Abstract: A display system is disclosed for an information system component that includes a case with a first connector. The display system comprises a housing, a screen mounted on the housing and configured to display information, a control mounted on the housing for controlling an aspect of operation of the screen, and a mount structure configured to connect the housing to the information system component. The mount structure is configured to removably mount the housing on the case of the information system component. The mount structure includes a second connector configured to removably connect to the first connector on the case of the information system component.

Abstract: A display module includes a bottom cover, a locking part, a pressing part, and a display panel. The bottom cover includes a bottom wall and two sidewalls, defines a first groove on the bottom wall and a second groove on one sidewall. The locking part is rotatably mounted on the bottom wall, and includes a first hook. The pressing part is slidably received in the first groove, and rotatably connected with the locking part. The display panel includes a sliding part and a display part rotatably connected with each other. The sliding part includes one peg slidably received in the second groove and a second hook engaging with the first hook. When the pressing part is slid in the first groove to rotate the locking part, the first hook disengages from the second hook, the display part is pulled out from the bottom cover and rotated to adjust viewing angle.

Abstract: An imaging support has a power feeding device that carries out a noncontact power feeding operation in an electromagnetic induction method. When a cassette is loaded in a cassette chamber of the imaging support, a power feeding controller of the power feeding device issues a query signal. In a case where the cassette loaded in the cassette chamber is an electronic cassette having a noncontact power receiving function, this electronic cassette issues a response signal answering the query signal. Upon receiving the response signal, the power feeding controller judges that the cassette is the electronic cassette, and starts the noncontact power feeding operation. On the other hand, in a case where the cassette loaded in the cassette chamber does not have the noncontact power receiving function, no response signal is issued. The power feeding controller stops issuing the query signal after a lapse of predetermined time.

Abstract: The present disclosure provides a memory device and a fabricating method thereof. The memory device includes a substrate including a first metal layer formed therein, the first metal layer having at least a first surface with at least a first exposed portion of the first surface exposed at a lateral surface of the substrate, at least a first semiconductor chip formed on a top surface of the substrate, and a second metal layer surrounding the first semiconductor chip and extending to lateral surfaces of the substrate, at least a first portion of the second metal layer contacting the exposed surface of the first metal layer.

Abstract: A subscriber identity module (SIM) card to be mounted to a terminal device that includes a SIM interface unit, the SIM card including: a first terminal to output a control signal indicating that the SIM card is mounted to the terminal device when the SIM card is mounted to the terminal device; and a second terminal to receive the control signal from the first terminal, and to transmit, to the SIM interface unit, the control signal when the SIM card is mounted to the terminal device.

Abstract: An actuator assembly for use in an electronic device is described. The actuator assembly includes a support tray, an actuator supported on the support tray, and a cover over the actuator and coupled to the support tray, a portion of the cover being movable relative to the support tray when the actuator is actuated.

Abstract: An electro-optical device includes an electro-optical panel, a first wiring board and a second wiring board. The first wiring board having a one-side first connection terminal electrically connected to the panel-side connection terminal at one end of a first wiring forming surface and having an other-side first connection terminal at the other end of the first wiring forming surface. The second wiring board having one-side second connection terminal electrically connected to the other-side first connection terminal at one end of a second wiring forming surface and having the other-side second connection terminal at the other end of the second wiring forming surface.

Abstract: Exemplary embodiments are directed to a power electronic device with an electronic device including a substrate, a metal layer formed on the substrate and a field grading means located along an edge of the metal layer. The field grading means has a non-linear electrical resistivity.

Abstract: The present invention provides for a protective enclosure comprising a base comprising a first continuous mating surface and at least one conveyance aperture, a cover comprising a second continuous mating surface, wherein the second continuous mating surface is configured to form a seal with the first continuous mating surface, and a clamp, wherein at least a portion of the clamp is coupleable to the base, wherein a mouth of the clamp is configured to be offset from the aperture when the clamp is coupled to the base, wherein the clamp comprises a first sealing layer, and wherein the clamp is configured to seal the aperture against contaminants. The protective enclosure may be configured for use in a remotely controllable model vehicle to protect a control module.

Abstract: A display assembly includes a transparent cover piece, a display shroud having a contact structure arranged to face the transparent cover piece, an interface subassembly mounted on the display shroud, an electronics board shroud having a support member and a connection feature, and a biasing member operably engaged between the display shroud and the electronics board shroud. The connection feature mechanically connects the electronics board shroud to the display shroud while permitting axial displacement and rotation therebetween. The biasing member rests on the support member of the electronics board shroud, and the biasing member is configured to urge the contact structure of the display shroud into physical contact with the transparent cover piece. The interface subassembly includes a display circuit for providing a digital display and a touch circuit for providing touch actuation at or near the digital display through the transparent cover piece.

