Abstract: The method is for sharpening a blade. An automatic sharpening apparatus is provided that has a holder. A blade is placed into the holder. A grinding-wheel driving motor, in operative engagement with a wheel on a spindle, rotates a grinding wheel. A grinding assembly motor moves the grinding wheel in an x-direction towards the blade. A linear motor moves the grinding wheel from a first position to a second position in a z-direction without moving the grinding-wheel driving motor. The rotating grinding wheel engages the blade. The grinding wheel sharpens the blade.

Abstract: The method is for sharpening a blade. An automatic sharpening apparatus is provided that has a housing with an elongate opening defined therein. A blade is placed inside the elongate opening. The blade is tightened between self-centered clamp holders. The rotation of the grinding wheel is turned on. The rotating grinding-wheel engages an underside of the blade and automatically moves along the blade by following a contour of the blade. While the grinding wheel moves along the blade, a counter-weight provides a counter-weight to the grinding wheel. The blade is sharpened while the blade is stationary inside the elongate opening of the housing.

Abstract: The present disclosure relates to a machine tool for machining workpieces, particularly a grinding machine, and to a method for positioning a spindle head of such a machine tool. The machine tool comprises a workpiece holder for receiving a workpiece, and a spindle head for receiving a tool, particularly a grinding wheel, wherein the spindle head is movable by motor with respect to the workpiece holder, wherein a handle is arranged at the spindle head and comprises at least one detector that is arranged to detect an impact on the handle, and wherein a control device is provided that is arranged to move the spindle head in at least one operation mode by motor in a defined manner dependent on the detected impact on the handle.

Abstract: Embodiments of the invention are directed to a portable grinding apparatus comprising: a frame; a boring bar operatively coupled to the frame; and a grinding assembly operatively coupled to the boring bar, wherein the grinding assembly is adjustable in one or more axes by adjusting the frame or the grinding assembly for grinding a component secured to the frame.

Abstract: An aero-contouring apparatus is provided. The aero-contouring apparatus has a housing assembly and a motor assembly disposed therein. The motor assembly has a motor unit and a drive unit. The aero-contouring apparatus further has an engagement force/tilt limiting member coupled to the housing assembly, which has a central opening and a bottom end configured to contact a surface to be aero-contoured of an aerodynamically functional coating applied to a structure. The aero-contouring apparatus further has an abrading unit coupled to the drive unit and inserted through the central opening in non-contact communication with the engagement force/tilt limiting member. The abrading unit is driven by the drive unit in a random orbit motion on the surface. The engagement force/tilt limiting member mechanically limits both an engagement force and any tilting motion of the abrading unit with respect to the surface.

Abstract: A substrate processing apparatus capable of accurately aligning a center of a substrate, such as a wafer, with an axis of a substrate stage and capable of processing the substrate without bending the substrate is disclosed. The substrate processing apparatus includes a first substrate stage having a first substrate-holding surface configured to hold a first region in a lower surface of the substrate, a second substrate stage having a second substrate-holding surface configured to hold a second region in the lower surface of the substrate, a stage elevator configured to move the first substrate-holding surface between an elevated position higher than the second substrate-holding surface and a lowered position lower than the second substrate-holding surface, and an aligner configured to measure an amount of eccentricity of a center of the substrate from the axis of the second substrate stage and align the center of the substrate with the axis of the second substrate stage.

Abstract: A head structure for a lapping assembly including a lapping control feature is disclosed. The lapping control feature includes a raised contact surface elevated from a front surface of the head structure of the lapping assembly. A relative position of the workpiece and raised contact surface are aligned to control workpiece thickness and other lapping parameters. In illustrated embodiments, the relative position of the workpiece and raised contact surface are aligned via an adjustment mechanism on the head structure. In illustrated embodiments, the adjustment mechanism is configured to adjust a position of the workpiece relative to the raised contact surface.

Abstract: A system for optical coherence tomography includes a source of optical radiation, an optical fiber, and a graded index fiber attached to a distal end of the optical fiber. The optical fiber and the graded index fiber are together configured to provide a common path for optical radiation reflected from a reference interface at a distal end of the graded index fiber and from a target.

Abstract: A substrate having an antimicrobial surface. The texture of the surface which has exposed metal e.g., copper or copper alloy contributes to the antimicrobial properties. Cavities or depressions in the surface can be coated or partially coated with an organic polymer, and the polymer can contain antimicrobial agents. Methods of preparing a coated surface, and uses are described.

