Abstract: A method determines a path of a tool machining a pocket shape in a workpiece. The pocket shape is defined by a closed curve in an x-y plane. The method determines positions and velocities of a motion of an oscillator having an energy defined by a function that is positive within a boundary of the pocket shape and equals zero on the boundary of the pocket shape. The method determines coordinates of the path of the tool based on corresponding pairs of position and velocity values of the motion, wherein a position value of each pair represents an x coordinate of the path of the tool in the x-y plane, and a velocity value of each pair represents a y coordinate of the path of the tool in the x-y plane.

Abstract: A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.

Abstract: An apparatus for determining and/or monitoring at least one process variable of a medium, comprising: an oscillatable unit, which has a membrane and at least one oscillatable element, wherein the oscillatable element is secured to the membrane at least in a first securement region and in a second securement region. At least one driving/receiving unit, which excites the oscillatable unit to execute mechanical oscillations and which produces a received signal dependent on the oscillations of the oscillatable unit; and a control/evaluation unit, which evaluates the received signal with reference to the process variable. The apparatus is distinguished by features including that the driving/receiving unit is embodied in such a manner and arranged on a rear face of the membrane facing away from the oscillatable element that the oscillatable element executes torsional oscillations.

Abstract: A coated abrasive article comprising a backing, an adhesive layer disposed in a discontinuous distribution on at least a portion of the backing, wherein the discontinuous distribution comprises a plurality of adhesive contact regions having at least one of a lateral spacing or a longitudinal spacing between each of the adhesive contact regions; and at least one abrasive particle disposed on each adhesive contact region, the abrasive particle having a tip, and there being at least one of a lateral spacing or a longitudinal spacing between each of the abrasive particles, and wherein at least 65% of the at least one of a lateral spacing and a longitudinal spacing between the tips of the abrasive particles is within 2.5 standard deviations of the mean.

Abstract: Methods and systems for providing cleaning and providing barrier coatings to interior wall surfaces of small diameter metal and composite piping systems in buildings. An entire piping system can be cleaned in one single pass by dry particulates forced by air throughout the building piping system by an external generator, and the entire piping system can be coated in one single pass by a machine connected exterior to the piping system. Small pipes can be protected by the effects of water corrosion, erosion and electrolysis, extending the life of piping systems such as copper, steel, lead, brass, cast iron piping and composite materials.

Abstract: A pressure-adjusting lapping element is included as a structural component of a carrier assembly in a lapping head. The lapping element includes actuator nodes that permit fine tuning of a lapping force applied through the lapping element to a work piece. An actuator assembly is directly attached to the lapping element and manipulates the individual actuator nodes. The lapping element further includes whippletree structure to permit a desired degree of flexibility in the lapping element to respond to force inputs at the actuator nodes.

Abstract: A system for use in removing a multi-layer coating from a substrate is provided. The multi-layer coating includes a first coating applied to the substrate and a second coating applied over the first coating. The first coating is formed from a first material and the second coating is formed from a second material different from the first material. The system includes a grinding mechanism configured to remove the multi-layer coating from the substrate, and a controller coupled in communication with the grinding mechanism. The controller is configured to position the grinding mechanism against the multi-layer coating, initiate a first removal mode that directs the grinding mechanism to traverse across the substrate, monitor a variable operating parameter of the grinding mechanism during the first removal mode, and evaluate a value of the variable operating parameter against a predetermined threshold to determine whether the second coating has been removed from the substrate.

Abstract: The present invention provides a sample stack structure with multiple layers. The sample stack structure has at least a substrate, an adhesive layer and a target layer. The target layer is directly sandwiched between the substrate and the adhesive layer.

Abstract: A disk buffing apparatus includes a spindle for rotating an annular disk, and a first pad arm for loading a first abrasive tape against a first surface of the annular disk. The first pad arm includes a pad arm frame having a pad receptacle and a first pad. The first pad has a first damping layer in contact with the first pad arm within the pad receptacle, and a first tape loading layer for contacting the first abrasive tape. The first damping layer comprises a first polymeric material and the first tape loading layer comprises a second polymeric material. The first polymeric material has a lesser hardness than the second polymeric material.

Abstract: Shaped ceramic articles can be obtained by screen printing the desired shapes from a dispersion of a precursor of the ceramic onto a receiving surface using a transfer assisted technique that applies a differential pressure, at least partially drying the screen printed shapes, and firing them to generate the shaped ceramic articles. Shaped abrasive particles made using lower viscosity sol gels that tended to flow or creep after the screen printing formation were found to have higher grinding performance over screen printed shaped abrasive particles made with higher viscosity sol gels.

