Abstract: A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line.

Abstract: An apparatus and method for cooling a semiconductor device. The apparatus comprises a chamber configured for receiving a cooling fluid; and a plurality of contact elements comprising respective first ends disposed within the chamber; wherein, during operation, respective second ends of contact elements contact a surface of the semiconductor device for transferring heat generated in the semiconductor device to the cooling fluid.

Abstract: An electronic device includes a printed circuit board having a wall deposited directly on a board serving as a base for a printed circuit. As the board is constructed, the wall is deposited on the board for controlling airflow. The wall controls airflow across the board and around components mounted to the board. The wall may be utilized for controlling airflow in combination with a second printed circuit board positioned adjacent to the first printed circuit board. The wall may be utilized for controlling various types of airflow, including airflow from sources including fans and convection, and from geometries including horizontal and vertical mounting geometries. The silicon wall may be utilized for preventing heat airflow generated by heat radiated from one component from impinging upon another component.

Abstract: A mounting assembly includes a circuit board, a securing member and a heat dissipating device. A retainer is located on the circuit board. The securing member includes a positioning portion and a claw connected to the positioning portion. The heat dissipating device includes a base attached to the circuit board and a number of fins perpendicularly located on the base. The number of fins defines a number of first air paths and a number of second air paths substantially perpendicular to the number of first air paths. The positioning portion is received in at least one of the number of first air paths and at least one of the number of second air paths, and the claw is engaged with the retainer.

Abstract: Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer.

Abstract: A connector assembly includes a cage with a plurality of ports for receiving modules. An air passage is associated with each port and extends from a rear wall of the cage through a front face of the cage. The air passage way is configured to provide relatively consistent airflow regardless of whether or not a module is inserted into the corresponding port.

Abstract: An apparatus is provided for facilitating cooling of an electronics rack of a data center. The apparatus includes: an airflow director mounted to the electronics rack to redirect airflow exhausting from the electronics rack through an airflow return pathway back towards an air inlet side of the rack; an air-to-liquid heat exchanger disposed within the airflow return pathway for cooling redirected airflow before exiting into the data center near the air inlet side of the rack; an air temperature sensor for monitoring air temperature of the redirected airflow; and an automated isolation door associated with the airflow director for automatically blocking airflow exhausting from the air outlet side of the electronics rack from passing through the airflow return pathway back towards the air inlet side of the rack responsive to temperature of the redirected airflow exceeding a defined temperature threshold.

Abstract: A laser apparatus comprises: a lead frame comprising a first outer lead and a first inner lead connected to the first outer lead; mold resin that has a top surface, does not seal the first outer lead but does seal the first inner lead and cleaves part of the first inner lead exposed on the top surface; a sub-mount comprising a mounting surface and a back surface facing each other, the mounting surface facing the top surface of the mold resin and the back surface being not covered with the mold resin; and a laser element mounted on the mounting surface of the sub-mount and electrically connected to the exposed part of the first inner lead.

Abstract: Some embodiments of the present invention provide a system that attenuates noise from a fan exhaust of a computer system. During operation, the system monitors the noise from the fan exhaust and calculates a frequency spectrum of the noise from the monitored noise. Next, the system generates an antiphase spectrum from the frequency spectrum and generates a flow of air which exhibits a property of the antiphase spectrum. Finally, the system directs the flow of air into the fan exhaust so that the noise is attenuated by a reduction of turbulence in the fan exhaust by the flow of air.

Abstract: A high density switching platform arranges multiple circuit cards interconnected by a single backplane. A single backplane has three sets of circuit cards on one side. A shared ventilation chamber on the other side of the backplane draws ambient air through each of the three sets of circuit cards independently. The air flow also allows cooling of power modules that supply power to the circuit cards. The platform allows interconnection of its circuit cards with circuit cards in adjacent platforms.

Abstract: A multi-panel electronic display for use on a structure, comprising a frame removably attached to the structure in such a way as to encounter a natural airflow, a plurality of individual panels mounted on the frame, each panel comprising a first side and a second side opposite the first side, the first side comprising a plurality of light sources, wherein each individual panel works with other individual panels to display an image, and a printed circuit on the second side of more than one of the individual panels of the multi-panel electronic display and in thermally conductive communication with the frame such that heat generated by electronic components on the circuit board is dissipated within the frame and such that the frame is cooled by the natural airflow. The frame may be corrugated to facilitate dissipation of the heat and create space for electrical wiring, and thermally conductive pads may be inserted between the circuit board and the frame to further dissipate heat.