Abstract: To stably perform cutting process even on a workpiece formed from a brittle material, in a ductile mode with high precision, without causing cracking and/or breaking in the workpiece. A dicing device which performs cutting process on a workpiece includes: a dicing blade that is formed into a discoid shape from a diamond sintered body formed by sintering diamond abrasive grains, and contains 80% or more of the diamond abrasive grains; a spindle (rotating mechanism) configured to rotate the dicing blade; and a movement mechanism configured to move the workpiece relatively to the dicing blade while forming a constant cut depth on the workpiece by the dicing blade.

Abstract: Flat-surfaced workpieces such as semiconductor wafers are attached to a rotatable floating workpiece holder carrier rotor that is supported by and rotationally driven by a bellows. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The idlers allow low-friction operation of the abrading system to be provided at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The carrier rotor is also restrained by a rigid rotating housing to allow a limited lateral motion and also a limited angular motion. Air pressure within a sealed bellows chamber provides controlled abrading pressure for wafers or other workpieces. Vacuum can also be applied to the bellows chamber to quickly move the wafer away from the abrading surface. Wafers can be quickly attached to the workpiece carrier with vacuum.

Abstract: Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating workpiece holder carrier that is supported by a pressurized-air flexible elastomer sealed air-chamber device and is rotationally driven by a circular flexible-arm device. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The range of abrading pressures is large and the device can provide a wide range of torque to rotate the workholder. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial and lateral motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.

Abstract: A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.

Abstract: A ceramic matrix composite component, turbine system and fabrication process are disclosed. The ceramic matrix composite (CMC) component includes a CMC material, an environmental barrier coating (EBC) on the CMC material, and a hard wear coating applied over the EBC. The turbine system includes a rotatable CMC component having a hard wear coating, and a stationary turbine component, the stationary turbine component having an abradable coating arranged and disposed to be cut by the silicon carbide material. The fabrication process includes positioning the rotatable CMC a pre-determined distance from the stationary turbine component and rotating the rotatable CMC component. The hard wear coating on the rotatable CMC component cuts the abradable coating on the stationary turbine component.

Abstract: An abrasive article includes a polymer matrix and abrasive grains dispersed in the polymer matrix, wherein the abrasive article has a void volume of at least 50%. The polymer matrix is polymerized from a monomer including at least one double bond.

Abstract: Manufacturing methods are provided. A component may be polished to remove defects thereon. An identifier may be added to the polishing material employed to polish the component. A detector may detect the identifier. For example, the identifier may be a fluroescing material that may illuminate in the presence of a fluorescent light. A determining apparatus may determine a status of the component based on the presence or absence of the identifier. For example, the determining apparatus may determine that the component needs to be re-cleaned based on presence of the identifier. Related systems and computer program products are also provided.

Abstract: A support accessory is disclosed for a hand tool, such as a grinder or polisher. The support accessory is configured to be detachably fastened to the hand tool. The support accessory includes a frame with a longitudinal beam configured to stabilize the hand tool front-to-back when the hand tool is fastened to the support accessory, as well as a trunnion rotatably coupled to the frame and configured to stabilize the hand tool side-to-side when the hand tool is fastened to the support accessory. The support accessory is also configured to support the hand tool in a position that is substantially parallel to a surface of a workpiece during use.

Abstract: A method of using a diamond cutting tool for ornamentation purpose is provided. The method includes positioning a work piece in proximity to a cutting tool. The cutting tool includes a shank. Further, the cutting tool may extend longitudinally from the shank and coaxial therewith. The cutting end includes a cutting end comprised of, but not limited to, a compact mass of sharp diamond dust. Further, the method includes activating the cutting tool to perform one of cutting and polishing of at least a portion of the work piece. Herein, activating the cutting tool enables movement of the cutting tool for positioning thereof. Further, activating the cutting tool may enable spinning of the cutting end to perform one of cutting and polishing of a portion of the work piece based on the positioning of the cutting tool.

Abstract: This disclosure provides economical and effective methods and apparatus for repairing scratches and scuffs on refillable bottle surfaces that minimally contaminates the bottle during the refurbishing process. In one aspect, the method comprises the steps of: a) adding at least one fluid into the polymeric packaging material such as a bottle to form at least a partially filled packaging material; and b) applying at least one heat source to an exterior surface of the at least partially filled packaging material to form a repaired polymeric packaging material. Apparatus and recycling systems that incorporate this method are also disclosed.

