Grounding ring of a process kit for semiconductor substrate processing

- APPLIED MATERIALS, INC.
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Description

FIG. 1 is a top isometric view of a grounding ring of a process kit for semiconductor substrate processing, according to the novel design.

FIG. 2 is a bottom isometric view thereof.

FIG. 3 is a top plan view thereof.

FIG. 4 is a bottom plan view thereof.

FIG. 5 is a left elevation view thereof.

FIG. 6 is a right elevation view thereof.

FIG. 7 is a back elevation view thereof, enlarged to more clearly show details; and,

FIG. 8 is a front elevation view thereof, enlarged to more clearly show details.

Claims

The ornamental design for a grounding ring of a process kit for semiconductor substrate processing, as shown and described.

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Patent History
Patent number: D1064005
Type: Grant
Filed: Aug 4, 2022
Date of Patent: Feb 25, 2025
Assignee: APPLIED MATERIALS, INC. (Santa Clara, CA)
Inventors: Abhishek Chowdhury (Bangalore), Nataraj Bhaskar Rao (Bangalore), Edwin C. Suarez (Pleasanton, CA), Harisha Sathyanarayana (Bangalore), Diego Ramiro Puente Sotomayor (Phoenix, AZ), Qanit Takmeel (Mesa, AZ), Mohammad Kamruzzaman Chowdhury (Phoenix, AZ), Arun Chakravarthy Chakravarthy (Tamil Nadu)
Primary Examiner: Nicole C Shiflet
Assistant Examiner: Karen M. Jones
Application Number: 29/848,745