Abstract: An airflow restrictor door is pivotably supported by and extends from a support towards a card receiving bay.

Abstract: The invention relates to heat dissipation means for use with electrical and/or electronic apparatus to provide for the improved cooling of at least one component within the housing of the apparatus. The heat dissipation means includes a first portion located internally of the housing at or adjacent to the at least one component to be cooled and the means is formed of a material to allow the same to be passed via the first portion to an interface and onto a second portion located externally of the housing to allow the heat to be dissipated therefrom to the external environment more effectively. This allows heat to be dissipated without the need for moving heat dissipation means to be provided and avoids the noise and/or vibration which can be created.

Abstract: An exemplary fan assembly includes a fan and a muffler. The fan includes an air outlet. The muffler is disposed at the air outlet of the fan. The muffler includes a base plate. The base plate defines vents therein and blades thereon corresponding to the air outlet of the fan. The blades extend from the base plate toward the fan. An electronic device incorporating the fan assembly is also provided.

Abstract: A circuit board chassis and a method for assembling a backplane and a circuit board into the circuit board chassis include an aperture within at least one sidewall of the circuit board chassis. The backplane is inserted and assembled into the circuit board chassis through the aperture (that may include a counter-opposed pair of backplane insertion and assembly slots) in a first direction, and a circuit board is inserted and assembled into the circuit board chassis and the backplane in a second direction perpendicular to the first direction. By inserting and assembling the backplane into the aperture and slots, rather than assembling the backplane as an external surface component of the circuit board chassis, the embodiments provide for ease of replacement of the backplane and circuit board under space constrained limitations. The resulting embodiments also provide enhanced rigidity and enhanced thermal dissipation within the circuit board chassis.

Abstract: A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape.

Abstract: A method of arranging a plurality of components of a circuit board for optimal heat dissipation and a circuit apparatus having a plurality of components arranged by performing the method are provided. The method includes arranging a predetermined number of the plurality of components in the order of size of the components in a heat dissipation area having a predetermined width on a virtual straight line connecting the air inlet unit and the air outlet unit.

Abstract: A device for air-cooling an electronic apparatus, where a suction opening (4) is provided in a housing (1), discharge openings (5) are provided in housings (1, 2), an airflow passing the inside of the housings is generated by a fan (6), and heat produced by a heart-producing body (9) is released to the outside of the housings by the airflow. Air introduction plates inclined to change the direction of the airflow are arranged at the suction opening (4), and a large number of projections are formed on the surfaces of the air introduction plates. The device for air-cooling an electronic apparatus has increased capacity for cooling a heat-producing part without increase in the size of the device, and in the device, accumulation of dust on the heat-producing part can be prevented.

Abstract: An airflow guiding and heat dissipating assembly is mounted in an electronic device and has a base and at least one baffle being mounted on the base. Multiple electronic components are mounted on the base and are arranged in a line. Airflow flows along one electronic component upstream, past the baffle and then over the other electronic component downstream to take away heat from the electronic component. The baffle prevents the airflow from becoming turbulent and, therefore, temperatures of the electronic component are lowered efficiently.

Abstract: An industrial computer includes a first casing, a second casing, a storage unit, a cover, and a heat dissipation unit. The second casing and the first casing form a closed casing, and the outside of the second casing has a containing area. The storage unit is disposed at the containing area. The cover is removably assembled at the second casing to cover the containing area and contact the storage unit. The heat dissipation unit is disposed at the cover.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: A power module includes a first power chip and a second power chip, each of which has at least two electrodes. The power module is applied to a power converter having a power density higher than 15 W/inch3 and a maximum efficiency higher than 92%, or to a power converter having a power density higher than 20 W/inch3 or having a maximum efficiency higher than 93%. At least one of the power chips operates at a frequency higher than 25 kHz.