Abstract: An abrasive polishing slurry including abrasive particles in a carrier fluid and micro-nano members. A system and method for making an abrasive article using the polishing slurry is also disclosed. The system includes a gimballed dressing bar adapted to provide a compressive force sufficient to embed the abrasive particles into the substrate, wherein the members set a height the embedded abrasive particles protrude above the substrate.

Abstract: A method for forming a pattern in an abradable coating includes the step of machining a groove in the abradable coating with a machining tool. The machining tool is configured to machine a top surface, a side surface and a bottom surface of the groove simultaneously. A repeating step repeats the machining step until a desired number of grooves is obtained in the abradable coating.

Abstract: A method of generating a library of reference spectra includes storing an optical model for a layer stack having at a plurality of layers, receiving user input identifying a set of one or more refractive index functions and a set of one or more extinction coefficient functions a first layer from the plurality of layers, wherein the set of one or more refractive index functions includes a plurality of different refractive index functions or the set of one or more extinction coefficient functions includes a plurality of different extinction coefficient functions, and for each combination of a refractive index function from the set of refractive index functions and an extinction coefficient function from the set of extinction coefficient functions, calculating a reference spectrum using the optical model based on the refractive index function, the extinction coefficient function and a first thickness of the first layer.

Abstract: A component manufacturing method includes causing a holding member to hold a workpiece such that a spherical center of a processed surface of the workpiece is located on a supporting member; rotating the workpiece by rotating the holding member; and polishing the workpiece by moving the supporting member to move the workpiece on a polishing tool, with the spherical center of the processed surface located at a spherical center of a processing surface of the polishing tool.

Abstract: Railcar coupling knuckles having areas of improved structure, improved surface characteristics, and reduced stress under loading, and systems and methods for shot peening railcar components such as, but not limited to, coupling knuckles. Such shot-peening systems and methods may include robotic and/or fixed-position shot-peening devices equipped with shot-emitting mechanisms for expelling shot media against desired areas of a railcar component.

Abstract: The V-belt is produced with inwardly tapered sidewalls using an apparatus having at least one motorized cutting wheel having first axis of rotation and a moving anvil system with an anvil wheel having a second axis of rotation not parallel to the first axis. The anvil system is motorized and situated so the workpiece follows a U-shaped trajectory into the path of the cutting wheel. The circumferential gripping surface of the anvil wheel and circumferential cutting surface of the cutting wheel are geometrically arranged so that at the point of contact between workpiece and cutting wheel the respective surfaces define planes that intersect in an acute angle that defines the inwardly tapered sidewalls.

Abstract: A method of forming a workpiece having machinability rating not greater than a machinability rating of Inconel 718. The method may include removing material from the workpiece by moving at least one grinding tool relative to the workpiece and may be conducted at a specific grinding energy of not greater than about 7 Hp/in3 min (about 19 J/mm3) for a material removal rate of at least about 2.5 in3/min·in (about 25 mm3sec/mm).

Abstract: The present invention relates to a hydrophobic or oleophobic microporous polymer membrane having a structurally induced drip-off effect, to methods for producing the membrane according to the invention, to the use of the membrane in the sterile filtration of gaseous fluids, and to the use of the membrane as a liquid barrier in liquid-containing systems to be vented.

Abstract: A method of forming a complex form in a workpiece includes moving a grinding tool having a complex shape relative to a surface of a workpiece to form a complex shape opening in the workpiece, and the grinding tool is tilted in a lateral plane relative to the workpiece.

Abstract: An orbital motion attachment for a die grinder includes a flexible collar mounted at a first end to a locating support ring and the locating support ring being removably secured to the die grinder. A collet has an offset bearing shaft extending from a first end. The collet is connected at a second end to an output shaft of the die grinder and the offset bearing shaft is connected at a second end to an applicator tip. An indexing ring is affixed to a second end of the flexible collar to secure the applicator tip to the offset bearing shaft.

Abstract: Disclosed herein is a method of manufacturing a noise removing filter, including preparing at least one conductive pattern, an insulating layer for covering the at least one conductive pattern, and a lower magnetic body including input/output stud terminals for electrically inputting and outputting electricity to and from the at least one conductive pattern; disposing a recognizable portion on upper surfaces of the input/output stud terminals; disposing an upper magnetic body on the recognizable portion and the insulating layer; polishing the upper magnetic body; and removing the recognizable portion such that a level of an upper surface of the upper magnetic body is higher than levels of the upper surfaces of the input/output stud terminals.

