Abstract: Provided are semiconductor devices and methods for fabricating and using the semiconductor devices, wherein the semiconductor devices may include a first element, a second element, and a plurality of parallel IO lines connecting the first element with the second element. The plurality of IO lines may have different lengths and the shortest IO line from among the plurality of the IO lines may be adjacent to a longest IO line from among the plurality of the IO lines.

Abstract: A semiconductor device comprising floating body memory cells performs read and write operations by selectively connecting bit lines and inverted bit lines to sense bit lines and inverted sense bit lines.

Abstract: In some embodiments, a memory cell includes a transistor gate spaced from a channel region by gate dielectric; a source region on one side of the channel region; and a drain region on an opposing side of the channel region from the source region. The channel region has phase change material adjacent the drain region. In some embodiments, the phase change material may be adjacent both the source region and the drain region. Some embodiments include methods of programming a memory cell that has phase change material adjacent a drain region. An inversion layer is formed within the channel region adjacent the gate dielectric, with the inversion layer having a pinch-off region within the phase change material adjacent the drain region. Hot carriers (for instance, electrons) within the pinch-off region are utilized to change a phase within the phase change material.

Abstract: A method of forming capacitorless DRAM over localized silicon-on-insulator comprises the following steps: A silicon substrate is provided, and an array of silicon studs is defined within the silicon substrate. An insulator layer is defined atop at least a portion of the silicon substrate, and between the silicon studs. A silicon-over-insulator layer is defined surrounding the silicon studs atop the insulator layer, and a capacitorless DRAM is formed within and above the silicon-over-insulator layer.

Abstract: A semiconductor device minimizes generation of an output signal skew of an input buffer and thus stabilizes the operation of the semiconductor device. The semiconductor integrated circuit includes an input potential detection unit outputting a detection signal in response to a level of an input signal, an input buffer buffering the input signal, and an output path control unit that receives the output signal of the input buffer and the detection signal of the input potential detection unit and outputs an output driving signal in response to the level of the detection signal.

Abstract: A system-on-chip semiconductor circuit includes a logic circuit having at least one first transistor with a thin gate dielectric, at least one dynamic random access memory cell coupled with the logic circuit having at least one storage capacitor and at least one thick gate dielectric access transistor, and an analog circuit operable with the logic circuit and the memory cell having at least one thick gate dielectric switched transistor and at least one switched capacitor, wherein the storage capacitors of the memory cell and the switched transistors are of the same type, and wherein the thick gate dielectric switched transistor and the switched capacitor of the analog circuit are made by a process for making the dynamic random access memory cell.

Abstract: A semiconductor device includes a plurality of word lines, a plurality of bit lines, a plurality of memory cells provided at the intersections of the plurality of word lines and the plurality of bit lines and each of that includes a MIS transistor and a memory element, a decoder circuit for selecting a plurality of word lines, and a sense-amplifier circuit for determining information that is read from any of the plurality of memory cells to any of the plurality of bit lines, wherein a twist connector for switching the wiring order of the plurality of word lines is provided and level-stabilizing circuits, for supplying the potential level of a non-selected state to the plurality of word lines in the non-selected state are arranged in the area below the twist connector.

Abstract: Improved memory devices that include one or more nanostructures such as carbon nanotubes or other nanostructures, as well as systems and devices incorporating such improved memory devices, are disclosed. In at least some embodiments, the improved memory device is of a nonvolatile type such as a flash memory device, and employs a pair of triodes that form a memory cell, where each triode employs at least one carbon nanotube. Also disclosed are methods of operating and fabricating such improved memory devices.