Abstract: A heat-dissipating assembly for a server includes a housing in which a partitioning plate and a power supply mounted on one side of the partitioning plate are provided. The power supply includes a casing and a power-supplying module received in the casing. The heat-dissipating assembly includes a fan received in the casing and located outside the power-supplying module. The partitioning plate and the casing are respectively provided with a plurality of first heat-dissipating holes and second heat-dissipating holes. The first heat-dissipating holes and the second heat-dissipating holes are positioned to correspond to the fan. The airflow caused by the fan drives the air inside the housing to flow out of the housing via the first heat-dissipating holes and the second heat-dissipating holes. In this way, the heat-dissipating efficiency can be improved without affecting the arrangement of other electronic devices in the housing.

Abstract: An apparatus, system, and method are disclosed for directing power supply airflow. A power supply is disposed adjacent a first end of a chassis. The chassis comprises a z axis from the first end to a second end of the chassis and an x axis orthogonal to the z axis. A bay is disposed adjacent the first end of the chassis along the x axis from the power supply. The bay comprises at least one storage device. A chamber is disposed adjacent the first end of the chassis adjacent the bay along the x axis between the bay and the power supply. A first baffle is disposed offset from the power supply, the bay, and the chamber along the z axis toward the second end. The first baffle forms a first section and isolates a first airflow in the first section from a second airflow.

Abstract: A fan duct includes a top plate, two side plates extending downward from opposite sides of the top plate, and plural guiding plates extending downward from the top plate. The side plates and the top plates cooperatively define an air inlet and an air outlet. The air inlet and the air outlet are located at another two opposite sides of the top plates, respectively. The guiding plates are located between the side plates and adjacent to the air outlet. Each of the guiding plates forms a guiding face facing the air inlet. The guiding face is obliquely oriented with respect to the top plate. An electronic device incorporating the fan duct is also provided.

Abstract: An internal device arrangement for a passenger cabin, for example of an aircraft, comprises an internal device element (15) which is selected from a group consisting of wall panelling, window panel, side panel, ceiling panelling and luggage compartment; an electrical apparatus (1) such as a lighting element, for example, which is fitted in or on the internal device element (15); and at least one line (2) for supplying power to the electrical apparatus (1). Furthermore, a heat dissipation device (6a . . . f) in the form of an integral component part of the internal device element (15), the electrical apparatus (1) and/or the at least one line (2) is provided. Such a heat dissipation device (6a . . . f) makes it possible to dispense with an additional heat sink for temperature management and thus for savings to be made in terms of installation space and weight.

Abstract: A module for an automation device with a plurality of adjacent modules is provided. The module includes a housing capsule that has at least one rear wall and two side walls and which is provided for housing electric components. Further, an automation device including the module is provided. One of the side walls of the modules is embodied as being thermally conductive and that the other side wall is embodied as being thermally insulated.

Abstract: An exemplary encapsulated high-voltage switch is disclosed which contains a heat-generating current conductor, a metal encapsulation surrounding the current conductor, and a cooling element. A cooler of the cooling element is fixed on a part of the encapsulation that is embodied as a mounting plate, and has cooling ribs arranged outside the encapsulation. In a section of the cooler that is embodied as a cooling block, at least a portion of the cooling ribs is arranged parallel to the mounting plate and is held on a heat distributor fixed to the mounting plate in such a way that on both sides of the heat distributor in each case one of two groups of cooling channels arises, in which the cooling channels are in each case arranged in the manner of a sandwich. The cooling channels can, for example, be oriented in a manner inclined relative to a horizontal axis of the switch.

Abstract: A cooling apparatus for semiconductor chips includes radiation fins formed on the opposite surface of metal base opposite to the surface of metal base, to which an insulator base board mounting semiconductor chips thereon, is disposed. The radiation fins, such as sheet-shaped fins having different lengths are arranged such that the surface area density of the fins becomes higher in the coolant flow direction, whereby the surface area density is the total surface area of radiation fins on a unit surface area of the metal base. As a result, the temperatures of semiconductor chips arranged along the coolant flow direction are closer to each other.

Abstract: An enclosure for electronics includes a body with a metal component and a polymeric component overmolded onto the metal component so as to be connected to the metal component without fasteners. The body defines a recess. A heat sink is defined in the metal component. A printed circuit board is located in the recess and includes a plurality of electronic components mounted thereon.

