Abstract: A system and method for performing side impact sensing in a vehicle including at least one side impact zone is provided. The system comprises a controller and at least one crash signature sensor. The controller is configured to deploy one or more safety restraints in response to at least one crash signature signal. The one crash signature sensor is positioned in the side impact zone. The crash signature sensor is configured to detect an impact with an object at the side impact zone. The crash signature sensor is further configured to generate the crash signature signal which corresponds to measured structural impact energy of the vehicle in the side impact zone deformed by the impact at frequencies above 2 kHz.

Abstract: An acceleration sensor, which has realized such a high impact-resistance that a weight bottom surface of an acceleration sensor element does not directly collide with an inner bottom plate of a protection case made of ceramic, glass or silicon to avoid edges and corners of the weight bottom surface of the acceleration sensor element chipping, even when an excessive acceleration or impact is applied to the acceleration sensor. The acceleration sensor comprises the acceleration sensor element having in a center a weight that works as a pendulum when acceleration is applied, and the protection case housing the acceleration sensor element. The inner bottom plate of the protection case works as a regulation plate to prevent the weight from excessively swing downwards. An impact buffer material of a metal layer or a resin layer is provided on the weight bottom surface or the inner bottom plate of the protection case.

Abstract: A micromechanical device and a method for producing this device are provided, two sensor patterns being provided in the semiconductor material to record two mechanical variables, in particular the pressure and the acceleration. The functionality of both sensor patterns is based on the same predefined converter principle.

Abstract: This application is directed to a shock sensor mounted in an electronic device. The shock sensor includes both active and passive shock detection methods that allow a technician to determine whether the electronic device was subjected to a shock event that exceeded an impact threshold level. The shock sensor may include shock detection contacts that form an electrical circuit that remains open in the absence of a shock event that exceeds an impact threshold level. In response to a significant shock event, a movable component or substance of the shock sensor may move from a first position to a second position, thereby closing the electrical circuit formed by the shock detection contacts. The change in circuit may be detected and used to provide active indication of whether the electronic device has been subjected to a substantial shock event. In addition, the shock sensor may be observed to passively determine whether the electronic device has been subjected to a substantial shock event.

Abstract: A sensor device includes a board, a sensor element and a resin member made of resin. The sensor element has a displace part to be displaced in a predetermined detection direction, and detects a displace amount of the displace part in the detection direction. The sensor element is mounted and connected to the board through the resin member. The resin member is arranged between the sensor element and the board in part such that a warp of the sensor element in the detection direction due to a temperature variation is smaller than a warp of the sensor element in a direction except for the detection direction.

Abstract: In an acceleration sensor, the magnitude of an acceleration of the vehicle is a predetermined value or more, a ball is moved laterally and upward along a supporting surface to rotate a lever upward. Even when the installing angle of a holder sensor is changed according to the type of the vehicle, engaging teeth of a bracket which mesh meshing teeth of the holder sensor are changed. So, the center axis of the supporting surface can be arranged parallel to the up-and-down direction to maintain the detecting performance of the acceleration of the vehicle. Therefore, the change of the bracket according to the type of the vehicle can be unnecessary.

Abstract: In an electrostatic-capacitance-type acceleration sensor, water, etc. penetrating into a sealed space incorporating an acceleration detector having a movable electrode 6, and sticking of the movable electrode 6 to a cap 8 due to static charge accumulated on the cap 8 during the anodic bonding being performed are prevented. A conductive shielding film 9 that can be extendedly transformed on the entire inner face of the cap 8 constituting the sealed space is provided, which is not only extendedly arranged so as to be sandwiched between a bonding frame 7 and the cap 8, but also electrically connected to the movable electrode 6; thereby, even if unevenness exists on the surface of the bonding frame 7, not only sufficient anodic bonding between the bonding frame 7 and the cap 8 becomes possible, but also the electric field due to the static charge accumulated in the cap 8 can be shielded.