Abstract: Localized temperature increases inside integrated circuits due to heating at operation are prevented or controlled by electronic devices or wirings with CPP (current-perpendicular-to-plane) structures which have a current cooling effect. A CPP structure refers to a structure comprising a columnar electrically conductive portion and an insulator portion surrounding the conductive portion. The columnar portion is formed from a multilayered structure in a direction perpendicular to the plane of the layers, so as to allow a current to flow from an upper layer to a lower layer (or vice versa). The cooling effect is induced by current at the interface (or a plural of interfaces) of appropriately selected different kinds of materials (which are conductive substances in general, such as metals, semiconductors, and alloys thereof) in the columnar portion due to the Peltier effect when a current flows through the column. Temperature in a minute range is detected by a thermocouple with the CPP structure.

Abstract: A semiconductor device includes a first CMOS inverter, a second CMOS inverter, a first transfer transistor and a second transfer transistor wherein the first and second transfer transistors are formed respectively in first and second device regions defined on a semiconductor device by a device isolation region so as to extend in parallel with each other, the first transfer transistor contacting with a first bit line at a first bit contact region on the first device region, the second transfer transistor contacting with a second bit line at a second bit contact region on the second device region, wherein the first bit contact region is formed in the first device region such that a center of said the bit contact region is offset toward the second device region, and wherein the second bit contact region is formed in the second device region such that a center of the second bit contact region is offset toward the first device region.

Abstract: A memory cell stores information in the form of a first logic level and a second logic level that are complementary to each other. The memory cell includes a first storage circuit and a second storage circuit for storing the first logic level and the second logic level. The first and second storage circuits each have a respective input and output. An isolation circuit provides electrical isolation of the input of the first storage device from the output of the second storage device, except during access to the first and second storage circuits.

Abstract: In a preferred embodiment, the invention provides a method for reducing soft errors in logic. After obtaining two delayed clock signals, the delayed clock signals, the clock signal, and an output from a logic circuit are applied to a triple redundant memory element. The delay of the first delayed clock signal is equal to or greater than the pulse width of a soft error event occurring in the logic circuit. The delay of the second delayed clock signal is equal to or greater than half the pulse width of a soft error event occurring in the logic circuit.

Abstract: A memory cell array includes a plurality of floating body memory cells, which are arranged in cell rows, and world lines, wherein each word line is configured to control memory cells associated with a pair of cell rows. The memory cell array also includes bitlines, wherein each bitline is electrically connected to an individual memory cell of each pair of the cell rows.

Abstract: A non-volatile memory device may include a plurality of stacked semiconductor layers, a plurality of NAND strings, a common bit line, a common source line, and/or a plurality of string selection lines. The plurality of NAND strings may be on the plurality of semiconductor layers. Each of the plurality of NAND strings may include a plurality of memory cells and/or at least one string selection transistor arranged in a NAND-cell array. The common bit line may be commonly connected to each of the NAND strings at a first end of the memory cells. The common source line may be commonly connected to each of the NAND strings at a second end of the memory cells. The plurality of string selection lines may be coupled to the at least one string selection transistor included in each of the NAND strings such that a signal applied to the common bit line is selectively applied to the NAND strings.

Abstract: An object is to provide a semiconductor device capable of reducing an area of the semiconductor device, reading data reliably, and simplifying replacement of data. A memory cell and a data line are controlled with a reset signal, so that data can be reliably outputted in the semiconductor device. In addition, an element of data holding unit is included, and the data holding unit includes a plurality of memory cells. The area can be reduced by using such a memory cell. A transistor is not connected to GND, thereby simplifying the replacement of data in the memory cell.

Abstract: First electrode layer includes a plurality of first electrode lines (W1, W2) extending parallel to each other. State-variable layer lying on the first electrode layer includes a plurality of state-variable portions (60-11, 60-12, 60-21, 60-22) which exhibits a diode characteristic and a variable-resistance characteristic. Second electrode layer lying on the state-variable layer includes a plurality of second electrode lines (B1, B2) extending parallel to each other. The plurality of first electrode lines and the plurality of second electrode lines are crossing each other when seen in a layer-stacking direction with the state-variable layer interposed therebetween. State-variable portion (60-11) is provided at an intersection of the first electrode line (W1) and the second electrode line (B1) between the first electrode line and the second electrode line.