Abstract: A motherboard including an electronic component is provided. Airflow flows through the motherboard along a direction. An adhesive air guiding device including at least one air guiding surface facing the direction of the airflow is stuck to the electronic component, for guiding the airflow to flow over the electronic component.

Abstract: A cooling device for an acoustic apparatus includes a cooling fan that is turned on and off, and adjusted in quantity of airflow in accordance with an apparatus temperature, wherein when the apparatus temperature is lower than a value requiring immediate cooling, and when an audio output is in a mute state, the cooling fan is not changed in operating state.

Abstract: An information processing apparatus sets a driving keeping voltage for keeping driving of a fan to a voltage that is higher than a voltage that is applied to the fan when the fan is determined not to be rotating after decreasing the voltage that is applied to the fan in a state where the fan is rotating.

Abstract: A heat dissipation apparatus adapted for simultaneously cooling a first electronic component and a second electronic component includes a heat sink adapted for being thermally attached to the first electronic component, a fan duct receiving the heat sink therein and a fan mounted to the fan duct. The fan duct comprises a top plate and two side plates extending from two opposite sides of the top plate. A receiving space is defined in the fan duct between the top plate and a top of the heat sink and adapted for receiving the second electronic component. Airflow from the fan is guided by the fan duct to blow towards the heat sink and the second electronic component, simultaneously.

Abstract: A power supply assembly includes an enclosure body, a cover panel mounted to the enclosure body, a power supply unit, and a positioning element. The enclosure body includes a bottom panel, a rear panel, and a side panel. The power supply unit is mounted in the enclosure body and is prevented from moving in a first direction substantially perpendicular to the rear panel and a second direction substantially perpendicular to the side panel. The positioning element includes a plate body, a first positioning portion, and a second positioning portion. The power supply unit is sandwiched between the bottom panel and the plate body. The first positioning portion is for preventing the power supply unit from moving along a first direction substantially parallel to the bottom panel. The second positioning portion for preventing the power supply unit from moving a second direction parallel to the bottom panel.

Abstract: In one example, a data center may be built in modular components that may be pre-manufactured and separately deployable. Each modular component may provide functionality such as server capacity, cooling capacity, fire protection, resistance to electrical failure. Some components may be added to the data center by connecting them to the center's utility spine, and others may be added by connecting them to other components. The spine itself may be a modular component, so that spine capacity can be expanded or contracted by adding or removing spine modules. The various components may implement functions that are part of standards for various levels of reliability for data centers. Thus, the reliability level that a data center meets may be increased or decreased to fit the circumstances by adding or removing components.

Abstract: In order to provide sound absorbing structure capable of reducing the noise of electronic equipment while maintaining the cooling capability of the electronic equipment, there is provided sound absorbing structure in which a plurality of penetrating openings are provided by arranging a plurality of acoustic materials having a predetermined shape at predetermined intervals in a flow channel of cooling fluid from a blower, and the plurality of acoustic materials are arranged so that the sound vertically incident on a penetrating plane of the penetrating openings from the blower does not directly go out of the electronic equipment.

Abstract: The invention relates to an electrical cabinet (1) for receiving electrical and/or electronic and/or optoelectronic devices, in particular low-current distribution devices, which is particularly suited for installation outdoors, comprising an inner cabin (2) and an outer cabin (3), a first cooling channel (12) and a second cooling channel (23) being configured to be bordering externally on boundary surfaces (6) of the inner cabin (2) and separated from each other.

Abstract: A network device includes an airflow baffle. The baffle redirects cooling air toward a transceiver cage to increase a rate of heat transfer from electronic devices on the transceiver. The baffle is bi-directional, so that cooling air is redirected regardless of whether it flows in a front-to-back or back-to-front direction.

Abstract: An electronic device having a piezoelectric pump. The electronic device includes: an audio input section; an audio recording section recording input sound from the audio input section; a piezoelectric pump cooling air by a piezoelectric element; a drive circuit driving the piezoelectric element; and a control circuit monitoring and controlling operation of the audio input section, the audio recording section, and the drive circuit, wherein when an operation mode being monitored is an audio recording mode, in which the input sound is used for recording by the audio recording section, the control circuit controls the drive circuit to decrease the amount of air flow exhausted outside from the piezoelectric pump, and when the operation mode being monitored is another mode without audio recording, the control circuit maintains the amount of the air flow.

