Electrostatic chuck for semiconductor manufacturing device

Description

FIG. 1 is a front view of an electrostatic chuck for semiconductor manufacturing device of the present invention;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a perspective view thereof;

FIG. 8 is a sectional view with inner mechanism omitted taken along the line 8-8 thereof of FIG. 1;

FIG. 9 is an enlarged view defined by the lines 901-901 and 902-902 thereof of FIG. 1;

FIG. 10 is an enlarged view defined by the lines 1001-1001 and 1002-1002 thereof of FIG. 7; and,

FIG. 11 is an enlarged view defined by the lines 11-11 thereof of FIG. 8.

The broken lines show portions of an electrostatic chuck for semiconductor manufacturing device that forms no part of the claimed design.

The alternate long and short dash lines are merely the boundary lines between the claimed parts and the non-claimed parts.

Claims

The ornamental design for an electrostatic chuck for semiconductor manufacturing device, as shown and described.