltage to a gate of a selected first memory cell among the plurality of first memory cells and a gate of a selected second memory cell among the plurality of second memory cells, a pass voltage lower than the program voltage to other memory cells in the plurality of first and second memory cells, and a control voltage to a gate of the transistor.

Abstract: A semiconductor memory device and a method of operating the same perform a program loop, including a program operation and a program verification operation based on a sub-verification voltage smaller than a target verification voltage and the target verification voltage, to the memory cells until a threshold voltage of the memory cells is greater than the target verification voltage. A positive voltage, supplied to the bit line of the memory cell of which the threshold voltage is higher than the sub-verification voltage, is increased whenever the program operation is performed, and thus a threshold voltage distribution of the memory cells may be improved.

Abstract: Regardless of data values stored on data memory cells, all read operations on the data memory cells are disallowed. For example, current flow is disallowed through a string of the data memory cells and one or more select line memory cells. The particular select value stored in a first select line memory cell in the string, for example coupled to a ground select line or a string select line, determines whether the string is enabled or disabled.

Abstract: Techniques are provided for programming and reading memory cells in a 3D stacked non-volatile memory device by compensating for variations in a memory hole diameter. The memory hole diameter is smaller at the bottom of the stack, resulting in more severe read disturb. To compensate, programming of memory cells at the lower word line layers is modified. In one approach, threshold voltage (Vth) distributions of one or more data states are narrowed during programming so that a lower read pass voltage can be used in a subsequent sensing operation. A sufficient spacing is maintained between the read pass voltage and the upper tail of the highest data state. The Vth distributions can be downshifted as well. In another approach, the read pass voltage is not lowered, but the lowest programmed state is upshifted to provide spacing from the upper tail of the erased state.

Abstract: Techniques are provided for sensing memory cells in a 3D stacked non-volatile memory device in a way which reduces read disturb, by using read pass voltages which are adjusted based on variations in a memory hole diameter. The memory cells are in NAND strings which extend in the memory holes. A larger read pass voltage is used for memory cells which are adjacent to wider portions of the memory holes, and a smaller read pass voltage is used for memory cells which are adjacent to narrower portions of the memory holes. This approach reduces the worst-case read disturb. Further, an overall resistance in the NAND string channel may be substantially unchanged so that a reference current used during sensing may be unchanged. The read pass voltage may be set based on a program voltage trim value, which is indicative of programming speed and memory hole diameter.

Abstract: Techniques are provided for programming and erasing of select gate transistors in connection with the programming or erasing of a set of memory cells. In response to a program command to program memory cells, the select gate transistors are read to determine whether their Vth is below an acceptable range, in which case the select gate transistors are programmed before the memory cells. Or, a decision can be made to program the select gate transistors based on a count of program-erase cycles, whether a specified time period has elapsed and/or a temperature history of the non-volatile storage device. When an erase command is made to erase memory cells, the select gate transistors are read to determine whether their Vth is above an acceptable range. If their Vth is above the acceptable range, the select gate transistors can be erased concurrently with the erasing of the memory cells.

Abstract: Upon programming a semiconductor memory device including a first and a second n-wells, a first and a second p-channel memory transistors respectively formed in the first and the second n-wells, and a bit line connected to a drain of the first p-channel transistor and a drain of the second p-channel memory transistor, a first voltage is applied to the first bit line, a second voltage is applied to the first n-well, and a third voltage lower than the second voltage is applied to the second n-well.

Abstract: Some embodiments include a memory device and a method of programming memory cells of the memory device. One such method can include applying, during a first pass of programming, a first bias voltage value to a source select gate to isolate memory cells from a source, applying a programming voltage to an access line of a page of the memory cells during the first pass of programming, and applying a second bias voltage value to the source select gate to isolate the memory cells from the source during a second pass of programming. Further devices, systems, and methods are disclosed.

Abstract: Apparatuses, systems, and methods are disclosed to manage non-volatile media. A method includes determining a configuration parameter for a set of storage cells of a non-volatile recording medium. A method includes reading data from a set of storage cells using a determined configuration parameter. A method includes adjusting a configuration parameter based on read data.

Abstract: The present invention provides a flash memory including a memory cell, a current limiter and a program voltage generator. The memory cell is programmed in response to a program current and a program voltage. The current limiter reflects amount of the program current by a data-line signal, e.g., a data-line voltage. The program voltage generator generates and controls the program voltage in response to the data-line voltage, such that the program current can track to a constant reference current.