Abstract: The present invention provides a memory element includes a thin film transistor configured to have a semiconductor thin film and a pair of gate electrodes that vertically sandwich the semiconductor thin film with intermediary of insulating films therebetween, and a capacitor configured to be connected to a first gate electrode of the pair of gate electrodes, wherein data is stored in the capacitor connected to the first gate electrode, and data stored in the capacitor is read out by controlling a second gate electrode of the pair of gate electrodes.

Abstract: Silicon-oxide-nitride-oxide-silicon SONOS-type devices (or BE-SONOS) fabricated in Silicon-On-Insulator (SOI) technology for nonvolatile implementations. An ultra-thin tunnel oxide can be implemented providing for very fast program/erase operations, supported by refresh operations as used in classical DRAM technology. The memory arrays are arranged in divided bit line architectures. A gate injection, DRAM cell is described with no tunnel oxide.

Abstract: Digital memory devices and systems, as well as methods of operating digital memory devices, that include a multivalue memory cell with a first and a second gating transistor arranged in parallel, having a first and a second node, respectively, coupled to a storage element, and sensing circuitry coupled to a third and a fourth node of the first and second gating transistors, respectively, to sense a stored voltage of the memory cell. In embodiments, the first and second gating transistors are configured to activate at different threshold voltage levels.

Abstract: A semiconductor memory cell structure having 4F2 dimensions and method for forming the same. The memory cell is formed on a surface of a substrate and includes an active region formed in the substrate, a semiconductor post formed on the surface of the substrate over the active region and a capacitor is formed on the semiconductor post. A vertical access transistor having a gate structure formed on the semiconductor post is configured to electrically couple the respective memory cell capacitor to the active region when accessed.

Abstract: The disclosure concerns a memory including a floating body provided in a semiconductor layer between a source and a drain and storing data; a first gate dielectric provided on a first surface of the body; a first gate electrode provided on the first surface via the first gate dielectric; a second gate dielectric provided on a second surface of the body different from the first surface; a second gate electrode provided on the second surface via the second gate dielectric; a driver driving the first gate electrode and the second gate electrode; and a sense amplifier writing into the memory cells first data showing a sate of a small charge amount in a state that a voltage of the second gate electrode at a data writing time is brought closer to a potential of the source layer than a voltage of the second gate electrode at a data holding time.

Abstract: A semiconductor array includes a matrix of cells, the matrix being arranged in rows and columns of cells, and a plurality of control lines. Each cell is coupled to a number of control lines allowing to select and read/write said cell. At least one of said control lines is coupled to cells of a plurality of columns and of at least two rows of the matrix.

Abstract: Disclosed herein is a semiconductor memory device including a plurality of memory cells including first and second inverters each having first and second driver transistors and first and second load transistors and including first and second memory node, and first and second transfer transistors. The of the first and second transfer transistors is connected to each of the first and memory nodes respectively. The memory cell is connected to a bit line and complementary bit line via the first and second transfer transistors respectively wherein a supply voltage applied to the bit line and the complementary bit line is lower than a supply voltage applied to the load transistors, and at least a memory-node-side end of a gate insulating film of the first driver transistor, second driver transistor, first load transistor, and the second load transistor have a thickness larger than a thickness of a gate insulating film of the other part.

Abstract: The embodiments of the invention provide SRAM cells with asymmetric floating-body pass-gate transistors. More specifically, a semiconductor device includes an SRAM cell, a first pass-gate transistor, and a second pass-gate transistor. The first pass-gate transistor is connected to a first side of the SRAM cell, wherein the first pass-gate transistor comprises a first drain region and a first source region. The second pass-gate transistor is connected to a second side of the SRAM cell, wherein the second side is opposite the first side. The second pass-gate transistor comprises a second source region and a second drain region. Furthermore, the first source region and/or the second source region comprise a xenon implant. The first drain region and the second drain region each lack a xenon implant.