Abstract: A cast slab having a pair of wide, substantially planar, and opposite side faces and a pair of narrow opposite edge faces, is ground by first orienting the slab with the side and edge faces vertical. Then grinding tools are pressed oppositely and horizontally against opposite wide faces, with the grinders throwing the chips downward. The tools and slab are relatively vertically displaced for the grinding.

Abstract: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.

Abstract: Presently described are methods of making an article via electrostatic deposition of particles, abrasive grains and articles, as well as a method of repairing a painted surface. The abrasive grain comprises a plurality of abrasive particles having a median primary particle size of less than 75 microns, and discrete hydrophobic nanoparticles.

Abstract: A wet sanding adjuvant is comprised of a composition comprising: (1) an alkali metal or ammonium salt of an alkoxylated alkyl sulfate; (2) an alkali metal or ammonium salt of an alphaolefin sulfonate; (3) a cellulose derivative selected from the group consisting of hydroxyalkyl cellulose, a carboxyalkyl cellulose and combinations thereof. The adjuvant is used in a method of removing a coating from a surface comprising the steps of: (1) contacting a coated surface with a composition according to the invention to form a wet surface on the coating; (2) abrading the wet surface with an abrasive; (3) removing the composition from the surface.

Abstract: A probe pin having a bent portion at its tip end portion is used for a probe card, the probe pin is configured such that an angle constituted by a direction of work groove generated at a time of machine-working of a tip end portion of the probe pin and a longitudinal direction of a metal wire is set to 45 degree or less, or both directions are set to be almost parallel to each other. Due to above configuration, even if the tip end portion of the probe pin is subjected to a bending work and a worked surface is formed with recessed portion, a breakage of the probe pin caused by the recessed portion existing on the worked surface and functioning as a starting point of the breakage can be effectively prevented whereby a lowering of a production yield of the probe pin can be greatly suppressed.

Abstract: A polishing composition of the present invention contains abrasive grains each having a surface with protrusions. Parts of the abrasive grains have larger particle diameters than the volume-based average particle diameter of the abrasive grains, and the average of values respectively obtained by dividing a height of each protrusion on the surface of each abrasive grain belonging to the parts of the abrasive grains by the width of a base portion of the same protrusion is 0.170 or more. Protrusions on the surfaces of abrasive grains belonging to the parts of the abrasive grains that have larger particle diameters than the volume-based average particle diameter of the abrasive grains have an average height of 3.5 nm or more. The polishing composition has a content of an organic alkali of 100 mmol or less per kilogram of the abrasive grains in the polishing composition.

Abstract: 3D spectacles for prescription wearers include a dished lens blank to which is applied a dished 3D laminate blank of substantially the same shape. The composite is machined on edge and face to form a non-plan 3D spectacle lens. In order to prevent delamination during edge machining, the 3D laminate layer first may be breached in a direction perpendicular to the lens face.

Abstract: A puncture needle includes a needle tube 1 provided with a spiral groove 3 and wall surfaces 3a and 3b of the spiral groove 3 serve as a surface for reflecting ultrasonic waves. The spiral groove is formed on the peripheral surface of the needle tube such that a grinding stone 2 is brought into contact with the peripheral surface of the needle tube while the needle tube 1 is being moved in its axial direction and rotated. The wall surfaces of the spiral groove formed on the needle tube serve as a reflection surface to change the orientation of the reflection surface in the axial direction of the needle tube according to change in position of the spiral. Therefore, even if a direction in which an ultrasonic wave is applied to the puncture needle is fixed, any portion of the reflection surface changing in orientation can become a surface for reflecting well ultrasonic waves, so that good ultrasonic waves can be obtained.

Abstract: Disclosed herein is a joining electrode including: an insulating layer; a recessed portion formed in the insulating layer; a covering layer formed on a side surface and a bottom surface of the recessed portion; and a joining metallic layer formed on the covering layer and having an upper surface protruding from a surface of the insulating layer.

Abstract: A method of manufacturing a microneedle including forming a plurality of first linear grooves on a substrate in parallel to one another along a first direction using grinding and forming a plurality of second linear grooves on the substrate in parallel to one another in a second direction intersecting the first direction using grinding. At least one of the forming of a plurality of first linear grooves and the forming of a plurality of second linear grooves includes forming first stage grooves using a first dicing blade; and processing the first stage grooves by tracing the first stage grooves using a second dicing blade having a side surface different from that of the first dicing blade to thereby form second stage grooves.

