Glow Discharge Sputter Deposition (e.g., Cathode Sputtering, Etc.) Patents (Class 204/192.12)
  • Patent number: 11594402
    Abstract: Magnetron sputtering source (1) for coating of a substrate (2), the sputtering source (1) comprising: a target (5) having a target surface at a front side a magnetron arrangement (511, 512) at a backside of the target (5) for creating a magnetic field near the target surface, to define a loop shaped erosion zone (20) at the target surface between an inner magnet assembly (512) and an outer magnet assembly (511), wherein the erosion zone (20) comprises a middle section with two parallel tracks (26) having a distance (d) and two curved end loop sections (27) each of which connects adjoining ends of the parallel tracks (26) and has a loop width (w) in the direction of the distance (d) which is greater than the distance (d) resulting in a double-T-shaped primary geometry of the erosion zone to provide an increased coating material flux from the end loop sections (27) to the substrate.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: February 28, 2023
    Assignee: OERLIKON SURFACE SOLUTIONS AG, PFAFFIKON
    Inventor: Othmar Z├╝ger
  • Patent number: 11581171
    Abstract: A cathode unit for performing a sputtering film formation includes: a target that emits sputtering particles; a target cooler that includes a cooling plate to which the target is bonded; and a power supply that supplies a power to the target. The target has a high-temperature region that has a higher temperature than other regions of the target during a film formation. The cooling plate includes a coolant flow space through which a coolant flows, and a first wall and a second wall that define the coolant flow space in a thickness direction. In the coolant flow space, a flow path of the coolant is formed by a first partition plate and a second partition plate. The first partition plate does not exist at a portion of the coolant flow space that corresponds to the high-temperature region.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: February 14, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masato Shinada, Einstein Noel Abarra
  • Patent number: 11569070
    Abstract: A plasma processing apparatus includes a balun having a first input terminal, a second input terminal, a first output terminal, and a second output terminal, a vacuum container, a first electrode electrically connected to the first output terminal, a second electrode electrically connected to the second output terminal, and a connection unit configured to electrically connect the vacuum container and ground, the connection unit including an inductor.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: January 31, 2023
    Assignee: CANON ANELVA CORPORATION
    Inventors: Kazunari Sekiya, Masaharu Tanabe, Tadashi Inoue, Hiroshi Sasamoto, Tatsunori Sato, Nobuaki Tsuchiya
  • Patent number: 11555791
    Abstract: Measurement cavities described herein include a cylindrical chamber having a first open end and a second open end; a first cap covering the first open end of the cylindrical chamber and a second cap covering the second open end of the cylindrical chamber, wherein the first and second caps hermetically seal the cylindrical chamber and wherein the first cap is rigidly coupled to the second cap; and a wafer holder positioned within and coupled to the cylindrical chamber. The measurement cavity has a mass m, a stiffness k, and a damping constant c configured such that the transmissibility ? x F ? of an input force at 60 Hz in the measurement cavity is reduced by a factor of at least 10 and the measurement cavity has a natural frequency of greater than 300 Hz.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: January 17, 2023
    Assignee: Corning Incorporated
    Inventors: John Weston Frankovich, Christopher Alan Lee, Matthew Ronald Millecchia
  • Patent number: 11532470
    Abstract: A method includes providing a jig including a predetermined center and a magnetron installed on the jig; rotating the magnetron and obtaining a measured first magnetic flux density at the predetermined center of the jig; defining a first area of the magnetron based on the measured first magnetic flux density; rotating the magnetron and measuring a plurality of second magnetic flux densities within the first area of the magnetron; deriving a measured second magnetic flux density among the plurality of second magnetic flux densities; comparing the measured second magnetic flux density with a predetermined threshold; and performing an operation based on the comparison.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: December 20, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Pradip Girdhar Chaudhari, Che-Hui Lee, Wen-Cheng Yang
  • Patent number: 11527437
    Abstract: Methods and apparatus for filling features on a substrate are provided herein. In some embodiments, a method of filling features on a substrate includes: depositing a first metallic material on the substrate and within a feature disposed in the substrate in a first process chamber via a chemical vapor deposition (CVD) process at a first temperature; depositing a second metallic material on the first metallic material in a second process chamber at a second temperature and at a first bias power to form a seed layer of the second metallic material; etching the seed layer in the second process chamber at a second bias power greater than the first bias power to form an intermix layer within the feature comprising the first metallic material and the second metallic material; and heating the substrate to a third temperature greater than the second temperature, causing a reflow of the second metallic material.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: December 13, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Lanlan Zhong, Fuhong Zhang, Gang Shen, Feng Chen, Rui Li, Xiangjin Xie, Tae Hong Ha, Xianmin Tang