Abstract: A semiconductor device has a first inverter including a drive transistor and a load transistor; a second inverter including a drive transistor and a load transistor, a transmission transistor provided between the output terminal of the first inverter and one line of a bit line pair, a transmission transistor provided between the output terminal of the second inverter and the other line of the bit line pair; and an isolation transistor for isolating the drive transistor and the transmission transistor. The transmission transistor, the transmission transistor, the drive transistor, and the isolation transistor are formed in a continuous active region and the isolation transistor is provided between the drive transistor and the transmission transistor.

Abstract: In an embodiment of the invention, a memory cell arrangement includes a substrate and at least one memory cell including a charge storing memory cell structure and a select structure. The memory cell arrangement further includes a first doping well, a second doping well and a third doping well arranged within the substrate, wherein the charge storing memory cell structure is arranged in or above the first doping well, the first doping well is arranged within the second doping well, and the second doping well is arranged within the third doping well. The memory cell arrangement further includes a control circuit coupled with the memory cell and configured to control the memory cell such that the charge storing memory cell structure is programmed or erased by charging or discharging the charge storing memory cell structure via at least the first doping well.

Abstract: Embodiments are described for programming and erasing a memory cell by utilizing a buried select line. A voltage potential may be generated between a source-drain region and the buried select line region of the memory cell to store charge in a storage region between the source-drain and buried select line regions. The generated voltage potential causes electrons to either tunnel towards the buried storage region to store electrical charge or away from the buried storage region to discharge electrical charge.

Abstract: A multiple-type memory is disclosed. The multiple-type memory includes memory blocks in communication with control logic blocks. The memory blocks and the control logic blocks are configured to emulate a plurality of memory types. The memory blocks can be configured into a plurality of memory planes that are vertically stacked upon one another. The vertically stacked memory planes may be used to increase data storage density and/or the number of memory types that can be emulated by the multiple-type memory. Each memory plane can emulate one or more memory types. The control logic blocks can be formed in a substrate (e.g., a silicon substrate including CMOS circuitry) and the memory blocks or the plurality of memory planes can be positioned over the substrate and in communication with the control logic blocks. The multiple-type memory may be non-volatile so that stored data is retained in the absence of power.

Abstract: The invention provides a thermal-emitting memory module, a thermal-emitting module socket, and a computer system comprising the thermal-emitting memory module and the thermal-emitting module socket. An embodiment of the thermal-emitting module includes: a module substrate having electrically-conductive traces; and a semiconductor device disposed on the module substrate and coupled to the electrically-conductive traces, the module substrate including a thermal-emitting component disposed in proximity of the semiconductor device without directly contacting the semiconductor device.

Abstract: A nonvolatile semiconductor memory device includes a latch configured to store data, a plurality of word lines, a driver configured to activate one of the plurality of word lines, and a plurality of nonvolatile memory cells coupled to the respective word lines, each of the nonvolatile memory cells coupled to the latch so as to exchange stored data with the latch upon activation of a corresponding one of the word lines, each of the nonvolatile memory cells including two MIS transistors and configured to store data as an irreversible change of transistor characteristics occurring in one of the two MIS transistors, wherein the driver includes at least one nonvolatile memory cell storing count data responsive to a number of times storing of data has been performed with respect to the plurality of nonvolatile memory cells, and is configured to activate one of the word lines indicated by the count data.

Abstract: A one-transistor type DRAM including a floating body storage element connected between a bit line and a source line and controlled by a word line comprises a plurality of source lines and word lines arranged in a row direction, a plurality of bit lines arranged in a column direction, a plurality of clamp bit lines and reference bit lines arranged in a column direction, a cell array including the floating body storage element and formed in a region where the source line, the word line and the bit line are crossed, a clamp cell array including the floating body storage element and formed in a region where the source line, the word line and the bit line are crossed, a reference cell array including the floating body storage element and formed in a region where the source line, the word line and the bit line are crossed, and a sense amplifier and a write driving unit connected to the bit line and configured to receive a clamp voltage and a reference voltage.