Abstract: Machining of the present invention is machining of polishing work to be polished by movement of polishing sheet relative to work, in a state where polishing sheet is in contact with a surface of work to be polished. In the machining, work is arranged in contact with polishing sheet in a state where work is sandwiched between first simultaneous machining material with hardness lower than that of work, and second simultaneous machining material with hardness higher than that of work, and work is polished by relative movement of polishing sheet from first simultaneous machining material toward second simultaneous machining material.

Abstract: Method for abrasive waterjet cutting of materials determines a constant of cuttability using an abrasive waterjet Kawj, according to version A, where three deformation parameters are measured on a test cut/sample, version B, where two deformation parameters are measured, version C where one parameter is measured, or a version D where the design is carried out by calculating Kawj according to Young's modulus or according to an ultrasonic wave speed of the cut material. This constant is subsequently input to an algorithm. The result of a calculation using the algorithm acquires sufficient numerical and graphical data to an optimum setting of parameters and are generally valid for all engineering materials, and further of data on cut quality, limit depth of cuts and economical parameters, and also on mechanical properties of the cut material with regard to classification of the material into cuttability class.

Abstract: Systems and methods for treating concrete, which includes the steps of wetting a surface of concrete with a amorphous colloidal silica, allowing time for the colloidal silica to penetrate the concrete surface, and cutting the surface of the concrete with a bladed tool wherein the longitudinal blade portion is positioned approximately at an angle between 30 degrees and 90 degrees relative to the surface of the concrete.

Abstract: Described herein is an apparatus for sanding an edge of a panel. The apparatus includes a base having a horizontal support surface for supporting the panel, and a fence mounted to the base. The fence has a vertical guide surface for engaging the edge of the panel. The fence also has at least one vertical slot along the vertical guide surface. The apparatus also includes at least one orbital sander positioned within the vertical slot for sanding the edge of the panel, and a linear actuator for reciprocating the orbital sander within the vertical slot along a vertical path. In use, the panel is moved along the base and the panel edge engages the fence while the sander oscillates and reciprocates to sand the panel edge.

Abstract: A compound barb medical device is provided which includes an elongated body having at least one barb formed along the length of the body, the barb defining an inner surface with a first portion disposed at a first orientation relative to a longitudinal axis of the elongated body, and a second portion disposed at a second orientation relative to the longitudinal axis. Optionally, the barb defines a third portion disposed at a third orientation relative to the longitudinal axis. A method for forming a compound barb on a medical device is also provided.

Abstract: Exemplary embodiments of the present invention disclose a non-halogenated etchant for etching an indium oxide layer and a method of manufacturing a display substrate using the non-halogenated etchant, the non-halogenated etchant including nitric acid, sulfuric acid, a corrosion inhibitor including ammonium, a cyclic amine-based compound, and water.

Abstract: Described are embodiments of an invention for a method and a tool to produce a textured surface on the retention tab of a storage cell. The tool has a form that fits within the storage cell. The form has a hard material with a hard surface with contacts a surface of the retention tab within the storage cell. The movement of the hard surface across the surface of the retention tab produces a textured surface on the retention tab. The textured interface between a notch of a data storage cartridge and a retention tab of a storage cell provides a consistent and low friction force that retains the data storage cartridge within the cell but allows the accessor to easily remove the data storage cartridge when needed.

Abstract: The method is for sharpening a blade. An automatic sharpening apparatus is provided that has a housing with an elongate opening defined therein. A blade is placed inside the elongate opening. The blade is tightened between self-centered clamp holders. The rotation of the grinding wheel is turned on. The rotating grinding-wheel engages an underside of the blade and automatically moves along the blade by following a contour of the blade. While the grinding wheel moves along the blade, a counter-weight provides a counter-weight to the grinding wheel. The blade is sharpened while the blade is stationary inside the elongate opening of the housing.

Abstract: The method is for sharpening a blade. An automatic sharpening apparatus is provided that has a holder. A blade is placed into the holder. A grinding-wheel driving motor, in operative engagement with a wheel on a spindle, rotates a grinding wheel. A grinding assembly motor moves the grinding wheel in an x-direction towards the blade. A linear motor moves the grinding wheel from a first position to a second position in a z-direction without moving the grinding-wheel driving motor. The rotating grinding wheel engages the blade. The grinding wheel sharpens the blade.