  • Patent number: 11521840
    Abstract: A method and apparatus are for controlling stress variation in a material layer formed via pulsed DC physical vapour deposition. The method includes the steps of providing a chamber having a target from which the material layer is formed and a substrate upon which the material layer is formable, and subsequently introducing a gas within the chamber. The method further includes generating a plasma within the chamber and applying a first magnetic field proximate the target to substantially localise the plasma adjacent the target. An RF bias is applied to the substrate to attract gas ions from the plasma toward the substrate and a second magnetic field is applied proximate the substrate to steer gas ions from the plasma to selective regions upon the material layer formed on the substrate.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: December 6, 2022
    Assignee: SPTS Technologies Limited
    Inventors: Anthony Wilby, Steve Burgess, Ian Moncrieff, Clive Widdicks, Scott Haymore, Rhonda Hyndman
  • Patent number: 11515147
    Abstract: A material deposition system comprises a dopant source containing at least one dopant precursor material, an inert gas source containing at least one noble gas, and a physical vapor deposition apparatus in selective fluid communication with the dopant source and the inert gas source. The physical vapor deposition apparatus comprises a housing structure, a target electrode, and a substrate holder. The housing structure is configured and positioned to receive at least one feed fluid stream comprising the at least one dopant precursor material and the at least one noble gas. The target electrode is within the housing structure and is in electrical communication with a signal generator. The substrate holder is within the housing structure and is spaced apart from the target electrode. A method of forming a microelectronic device, a microelectronic device, a memory device, and an electronic system are also described.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: November 29, 2022
    Assignee: MICRON TECHNOLOGY, INC.
    Inventors: Clement Jacob, Richard L. Elliott, Christopher W. Petz
  • Patent number: 11506706
    Abstract: In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: November 22, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Harry-Hak-Lay Chuang, Chih-Yang Chang, Ching-Huang Wang, Tien-Wei Chiang, Meng-Chun Shih, Chia Yu Wang
  • Patent number: 11501956
    Abstract: A showerhead including a body having an opening, a first plate positioned within the opening and having a plurality of slots, a second plate positioned within the opening and having a plurality of slots, and wherein each of the first plate plurality of slots are concentrically aligned with the second plate plurality of slots.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: November 15, 2022
    Assignee: ASM IP Holding B.V.
    Inventors: Carl White, Todd Dunn, Eric Shero, Kyle Fondurulia
  • Patent number: 11486503
    Abstract: An assembly having at least two chambers (1, 2) and at least one transfer valve (3), wherein: a valve housing interior (9) of the transfer valve (3) is separated from each the chamber interiors (4, 5) of the chambers (1, 2) by respective partitions (12, 13) and a transfer opening (14, 15) for the feeding through of objects and/or fluids is formed in each of the partitions (12, 13) and in addition to the transfer opening (14, 15) in question an additional opening (16, 17) is arranged in each of the partitions (12, 13). The additional openings (16, 17) can be closed by respective switching valves (18, 19) of the assembly and, in an open state of the respective switching valves (18, 19), directly fluidically connect the valve housing interior (9) to the respective chamber interiors (4, 5) adjoining the respective partitions (12, 13).
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: November 1, 2022
    Assignee: VAT Holding AG
    Inventors: Dominik Gachter, Oliver Mahr
  • Patent number: 11488811
    Abstract: The present disclosure relates to methods and systems for chucking in substrate processing chambers. In one implementation, a method of chucking one or more substrates in a substrate processing chamber includes applying a chucking voltage to a pedestal. A substrate is disposed on a support surface of the pedestal. The method also includes ramping the chucking voltage from the applied voltage, detecting an impedance shift while ramping the chucking voltage, determining a corresponding chucking voltage at which the impedance shift occurs, and determining a refined chucking voltage based on the impedance shift and the corresponding chucking voltage.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: November 1, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Bhaskar Kumar, Ganesh Balasubramanian, Vivek Bharat Shah, Jiheng Zhao
  • Patent number: 11482432
    Abstract: Methods of processing a semiconductor substrate and apparatus to process semiconductor substrates are described. The methods and apparatus described enable the repetitive cyclic low temperature application of a chemistry and high temperature treatment step to a substrate.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: October 25, 2022
    Assignee: Applied Materials, Inc.