Abstract: A sensor having a mass that moves relative to a structure is disclosed. A spring mechanism applies a restoring force to the mass when the mass moves from an equilibrium position with respect to the structure. A first code scale is attached to the mass and viewed by a first imaging system that is fixed with respect to the structure. The first imaging system forms images of the first code scale that are used by a controller to provide an indication of the relative position of the mass with respect to the structure. The mass can be located in a sealed chamber in the structure that has a transparent liquid through which the mass moves. The first imaging can view the first code scale from outside the chamber through a transparent window in the chamber.

Abstract: A microelectromechanical system (MEMS) device with a mechanism layer having a first part and a second part, and at least one cover for sealing the mechanism layer. The inner surface of at least one of the covers is structured such that a protruding structure is present on the inner surface of the cover and wherein the protruding structure mechanically causes the first part to be deflected out of a plane associated with the second part.

Abstract: The invention relates to a device for measuring the dynamic interaction, in particular power transfer and work performed, between a first and a second body, in particular during relatively random movements. The device comprises a housing in which at least one kinematic sensor and at least one kinetic sensor is arranged, in addition to processing means for processing the signals from the sensors, and communication means for data exchange with the outside world. The invention also relates to a method for measuring the dynamic interaction between a first and a second body, and a carrier provided with a number of devices according to the invention.

Abstract: The invention relates to measuring devices to be used in physical measuring, and more particularly, to a method and a device for measuring the progress of a moving person. In the solution according to the invention the quantities describing the progress of the moving person can be calculated based on vertical acceleration values of the body measured by means of an acceleration sensor, and on the measured time. The invention aims at providing a solution, better and simpler than prior solutions, for measuring the progress of a moving person, which solution is applicable for use in a multitude of measuring solutions for ways of locomotion of various types.

Abstract: Disclosed is a method of measuring the amount of exercise using a mobile communication terminal equipped with an acceleration sensor capable of measuring movement of a user. The method includes the steps of: a) measuring acceleration according to a change in the location of the mobile communication terminal by the acceleration sensor and detecting acceleration values of the terminal expressed in an orthogonal coordinate system where the acceleration sensor is set to a reference position; b) calculating gravitational acceleration direction values of the acceleration of the terminal from the acceleration values of the terminal detected in step a); c) detecting relative values of the acceleration values with respect to the gravitational acceleration direction values; and d) calculating the movement amount from the detected relative values.

Abstract: In a sensing unit according to the present invention, a movable portion of a spring portion is supported floatably above a recessed portion formed in a substrate. Thus, the movable portion is capable of oscillating in any direction parallel to the substrate surface. Moreover, the movable portion is capable of oscillating in the thickness direction of the substrate such that the amplitude of a center side end portion thereof reaches a maximum. A sensor portion is provided on the movable portion. As a result, the sensing unit according to the present invention has a higher degree of freedom in terms of the measurement direction than a conventional sensing unit that oscillates in only one direction.

Abstract: The invention relates to a sensor device for monitoring accelerations to which an object is subjected. In order to detect whether a value has exceeded or is below a threshold for the acceleration to which objects have been subjected in the past, i.e. without having visual contact with the sensor, the inventive sensor device includes an acceleration sensor, which is permanently linked to the object to be monitored, so that a relative movement between the acceleration sensor and the object is prevented, and an RFID transceiver for non-contact coupling of electrical energy into the acceleration sensor and for sending out radio signals as a function of the physical state of the acceleration sensor.

Abstract: A semiconductor device includes a first substrate including first, second and third layers; a second substrate; and a loop bump. The first and second substrates provides an electric device and physical quantity sensor. The first layer is a shield for protecting the electric device and physical quantity sensor. The physical quantity sensor includes a movable portion surrounded by a first loop layer of the third layer. The loop bump is disposed between the first and second substrates and surrounds the movable portion, and is electrically coupled with the first loop layer so that the loop bump, first loop layer, first layer and second substrate shield the electric device and physical quantity sensor. The first substrate includes inner and outer pads which are electrically coupled through a wire layer which is electrically insulated from the loop bump, so that a signal from the movable portion is output to and external circuit.

Abstract: A method and apparatus for estimating a motion parameter corresponding to a subject element employs one or more accelerometers operable to measure accelerations and a processing system operable to generate a motion parameter metric utilizing the acceleration measurements and estimate the motion parameter using the motion parameter metric.