Abstract: The present disclosure relates to a machine tool for machining workpieces, particularly a grinding machine, and to a method for positioning a spindle head of such a machine tool. The machine tool comprises a workpiece holder for receiving a workpiece, and a spindle head for receiving a tool, particularly a grinding wheel, wherein the spindle head is movable by motor with respect to the workpiece holder, wherein a handle is arranged at the spindle head and comprises at least one detector that is arranged to detect an impact on the handle, and wherein a control device is provided that is arranged to move the spindle head in at least one operation mode by motor in a defined manner dependent on the detected impact on the handle.

Abstract: Embodiments of the invention are directed to a portable grinding apparatus comprising: a frame; a boring bar operatively coupled to the frame; and a grinding assembly operatively coupled to the boring bar, wherein the grinding assembly is adjustable in one or more axes by adjusting the frame or the grinding assembly for grinding a component secured to the frame.

Abstract: An aero-contouring apparatus is provided. The aero-contouring apparatus has a housing assembly and a motor assembly disposed therein. The motor assembly has a motor unit and a drive unit. The aero-contouring apparatus further has an engagement force/tilt limiting member coupled to the housing assembly, which has a central opening and a bottom end configured to contact a surface to be aero-contoured of an aerodynamically functional coating applied to a structure. The aero-contouring apparatus further has an abrading unit coupled to the drive unit and inserted through the central opening in non-contact communication with the engagement force/tilt limiting member. The abrading unit is driven by the drive unit in a random orbit motion on the surface. The engagement force/tilt limiting member mechanically limits both an engagement force and any tilting motion of the abrading unit with respect to the surface.

Abstract: A substrate processing apparatus capable of accurately aligning a center of a substrate, such as a wafer, with an axis of a substrate stage and capable of processing the substrate without bending the substrate is disclosed. The substrate processing apparatus includes a first substrate stage having a first substrate-holding surface configured to hold a first region in a lower surface of the substrate, a second substrate stage having a second substrate-holding surface configured to hold a second region in the lower surface of the substrate, a stage elevator configured to move the first substrate-holding surface between an elevated position higher than the second substrate-holding surface and a lowered position lower than the second substrate-holding surface, and an aligner configured to measure an amount of eccentricity of a center of the substrate from the axis of the second substrate stage and align the center of the substrate with the axis of the second substrate stage.

Abstract: A substrate having an antimicrobial surface. The texture of the surface which has exposed metal e.g., copper or copper alloy contributes to the antimicrobial properties. Cavities or depressions in the surface can be coated or partially coated with an organic polymer, and the polymer can contain antimicrobial agents. Methods of preparing a coated surface, and uses are described.

Abstract: A head structure for a lapping assembly including a lapping control feature is disclosed. The lapping control feature includes a raised contact surface elevated from a front surface of the head structure of the lapping assembly. A relative position of the workpiece and raised contact surface are aligned to control workpiece thickness and other lapping parameters. In illustrated embodiments, the relative position of the workpiece and raised contact surface are aligned via an adjustment mechanism on the head structure. In illustrated embodiments, the adjustment mechanism is configured to adjust a position of the workpiece relative to the raised contact surface.

Abstract: A system for optical coherence tomography includes a source of optical radiation, an optical fiber, and a graded index fiber attached to a distal end of the optical fiber. The optical fiber and the graded index fiber are together configured to provide a common path for optical radiation reflected from a reference interface at a distal end of the graded index fiber and from a target.

Abstract: To stably perform cutting process even on a workpiece formed from a brittle material, in a ductile mode with high precision, without causing cracking and/or breaking in the workpiece. A dicing device which performs cutting process on a workpiece includes: a dicing blade that is formed into a discoid shape from a diamond sintered body formed by sintering diamond abrasive grains, and contains 80% or more of the diamond abrasive grains; a spindle (rotating mechanism) configured to rotate the dicing blade; and a movement mechanism configured to move the workpiece relatively to the dicing blade while forming a constant cut depth on the workpiece by the dicing blade.

Abstract: Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating workpiece holder carrier that is supported by a pressurized-air flexible elastomer sealed air-chamber device and is rotationally driven by a circular flexible-arm device. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The range of abrading pressures is large and the device can provide a wide range of torque to rotate the workholder. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial and lateral motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.