Abstract: When performing a data erase operation, the control circuit generates positive holes at least at any one of the drain side select transistor and the source side select transistor, and supply the positive holes to a body of the memory string to raise a voltage of the body of the memory string to a first voltage. Then, it applies a voltage smaller than the first voltage to a first word line among the plurality of the word lines during a first time period. In addition, it applies a voltage smaller than the first voltage to a second word line different from the first word line during a second time period. The second time period is different from the first time period.

Abstract: Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a first region connected to a bit line extending in a first orientation and a second region connected to a source line extending in a second orientation. The direct injection semiconductor memory device may also include a body region spaced apart from and capacitively coupled to a word line extending in the second orientation, wherein the body region is electrically floating and disposed between the first region and the second region. The direct injection semiconductor memory device may further include a third region connected to a carrier injection line extending in the second orientation, wherein the first region, the second region, the body region, and the third region are disposed in sequential contiguous relationship.

Abstract: Memory devices and programming methods for memories are disclosed, such as those adapted to program a memory using an increasing channel voltage for a first portion of programming, and an increasing but reduced channel voltage for a second portion of programming.

Abstract: A nonvolatile semiconductor memory device according to an embodiment comprises: a memory string including a first memory cell and a second memory cell; a first word line connected to a gate of the first memory cell; a second word line connected to a gate of the second memory cell; and a peripheral circuit configured to control a write sequence and a read sequence, the peripheral circuit, during the write sequence or the read sequence on the first memory cell, executing a first operation on the condition that a positive first pass voltage is applied to the first word line and the second word line.

Abstract: A circuit comprises a first path, a second path, a current generating circuit, and a sense amplifier. The first path has a first current having a first current value. The second path has a second current having a second current value. The current generating circuit is configured to generate a reference current having a reference current value based on the first current value and the second current value. The sense amplifier is configured to receive a third current having a third current value and to generate a logical value based on the reference current value and the third current value.

Abstract: Techniques are provided for sensing memory cells in a 3D stacked non-volatile memory device in a way which reduces read disturb, by using read pass voltages which are adjusted based on variations in a memory hole diameter. The memory cells are in NAND strings which extend in the memory holes. A larger read pass voltage is used for memory cells which are adjacent to wider portions of the memory holes, and a smaller read pass voltage is used for memory cells which are adjacent to narrower portions of the memory holes. This approach reduces the worst-case read disturb. Further, an overall resistance in the NAND string channel may be substantially unchanged so that a reference current used during sensing may be unchanged. The read pass voltage may be set based on a program voltage trim value, which is indicative of programming speed and memory hole diameter.

Abstract: An one-transistor-one-bit (1T1b) Flash-based EEPROM cell is provided along with improved key operation schemes including applying a negative word line voltage and a reduced bit line voltage for perform erase operation, which drastically reduces the high voltage stress on each cell for enhancing the Program/Erase cycles while reducing cell size. An array made by the 1T1b Flash-based EEPROM cells can be operated with Half-page or Full-page divided programming and pre-charging period for each program cycle. Utilizing PGM buffer made of Vdd devices in the cell array further save silicon area. Additionally, a two-transistor-two-bit (2T2b) EEPROM cell derived from the 1T1b cell is disclosed with additional cell size reduction but with the operation of program and erase the same as that for the 1T1b cells with benefits of no process change but much enhanced storage density, superior Program/Erase endurance cycle, and capability for operating in high temperature environment.

Abstract: According to one embodiment, a data transfer control device complying with a communication protocol which executes an update of information from an attachment device in a predetermined area of a system memory, the device includes a receiving part receiving the information from the attachment device, a transferring part transferring the information in the predetermined area, the information from the transferring part overwritten in the predetermined area sequentially, and a determining part inhibiting a transfer of the information in the transferring part to omit the update of the information in the predetermined area.

Abstract: A communication line is connected to first and second chips, and held at a first signal level. A monitor circuit changes a signal level of the communication line from the first signal to a second signal level while one of the first and second chips uses a current larger than a reference current. When the signal level of the communication line is the second signal level, the other of the first and second chips is controlled to a wait state that does not transfer to an operating state of using a current larger than the reference current.

Abstract: According to an embodiment, a nonvolatile semiconductor memory device includes a plurality of memory cells and a control circuit. The memory cell includes a semiconductor layer, a gate insulating layer, a floating gate, a lower control gate, and an upper control gate. The semiconductor layer extends in a certain direction. The lower control gate is formed on the floating gate via an insulating layer. The upper control gate is formed on the lower control gate via an insulating layer. In addition, the control circuit, when performing a write operation, applies a first pass voltage to the upper control gate in a selected memory cell, and applies a first write voltage which is larger than the first pass voltage to the upper control gate in an adjacent memory cell formed on an identical semiconductor layer to the selected memory cell and adjacent to the selected memory cell.

