Abstract: A housing for an electronic device. The housing includes a first shell at least partly enclosing the electronic device, a second shell, and at least a first fan. The first shell is arranged to allow a gaseous fluid to surround the electronic device. The second shell at least partly encloses the first shell, and is arranged in relation to the first shell such that the gaseous fluid may be present between the shells. The at least first fan is arranged in an opening of the first shell such that it is capable of providing a flow of the gaseous fluid through the opening in the first shell of the gaseous fluid to the second shell and thereby provide heat transport from the electronic device to the second shell.

Abstract: A cable management system is provided that includes a cable management rack for accommodating a heat generating device, a first baffle mounted with respect to a first upright of the rack and for redirecting a rearward flow of cool air sideways from a space adjacent a front side of the rack, and/or a second baffle mounted with respect to a second upright of the rack and for redirecting a sideways flow of exhaust air from the rack and through the second upright into a space adjacent a rear side of the rack. A method of cooling a heat-generating device mounted in or on a cable management rack includes providing a sideways flow of cooling air into the rack and into the device.

Abstract: A weatherproof box enclosure adapted to be secured on one of an outside wall and roof location of a multi-tenant building structure supporting roof-mounted solar panel or wind turbine generators including a multiple pole control unit receiving and distributing received alternating current voltages from the generators, which is disengagable by a normally open override switch when supplied voltages fall below a predetermined level, when servicing of the components of the safety box enclosure is to be had, and automatically in the event of an emergency as representative of a closing of the override switch by a ground level control.

Abstract: An electronic device includes a body portion such as, for example, a laptop chassis, and a deployable support coupled to the bottom surface of the body portion. The deployable support can be moved between a stowed position relative the bottom surface of the body portion and a deployed position in which support is positioned in spaced relationship to the bottom to create an airflow path beneath the body portion.

Abstract: A semiconductor device of the present invention is a semiconductor device applicable in a cooling system including an ECU functioning as a setting part that sets target temperature of a refrigerant used to cool the semiconductor device, and a sensor functioning as a detector that detects the temperature of the refrigerant as refrigerant's temperature. The semiconductor device generates variable heating loss. The semiconductor device includes a heating controller that controls the heating loss in the semiconductor device such that the target temperature and the refrigerant's temperature become the same.

Abstract: A power supply system includes a distribution board, two power supplies, an interface board, and a cable. The interface board comprises two parallel connectors arranged at a center portion of a first side of the interface board, a pair of vents respectively defined beside the two connectors, and a first adapter connector formed at an end portion of the first side. The distribution board is coupled to a second side of the interface board and comprising a second adapter connector arranged thereon. The power supplies are respectively connected to the two connectors and each defines an air vent in alignment with the vents of the interface board. The cable is connected between the first adapter connector and the second adapter connector.

Abstract: An illuminated sign includes a plurality of straight fin heat sinks framed together; a plurality of LED plates framed together, each LED plate comprising a plurality of LEDs arranged in rows on a front surface, and a plate heat sink on a rear surface, the plate heat sinks being in contact with the straight fin heat sinks; and an LCD panel mounted in front of the LED plates by framing.

Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.

Abstract: An electronic device includes an enclosure. The enclosure includes a motherboard area and a power supply area adjacent to the motherboard area, which are both located at a first end of the enclosure, a hard disk drive area for mounting hard disk drives at a second end of the enclosure, and a fan area arranged between the motherboard area and the hard disk drive area.

Abstract: A switching module is for connecting a Pulse Width Modulation (PWM) device to a plurality of fans under test. The switching module includes a print circuit board (PCB), and a plurality of groups of signal connectors arranged on the PCB. Each group of signal connectors includes a first port, a second port, and a third port interconnected with each other. The first port is for connecting to a testing port of an external PWM device. The second port is for connecting one corresponding fan of the plurality of fans. The third port is for connecting an interface of a server motherboard.

Abstract: The air conditioning device for electronic components features three channels (6, 7, 8) for two flowing fluids that are in heat exchange with one another. In the first operating mode these two fluids are guided by means of switchable flaps into two selected channels (7, 8) where they are in heat exchange with one another at a partition (12) that is equipped with heat exchange elements (12, 13). In a second operating mode the flaps are switched in such a manner that the two fluids are in heat exchange with one another at a Peltier element (9) that is equipped on both sides with heat exchange elements (9, 11). In a third operating mode the Peltier element is switched as a heating element. In the first operating mode on the other hand the Peltier element is deactivated and consumes no electric energy.