Abstract: Flat-surfaced workpieces such as semiconductor wafers are attached to a rotatable floating workpiece holder carrier rotor that is supported by and rotationally driven by a bellows. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The idlers allow low-friction operation of the abrading system to be provided at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The carrier rotor is also restrained by a rigid rotating housing to allow a limited lateral motion and also a limited angular motion. Air pressure within a sealed bellows chamber provides controlled abrading pressure for wafers or other workpieces. Vacuum can also be applied to the bellows chamber to quickly move the wafer away from the abrading surface. Wafers can be quickly attached to the workpiece carrier with vacuum.

Abstract: A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.

Abstract: A ceramic matrix composite component, turbine system and fabrication process are disclosed. The ceramic matrix composite (CMC) component includes a CMC material, an environmental barrier coating (EBC) on the CMC material, and a hard wear coating applied over the EBC. The turbine system includes a rotatable CMC component having a hard wear coating, and a stationary turbine component, the stationary turbine component having an abradable coating arranged and disposed to be cut by the silicon carbide material. The fabrication process includes positioning the rotatable CMC a pre-determined distance from the stationary turbine component and rotating the rotatable CMC component. The hard wear coating on the rotatable CMC component cuts the abradable coating on the stationary turbine component.

Abstract: An abrasive article includes a polymer matrix and abrasive grains dispersed in the polymer matrix, wherein the abrasive article has a void volume of at least 50%. The polymer matrix is polymerized from a monomer including at least one double bond.

Abstract: Manufacturing methods are provided. A component may be polished to remove defects thereon. An identifier may be added to the polishing material employed to polish the component. A detector may detect the identifier. For example, the identifier may be a fluroescing material that may illuminate in the presence of a fluorescent light. A determining apparatus may determine a status of the component based on the presence or absence of the identifier. For example, the determining apparatus may determine that the component needs to be re-cleaned based on presence of the identifier. Related systems and computer program products are also provided.

Abstract: A support accessory is disclosed for a hand tool, such as a grinder or polisher. The support accessory is configured to be detachably fastened to the hand tool. The support accessory includes a frame with a longitudinal beam configured to stabilize the hand tool front-to-back when the hand tool is fastened to the support accessory, as well as a trunnion rotatably coupled to the frame and configured to stabilize the hand tool side-to-side when the hand tool is fastened to the support accessory. The support accessory is also configured to support the hand tool in a position that is substantially parallel to a surface of a workpiece during use.

Abstract: A method of using a diamond cutting tool for ornamentation purpose is provided. The method includes positioning a work piece in proximity to a cutting tool. The cutting tool includes a shank. Further, the cutting tool may extend longitudinally from the shank and coaxial therewith. The cutting end includes a cutting end comprised of, but not limited to, a compact mass of sharp diamond dust. Further, the method includes activating the cutting tool to perform one of cutting and polishing of at least a portion of the work piece. Herein, activating the cutting tool enables movement of the cutting tool for positioning thereof. Further, activating the cutting tool may enable spinning of the cutting end to perform one of cutting and polishing of a portion of the work piece based on the positioning of the cutting tool.

Abstract: This disclosure provides economical and effective methods and apparatus for repairing scratches and scuffs on refillable bottle surfaces that minimally contaminates the bottle during the refurbishing process. In one aspect, the method comprises the steps of: a) adding at least one fluid into the polymeric packaging material such as a bottle to form at least a partially filled packaging material; and b) applying at least one heat source to an exterior surface of the at least partially filled packaging material to form a repaired polymeric packaging material. Apparatus and recycling systems that incorporate this method are also disclosed.

Abstract: An abrasive polishing slurry including abrasive particles in a carrier fluid and micro-nano members. A system and method for making an abrasive article using the polishing slurry is also disclosed. The system includes a gimballed dressing bar adapted to provide a compressive force sufficient to embed the abrasive particles into the substrate, wherein the members set a height the embedded abrasive particles protrude above the substrate.

Abstract: A method for forming a pattern in an abradable coating includes the step of machining a groove in the abradable coating with a machining tool. The machining tool is configured to machine a top surface, a side surface and a bottom surface of the groove simultaneously. A repeating step repeats the machining step until a desired number of grooves is obtained in the abradable coating.

Abstract: A method of generating a library of reference spectra includes storing an optical model for a layer stack having at a plurality of layers, receiving user input identifying a set of one or more refractive index functions and a set of one or more extinction coefficient functions a first layer from the plurality of layers, wherein the set of one or more refractive index functions includes a plurality of different refractive index functions or the set of one or more extinction coefficient functions includes a plurality of different extinction coefficient functions, and for each combination of a refractive index function from the set of refractive index functions and an extinction coefficient function from the set of extinction coefficient functions, calculating a reference spectrum using the optical model based on the refractive index function, the extinction coefficient function and a first thickness of the first layer.