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.

Abstract: An electronic assembly is disclosed. One embodiment includes at least one semiconductor chip and a package structure embedding the semiconductor chip. The package structure includes at least one conducting line extending into an area of the package structure outside of the outline of the chip.

Abstract: A wireless sensor device capable of constant operation without replacement of batteries. The wireless sensor device is equipped with a rechargeable battery and the battery is recharged wirelessly. Radio waves received at an antenna circuit are converted into electrical energy and stored in the battery. A sensor circuit operates with the electrical energy stored in the battery, and acquires information. Then, a signal containing the information acquired is converted into radio waves at the antenna circuit, whereby the information can be read out wirelessly.

Abstract: A fixing mechanism includes a base whereon at least one buckling portion is formed. The fixing mechanism further includes a bracket connected to an electronic module. The bracket includes a bottom plate, at least one lateral plate connected to the bottom plate and being buckled inside the buckling portion, and a baffle connected to the bottom plate. The fixing mechanism further includes a cover portion including a board, at least one hook connected to a side of the board for hooking the base, a constraining portion connected to the side of the board for laterally constraining the at least one lateral plate, and a resilient structure connected to the constraining portion for contacting against the baffle of the bracket so as to support the electronic module resiliently.

Abstract: Components within a portable device are arranged around a perimeter of a display component to reduce the height of the portable device. Components such as a battery, a main logic board, a wireless networking interface, and so forth may be distributed around a display component such as an electrophoretic display. Distribution of components around the perimeter of the display component rather than behind the display component reduces the height. Furthermore, the placement of components in the perimeter provides a structure for a user to grip the portable device or for placement of user actuable controls.

Abstract: A modular electronics enclosure for reducing electromagnetic interference (EMI) is disclosed. The electronics assembly includes a first electronic component having an output, a second electronic component having an input with an input impedance, and a circuit matching element having an input coupled to the output of the first electronic component and an output coupled to the input of the second electronic component. The output of the circuit matching element is configured to provide an output impedance that matches the input impedance of the second electronic component. The electronics assembly also includes a conductive surface that forms a volume that encloses the first electronic component and the circuit matching element. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a maximum shielding frequency.

Abstract: A fixing mechanism for fixing a detachable module is disclosed. The fixing mechanism includes a frame for covering the detachable module. The frame includes a frame body and a pivoting portion connected to the frame body. A pivoting hole is formed on the pivoting portion. The fixing mechanism further includes a casing. The casing includes a lateral plate whereon a slot is formed, a shaft portion extended from the lateral plate in a first direction and disposed on a side of the slot, and an engaging portion extended from the lateral plate in a second direction and disposed on another side of the slot for inserting into the pivoting hole of the pivoting portion so that the pivoting portion is capable of pivoting from a first position to a second position as abutting against the shat portion.

Abstract: Disclosed are a non-flat panel display module and the back frame support structure thereof. The non-flat panel display module comprises a non-flat display panel and an outer frame. The outer frame comprises a back frame. The back frame has a non-flat shape in accordance with a back surface of the non-flat display panel and is fixed to the back surface of the non-flat display panel. At least one support structure is fixed to the outer surface of the back frame. The support structure is fixed to an outer surface of the back frame. Therefore, the support structure can strengthen the outer frame intensity and to ensure the intensity and the curved feature of the non-flat panel display module.

Abstract: In one embodiment, a communication system for a multi-blade server system includes a multi-drop serial bus network interconnecting a management module with each of a plurality of servers in a multi-server chassis. A first transceiver subsystem is configured for communicating over the serial bus network between the management module and each server within a first frequency band. A second transceiver subsystem is configured for simultaneously communicating over the serial bus network between the management module and the servers within a second frequency band higher than the first frequency band. A first signal-filtering subsystem substantially filters out signals in the second frequency band from the first transceiver subsystem. A second signal-filtering subsystem substantially filters out the signals in the first frequency band from the second transceiver subsystem.

Abstract: Disclosed is a portable adjunct device that includes a case having a first recess and a second recess. Mounted in the first recess is a docking connector movable between closed and open positions. Detachably mounted in the second recess is a universal serial bus connector operably connected to the docking connector. The case defines a chamber and a battery operably connected to the docking connector is disposed in the chamber.