    Inventor: Errol Antonio C. Sanchez
  • Patent number: 11479847
    Abstract: A magnetron sputtering system includes a substrate mounted within a vacuum chamber. A plurality of cathode assemblies includes a first set of cathode assemblies and a second set of cathode assemblies, and is configured for reactive sputtering. Each cathode assembly includes a target comprising sputterable material and has an at least partially exposed planar sputtering surface. A target support is configured to support the target in the vacuum chamber and rotate the target relative to the vacuum chamber about a target axis. A magnetic field source includes a magnet array. A cathode assemblies controller assembly is operative to actuate the first set of cathode assemblies without actuating the second set of cathode assemblies, and to actuate the second set of cathode assemblies without actuating the first set of cathode assemblies.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: October 25, 2022
    Assignee: Alluxa, Inc.
    Inventors: Michael A. Scobey, Shaun Frank McCaffery
  • Patent number: 11473189
    Abstract: Physical vapor deposition methods for reducing the particulates deposited on the substrate are disclosed. The pressure during sputtering can be increased to cause agglomeration of the particulates formed in the plasma. The agglomerated particulates can be moved to an outer portion of the process chamber prior to extinguishing the plasma so that the agglomerates fall harmlessly outside of the diameter of the substrate.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: October 18, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Halbert Chong, Lei Zhou, Adolph Miller Allen, Vaibhav Soni, Kishor Kalathiparambil, Vanessa Faune, Song-Moon Suh
  • Patent number: 11476100
    Abstract: The present disclosure is a substrate-processing chamber with a shielding mechanism, which includes a reaction chamber, a substrate carrier, a storage chamber and a shielding mechanism. The reaction chamber is connected to the storage chamber, the substrate carrier is within the reaction chamber. The shielding mechanism includes at least one guide unit, at least one connecting seat, a shield and at least one drive arm. The drive arm is connected to the shield for driving the shield to move between the storage chamber and the reaction chamber. During a deposition process, the drive arm drives the shield to move into the storage space. During a cleaning process, the drive arm moves the shield to move into the reaction chamber for prevent pollution to the substrate carrier.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: October 18, 2022
    Assignee: SKY TECH INC.
    Inventors: Jing-Cheng Lin, Ta-Hao Kuo, Yu-Te Shen, Chi-Hung Cheng
  • Patent number: 11462394
    Abstract: A PVD method includes tilting a first magnetic element over a back side of a target. The first magnetic element is moved about an axis that extends through the target. Then, charged ions are attracted to bombard the target, such that particles are ejected from the target and are deposited over a surface of a wafer. By tilting the magnetic element relative to the target, the distribution of the magnetic fields can be more random and uniform.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: October 4, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Hsi Wang, Kun-Che Ho, Yen-Yu Chen
  • Patent number: 11459651
    Abstract: Embodiments of a tantalum (Ta) target pasting process for deposition chambers using RF powered processes include pasting at least a portion of the inner surfaces of the process chamber with Ta after using RF sputtering to deposit dielectric material on a wafer. Pressure levels within the process chamber are adjusted to maximize coverage of the Ta pasting layer. The Ta pasting encapsulates the dielectric material that has been inadvertently sputtered on the process chamber inner surfaces such as the shield. Oxygen is then flowed into the process chamber to form a tantalum oxide layer on the Ta pasting layer to further reduce contamination and particle generation.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: October 4, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Xiaodong Wang, Rongjun Wang, Hanbing Wu
  • Patent number: 11456162
    Abstract: An apparatus has a cathode target with a cathode target outer perimeter. An inner magnet array with an inner magnet array inner perimeter is within the cathode target outer perimeter. The inner magnet array includes an inner magnet array base portion and an inner magnet array upper portion. A keeper plate assembly is connected to the inner magnet array upper portion and isolates the inner magnet array upper portion from the inner magnet array base portion. An outer magnet array is connected to a bottom surface of the keeper plate. The outer magnet array has an outer magnet array outer perimeter larger than the inner magnet array inner perimeter. The inner magnet array upper portion has a first magnetic orientation and the outer magnet array and the inner magnet array base portion have a second magnetic orientation opposite the first magnetic orientation.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: September 27, 2022
    Assignee: HIA, Inc.