Abstract: An inertial measurement unit is provided. The inertial measurement unit comprises two rotational axes, wherein a first of the two rotational axes is aligned nominally along a thrust axis and a second of the two rotational axes is aligned substantially perpendicular to a plane formed by a local gravity vector and a thrust vector, and one or more sensors which rotate about the second rotational axis.

Abstract: A method and apparatus for sensing accelerations directed along multiple directions are provided. An embodiment comprises a sensor array comprising two sensor pairs, each of which provides an output signal based on acceleration along two orthogonal directions. The sensor pairs are so that they collectively provide an output signal for each of three mutually orthogonal directions. In some embodiments, the sensor array is augmented to provide three additional signals, each of which is based on rotation about an axis aligned with one of the three orthogonal directions.

Abstract: The electrostatically-driven/capacitance-detection type gyro sensor has a sensing element including a movable part, the sensitivity of the sensing element and accordingly the sensitivity of a sensor output signal thereof being kept unchanged by controlling the amplitude of displacement or displacing velocity of the movable part and by using a reference voltage independent of variation of a power supply voltage, even there occurs a change in the vibrating state of the movable part due to temperature change or secular variation.

Abstract: A vibration sensor capable of preventing a diaphragm electrode from being damaged without lowering sensitivity as well as realizing a satisfactory assembling process. The vibration sensor includes a fixed electrode 1, and a diaphragm electrode 3 having a weight member 2 attached to a membrane surface facing away from the fixed electrode 1 and fixedly supported at peripheries thereof, the vibration sensor being capable of outputting variation of capacitance between the fixed electrode and the diaphragm electrode as vibration signals. The vibration sensor further includes projecting portions 2a formed on parts of an end portion of the weight member 2 to project along the direction of the membrane surface and spaced from the membrane surface of the diaphragm electrode 3, and a restricting member 4 for contacting the projecting portions 2a of the weight member 2 displaced along the direction of the membrane surface of the diaphragm electrode 3, thereby to restrict displacement of the weight member 2.

Abstract: A system and method detect freefall associated with an object that is spinning or tumbling as it falls. Two tri-axis accelerometers provide inputs to an algorithm that detects the freefall of a spinning object that would not otherwise be detected by a conventional freefall detection system, due to the centrifugal and centripetal forces being placed on the falling object as it spins. The system can be used to detect the freefall of portable devices with onboard memory or hard disk drives, allowing the devices to have time to park the read/write head and reduce the potential of losing data that can be damaged by impact. This freefall detection system may be applied to such portable devices as notebook computers, PDAs, MP3 players, digital cameras, mobile phones and even automobiles.

Abstract: In an acceleration sensor detecting inclined displacement of a predetermined article from a basic position, the acceleration sensor (10) includes a sensor chip having a detection plane including one detection axis or two crossing detection axes detecting the inclined displacement. An axis orthogonal to the detection plane of the sensor chip is disposed in parallel with a standard plane of the article in the basic position. Then, the sensor chip obtains an output signal according to the inclined displacement of the standard plane.

Abstract: A seat belt retractor (10) has an actuator (14) for unlocking and locking the seat belt retractor (10) An inertial sensor (18) detects changes in vehicle acceleration and interacts with the actuator (14) to lock and unlock the seat belt retractor (10). The inertial sensor (18) has one inertial sensor mass, each mass (26, 27, 29, 30, 32, 33) has a wide portion (70) and a narrow portion (72). Preferably each inertial sensor mass (26, 27, 29, 30, 32, 33) has a high density body (31) embedded in the wide portion (70) of the elastomeric material (34). The inertial sensor mass (26, 27, 29, 36, 32, 33) has a greater density than the elastomeric material (34) Moreover, the elastomeric material (34) at least partially surrounds an exterior circumferential surface (38) of the inertial sensor mass (26, 27, 29, 30, 32, 33).