Abstract: A temperature control apparatus for a hard disk drive includes a thermal chamber for receiving the hard disk drive. The apparatus also includes an oscillatory air movement generator for generating air movement within a region between the thermal chamber and the hard disk drive when the hard disk is received in the thermal chamber, thereby to facilitate heat transfer between the thermal chamber and the hard disk drive.

Abstract: In one embodiment, an air mover may include a first electrode, a second electrode and an ionization device to selectively ionize molecules in an electric field between the first and second electrodes. The ionized molecules can drive airflow between the first and second electrodes. In certain embodiments, the ionization device has an operational characteristic that prevents ionization of oxygen so that the airflow is ozone-free.

Abstract: An exemplary electronic device includes an enclosure, two electronic components received in the enclosure, a heat sink, and a thermal insulation member. The enclosure defines a receiving space for receiving the electronic components and the thermal insulation member. Two ventilating holes are defined in the enclosure. The thermal insulating member defines a heat dissipating passage therein, communicating with the exterior via the ventilating holes of the enclosure. The heat sink is received in the heat dissipating passage and thermally coupled to the electronic components for dissipating heat from the electronic components. The heat dissipating passage is substantially thermally insulated from the part of the receiving space of the enclosure having the electronic components by the thermal insulation member.

Abstract: A sheathing layer spans a supporting surface from which moisture is to be removed. In one exemplary system, ventilation channels extend between opposed ends of the substrate layer, communicating with an outlet opening at one end and with a duct at the opposing end which in turn communicates with an inlet opening at the same end of the substrate layer as the outlet opening. A fan is arranged to circulate air through channels from the inlet opening to the outlet opening to replace humid air in the channels with drier replacement air. In another example, a substrate layer includes ventilation channels communicating only between the supporting surface and an outlet opening. The outlet opening connects to a fan which maintains the channels at a vacuum pressure to withdraw moisture therefrom.

Abstract: An electronic device includes a printed circuit board and a heat dissipation module. The printed circuit board has a first heat-generating electronic component and a number of second heat-generating electronic components. The heat dissipation module includes a heat sink thermally engaging on the first heat-generating electronic component and an enclosure enclosing the printed circuit board. The heat sink includes a number of fins. The enclosure extends an inner casing to envelop the fins of the heat sink. The enclosure defines a number of slots letting the casing communicate with an exterior of the enclosure. The casing separates the fins from the second heat-generating electronic component.

Abstract: A power supply assembly includes an enclosure body, a cover panel mounted to the enclosure body, a power supply, and a positioning element mounted to the cover panel. The enclosure body includes a bottom panel, a rear panel substantially perpendicular to the bottom panel, and a side panel substantially perpendicular to the bottom panel and the rear panel. The power supply assembly is mounted in the enclosure body and is prevented from moving in a first direction, that is substantially perpendicular to the rear panel, and a second direction, that is substantially perpendicular to the side panel, and disposed between the bottom panel and the cover panel. The positioning element includes a first ladder-shaped positioning tab abutting two adjacent surfaces of the power supply and preventing the power supply assembly from moving in a third direction, that is substantially perpendicular to the cover panel and the second direction.

Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

Abstract: A server and cooler module arrangement includes a server accommodating a stack of an operating system and an electronic device in an accommodation chamber therein at one side and an access device unit in the accommodation chamber at an opposite side, and a cooler module, which comprises a rack mounted in a partition way in the accommodation chamber between the stack of operating system and electronic device and the access device unit and a plurality of fans respectively adjustably mounted in respective open frames at different elevations and adapted for drawing air or sending air toward different heat sources in the operating system, the electronic device and the access device unit for quick dissipation of waste heat.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: The extruded section forms a tunnel that is substantially rectangular and is provided with fins on at least one side of the rectangle. The fins allow air to flow outside the housing by natural convection in the extrusion direction. A side without fins serves as a base for fastening the housing and as a support for power electronic components of the power electronic device. The fins are machined transversely to the extrusion direction to form notches in the fins. The notches being aligned in succession to allow air to flow outside the housing by natural convection in the optimum direction.