    Inventors: Samuel D. Harkness, IV, Quang N. Tran
  • Patent number: 11450514
    Abstract: Embodiments of methods and apparatus for reducing particle formation in physical vapor deposition (PVD) chambers are provided herein. In some embodiments, a method of reducing particle formation in a PVD chamber includes: performing a plurality of first deposition processes on a corresponding series of substrates disposed on a substrate support in the PVD chamber, wherein the PVD chamber includes a cover ring disposed about the substrate support and having a texturized outer surface, and wherein a silicon nitride (SiN) layer having a first thickness is deposited onto the texturized outer surface during each of the plurality of first deposition processes; and performing a second deposition process on the cover ring between subsets of the plurality of first deposition processes to deposit an amorphous silicon layer having a second thickness onto an underlying silicon nitride (SiN) layer.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: September 20, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Wei Dou, Yong Cao, Mingdong Li, Shane Lavan, Jothilingam Ramalingam, Chengyu Liu
  • Patent number: 11424112
    Abstract: Embodiments herein include a transparent halo assembly for reducing an amount of sputtered material to minimize particle defects impacting a workpiece. In some embodiments, a halo assembly may include a first halo arranged around a semiconductor workpiece, and a mounting assembly coupling the first halo to a roplat. The first halo may include a first side opposite a second side, and a first end opposite a second end, wherein the first side is operable to receive an ion beam from an ion source. The first halo may further include a plurality of apertures extending between the first and second sides, wherein the plurality of apertures permit passage of a portion of the ion beam to pass therethrough, towards the mounting assembly. In some embodiments, the halo assembly may include a second halo positioned proximate the first halo, and a third halo disposed between the first halo and the mounting assembly.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: August 23, 2022
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Ernest E. Allen, Costel Biloiu, Daniel McGillicuddy
  • Patent number: 11414746
    Abstract: A film forming apparatus includes a base material support mechanism configured to rotate a base material supported by the base material support mechanism about a first axis, and a first cathode portion on which a target in a cylindrical shape containing a film forming material is mounted and configured to rotate the target about a second axis, in a chamber. The second axis is disposed at a position skewed with respect to the first axis.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: August 16, 2022
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Kazuya Demura, Takamasa Horie, Hiroyuki Kobayashi
  • Patent number: 11414747
    Abstract: A sputtering device includes a processing chamber where a substrate is accommodated, and a slit plate that partitions the processing chamber into a first space where a target member is disposed and a second space where the substrate is disposed. The slit plate includes an inner member having an opening that penetrates therethrough in a thickness direction of the slit plate, and an outer member disposed around the inner member. The inner member is attachable to and detachable from the outer member.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: August 16, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Junichi Takei, Hiroshi Sone, Naoyuki Suzuki, Shinji Orimoto
  • Patent number: 11410874
    Abstract: The present disclosure discloses a method for forming a semiconductor structure. The method for forming a semiconductor structure includes: providing a base; forming a dielectric layer on the base; forming one or more openings in the dielectric layer; and forming an anti-reflective coating in the one or more openings. When forming the anti-reflective coating, alternating current is applied around the base.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: August 9, 2022
    Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventor: Quan Zuo
  • Patent number: 11410837
    Abstract: A film-forming device according to one embodiment includes a chamber body, a support, a moving device, a shielding member, a first holder and a second holder, in the film-forming device, a substrate supported by the support is linearly moved. The shielding member is disposed above an area where the substrate is moved, and includes a slit extending in a direction perpendicular to a movement direction of the substrate. The first holder and the second holder hold a first target and a second target, respectively, above the shielding member. The first target and the second target are arranged symmetrically with respect to a vertical plane including a linear path on which the center of the substrate is moved.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: August 9, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Hiroyuki Toshima, Tatsuo Hatano, Tetsuya Miyashita, Shinji Furukawa, Junichi Takei
  • Patent number: 11400611
    Abstract: A razor blade substrate having a substrate that includes a blade edge portion having a profiled geometry which is covered by a strengthening coating deposited on the razor blade substrate at least at the blade edge portion. The strengthening coating covering the blade edge tip, having a profiled geometry and having a tapering geometry with two coating sides converge toward a blade edge tip. The strengthening coating includes a strengthening layer made of a titanium- and boron-containing material.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: August 2, 2022
    Assignee: BIC-VIOLEX SA
    Inventors: Stergios Logothetidis, Nikolaos Kalfagiannis, Konstantinos Mavroeidis, Vasileios Papachristos, Michail Karousis
  • Patent number: 11393665