Abstract: The invention concerns a method of removing encapsulating material from encapsulated particles deposited onto a substrate. According to the method, a substrate is used which is capable of facilitating said removal of encapsulating material. The particles may be nanoparticles. In particular, the substrate-facilitated removal may result in sintering of the particles. The invention provides a novel way of functionalizing electronic structures using particulate matter and for conveniently producing e.g. printed electronics devices.

Abstract: A wiring board is formed with a substrate designating either the upper surface or the lower surface as a first surface and the other as a second surface; an electronic component arranged inside the substrate; and a first conductive layer formed on the first-surface side of the substrate by means of a first insulation layer made up of a first lower insulation layer and a first upper insulation layer. In such a wiring board, the first lower insulation layer and the first upper insulation layer are made of different materials from each other. Moreover, the first lower insulation layer is positioned on the first surface of the substrate and the electronic component, and the material that forms the first lower insulation layer fills a clearance between the substrate and the electronic component.

Abstract: A microelectronic package includes a microelectronic element including a first surface having contacts thereon, a second surface remote therefrom, and edge surfaces extending between the first and second surfaces. A reinforcing layer adheres to the at least one edge surface and extends in a direction away therefrom, the reinforcing layer not extending along the first surface of the microelectronic element. A conductive redistribution layer including a plurality of conductive elements extends from the contacts along the first surface and along a surface of the reinforcing layer beyond the at least one edge surface. An encapsulant overlies at least the reinforcing layer. The microelectronic element has a first coefficient of thermal expansion, the encapsulant has a second coefficient of thermal expansion, and the reinforcing layer has a third coefficient of thermal expansion that is between the first and second coefficients of thermal expansion.

Abstract: The present invention is to provide a thin carrier device with a support pad's length positioned at a USB port's height for a supporting segment securely supported and a USB metal contact electrically connected to a female connector of the USB port effectively without problems such as invalid electrical connection or poor contact between a USB metal contact and a female connector of a computer's USB port affected by the integrated circuit module's thinned thickness. Relying on the lowered thickness of the integrated circuit module, the present invention is able to integrate other thin products with their shapes including, without limitation, card, paper card or business card for the purpose of a thinning tendency.

Abstract: A printed circuit board fastening structure aims to fasten a printed circuit board which has a first bearing surface abutting and coupling on a casing and a second bearing surface. The first bearing surface is coupled with at least one support member. The support member has at least one leg connecting to the first bearing surface and an end portion formed with a fastening hole. The end portion is adjacent to the casing. A fastening element is provided to run through the casing from another side thereof to couple with the support member, thereby to fasten the printed circuit board to the casing.

Abstract: An electrical control device comprising a housing configured to be at least partially mountable within a single-gang electrical box; and including at least first and second switches disposed at least partially within the housing, each the at least first and second switches configured as providing a respective first and second input to the electrical control device and, the electrical control device being configured to be wired to a respective first and a second electrical load. A communications device disposed at least partially within the housing is configured to wirelessly transmit a control signal to control at least one additional electrical load.

Abstract: Disclosed is an electrochemical capacitor that can be reflow soldered, and wherein film package is used on the capacitor body. The container (20) of the electrochemical capacitor (ECC) stores the film package (11) of the capacitor body (10) within a storage space (SR) such that sealing sections (11a-11c) do not contact the inner surface of the storage space (SR). Inner material (30), which cover the sealing sections (11a-11c) and rear edge of the film package 11 and are adhered to the inner surface of the storage space (SR), affixing the film package (11) within the storage space (SR), are provided in a rectangular framework to the regions in the storage space (SR) of the container (20) that correspond to said sealing sections (11a-11c) and rear edge.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

Abstract: A method of manufacturing a plurality of circuit modules includes cutting a mother board including a plurality of electronic components mounted on at least a single surface thereof, and cutting out a plurality of circuit boards from the mother board. A plurality of terminal electrode boards, each of which is arranged so as to straddle at least the circuit boards that are adjacent to each other, are mounted onto one surface of the mother board. The mother board including the terminal electrode boards mounted on the one surface, and the electronic components, mounted on the at least single surface, is diced at positions where the circuit boards are to be cut out.

Abstract: Disclosed herein is a memory module that includes a register buffer and a memory chip each mounted on a module substrate. Each of the command address output terminals belonging to the first group provided on the register buffer is connected to an associated one of the command address input terminals belonging to the first group provided on the memory chip through associated ones of the plurality of contact plugs and the first wiring layer. Each of the command address output terminals belonging to the second group provided on the register buffer is connected to an associated one of the command address input terminals belonging to the second group provided on the memory chip through associated ones of the plurality of contact plugs and the second wiring layer.