Abstract: A computer system includes a computer case and an air guiding duct. The motherboard is attached to the computer case, and a heat sink is attached to the motherboard. The air guiding duct includes a top panel. A mounting member is slidably attached to the top panel and is clipped to the heat sink. A limiting device is located on the top panel and engaged with the mounting member to prevent the mounting member from sliding relative the top panel.

Abstract: The electronic device according to the Present Disclosure is an electronic device provided with a heat-dissipating portion and an electronic component socket that can accommodate, therein, an installable electronic component, wherein the electronic component socket has a thermal connecting portion for connecting thermally to the electronic component, and, when the electronic component is operating, the electronic component and the heat-dissipating portion are connected thermally through the thermal connecting portion.

Abstract: The present invention relates generally to a heat sink comprising a plurality of fins, each fin having two or more prongs extending from a root section of the fin. In certain embodiments, the heat sink may be assembled by aligning the plurality of fins within slots between protrusions extending from a base of the heat sink. However, in other embodiments, the plurality of fins may have connector ends having female sides and opposite male sides, wherein the plurality of fins may be attached to each other via the interlocking female and male sides, thereby forming at least part of the base of the heat sink, and fortified with reinforcing members.

Abstract: A power module includes a first power chip and a second power chip, each of which has at least two electrodes. The power module is applied to a power converter having a power density higher than 15 W/inch3 and a maximum efficiency higher than 92%, or to a power converter having a power density higher than 20 W/inch3 or having a maximum efficiency higher than 93%. At least one of the power chips operates at a frequency higher than 25 kHz.

Abstract: A container data center includes a mobile container and a number of servers. The mobile container includes a main room receiving the servers, and an air shower room isolated from the main room. The air shower room includes an outer door, an inner door, a blower, and a dust absorber. The outer door connects the air shower room and is used to separate the air shower room from the outer environment. The inner door connects the air shower room and is used to separate the air shower room from the main room. The blower and the dust absorber are secured on two opposite walls of the air shower room respectively, the blower being configured for blowing air towards the dust absorber.

Abstract: An image pickup apparatus that does not give a user, who grips an apparatus body with his/her hand when he/she uses the imaging apparatus or the electronic device, a sense of discomfort due to a heat, and that can efficiently diffuse heat generated from a heat source inside the apparatus body to suppress a local temperature rise inside the apparatus body. An image pickup apparatus comprises an outer cover that forms an exterior of a device body, the device body having a grip at one end thereof and having a heat source therein. A first thermal conductive path from a first circuit unit to a first heat storage member via a first heat conductive member and a second thermal conductive path from a second circuit unit to a second heat storage member via the second heat conductive member are separated from each other.

Abstract: The invention provides an apparatus for dissipating heat produced by a laser for lighting projection to enable a passive encapsulated enclosure. The laser is mounted into a collar system which integrates to the internal enclosure body with a single or plurality of bonded extending facet planes. The facet planes can conduct and radiate heat to the internal enclosure body planes which dissipate heat to the outside environment of the closed enclosure as a heat sink.

Abstract: This invention provides a motor control method which comprises the steps of operating a motor at a fanless operation mode when a ambient temperature is lower than a lower temperature, operating the motor at a silent operation mode when the ambient temperature is higher than the lower temperature and lower than a higher temperature, and operating the motor at a cooling operation mode when the ambient temperature is higher than the higher temperature. When the motor operates at the fanless operation mode, the rotation speed of the motor is zero rpm. When the motor operates at the silent operation mode, the motor operates at a constant rotation speed. When the ambient temperature is higher than the higher temperature, the rotation speed of the motor is a linear function of the temperature and varies between the higher temperature and a maximum temperature corresponding to the full rotation speed of the motor.

Abstract: A cooling system and a method for cooling an electronic display is disclosed. A preferred embodiment utilizes a first gas chamber positioned anterior to the front display surface and a second gas chamber in gaseous communication with the first gas chamber and positioned posterior to the electronic display. The space between the second gas chamber and electronic display defines a gap, where ambient air can be drawn through the gap in order to cool the electronic display. A cooling chamber fan preferably forces gas to circulate through the first and second gas chambers, in order to remove heat from the front display surface.

Abstract: A system includes a rack, one or more computer systems mounted in the rack, and two or more alternating current (AC) fans mounted in the rack. The AC fans move air through the computer systems mounted in the rack. At least one of the AC fans can move air through at least two of the computer systems mounted in the rack.

