Precision Device Or Process - Or With Condition Responsive Control Patents (Class 451/1)
  • Publication number: 20130203321
    Abstract: A load cup apparatus for transferring a substrate in a processing system includes a pedestal assembly having a substrate support, an actuator, and a controller. The actuator is configured to move the pedestal assembly into a loading position in contact with a retaining ring of a carrier head and to generate a retaining ring thickness signal based on a distance travelled by the pedestal assembly. The controller is configured to receive the retaining ring thickness signal from the actuator.
    Type: Application
    Filed: January 24, 2013
    Publication date: August 8, 2013
    Inventors: Hung Chih Chen, Thomas H. Osterheld, Charles C. Garretson, Jason Garcheung Fung
  • Publication number: 20130196572
    Abstract: A particle cleaning module includes a housing, a substrate holder, a pad holder, an actuator and a pad conditioner. The substrate holder is disposed in the housing, is configured to retain a substrate in a substantially vertical orientation, and is rotatable on a first axis. The pad holder is disposed in the housing, has a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, and is rotatable on a second axis parallel to the first axis. The actuator is operable to move the pad holder relative to the substrate holder to change a distance defined between the pad retaining surface and the substrate. The pad conditioner is disposed in the housing and has a conditioning surface oriented parallel to the pad retaining surface.
    Type: Application
    Filed: January 27, 2012
    Publication date: August 1, 2013
    Inventors: Sen-Hou Ko, Hui Chen
  • Publication number: 20130189901
    Abstract: An angle grinder includes a housing, a drive unit configured to drive a usage tool, a sensor device configured to provide a rotation parameter, and a control unit configured to evaluate the rotation parameter to detect a clamped state of the usage tool. The sensor device has a yaw rate sensor configured to provide the rotation parameter in accordance with a rotational movement of the housing. The control unit triggers a safety mode in accordance with the rotation parameter or throttles the rotational speed and/or torque of the drive unit.
    Type: Application
    Filed: February 25, 2011
    Publication date: July 25, 2013
    Applicant: ROBERT BOSCH GmbH
    Inventors: Christoph Klee, Hans-Joerg Faisst
  • Publication number: 20130183886
    Abstract: While data that indicate a relationship between a dressing position P defined by a distance between a rotating shaft 11 of a polishing pad 13 and a rotating shaft 31 of a dresser 30 and shape change of the polishing pad 13 based on input of a target shape of the polishing pad 13 and alternating repetition of dressing the polishing pad 13 by the dresser 30 and measurement of shape of the polishing pad 13 by a pad shape measurement instrument 20 is acquired at a stage prior to commencement of a series of polishing steps for continuously polishing a plurality of polishing target objects (semiconductor wafer W) by a polishing tool 10, the polishing pad 13 is machined to the target shape 13 while the dressing position P is controlled, whereby the dressing position P is set during the polishing steps on the basis of a processing result of this data.
    Type: Application
    Filed: March 5, 2013
    Publication date: July 18, 2013
    Applicant: NIKON CORPORATION
    Inventor: NIKON CORPORATION
  • Publication number: 20130136952
    Abstract: A substrate for a magnetic recording medium having a disc shape with a central hole is provided in which the surface roughness of the principal surface of the substrate is 1 angstrom or less in terms of root mean square roughness (Rq) when a space period (L) of an undulation in the circumferential direction is in the range 10 to 1,000 ?m, and in which when a component in the vertical axis direction of a line segment Z connecting a point A with the space period (L) of 10 ?m and a point B with the space period (L) of 1,000 ?m in a curve S marked on a double logarithmic graph which is obtained by analyzing the surface roughness using a spectrum and in which the horizontal axis is set to the space period (L) (?m) and the vertical axis is set to the power spectrum density (PSD) (k·angstrom2·?m) (where k is a constant) is defined as H and a displacement at which the component in the vertical axis direction of the curve S is the maximum with respect to the line segment Z is defined as ?H, a value (P) expressed by (?
    Type: Application
    Filed: November 28, 2012
    Publication date: May 30, 2013
    Applicant: SHOWA DENKO K.K.
    Inventor: Showa Denko K. K.
  • Publication number: 20130095661
    Abstract: According to one embodiment, a CMP method includes starting a polishing of a silicon oxide film by using a slurry including a silicon oxide abrasive and a polishing stopper film including a silicon nitride film, and stopping the polishing when the polishing stopper is exposed. The slurry includes a first water-soluble polymer with a weight-average molecular weight of 50000 or more and 5000000 or less, and a second water-soluble polymer with a weight-average molecular weight of 1000 or more and 10000 or less.