    Abstract: Embodiments of a process chamber are provided herein. In some embodiments, a process chamber includes a chamber body having an interior volume, a substrate support disposed in the interior volume, a target disposed within the interior volume and opposing the substrate support, a process shield disposed in the interior volume and having an upper portion surrounding the target and a lower portion surrounding the substrate support, the upper portion having an inner diameter that is greater than an outer diameter of the target to define a gap between the process shield and the target, and a gas inlet to provide a gas to the interior volume through the gap or across a front opening of the gap to substantially prevent particles from the interior volume from entering the gap during use.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: July 19, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Chao Du, Yong Cao, Chen Gong, Mingdong Li, Fuhong Zhang, Rongjun Wang, Xianmin Tang
  • Patent number: 11390520
    Abstract: In an embodiment, a system includes: a chamber; and a magnetic assembly contained within the chamber. The magnetic assembly comprises: an inner magnetic portion comprising first magnets; and an outer magnetic portion comprising second magnets. At least two adjacent magnets, of either the first magnets or the second magnets, have different vertical displacements, and the magnetic assembly is configured to rotate around an axis to generate an electromagnetic field that moves ions toward a target region within the chamber.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: July 19, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chen-Fang Chung, Wen-Cheng Cheng, Tsez-Chong Tsai, Shuen-Liang Tseng, Szu-Hsien Lo, Po-Wen Yang, Ming-Jie He
  • Patent number: 11387086
    Abstract: A machine for the deposition of material on a substrate by the cathodic sputtering technique is provided, of the type provided with a cathode assembly having a tubular support extending substantially along a first axis (A), and a plurality of magnetic elements constrained to the tubular support and spaced from one another along the first axis (A), and wherein each of the magnetic elements has at least one second axis (M) of magnetic orientation, linking the respective magnetic poles (N; S) and has an outer side jutting from the tubular support and an inner side constrained to the tubular support, wherein the second axis (M) linking the poles of each magnetic element is transverse to the first axis (A) of the tubular support and the polarity (S; N) of the outer sides of two consecutive magnetic elements along the first axis (A) on the tubular support is alternating.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: July 12, 2022
    Assignee: KENOSISTEC S.R.L.
    Inventors: Stefano Perugini, Simone Mutti, Michele Abbiati
  • Patent number: 11359274
    Abstract: A method of depositing a layer on a substrate includes applying a first magnetic field to a cathode target, electrically coupling the cathode target to a first high power pulse resonance alternating current (AC) power supply, positioning an additional cylindrical cathode target electrode around the cathode, applying a second magnetic field to the additional cylindrical cathode target electrode, electrically coupling the additional cylindrical cathode target electrode to a second high power pulse resonance AC power supply, generating magnetic coupling between the cathode target and an anode, providing a feed gas, and selecting a time shift between negative voltage peaks associated with AC voltage waveforms generated by the first high power pulse resonance AC power supply and the second high power pulse resonance AC power supply.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: June 14, 2022
    Assignee: IonQuestCorp.
    Inventors: Bassam Hanna Abraham, Roman Chistyakov
  • Patent number: 11322338
    Abstract: A method for modifying magnetic field distribution in a deposition chamber is disclosed. The method includes the steps of providing a target magnetic field distribution, removing a first plurality of fixed magnets in the deposition chamber, replacing each of the first plurality of fixed magnets with respective ones of a second plurality of magnets, performing at least one of adjusting a position of at least one of the second plurality of the magnets, and adjusting a size of at least one of the second plurality of magnets, adjusting a magnetic flux of at least one of the second plurality of magnets, measuring the magnetic field distribution in the deposition chamber, and comparing the measured magnetic field distribution in the deposition chamber with the target magnetic field distribution.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: May 3, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Jie He, Shawn Yang, Szu-Hsien Lo, Shuen-Liang Tseng, Wen-Cheng Cheng, Chen-Fang Chung, Chia-Lin Hsueh, Kuo-Pin Chuang
  • Patent number: 11306391
    Abstract: A magnetically enhanced low temperature high density plasma chemical vapor deposition (LT-HDP-CVD) source has a hollow cathode target and an anode, which form a gap. A cathode target magnet assembly forms magnetic field lines substantially perpendicular to the cathode surface. A gap magnet assembly forms a magnetic field in the gap that is coupled with the cathode target magnetic field. The magnetic field lines cross the pole piece electrode positioned in the gap. The pole piece is isolated from ground and can be connected to a voltage power supply. The pole piece can have negative, positive, floating, or RF electrical potentials. By controlling the duration, value, and sign of the electric potential on the pole piece, plasma ionization can be controlled. Feed gas flows through the gap between the hollow cathode and anode. The cathode can be connected to a pulse power or RF power supply, or cathode can be connected to both power supplies. The cathode target and substrate can be inductively grounded.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: April 19, 2022
    Assignee: IonQuest Corp.