Abstract: One or more fixed sensing electrodes are employed to sense movement of a mass both within the plane of the mass/electrodes and along an axis normal to that plane. In order to measure movement of the mass along the axis normal to the plane, a reference capacitance is measured between the fixed sensing electrode(s) and an underlying conducting plane and a measurement capacitance is measured between the mass and the underlying conducting plane. A value Cv-KCf may be computed, where Cf is the reference capacitance, Cv is the measurement capacitance, and K is a predetermined constant. In accordance with certain embodiments of the invention, a standard one or two axis acceleration sensor that measures movement of the mass within the plane can be used to also measure movement of the mass in the axis normal to the plane.

Abstract: A motion sensing apparatus generally comprising a housing unit operable to be attached to an object at an attachment position, an accelerometer operable to provide a signal corresponding to an acceleration measurement; and a processing system. The processing system is operable to acquire the signal corresponding to the acceleration measurement and analyze the acquired acceleration measurement to identify the attachment position of the housing unit.

Abstract: A tool configured to emit electromagnetic radiation therefrom such that one or more aspects of the emission of the electromagnetic radiation may be varied as a function of time. By varying the emission of the electromagnetic radiation as a function of time, the tool may enable information related to its position and/or motion to be determined with an enhanced specificity based on detection of the emitted electromagnetic radiation. For example, the varying emission of the electromagnetic radiation may enable a three dimensional position of the tool to be determined, may enable the position of the tool to be determined in three rotational degrees of freedom, and/or may enable time derivatives of these (and other) position information to be determined to quantify motion of the tool. In some implementations, the emission of the electromagnetic radiation may be varied such that position and/or motion information related to a plurality of tools may be determined simultaneously (or substantially simultaneously).

Abstract: Various systems and methods for sensing are provided. In one embodiment, a sensing system is provided that includes a first electrode array disposed on a proof mass, and a second electrode array disposed on a planar surface of a support structure. The proof mass is attached to the support structure via a compliant coupling such that the first electrode array is positioned substantially parallel to and faces the second electrode array, where the proof mass is capable of displacement relative to the support structure. The displacement of the proof mass is in a direction substantially parallel to the second electrode array. The first electrode array comprises a plurality of first patterns of electrodes, the first patterns being interdigitated, and each of the first patterns comprises at least two first electrodes. The second electrode array comprises a plurality of second patterns of electrodes, the second patterns being interdigitated.

Abstract: An apparatus and method for an accelerometer mechanism having a proof mass that is suspended for out-of-plane motion between first and second damping plates, wherein at least one of the first and second damping plates is movable between first and second positions relative to the proof mass under the control of a position control structure that is coupled to the movable damping plate for positioning the damping plate in the second position relative to the proof mass.

Abstract: An inertial input apparatus with six-axial detection ability, structured with a gyroscope and an acceleration module capable of detecting accelerations of X, Y, Z axes defined by a 3-D Cartesian coordinates, which is operable either being held to move on a planar surface or in a free space. When the inertial input apparatus is being held to move and operate on a planar surface by a user, a two-dimensional detection mode is adopted thereby that the gyroscope is used for detection rotations of the inertial input apparatus caused by unconscious rolling motions of the user and thus compensating the erroneous rotations, by which the technical disadvantages of prior-art inertial input apparatuses equipped with only accelerometer can be overcame and thus control smoothness of using the input apparatus is enhanced.

Abstract: In order to provide a compact, multifunctional sensor element, a sensor element for acquiring the acceleration of a motor vehicle is additionally equipped with a distance measurement device for measuring the distance between the motor vehicle and a foreign object.

Abstract: An inertial sensing input apparatus is disclosed, which includes: an accelerometer module, capable of detecting accelerations with respect to a Cartesian coordinate system of X-, Y-, and Z-axes; and a gyroscope, used for detecting a rotation measured with respect to the Z-axis.

Abstract: A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.

Abstract: An accelerometer comprises a chamber and a proof mass supported by an elastic element within the chamber. The elastic element is formed of fused silica. A sensor senses displacement of the proof mass. Means to inhibit interaction of water vapour with the elastic element is provided.