Abstract: A component manufacturing method includes causing a holding member to hold a workpiece such that a spherical center of a processed surface of the workpiece is located on a supporting member; rotating the workpiece by rotating the holding member; and polishing the workpiece by moving the supporting member to move the workpiece on a polishing tool, with the spherical center of the processed surface located at a spherical center of a processing surface of the polishing tool.

Abstract: The V-belt is produced with inwardly tapered sidewalls using an apparatus having at least one motorized cutting wheel having first axis of rotation and a moving anvil system with an anvil wheel having a second axis of rotation not parallel to the first axis. The anvil system is motorized and situated so the workpiece follows a U-shaped trajectory into the path of the cutting wheel. The circumferential gripping surface of the anvil wheel and circumferential cutting surface of the cutting wheel are geometrically arranged so that at the point of contact between workpiece and cutting wheel the respective surfaces define planes that intersect in an acute angle that defines the inwardly tapered sidewalls.

Abstract: Railcar coupling knuckles having areas of improved structure, improved surface characteristics, and reduced stress under loading, and systems and methods for shot peening railcar components such as, but not limited to, coupling knuckles. Such shot-peening systems and methods may include robotic and/or fixed-position shot-peening devices equipped with shot-emitting mechanisms for expelling shot media against desired areas of a railcar component.

Abstract: A method of forming a workpiece having machinability rating not greater than a machinability rating of Inconel 718. The method may include removing material from the workpiece by moving at least one grinding tool relative to the workpiece and may be conducted at a specific grinding energy of not greater than about 7 Hp/in3 min (about 19 J/mm3) for a material removal rate of at least about 2.5 in3/min·in (about 25 mm3sec/mm).

Abstract: The present invention relates to a hydrophobic or oleophobic microporous polymer membrane having a structurally induced drip-off effect, to methods for producing the membrane according to the invention, to the use of the membrane in the sterile filtration of gaseous fluids, and to the use of the membrane as a liquid barrier in liquid-containing systems to be vented.

Abstract: A method of forming a complex form in a workpiece includes moving a grinding tool having a complex shape relative to a surface of a workpiece to form a complex shape opening in the workpiece, and the grinding tool is tilted in a lateral plane relative to the workpiece.

Abstract: An orbital motion attachment for a die grinder includes a flexible collar mounted at a first end to a locating support ring and the locating support ring being removably secured to the die grinder. A collet has an offset bearing shaft extending from a first end. The collet is connected at a second end to an output shaft of the die grinder and the offset bearing shaft is connected at a second end to an applicator tip. An indexing ring is affixed to a second end of the flexible collar to secure the applicator tip to the offset bearing shaft.

Abstract: Disclosed herein is a method of manufacturing a noise removing filter, including preparing at least one conductive pattern, an insulating layer for covering the at least one conductive pattern, and a lower magnetic body including input/output stud terminals for electrically inputting and outputting electricity to and from the at least one conductive pattern; disposing a recognizable portion on upper surfaces of the input/output stud terminals; disposing an upper magnetic body on the recognizable portion and the insulating layer; polishing the upper magnetic body; and removing the recognizable portion such that a level of an upper surface of the upper magnetic body is higher than levels of the upper surfaces of the input/output stud terminals.

Abstract: A cast slab having a pair of wide, substantially planar, and opposite side faces and a pair of narrow opposite edge faces, is ground by first orienting the slab with the side and edge faces vertical. Then grinding tools are pressed oppositely and horizontally against opposite wide faces, with the grinders throwing the chips downward. The tools and slab are relatively vertically displaced for the grinding.

Abstract: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.

Abstract: A method of polishing a metal layer comprising the following steps. A structure having an upper patterned dielectric layer with an opening therein is provided. A barrier layer is formed over the patterned upper dielectric layer and lining the opening. A metal layer is formed over the barrier layer, filling the opening. A first polish step employing a first slurry composition is conducted to remove a portion of the overlying metal layer. A second polish step employing the first slurry composition is conducted to: polish the partially removed overlying metal layer; and to expose portions of the barrier layer overlying the patterned upper dielectric layer. A third polish step employing a second slurry composition is conducted to remove the exposed barrier layer portions and exposing underlying portions of the patterned upper dielectric layer. A fourth polish step employing the second slurry composition and BTA is conducted to buff the exposed upper dielectric layer portions.