    Inventors: Bassam Hanna Abraham, Roman Chistyakov
  • Patent number: 11309169
    Abstract: A collimator that is biasable is provided. The ability to bias the collimator allows control of the electric field through which the sputter species pass. In some implementations of the present disclosure, a collimator that has a high effective aspect ratio while maintaining a low aspect ratio along the periphery of the collimator of the hexagonal array of the collimator is provided. In some implementations, a collimator with a steep entry edge in the hexagonal array is provided. It has been found that use of a steep entry edge in the collimator reduces deposition overhang and clogging of the cells of the hexagonal array. These various features lead to improve film uniformity and extend the life of the collimator and process kit.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: April 19, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Martin Lee Riker, Fuhong Zhang, Anthony Infante, Zheng Wang
  • Patent number: 11295938
    Abstract: Methods and apparatus for processing a substrate are provided herein. In embodiments, a magnetron assembly for use in a PVD chamber includes: a base plate having a first side, a second side opposite the first side, and a central axis; a magnet plate rotatably coupled to the base plate, wherein the magnet plate rotates with respect to the base plate about an offset axis; a magnet assembly coupled to the magnet plate offset from the offset axis and configured to rotate about the central axis and the offset axis; a first motor coupled to the base plate to rotate the magnet assembly about the central axis; and a second motor coupled to the magnet plate to control an angular position thereof and to position the magnet assembly in each of a plurality of fixed angular positions defining a plurality of different fixed radii.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: April 5, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Jiao Song, Anthony Chih-Tung Chan, David Gunther, Kirankumar Neelasandra Savandaiah, Irena H. Wysok
  • Patent number: 11286555
    Abstract: A magnetically enhanced HDP-CVD plasma source includes a hollow cathode target and an anode. The anode and cathode form a gap. A cathode target magnet assembly forms magnetic field lines that are substantially perpendicular to a cathode target surface. The gap magnet assembly forms a cusp magnetic field in the gap that is coupled with the cathode target magnetic field. The magnetic field lines cross a pole piece electrode positioned in the gap. This pole piece is isolated from ground and can be connected with a voltage power supply. The pole piece can have a negative, positive, or floating electric potential. The plasma source can be configured to generate volume discharge. The gap size prohibits generation of plasma discharge in the gap. By controlling the duration, value and a sign of the electric potential on the pole piece, the plasma ionization can be controlled. The magnetically enhanced HDP-CVD source can also be used for chemically enhanced ionized physical vapor deposition (CE-IPVD).
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: March 29, 2022
    Assignee: IonQuest Corp.
    Inventors: Bassam Hanna Abraham, Roman Chistyakov
  • Patent number: 11274364
    Abstract: Sputter devices comprise a vacuum supply, a gas supply, a substrate holding device, and sputter sources. Each sputter source is held by an individual source support, each of which has an individual reference point allocated on a sputter surface facing the deposition area, and each of which has a source distance to a source reference surface from the individual reference point. The sputter sources are spaced apart from each other, are arranged as a two-dimensional array opposite the deposition area, and extend along the source reference surface. The source reference surface is parallel to the substrate reference surface. At least one of the sputter sources has a source distance deviating from zero.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: March 15, 2022
    Assignee: Solayer GmbH
    Inventors: Martin Portka, Markus Kress, Michael Geisler, Florian Peter Schwarz
  • Patent number: 11275200
    Abstract: An array substrate and a manufacturing method thereof, a display panel and a display device are disclosed. The array substrate includes a transparent base substrate and an electrode structure provided on the transparent base substrate, the electrode structure including an anti-reflective layer and a first electrode layer, the anti-reflective layer being located between the first electrode layer and the transparent base substrate.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: March 15, 2022
    Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Shoukun Wang, Huibin Guo, Hao Han, Fangbin Fu, Yihe Jia, Yongzhi Song, Zhichang Liu, Jiantao Liu
  • Patent number: 11275043
    Abstract: Nano-sensors, nano-sensor array and methods of fabrication thereof are provided. A nano-sensor comprises a pair of sensing electrode assemblies aligned longitudinally along a first axis. Each sensing electrode assembly comprises an electrode strip coupled to a contact pad at a first end of the electrode strip. A sensing member is disposed between the pair of sensing electrode assemblies to detect, at a predetermined temperature, presence of a gaseous component. A thermally conductive layer is provided in contact with the sensing member. The nano-sensor comprises a heating assembly, comprising a heating strip disposed between and coupled to a pair of heating contact pads, aligned longitudinally along a second axis substantially perpendicular to the first axis. A portion of the heating strip is in contact with the thermally conductive layer to heat the sensing member through the thermally conductive layer.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: March 15, 2022
    Assignee: Indian Institute of Science
    Inventors: Chandra Shekhar Prajapati, Navakanta Bhat
  • Patent number: 11255012
    Abstract: An electrically and magnetically enhanced ionized physical vapor deposition (I-PVD) magnetron apparatus and method is provided for sputtering material from a cathode target on a substrate, and in particular, for sputtering ceramic and diamond-like coatings. The electrically and magnetically enhanced magnetron sputtering source has unbalanced magnetic fields that couple the cathode target and additional electrode together. The additional electrode is electrically isolated from ground and connected to a power supply that can generate positive, negative, or bipolar high frequency voltages, and is preferably a radio frequency (RF) power supply. RF discharge near the additional electrode increases plasma density and a degree of ionization of sputtered material atoms.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: February 22, 2022
    Assignee: IonQuest Corp.