Abstract: The invention comprises a method of fabricating a three-axis accelerometer. A first wafer having a first and a second major surface provided with etching at least two cavities in the first major surface of the first wafer and patterning metal onto the first major surface of the first wafer to form electrical connections for a third accelerometer. A second wafer, etching a portion of a first major surface of the second wafer and bonding the first major surface of the first wafer to the first major surface of the second wafer. The etching and bonding of the surfaces deposit and pattern metallizating, and deposit and pattern a masking layer on the second major surface of the second wafer, defining the shape of a first, a second and the third accelerometer. The first and second accelerometers are formed over the cavities etched in the first major surface of the first wafer.

Abstract: A method of manufacturing a floating structure capable of providing increased device yield. The method includes: a) forming an insulation film, a predetermined area of which is removed, between a first substrate and a second substrate; and b) forming a floating structure in the removed predetermined area.

Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.

Abstract: A method and apparatus for detecting a free fall of an electronic device. The method includes: sensing a falling acceleration of the electronic device using an acceleration sensor; determining whether the sensed falling acceleration is less than a predetermined threshold; when the sensed falling acceleration is less than the predetermined threshold, determining whether the falling acceleration is a statistical constant, which has a statistical significance, and is maintained for a predetermined time; and when the falling acceleration is a statistical constant and maintained for a predetermined time, determining that the electronic device falls freely. Accordingly, it is possible to exactly detect a free fall of an electronic device, irrespective of an error of the acceleration of gravity generated when a falling acceleration of the electronic device is measured, due to ambient conditions, e.g., a temperature change and a rotation acceleration generated when the electronic device rotates.

Abstract: A semiconductor device includes a lead frame. The lead frame has a chip mounting section and a plurality of leads. The chip mounting section has a base section, an insulation film covering the base section, a plurality of inter-connect sections, and a chip mounting area. The leads surround the chip mounting section. The semiconductor device also includes a first semiconductor chip having a plurality of first electrode pads. The semiconductor device also includes first bonding wires for connecting the first electrode pads to the inter-connect sections. The semiconductor device also includes a second semiconductor chip which has a cavity and a plurality of second electrode pads. The first semiconductor chip and the first bonding wires are received in the cavity. Second bonding wires connect the inter-connect sections exposed from the second semiconductor chip to the leads. Third bonding wires connect the second electrode pads to the leads. The semiconductor device also includes a sealing section.

Abstract: A micromechanical component and a method for producing the component are provided. The micromechanical component includes a substrate and a micromechanical functional layer of a first material provided over the substrate. The functional layer has a first and second regions, which are connected by a third region of a second material, and at least one of the regions is part of a movable structure, which is suspended over the substrate.

Abstract: An acceleration sensor chip package includes an acceleration sensor chip formed of a frame portion with an opening portion, a movable structure, a detection element, and an electrode pad. The movable structure has a beam portion and a movable portion supported on the beam portion to be movable. The acceleration sensor chip package further includes a re-wiring layer with a wiring portion having one end connected to the electrode pad; an outer terminal connected to the other end of the wiring portion; a first sealing portion for sealing the electrode pad and the re-wiring layer; and a substrate for sealing the opening portion of the frame portion.

Abstract: A computer input device includes a magnetized fluid and an inertial body within the magnetized fluid. A signal converter provides angular acceleration information based on behavior of the inertial body. The computer input device can be attached to a Virtual Reality Suit, or can be used to control computer-generated graphical objects. The inertial body can be non-magnetic. The body can be solid or hollow. Electromagnets and/or permanent magnets can be used for magnetizing the fluid. Magnetic coils sense the changes in the magnetic flux lines. Signals from the magnetic coils are used by the signal converter to calculate the angular acceleration. A housing encloses the magnetized fluid and the inertial body.

Abstract: A vibration sensing device, an acceleration sensing system and a method of manufacturing a vibration sensing device wherein the vibration sensing device comprises a flexible disk that is mounted symmetrically about a radial plane and has a mass located on the disk substantially symmetrical about this radial plane which exerts a force that is greater towards the edge than it is towards the centre of the disk. The vibration sensing device is sensitive to on-axis signals and insensitive to cross axis signals.

Abstract: An acceleration sensor includes a semiconductor substrate, a sensing element formed on the semiconductor substrate, a bonding frame made of polysilicon which is formed on the semiconductor substrate and surrounds the sensing element, and a glass cap which is bonded to a top surface of the bonding frame made of polysilicon to cover the sensing element above the sensing element while being spaced by a predetermined distance from the sensing element. The bonding frame made of polysilicon is not doped with any impurity.