Abstract: The present disclosure provides, among other things, scale-coated surfaces, vessels with controlled deposits of scale, and associated methods for enhanced boiling heat transfer. It is presently found that creating and/or maintaining a scale deposit at a controlled thickness actually enhances a type of boiling called nucleate boiling, which improves heat transfer.

Abstract: Compositions comprising an alkanesulfonic acid and an organic nitrogenous base, and related methods of use.

Abstract: The housing of a grinding spindle unit is pivotably mounted by way of a pivot axle on the receiving part of a grinding machine, e.g., on a grinding headstock. The grinding spindle unit bears a grinding wheel which is driven in rotation. The actuation of an adjusting unit extends a pressure pin, which pivots the housing of the grinding spindle unit about the pivot axle and thus slants the grinding wheel. The pivot axle is in this case formed as a film hinge through a zone of targeted elastic material deformation. A tensile spring device brings about constant contact between the pressure pin and the receiving part.

Abstract: The present relates to an apparatus and method for blending added material with base material on manufactured components. The apparatus comprises an abrasive device having an abrasive surface for removing exceeding added material, and a guide fixed to the abrasive device. The method determines a trajectory of the abrasive surface with respect to a manufactured component: determines which of a plurality of contact points of the guide shall be in contact with the manufactured component along the trajectory; actuates the abrasive device; and controls position and angle of the abrasive surface en the manufactured component along the trajectory, while keeping the determined contact point in contact with the manufactured component. A force is applied to the abrasive device when the abrasive surface is in contact with the manufactured component and transferred when the guide gets in contact with the base material.

Abstract: The present invention relates to a bonded abrasive article comprising specific shaped abrasive particles and a bonding medium comprising a vitreous bond. The present invention also relates to the use of an article according to the present invention in grinding applications, in particular in high performance grinding applications and to the use of an article according to the present invention for abrading a workpiece material particularly a workpiece material selected from steels, non-ferrous metals, and alloys. In addition, the present invention relates to a method for abrading a workpiece, the method comprising frictionally contacting at least a portion of an abrasive article according to the invention with a surface of a workpiece; and moving at least one of the workpiece or the abrasive article to abrade at least a portion of the surface of the workpiece.

Abstract: A method of abrading a workpiece includes: contacting a metallic workpiece, having a bulk temperature of less than 500 degrees Celsius, with a stationary rotating bonded abrasive wheel having a diameter of at least 150 millimeters, wherein the bonded abrasive wheel comprises ceramic shaped abrasive particles retained in a binder, and wherein metallic swarf is formed, and at least 20 percent by weight of the metallic swarf is filamentary metallic swarf having a length of at least 3 mm.

Abstract: A nanocomposite fluid includes a fluid medium; and a nanoparticle composition comprising nanoparticles which are electrically insulating and thermally conductive. A method of making the nanocomposite fluid includes forming boron nitride nanoparticles; dispersing the boron nitride nanoparticles in a solvent; combining the boron nitride nanoparticles and a fluid medium; and removing the solvent.

Abstract: A surface machining mechanism modifies a repair segment of a body having a contoured surface. The surface machining mechanism includes a frame assembly and one or more guide members for supporting the frame assembly on the contoured surface. The guide members mate with the contoured surface and are movable along the contoured surface to guide the frame assembly. A machining apparatus is supported by the frame assembly. The machining apparatus engages the repair segment of the body as the machining apparatus is moved along the contoured surface. A method of modifying a repair segment of a body having a contoured surface with the surface machining mechanism is also provided.

Abstract: An apparatus for illumination is provided. In one aspect, the apparatus comprises a light guide device including a hollow light pipe portion, an opening, and a distal end longitudinally opposite from the opening. The opening is configured to receive at least a portion of an illumination device therein. Either or both of the light pipe portion and the distal end has a textured surface thereof.

Abstract: A method of polishing a metal layer comprising the following steps. A structure having an upper patterned dielectric layer with an opening therein is provided. A barrier layer is formed over the patterned upper dielectric layer and lining the opening. A metal layer is formed over the barrier layer, filling the opening. A first polish step employing a first slurry composition is conducted to remove a portion of the overlying metal layer. A second polish step employing the first slurry composition is conducted to: polish the partially removed overlying metal layer; and to expose portions of the barrier layer overlying the patterned upper dielectric layer. A third polish step employing a second slurry composition is conducted to remove the exposed barrier layer portions and exposing underlying portions of the patterned upper dielectric layer. A fourth polish step employing the second slurry composition and BTA is conducted to buff the exposed upper dielectric layer portions.