Abstract: A cooling system for a mobile computing device configured to drive two devices, a fan and an alert device. The fan cools components of the mobile computing device by exchanging air between an inner cavity of the mobile computing device and an outer environment surrounding the mobile computing device. The alert device produces an alert, e.g., a vibration, for the mobile computing device. The cooling system includes a motor operably connected to a first device (either the fan or the alert device) and operably connected via a clutch to a second device (either the fan or the alert device). The clutch allows the second device to be selectively activated depending on a speed or rotational direction of a drive shaft of the motor.

Abstract: A container data center system includes a plurality of container data centers and a dissipation system. Each container data center includes a container and a number of servers arranged in the container. The containers of the container data centers communicate with each other. The heat dissipation system includes a refrigerating device configured for generating cooling air to one of the containers.

Abstract: An electronic device including a first body, a rotating base and a transmission module is provided. The rotating base has a first ventilation opening. The rotating base is pivoted on the first body and suitable for rotating between a using position and a retracted position in relative to the first body. When the rotating base is located at the retracted position, the first ventilation opening is exposed from the first body. When the rotating base is located at the using position, the first ventilation opening is retracted in the first body. The transmission module is connected to the rotating base for outputting a mechanical force to actuate the rotating base.

Abstract: An electronic device includes a main board, a plurality of add-on cards, a bracket mounted above the add-on cards, and an air guider. The add-on cards are mounted on the main board and spaced apart from each other. The add-on cards define a plurality of channels therebetween. The air guider includes a plurality of baffles pivotally connected to a bottom of the bracket, and a plurality of elastic members. Each of the elastic members pushes a corresponding baffle to contact a top of a corresponding add-on card to baffle air flowing between the bracket and the top of the corresponding add-on card and direct such air flowing through the channels.

Abstract: A data center includes a row of one or more racks. Computer systems are mounted in the racks. A cold aisle is on a first side of the rack row and a hot aisle is on the second side of the rack row. An air handling system moves air from the cold aisle on the first side of the row of racks through computer systems in at least one of the racks and exhausts air from the computer systems into the hot aisle on the second side of the row of racks. The computer systems include input/output connectors, power input connectors, and power supply air inlets on the first side (cold-aisle side) of the row. One or more power rack power distribution units are provided on the first side (cold-aisle side) of the row.

Abstract: Apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure associated with the electronic component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop to receive coolant from and supply coolant to the liquid-cooled structure. The heat exchanger is disposed external to the electronics rack within a cool air plenum of the data center containing the rack, and the plenum is coupled to a cool air source providing cooled air to the data center. Cooled air of the cool air plenum passes across the heat exchanger and cools coolant passing through the heat exchanger, which dissipates heat from the coolant passing therethrough to the cool air passing across the heat exchanger to facilitate liquid cooling of the electronic component(s) associated with the liquid-cooled structure.

Abstract: Solid state switching device having a heatsink, a solid state switching element in heat conductive relationship with the heatsink, and an enclosure having ventilation openings adjacent to the heatsink through which air can flow to remove heat from the heatsink. In some disclosed embodiments, the heatsink has fins and ducts aligned with ventilation openings in the enclosure for removing heat by radiation and convection. In others, the heatsink is a generally planar baseplate, with ventilation openings in a side wall of the enclosure next to the baseplate for removing heat from the device. Spacers project laterally from the devices and permit a plurality of the devices to mounted side-by-side with space between the devices through which air can flow.

Abstract: A flat-panel display apparatus comprises a display panel, a circuit board, and a cover. The circuit board includes a first and second circuit boards. The first circuit board is arranged above the second circuit board so that, on the back side of the display panel, a mounting surfaces of the first and second circuit boards are approximately in parallel with a display surface of the display panel and do not overlap each other. Each of the first and second circuit boards have a primary mounting surface on which a large number of electrical components are mounted, and a secondary mounting surface that is opposite the primary mounting surface. The primary mounting surface of the first circuit board is arranged in an inverted orientation to the primary mounting surface of the second circuit board. A radiator with fins is provided on the secondary mounting surface side of the first circuit board.

Abstract: Systems and methods for balanced cooling of electrical systems, including electrical systems containing transceivers used in electrical and optical communication. An electrical system includes a cage, where the cage has a top, front and bottom. The cage contains a plurality of upper bays disposed in the front of the cage. Each of the plurality of upper bays is configured to receive a transceiver. The cage also contains a plurality of lower bays disposed in the front of the cage. Each of the lower bays is configured to receive a transceiver. Additionally, each of the plurality of upper bays is stacked on one of the plurality of lower bays. An upper heat sink extends from the outer surface of the top of the cage and a lower heat sink extends from the outer surface of the bottom of the cage.