Abstract: Methods and arrangements for data storage are discussed. Embodiments include applying a first voltage between a tip and an electrode, thereby forming a polarized domain in a ferroelectric material between 1 nanometer (nm) and 50 nm in thickness. The embodiments may also include applying another voltage through the tip, thereby generating a current responsive to an orientation of the polarized domain. The embodiments may also include measuring the current and determining the orientation of the polarized domain, based upon the measuring.

Abstract: The semiconductor memory device includes an initialization memory cell having a first inverter circuit including a first transistor and a second transistor, and a second inverter circuit whose input portion is connected to an output portion of the first inverter circuit and output portion is connected to an input portion of the first inverter circuit, and including a third transistor and a fourth transistor.

Abstract: Provided herein are embodiments of layouts for applying impact ionization potentials across the channel of a selected floating body cell in an array without having to impose the potential on other unselected cells.

Abstract: A semiconductor storage device comprising: unit blocks each including memory cells, first row of sense amplifiers on one side of bit lines; second row of sense amplifiers on an other side of the bit lines; first switch means which switches a connection state between the one side of the bit lines and the first row of sense amplifiers; second switch means which switches a connection state between the other side of the bit lines and the second row of sense amplifiers; third switch means arranged in the approximate center of the bit lines in an extending direction thereof to switch a connection state of the bit lines; and refresh control means which divides the unit block into two areas and controls the refresh operation using the switch means and the row of sense amplifiers according to which area a selected word line to be refreshed is in.

Abstract: A nonvolatile memory device is provided. The nonvolatile memory device includes a semiconductor substrate and memory cell units arranged in a matrix on the semiconductor substrate. Each of the memory cell units includes a tunnel insulation layer on the semiconductor substrate. A first memory gate and a second memory gate are disposed on the tunnel insulation layer. An isolation gate is disposed between the first and second memory gates. A word line covers the first memory gate, the second memory gate and the isolation gate. A method of forming the nonvolatile memory device is also provided.

Abstract: Circuits and methods are described for decoding exemplary memory arrays of programmable and, in some embodiments, re-writable passive element memory cells, which are particularly useful for extremely dense three-dimensional memory arrays having more than one memory plane. In addition, circuits and methods are described for selecting one or more array blocks of such a memory array, for selecting one or more word lines and bit lines within selected array blocks, for conveying data information to and from selected memory cells within selected array blocks, and for conveying unselected bias conditions to unselected array blocks.

Abstract: A semiconductor device includes a semiconductor substrate including an element region which is surrounded by an element isolation insulation layer, a transistor including a gate electrode which is provided on the element region, and a source region and a drain region which are provided in the first element region, a first auxiliary wiring layer and a second auxiliary wiring layer which extend in a channel length direction and are provided on the element isolation insulation layer such that the first transistor is interposed between the first auxiliary wiring layer and the second auxiliary wiring layer, and a control circuit which sets, while the first transistor is in an ON state, the first auxiliary wiring layer and the second auxiliary wiring layer at a first voltage of the same polarity as a gate voltage of the first transistor that is in the ON state.

Abstract: A new memory cell can contain only a single thyristor. There is no need to include an access transistor in the cell. In one embodiment, the thyristor is a thin capacitively coupled thyristor. The new memory cell can be connected to word, bit, and control lines in several ways to form different memory arrays. Timing and voltage levels of word, bit and control lines are disclosed.

Abstract: A system for determining a history state of data in a data retaining device are disclosed. A state of a partially-depleted silicon-on-insulator (PD SOI) device coupled to a data retaining device is measured to indicate a body voltage of the PD SOI device. The body voltage of the PD SOI device may indicate, among others, how long the PD SOI device has been idling, which indirectly indicates how long data in the data retaining device has not been accessed. As such, the current invention may be used efficiently with, e.g., a cache replacement algorithm in a management of the data retaining device.