Abstract: According to one embodiment, CONTROLLER includes a phase comparator that receives a data strobe signal outputted from a memory in response to a read enable signal, and a delayed data strobe signal formed by applying a delay to the data strobe signal, and outputs a result of comparison between phases of two signals. The controller also includes a Duty control unit that corrects a Duty of the read enable signal outputted to the memory based upon the comparison result of the phase comparator.

Abstract: A control circuit is configured to, during an erase operation, set a voltage of a first line connected to a selected cell unit to a voltage larger than a voltage of a gate of a first transistor included in the selected cell unit by an amount of a first voltage. The control circuit is configured to, during the erase operation, set a voltage difference between a voltage of a first line connected to an unselected cell unit and a voltage of a gate of a first transistor included in the unselected cell unit to a second voltage, the second voltage differing from the first voltage. In addition, the control circuit is configured to, during the erase operation, apply in the selected cell unit and the unselected cell unit a third voltage to a gate of at least one of dummy memory transistors in a dummy memory string, and apply a fourth voltage to a gate of another one of the dummy memory transistors in the dummy memory string, the fourth voltage being lower than the third voltage.

Abstract: A method is provided for programming a flash memory device including memory cells formed in a direction perpendicular to a substrate, a first sub word line connected to first memory cells and selectable by a first selection line, and a second sub word line connected to second memory cells and selectable by a second selection line, the first and second memory cells being formed at the same level and being supplied with a program voltage at the same time. The method includes performing LSB program operations on the first and second sub word lines by enabling the first and second selection lines, respectively; performing CSB program operations on the first and second sub word lines by enabling the first and second selection lines, respectively; and performing MSB program operations on the first and second sub word lines by enabling the first and second selection lines, respectively.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell array including a plurality of memory cells, a random number generation circuit configured to generate a random number, and a controller configured to control the memory cell array and the random number generation circuit. The random number generation circuit includes a random number control circuit configured to generate a random number parameter based on data which is read out from the memory cell by a generated control parameter, and a pseudo-random number generation circuit configured to generate the random number by using the random number parameter as a seed value.

Abstract: According to one embodiment, a storage device includes a nonvolatile memory and a controller. The nonvolatile memory includes blocks which store data. Each of the blocks is an erase unit. The controller controls an operation of the nonvolatile memory. The controller executes writes and erases with respect to a first block of the blocks in the nonvolatile memory for the first number of times during a first period. The controller executes writes and erases with respect to other blocks for the second number of times smaller than the first number of times during the first period.

Abstract: Apparatus and methods are disclosed, including a method that raises an electrical potential of a plurality of access lines to a raised electrical potential, where each access line is associated with a respective charge storage device of a string of charge storage devices. The electrical potential of a selected one of the access lines is lowered, and a data state of the charge storage device associated with the selected access line is sensed while the electrical potential of the selected access line is being lowered. Additional apparatus and methods are described.

Abstract: The operating method of a data storage device includes storing data in a buffer memory according to an external request, and determining whether the data stored in the buffer memory is data accompanying a buffer program operation of a memory cell array. When the data stored in the buffer memory is data accompanying the buffer program operation, the method further includes determining whether a main program operation on the memory cell array is required, and when a main program operation on the memory cell array is required, determining a program pattern of the main program operation on the memory cell array. The method further includes issuing a set of commands for the main program operation on the memory cell array to a multi-bit memory device based on the determined program pattern.

Abstract: N-channel multi-time programmable memory devices having an N-conductivity type substrate, first and second P-conductivity type wells in the N-conductivity type substrate, N-conductivity type source and drain regions formed in the first P-conductivity type well, the source and drain regions being separated by a channel region, an oxide layer over the N-conductivity type substrate; and a floating gate extending over the channel region and over the second P-conductivity type well in the N-conductivity type substrate, the multi-time programmable memory cell being programmable by hot electron injection and erasable by hot hole injection.

Abstract: A memory device that includes a sample and hold circuit coupled to a bit line. The sample and hold circuit stores a target threshold voltage for a selected memory cell. The memory cell is programmed and then verified with a ramped read voltage. The read voltage that turns on the memory cell is stored in the sample and hold circuit. The target threshold voltage is compared with the read voltage by a comparator circuit. When the read voltage is at least substantially equal to (i.e., is substantially equal to and/or starts to exceed) the target threshold voltage, the comparator circuit generates an inhibit signal.