Abstract: An exemplary electronic device includes a cover, a circuit board and a driving module both mounted on the bottom cover, an electronic component fixed on the circuit board, and a top cover covering the bottom cover. The driving module has a rotating shaft adapted for supportively driving an optical disk to rotate. The electronic component generates heat during operation. Through holes are defined in the top cover and located at a periphery of the rotating shaft. When the optical disk is mounted on the rotating shaft and driven to rotate by the rotating shaft, air heated by the electronic component in the electronic device can flow out of the top cover via the through holes, and rotation of the optical disk facilitates such airflow.

Abstract: A power supply apparatus includes an air path extending longitudinally, a fan that blows air into the air path in a direction intersecting a longitudinal direction of the air path, and a plurality of electronic components arranged in the longitudinal direction. Each of the electronic components is cooled by air passing through the air path. With this configuration, it is possible to efficiently cool the electronic components without compromising the flexibility of arrangement of the various electronic components. Also, a dust removal operation can be readily performed without the possibility of damaging the fan.

Abstract: A computer system includes a display, a computer case securing the display, a fan assembly and a cover. A motherboard is attached to the computer case. A chip, a heat dissipating device, and a system fan are located on the motherboard. The fan assembly includes a securing plate and a fan attached to the securing plate. The securing plate covers the plurality of the memory cards. The cover defines a plurality of air intakes and a plurality of air outlets. The plurality of air intakes, the fan, the heat dissipating device, the chip, the system fan and the plurality of air outlets together form an air path for moving air therethrough.

Abstract: A support part serves is arranged in an instrument panel of a motor vehicle to hold a vehicle data display unit having an integrated navigation or radio unit. The support part has a single-piece frame composed of a magnesium pressure die cast material with a central holding frame for the unit and lateral holding frames for the air outlets. The support part is connected at one side to the instrument panel and another side to the cockpit cross member. Centering receptacles for the unit and further centering receptacles for the air outlets are arranged in the central holding frame and in the two lateral holding frames. Centering elements are arranged on the unit and on the air outlet correspondingly to the centering receptacles of the holding frames.

Abstract: With respect to a housing device having a plurality of slots in which plug-in units are mountable, division plates corresponding to the positions of the openings of the slots are put in the inside of a baffle section for changing the direction of the flow of cooling air released from the slots, and the division plates are used to divide the inside space of the baffle section into a plurality of regions corresponding to the slots, thereby reducing mutual interference of the cooling air from the slots in the baffle section and preventing a further increase in differences in the amount of passing air among the slots. Thereby, even if any difference occurs in the amount of passing air among the slots due to a structural factor, it is possible to reduce the deterioration of the cooling capacity of a slot through which relatively less amount of air passes.

Abstract: Arc resistant enclosures for dry-type transformers. More particularly, transformer enclosures having one or more arc-resistant features, including arc channels, arc fault dampers, and arc fault plenums, and methods for providing same.

Abstract: A power supply assembly includes an enclosure body, a cover panel mounted to the enclosure body, a power supply, and a positioning element mounted to the cover panel. The enclosure body includes a bottom panel, a rear panel substantially perpendicular to the bottom panel, and a side panel substantially perpendicular to the bottom panel and the rear panel. The power supply assembly is mounted in the enclosure body and is prevented from moving in a first direction, that is substantially perpendicular to the rear panel, and a second direction, that is substantially perpendicular to the side panel, and disposed between the bottom panel and the cover panel. The positioning element includes a first ladder-shaped positioning tab abutting two adjacent surfaces of the power supply and preventing the power supply assembly from moving in a third direction, that is substantially perpendicular to the cover panel and the second direction.

Abstract: A keyboard including a case, a first fan, an air deflector and a keycap module is provided. The case includes a first side and a second side. The first side has an opening, the second side is disposed at a side of the first side and has at least one hole. The first fan is disposed at the second side and located between the first side and the second side. The air deflector is disposed between the first side and the second side of the case and corresponding to the hole of the second side and the opening of the first side. The keycap module is disposed at the opening of the first side.

Abstract: A mechanism is described for chimney-based cooling of computer components. A method of embodiments of the invention includes determining heat-emitting components of a computing device. The method further includes coupling a chimney to one or more of the heat-emitting components such that chimney effect of the chimney is used to guide air associated with a component in and out of the chimney.