    Inventors: Bassam Hanna Abraham, Roman Chistyakov
  • Patent number: 11251020
    Abstract: The apparatus includes: a vacuum container; a substrate-holding part inside the vacuum container; a target-holding part inside the vacuum container; and a plurality of antennas having a flow channel through which a cooling liquid flows. The antennas include: at least two tubular conductor elements; a tubular insulating element that is arranged between mutually adjacent conductor elements and insulates the conductor elements; and a capacitive element that is connected electrically in series to the mutually adjacent conductor elements. The capacitive element includes: a first electrode which is connected electrically to one of the mutually adjacent conductor elements; a second electrode which is connected electrically to the other of the mutually adjacent conductor elements and is disposed facing the first electrode; and a dielectric substance that fills the space between the first electrode and the second electrode. The dielectric substance is a cooling liquid.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: February 15, 2022
    Assignee: NISSIN ELECTRIC CO., LTD.
    Inventors: Shigeaki Kishida, Daisuke Matsuo, Yoshitaka Setoguchi, Yasunori Ando
  • Patent number: 11242596
    Abstract: The present disclosure discloses a film-forming device belongs to the field of film forming technology comprising: a film-forming chamber configured to form a film on a substrate disposed inside the film-forming chamber; a transfer assembly configured to transport a shielding plate into the film-forming chamber along a conveying path, move the shielding plate to a first position, and remove the shielding plate from the film-forming chamber along the conveying path; and a cleaning assembly disposed at the conveying path outside the film-forming chamber for cleaning the shielding plate removed from the film-forming chamber.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: February 8, 2022
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Guangfei Chen, Dagang Liu, Feng Liu
  • Patent number: 11244815
    Abstract: A sputtering target comprising a sputtering material and having a non-planar sputtering surface prior to erosion by use in a sputtering system, the non-planar sputtering surface having a circular shape and comprising a central axis region including a concave curvature feature at the central axis region. The central axis region having a wear profile after erosion by use in a sputtering system for at least 1000 kWhrs including a protuberance including a first outer circumferential wear surface having a first slope. A reference, protruding convex curvature feature for a reference target after sputtering use for the same time includes a second outer circumferential wear surface having a second slope. The protuberance provides a sputtered target having reduced shadowing relative to the reference, protruding convex curvature feature, wherein the first slope is less steep than a second slope.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: February 8, 2022
    Assignee: Honeywell International Inc.
    Inventors: Shih-Yao Lin, Stephane Ferrasse, Jaeyeon Kim, Frank C. Alford
  • Patent number: 11239063
    Abstract: A magnet unit for a magnetron sputtering apparatus is disposed above the target has: a yoke made of magnetic material and is disposed to lie opposite to the target; and plural pieces of magnets disposed on a lower surface of the yoke, wherein a leakage magnetic field in which a line passing through a position where the vertical component of the magnetic field becomes zero is closed in an endless manner, is caused to locally act on such a lower space of the target as is positioned between the center of the target and a periphery thereof, the magnet unit being driven for rotation about the center of the target. In a predetermined position of the yoke there is formed a recessed groove in a circumferentially elongated manner along an imaginary circle with the center of the target serving as a center.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: February 1, 2022
    Assignee: ULVAC, INC.