Abstract: A memory device includes memory cells each having a recordable layer between two metal layers, each memory cell being constructed and designed to change from a first state to a second state upon application of an initialization signal, and change from the second state to a third state upon application of a write signal. For a voltage within a specified range that is applied across the two metal layers, the memory cell has a lower resistance in the first state than in the second state, and has a higher resistance in the second state than in the third state.

Abstract: A non-volatile memory cell includes an access and a storage transistor coupled in series. The memory cell is formed on a thin gate well tailored for transistors with thin gate dielectrics. The access transistor is a hybrid transistor which includes a gate with a thick gate dielectric layer formed on the thin gate well.

Abstract: In one embodiment, a DRAM is provided that includes a plurality of memory cells, each memory cell including an access transistor and a storage capacitor, wherein the storage capacitor includes a first node coupled to the access transistor and a second node isolated from the first node, the second node comprising signal-bearing metal conductors.

Abstract: A method for calibrating a data valid window including the steps of: (A) setting a base delay of one or more datapaths to a predetermined value, (B) determining an optimum offset delay value for each of the one or more datapaths based upon actual memory accesses and (C) delaying a read data strobe signal based upon the base delay and the optimum offset delay value for each of the one or more datapaths.

Abstract: A novel nonvolatile memory element, which can be manufactured by a simple and high yield process by using an organic material and has a high on/off ratio, and a method for manufacturing such nonvolatile memory element. A switching layer (14) made of an electrical insulating radical polymer is provided between an anode layer (12) and a cathode layer (16). Further, a hole injection transport layer (13) is provided between the switching layer (14) and the anode layer (12), and an electron injection transport layer (15), between the switching layer (14) and the cathode layer (16). An intermediate layer is provided between the switching layer and the adjacent layer. The radical polymer is preferably nitroxide radical polymer. The switching layer (14), the hole injection transport layer (13) and the electron injection transport layer (15) are formed by being stacked by a wet process.

Abstract: A semiconductor memory device includes circuitry coupled to a plurality of memory cells with transistors. The circuitry is configured to change a potential of a body of the transistor to a degree depending on a charging state of the body. A gate electrode of the transistor is maintained in a non-addressed state.

Abstract: A nonvolatile semiconductor memory device includes a memory cell array which includes a memory cell string including a plurality of memory cells each having a variable resistor element and a switching element having a current path with one end and the other end, between which the variable resistor element is connected, the plurality of memory cells having current paths thereof being connected in series, the memory cell array further including a first select element connected to one end of a current path of the memory cell string, and a second select element connected to the other end of the current path of the memory cell string, a bit line which is electrically connected to one end of a current path of the first select element, and a source line which is electrically connected to one end of a current path of the second select element.

Abstract: The disclosure concerns a semiconductor memory device comprising a semiconductor layer; a charge trap film in contact with a first surface of the semiconductor layer; a gate insulating film in contact with a second surface of the semiconductor layer, the second surface being opposite to the first surface; a back gate electrode in contact with the charge trap film; a gate electrode in contact with the gate insulating film; a source and a drain formed in the semiconductor layer; and a body region provided between the drain and the source, the body region being in an electrically floating state, wherein a threshold voltage or a drain current of a memory cell including the source, the drain, and the gate electrode is adjusted by changing number of majority carriers accumulated in the body region and a quantity of charges trapped into the charge trap film.

Abstract: A nanostructure includes a nanowire having metallic spheres formed therein, the spheres being characterized as having at least one of about a uniform diameter and about a uniform spacing there between. A nanostructure in another embodiment includes a substrate having an area with a nanofeature; and a nanowire extending from the nanofeature, the nanowire having metallic spheres formed therein, the spheres being characterized as having at least one of about a uniform diameter and about a uniform spacing there between. A method for forming a nanostructure is also presented. A method for reading and writing data is also presented. A method for preparing nanoparticles is also presented.

Abstract: Systems, circuits and methods for reducing read disturbances in Spin Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) are disclosed. A resistive element can be used during the read operation to control the read current and control read disturbances. An isolation element can be used to isolate the resistive element from the circuit during write operations.