Abstract: A semiconductor memory device includes a memory block as a code storage memory area which has a large memory capacity and in which the number of bits to be written at once is large, and a memory block as a work memory area which has a small memory capacity and in which the number of bits to be written at once is small, in which in writing to the code storage memory area a first voltage is supplied to a source line of this memory block, and in writing to the work memory area a second voltage higher than the first voltage is supplied to a source line of this memory block.

Abstract: A nonvolatile memory device comprises a cell array connected to a plurality of bit lines in an all bit line structure, a page buffer circuit connected to the plurality of bit lines, and control logic configured to control the page buffer circuit. The control logic controls the page buffer circuit to sense memory cells corresponding to both even-numbered and odd-numbered columns of a selected page in a first read mode and to sense memory cells corresponding to one of the even-numbered and odd-numbered columns of the selected page in a second read mode. A sensing operation is performed at least twice in the first read mode and once in the second read mode.

Abstract: A nonvolatile memory device includes a plurality of global word lines, a voltage pump configured to generate a plurality of voltages, a control unit configured to divide the plurality of global word lines into a first group and a second group in response to an input row address and generate control signals, a first selection unit configured to output at least two different voltages that are to be applied to global word lines of the first group, a second selection unit configured to output a voltage that is to be applied to global word lines of the second group, and a third selection unit configured to apply output voltages of the first selection unit to the global word lines of the first group, and apply an output voltage of the second selection unit to the global word lines of the second group.

Abstract: A method of testing a non-volatile memory device and a method of managing the non-volatile memory device are provided. The method of testing the non-volatile memory device includes calculating first and second values based on program loop frequencies corresponding to word lines of a memory area. A characteristic value of the memory area may be calculated based on the first and second values, and may be compared to a reference value to determine whether the memory area is defective.

Abstract: A memory device has an array of memory cells and a controller coupled to the array of memory cells. The controller is configured to determine a program window after a portion of a particular programing operation performed on the memory device is performed and before a subsequent portion of the particular programing operation performed on the memory device is performed. The controller is configured to determine the program window responsive to an amount of program disturb experienced by a particular state of a memory cell. The controller is configured to perform the subsequent portion of the particular programing operation performed on the memory device using the determined program window.

Abstract: Memory devices and methods are disclosed, such as those facilitating data line shielding by way of capacitive coupling with data lines coupled to a memory string source line. For example, alternating data lines are sensed while adjacent data lines are coupled to a common source line of the data lines being sensed. Data line shielding methods and apparatus disclosed can reduce effects of source line bounce occurring during a sense operation of a memory device.

Abstract: The present disclosure includes apparatuses and methods for continuous adjusting of sensing voltages. A number of embodiments include continuously monitoring an error rate associated with sense operations performed on a group of memory cells, and continuously adjusting a sensing voltage used to determine a state of the memory cells of the group based, at least partially, on the error rate.

Abstract: According to one embodiment, a memory system includes a nonvolatile memory and a control circuit. The nonvolatile memory includes a storage area having a plurality of memory cells configured to store data. The control circuit determines whether data write to the storage area is possible or impossible.

Abstract: In a memory cell array, a plurality of memory cells connected to a plurality of word lines and a plurality of bit lines are arranged in a matrix. A control circuit controls the potentials of said plurality of word lines and said plurality of bit lines. In an erase operation, the control circuit erases an n number of memory cells (n is a natural number equal to or larger than 2) of said plurality of memory cells at the same time using a first erase voltage, carries out a verify operation using a first verify level, finds the number of cells k (k?n) exceeding the first verify level, determines a second erase voltage according to the number k, and carries out an erase operation again using the second erase voltage.

Abstract: A method is provided for programming a multi-level cell flash memory device. The programming method includes programming a first memory cell of the multi-level call flash memory device to one of first through i-th program states, wherein i is a positive integer, by applying a first program pulse to the first memory cell in a first type programming operation, and programming a second memory cell to one of i+1-th through j-th program states, wherein j is an integer equal to or greater than three, by applying a second program pulse to the second memory cell in a second type programming operation. At least one of a second step voltage, a second bit-line forcing voltage and a second verification operation of the second type programming operation is different from a first step voltage, a first bit-line forcing voltage, and a first verification operation of the first type programming operation, respectively.