Abstract: A circuit board chassis and a method for assembling a backplane and a circuit board into the circuit board chassis include an aperture within at least one sidewall of the circuit board chassis. The backplane is inserted and assembled into the circuit board chassis through the aperture (that may include a counter-opposed pair of backplane insertion and assembly slots) in a first direction, and a circuit board is inserted and assembled into the circuit board chassis and the backplane in a second direction perpendicular to the first direction. By inserting and assembling the backplane into the aperture and slots, rather than assembling the backplane as an external surface component of the circuit board chassis, the embodiments provide for ease of replacement of the backplane and circuit board under space constrained limitations. The resulting embodiments also provide enhanced rigidity and enhanced thermal dissipation within the circuit board chassis.

Abstract: In an electric connection box, a heat insulation wall is vertically extended in a case. This forms, between the heat insulation wall and the inner wall of the case, an ascending flow path where air can ascend and a descending flow path where air can descend. An upper communication opening and a lower communication opening that connect between the ascending flow path and the descending flow path are arranged at the upper end and the lower end, respectively, of the heat insulation wall. A relay is placed in the ascending flow path. Among the regions of the case, a region forming the descending flow path is provided with a heat radiation wall section for releasing heat of air in the descending flow path to the outside of the case.

Abstract: A display device for an electronic appliance includes: a touch screen panel; an LCD panel; and an intermediate member provided between the touch screen panel and the LCD panel. The intermediate member has an air passage for allowing air to flow into and out of an interior space defined by the intermediate member between the touch screen panel and the LCD panel. The air passage has a plurality of paths oriented in different directions.

Abstract: An electronic device includes a casing, a fan bracket and a fan module. The casing includes a top plate and a bottom plate spaced from and facing the top plate. The fan bracket is mounted on the bottom plate. The fan module includes a fan, a fan holder enclosing the fan therein, and two vibration dampening structures mounted on opposite top and bottom sides of the fan holder. The fan holder is engaged in the fan bracket. The vibration structures protrude beyond the top and bottom sides of the fan holder and abut the top plate and the bottom plate of the casing, respectively.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: A computer enclosure includes an enclosure, an air conduction member mounted in the enclosure to guide airflow, and a data storage device mounted to a top of the air conduction member.

Abstract: An air duct arrangement for cooling a group (1) of at least two heat producing modules is provided, said modules (2, 3) being arranged one after the other in the direction of an air flow through said group (1), said air duct arrangement comprising an air path (5, 6) for each module (2, 3). The cooling of modules of a group of modules with cooling air should be enabled with only small space requirements. To this end said air paths (5, 6) are arranged in parallel along a lengthwise direction from a first side of said group (1) to a second side of said group (1), said second side being opposite to the first side, said air path (5, 6) changing their order in a direction perpendicular to said lengthwise direction in a region (13) between said two modules (2, 3).

Abstract: The present invention relates generally to tuning the flow of cooling air across converter and inverter heat sinks in a motor drive system. More specifically, present techniques relate to motor drive duct systems including heat sinks with separate, sequential heat sink fin sections disposed in a common cooling air path and having different geometries to optimize the flow of cooling air across and between fins of the separate heat sink fin sections. For example, the heat sink fin sections may have different fin lengths, fin heights, fin counts, fin pitch (e.g., distance between adjacent fins), and so forth. Each of these different geometric characteristics may be tuned to ensure that temperatures and temperature gradients across the heat sinks are maintained within acceptable ranges.

Abstract: An in-row electronic equipment storage system and corresponding method provides cooling to an electronic equipment rack. The system includes an electronic equipment rack that includes a housing adapted to receive electronic equipment, and an electronic equipment rack air cavity. A cooling rack, including a housing adapted to receive cooling equipment, and a cooling rack air cavity, is configured to be disposed adjacent to the electronic equipment rack. An interface allows for fluid communication between the cooling rack air cavity and the electronic equipment air cavity. The interface may include dampers to control air flow between the air cavities.

Abstract: A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.

Abstract: A multi-modular data center includes at least one modular computing module and at least one modular power supply module. The modular computing module includes a transportable container, a plurality of computing systems, a cooling system, a surveillance system, and a network interface. The modular power supply module includes a transportable container and a plurality of power supply systems. The transportable containers are configured for transport via a transport infrastructure. The plurality of computing systems is mounted within the transportable container. The cooling system is disposed in the transportable container. The surveillance system is configured to monitor the transportable container. The network interface is configured to interface between an Internet access connection and the computing systems. The plurality of power supply systems is mounted within the transportable container.