    Inventor: Yoshinori Fujii
  • Patent number: 11239056
    Abstract: This disclosure describes systems, methods, and apparatus for a pulsed power supply assembly that distributes pulsed power to two or more loads using a single pulsed power supply. A pulsed power supply of the assembly can phase shift pulses to the different loads to ensure that there is no overlap between pulses at the outputs even where target frequencies and/or duty cycles for the different loads would otherwise call for such pulse overlaps. Variances applied by the pulsed power supply can be limited by attempts to keep average parameters of the pulse trains provided to the different loads to within predetermined variances.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: February 1, 2022
    Assignee: Advanced Energy Industries, Inc.
    Inventors: Joel Oehen, Alain Richoz, Fabio Vicinanza
  • Patent number: 11230761
    Abstract: A deposition system, and a method of operation thereof are disclosed. The deposition system comprises a cathode assembly comprising a rotating magnet assembly including a plurality of outer peripheral magnets surrounding an inner peripheral magnet.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: January 25, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Vibhu Jindal, Sanjay Bhat
  • Patent number: 11230760
    Abstract: A sputtering apparatus SM has: a vacuum chamber in which a substrate and a target are disposed to lie opposite to each other; a plasma generating means generating a plasma inside the vacuum chamber; and a magnet unit disposed above the target. The magnet unit has a plurality of magnets with different polarities on a substrate side. A leakage magnetic field in which a line passing through a position where a vertical component of the magnetic field becomes zero is closed in an endless manner, is caused to locally act on such a space below the target as is positioned between the center of the target and a periphery thereof. The magnet unit is divided, on an imaginary line extending from the center of the target toward a periphery thereof, into a plurality of segments each having a plurality of magnets.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: January 25, 2022
    Assignee: ULVAC, INC.
    Inventors: Yoshinori Fujii, Shinya Nakamura
  • Patent number: 11220735
    Abstract: A method of depositing of a film on a substrate with controlled adhesion. The method comprises depositing the film including metal, wherein the metal is deposited on the substrate using physical vapor deposition at a pressure that achieves a pre-determined adhesion of the film to the substrate. The pre-determined adhesion allows processing of the film into a device while the film is adhered to the substrate but also allows removal of the device from the substrate.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: January 11, 2022
    Assignee: MEDTRONIC MINIMED, INC.
    Inventors: Akhil Srinivasan, Yifei Wang
  • Patent number: 11211234
    Abstract: An apparatus for generating sputtering of a target to produce a coating on a substrate is provided. The apparatus has a magnetron including a cathode and an anode. A power supply is operably connected to the magnetron and at least one capacitor is operably connected to the power supply. The apparatus also includes an inductance operably connected to the at least one capacitor. A first switch and a second switch are also provided. The first switch operably connects the power supply to the magnetron to charge the magnetron and the first switch is configured to charge the magnetron according to a first pulse. The second switch is operably connected to discharge the magnetron. The second switch is configured to discharge the magnetron according to a second pulse.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: December 28, 2021
    Assignee: EVATEC AG
    Inventors: Stanislav Kadlec, Jurgen Weichart
  • Patent number: 11186907
    Abstract: Disclosed is a deposition apparatus for a substrate, in particular, a deposition apparatus for both lateral portions of a substrate, in which at least one substrate is inserted in and mounted to a revolvably disposed substrate mounting drum in a direction from an outside circumferential surface toward an inside circumferential surface, one lateral portion of the substrate exposed protruding from an inside circumferential surface is subjected to deposition based on an inside source target, and the other lateral portion of the substrate exposed protruding from an outside circumferential surface is subjected to deposition based on an outside source target, thereby depositing wiring to both lateral portions of the substrate at once, and achieving a three-dimensional (3D) deposition improved in uniformity and quality.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: November 30, 2021
    Assignee: TETOS Co., Ltd.
    Inventor: Kun Ho Song
  • Patent number: 11172309
    Abstract: The present disclosure relates to a magnetic circuit assembly of a bone conduction speaker. The magnetic circuit assembly may generate a first magnetic field. The magnetic circuit assembly may include a first magnetic element, and the first magnetic element may generate a second magnetic field. The magnetic circuit may further include a first magnetic guide element and at least one second magnetic element. The at least one second magnetic element may be configured to surround the first magnetic element and a magnetic gap may be configured between the second magnetic element and the first magnetic element. A magnetic field strength of the first magnetic field within the magnetic gap may exceed a magnetic field strength of the second magnetic field within the magnetic gap.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: November 9, 2021
    Assignee: SHENZHEN VOXTECH CO., LTD.
    Inventors: Lei Zhang, Fengyun Liao, Xin Qi