Abstract: A control panel having a pivotable connector has a body, a rear cover and a connector. The connector is pivotally mounted inside the body and the rear cover, and has a plug being pivotable and freely aligned with an intended direction. Accordingly, users can adjust the orientation of the connector based on a position on which the control panel is to be mounted, placed or hung, so that the connector of the control panel can be smoothly connected with a connection port of the machine directly or through a connection cable.

Abstract: A wearable containing element for an electronic apparatus, comparable to an ornament or pendant, comprising at least a pair of complementary shells, able to be coupled with each other so as to define a containing body with an external surface having a shape and size comparable to those of a traditional ornament, and an internal containing compartment, of a shape and size sufficiently large to house the electronic apparatus.

Abstract: An electronic component includes hollow vias provided within a resin layer such that first ends thereof extend to solders which connect and secure an embedded electronic component, and second ends thereof are sealed by a sealing-member layer, in order to cause the solders that become molten again to flow into the hollow vias such that the solders that have become molten again are housed in the hollow vias, thereby suppressing and preventing the occurrence of solder splash phenomena.

Abstract: A sensor module includes a supporting member having three support faces orthogonal to one another, three IC chips each having connection terminals and external connection terminals on the side thereof where an active face is located, the three IC chips attached to the support faces of the supporting member on the sides thereof where passive faces lying along the active faces are located, three vibrating gyro elements each having a base, vibrating arms extending from the base, and connection electrodes, and flexible wiring substrates connected to the external connection terminals of the IC chips, each vibrating gyro element is disposed on the side of the IC chip where the active face is located, the connection electrodes are attached to the connection terminals of each IC chip such that one principal surface lies along the support face, and the flexible wiring substrate has a reinforcing layer.

Abstract: An electronic article surveillance (EAS) security apparatus is comprised of a base, a reel housing containing a reel, a tether joined to the base and the reel housing and disposed on the reel, and an electronics package. The base attaches to an object to be protected and the tether is wrapped around the object as the reel housing is passed around the object. The reel housing is releasably attached to the base by complimentary coupling elements on each. The base has a tether guide, which allows the tether to be redirected in additional directions as it is wrapped around the object. A releasable blocking mechanism keeps the base and reel housing coupled. The electronics package includes at least a passive EAS element and can contain a microprocessor, wireless communication elements, switches, sound generator, a power supply, and the tether if electrically conductive. The blocking mechanism may be magnetically releasable.

Abstract: A standoff contact array is disposed between a mounting substrate of a flip-chip package and a board. The standoff contact array is formable by mating a low-profile solder bump on the mounting substrate with a low-profile solder paste on the board. Thereafter, the standoff contact array is formed by reflowing the low-profile solder paste on the board against the low-profile solder bump on the mounting substrate.

Abstract: The time base device for a watch includes at least one electric motor coil (30), an electronic module (1) that has at least one time base oscillator circuit mounted in a case of the module, and an electric power source (8). The electric motor coil (30), the electronic module (1) with an oscillator circuit and the voltage source (8), which is preferably a battery, are connected to each other mechanically and electrically without the use of a printed circuit board to form a compact unit. The electronic module includes four connection terminals (14, 15, 16, 17) on an external surface for connecting the voltage source on one side and the wires (31, 32) of a winding of the coil (30) on the other side.

Abstract: According to one embodiment, a broadcast receiver includes a housing, a circuit board, a module, a holder, and a buffer. The housing is provided with a wall. The circuit board is housed in the housing and includes a first connector. The module includes a second connector to be electrically connected to the first connector and fits to the first connector with a gap therebetween. The module is movable between a first position where the length of connected portions of the first connector and the second connector is short and a second position where the length of the connected portions is long. The holder holds the module. The buffer is provided to the holder and is bent along with the movement of the module from the first position to the second position.

Abstract: The present relates to pluggable electronic unit with transmission power adjustment capability such as for example small form-factor pluggable transceivers. The pluggable electronic unit with transmission power adjustment capability may comprise a power adjustment unit. By verifying the transmitted power is sufficient or could be reduced, it is possible to regulate transmission power of a transceiver autonomously within the pluggable electronic unit itself.

Abstract: A computer system is provided. The computer system includes a chassis, a motherboard secured in the chassis, and a mounting bracket. A connector is arranged on the motherboard, and a riser card is inserted in the connector. The mounting bracket is secured to the chassis and located above the motherboard. The computer system further includes a positioning member attached to the riser card. The positioning member has two opposite side plates. One of the side plates is secured to the second riser card, and the other side plate is secured to the mounting bracket.