Abstract: An integrally micromachined acceleration sensor has a mass with a surface facing a stopper. At least one protrusion projects from this surface toward the stopper. In the absence of acceleration, the protrusion is spaced apart from the stopper, but by limiting motion of the mass toward the stopper, the protrusion improves the shock resistance of the acceleration sensor. The protrusion also prevents the mass from sticking to the stopper during the fabrication process. The stopper may have a pattern of holes surrounding the protrusion, so that the protrusion is produced naturally during the wet etching process that separates the mass from the stopper. The holes also shorten the wet etching time.

Abstract: An acceleration sensing device includes a movable sensing member, a frame member and a supporting member. The supporting member is coupled between the movable sensing member and the frame member so as to support the movable sensing member. The acceleration sensing device further includes a covering member disposed above the movable sensing member, with a gap between the covering member and the movable sensing member. The acceleration sensing device still further includes internal electrodes, interconnection films, external electrodes and a resin film. The internal electrodes are arranged around the covering member. The interconnection films are disposed on the frame member so as to be coupled to the internal electrodes. The external electrodes are disposed on the interconnection films. The resin film is disposed on the frame member so as to seal the covering member. Also, there is provided a manufacturing method of the acceleration sensing device.

Abstract: A monolithic integrated 3-axis accelerometer chip includes a single crystal substrate, the substrate including at least one single crystal membrane layer portion. A single sensor microstructure made from the single crystal membrane senses acceleration in each of the three orthogonal directions. At least one electronic circuit can also be disposed on the chip, such as a circuit for driving, detecting, controlling and signal processing.

Abstract: A microelectromechanical (MEM) device includes a substrate, a structure, a travel stop, and a protective cap. The substrate has a surface, and the structure is coupled to, and movably suspended above, the substrate surface. The structure has at least an outer surface, and the travel stop coupled to the structure outer surface and movable therewith. The travel stop includes at least an inner peripheral surface that defines a cavity. The protective cap is coupled to the substrate and includes a stop section that is disposed at least partially within the travel stop cavity and is spaced apart from the travel stop inner peripheral surface. The travel stop and the protective cap stop section together limit movement of the structure in at least three orthogonal axes.

Abstract: A collision sensing apparatus includes an acceleration sensor, first and second connector terminals, reference connector terminals and leads. The acceleration sensor is shaped into a square form. First and second contacts are provided in two diagonally opposed corner portions of the sensor. Reference contacts are arranged in the other two diagonally opposed corner portions of the sensor. The first and second connector terminals are opposed to the first and second contacts, respectively. The reference connector terminals are opposed to the reference contacts, respectively. The leads connect the first and second connector terminals and the reference connector terminals to the first and second contacts and the reference contacts.

Abstract: A three-axis acceleration sensor having a simple construction is provided for improving shock resistance without lowering sensor sensitivity. An acceleration sensor for detecting acceleration in three orthogonal directions comprises an electrode substrate pair including electrode substrates (4) opposed to each other, and each having fixed electrodes (4c, 4b, 4a) corresponding to three axes, respectively, a diaphragm (2) acting as a movable electrode, and an umbrella-like weight (3) mounted centrally of the diaphragm (2). Acceleration is detected based on variations in capacitance between the fixed electrodes (4c, 4b, 4a) and diaphragm (2). Each electrode substrate (4) has an electret layer (1) formed to cover surfaces of the fixed electrodes (4c, 4b, 4a). At least one of the electrode substrates defines, centrally thereof, a through hole (7). A shaft portion of the umbrella-like weight (3) extends through the through hole (7) from outside, and is connected to the diaphragm (2).

Abstract: A method of producing an electronic device electrically and mechanically couples an integrated circuit to a leadframe to produce an intermediate assembly. At least a portion of the intermediate assembly then is encapsulated with a molten encapsulating material. After it is encapsulated, the method permits the molten encapsulating material to substantially solidify. A method of detecting the orientation of a sensor as mounted to an external object also is disclosed.