Abstract: An electronic device includes a main body, an expansion card holder, and a protective cover assembly. The main body defines an opening. The expansion card holder is located in the main body adjacent to the opening. The expansion card holder defines a bay facing the opening to receive an expansion card. The protective cover assembly includes a rotary shaft unit, and a metallic cover rotatably connected to the main body via the rotary shaft unit. The metallic cover includes a cover portion covering the opening, and a resisting portion extending from the cover portion and resisting the main body. The resisting portion provides resilient force impelling the cover portion to cover the opening automatically.

Abstract: A flash drive and a housing assembly thereof is provided. The housing assembly comprises a housing, a base and a rotating mechanism. The housing has a first opening, a second opening, and a space, the first opening is situated at a side surface of the housing, and the second opening is situated on a top surface of the housing. The base is used for accommodating a storage device which has a connecting member, the base is movably disposed in the space and has a slot facing the second opening. The rotating mechanism is disposed at the second opening and mounted to the housing, the rotating mechanism has a protrusion portion movably engaged in the slot. When the rotating mechanism rotates relative to the housing, the protrusion portion moves along the slot and drives the base to reciprocate between a first position and a second position.

Abstract: Thermoelectric-enhanced, liquid-cooling apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure in thermal communication with the component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop for receiving coolant from and supply coolant to the liquid-cooled structure. A thermoelectric array is disposed with first and second coolant loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the liquid-to-air heat exchanger for cooling thereof.

Abstract: Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.

Abstract: An electronic device includes a main body, a cover rotatably connected to the main body, at least one locking mechanism for fastening the cover to the main body, and a switch. The locking mechanism defines a locking hole in the main body and includes a locking member fixed to the cover. The locking member includes a magnetic member, an electromagnet, a compressed spring, and a locking pin. The electromagnet is electrically connected to the switch, and is operable to be powered off via switching the switch. The spring is disposed between the magnetic member and the electromagnet, and moves one of the magnetic member and the electromagnet when the electromagnet is powered off. The locking pin is inserted into the locking hole when the cover covers the main body and the electromagnet is powered off.

Abstract: According to one embodiment, an electronic device includes a display module, a first component, a second component, a reinforcing member, a wiring, and a supporting member. The display module includes a display screen. The first component includes a first wall and a first engagement portion. The second component includes a second wall located opposite the first wall with respect to the display module and a second engagement portion that engages with the first engagement portion. The reinforcing member is located between the display module and the first and second engagement portions and extends along at least part of the periphery of the display module. The wiring is located between the reinforcing member and the display module. The supporting member is provided to at least one of the first component and the second component and is located between the display module and the wiring to support the display module.

Abstract: According to one embodiment, an electronic apparatus includes a hinge, a member attached to the hinge, and a housing. The housing accommodates the member and includes a wall configured to support the member and a portion configured to support the member from a side opposite to the wall.

Abstract: A fixing mechanism for fixing an object to a base plate is provided. The object defines a hole and includes a ring extending from an edge of the hole. The ring includes a threaded hole. The base plate includes a post on its top surface and respectively opposing to the hole. The fixing mechanism includes an elastic element, a first hollow bolt and a second bolt. The first hollow bolt passes through the hole and the elastic element, and includes an externally threaded portion engaging with the threaded hole of the ring. The second bolt is inserted into the first hollow bolt, and engages with the post of the base plate.

Abstract: An electronic apparatus includes a rectangular-parallelepiped first casing, a rectangular-parallelepiped second casing, and a first connecting apparatus. The first connecting apparatus connects the first casing and the second casing such that the first casing and the second casing are capable of being rotated relatively in one of a first rotation direction and a second rotation direction orthogonal to each other between a first state and a second state. The first state is a state where a first main surface of the first casing comes to be faced with a third main surface of the second casing. The second state is a state where a second main surface of the first casing comes to be faced with a fourth main surface of the second casing.

Abstract: A waterproof structure for a portable electronic device includes a housing, an interface member, a waterproof circuit board, a chamber, and a main circuit board. The housing has a bottom wall and a peripheral wall around the bottom wall, the bottom wall has an enclosure formed thereon, the peripheral wall defines a connecting hole through to the enclosure. The interface member has an interconnect inlet, the interface member is placed into a chamber, the interconnect inlet aligns with the connecting hole, the waterproof circuit board engages in the enclosure to prevent vapors or dust enter into the main circuit board, the waterproof circuit board also electronically connect the main circuit board.