    Type: Application
    Filed: March 23, 2012
    Publication date: April 18, 2013
    Inventors: Akifumi GAWASE, Yukiteru Matsui, Gaku Minamihaba, Hajime Eda
  • Patent number: 8411393
    Abstract: An electrical lap guide having a first layer, the first layer including a material having a first resistivity, the first layer having first and second contact regions for electrically connecting the electrical lap guide to electrical leads; a second layer, the second layer including a material having a second resistivity, wherein the electrical lapping guide has a lapping axis and a layered axis, the layered axis being perpendicular to the lapping axis, the electrical lapping guide has an air bearing plane, the air bearing plane being perpendicular to the lapping axis, the second layer is disposed adjacent to a portion of the first layer in the direction of the layered axis, and the first layer extends farther in the lapping axis than does the second layer.
    Type: Grant
    Filed: June 17, 2009
    Date of Patent: April 2, 2013
    Assignee: Seagate Technology LLC
    Inventors: Jie Zou, Zhongyan Wang
  • Publication number: 20130023185
    Abstract: Disclosed is a method of producing a glass substrate for an information recording medium including a precision polishing step of using a polishing material containing colloidal silica and performing precision polishing, under acidic conditions, on a glass material in which the amount of iron adhered on the surface is 0.5 ng/cm2 or less and the surface roughness Ra is 1 nm or less. Additionally disclosed is a glass substrate for an information recording medium produced by the foregoing method of producing a glass substrate for an information recording medium.
    Type: Application
    Filed: March 15, 2011
    Publication date: January 24, 2013
    Inventor: Hazuki Nakae
  • Publication number: 20130017761
    Abstract: The present invention provides a method of detecting and preventing grind burn from developing on a gear. The method includes performing acoustic emission testing while the gear is being ground during a grinding operation. The grinding wheel is evaluated during an eddy current test to detect material buildup on the grinding wheel which could cause grind burn. In addition, the method includes collecting swarf from the gear during the grinding operation and inspecting the swarf for an indication of grind burn.
    Type: Application
    Filed: September 14, 2012
    Publication date: January 17, 2013
    Inventors: Elizabeth Frazee, Paul Horvath
  • Publication number: 20120276813
    Abstract: A machine tool is provided which comprises a machine base; a first support provided on a first rotational machine axis, the first rotational axis being mounted on the base in a fixed position relative to the base; a second support provided on a second rotational machine axis, the second rotational axis being mounted on the base in a fixed position relative to the base, wherein the axis of rotation of the second rotational axis is parallel to and spaced laterally from the axis of rotation of the first rotational axis. A mount is carried by a support arm on the second support, with the support arm being moveable relative to the second support about a rotary axis.
    Type: Application
    Filed: December 20, 2010
    Publication date: November 1, 2012
    Applicant: CINETIC LANDIS LIMITED
    Inventor: Mark Stocker
  • Publication number: 20120264354
    Abstract: A distance monitoring device is provided. The device is suitable for a chemical mechanical polishing (CMP) apparatus. A polishing head of the CMP apparatus includes a frame and a membrane. The membrane is mounted on the frame, and a plurality of air bags is formed by the membrane and the frame in the polishing head. The distance monitoring device includes a plurality of distance detectors disposed on the frame corresponding to the air bags respectively to set a location of each of the distance detectors on the frame as a reference point, wherein each of the distance detectors is configured to measure a distance between each of the reference points and the membrane.
    Type: Application
    Filed: April 13, 2011
    Publication date: October 18, 2012
    Applicant: NANYA TECHNOLOGY CORPORATION
    Inventors: Chien-Mao Liao, Yi-Nan Chen, Hsien-Wen Liu
  • Publication number: 20120244784
    Abstract: A chemical-mechanical polishing tool and a method for preheating the same are disclosed. The chemical-mechanical polishing tool includes: a polishing pad, a deionized water supply channel, a polishing slurry supply channel and a polishing pad conditioner; and the chemical-mechanical polishing tool further includes: a heating apparatus, adapted to heat DI water fed to the DI water supply channel; a temperature sensor, arranged close to the polishing pad to measure a temperature of the polishing pad; and a preheating control system, connected to the temperature sensor, and adapted to control the DI water supply channel to spray the heated DI water to the polishing pad, and when the temperature measured by the temperature sensor is equal to or higher than a predetermined temperature, to close the DI water supply channel, control the polishing slurry supply channel to spray polishing slurry to the polishing pad, and startup the polishing pad conditioner to dress the polishing pad.
    Type: Application
    Filed: April 11, 2011
    Publication date: September 27, 2012
    Applicant: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
    Inventors: Tao Yang, Chao Zhao, Junfeng Li
  • Publication number: 20120238185
    Abstract: Provided is a method of phasing a threaded grinding stone, as well as a device therefor, the aforementioned method and device being such that contact or non-contact of a threaded grinding stone with a disk dresser can be detected with high accuracy, with the result that the phasing of the threaded grinding stone can be accurately performed. For the purpose of achieving the above, a threaded grinding stone (14) is phased with respect to a disk dresser (32) prior to the engagement of the threaded grinding stone (14) with the disk dresser (32) during dressing. In performing this phasing, it is determined whether or not the threaded grinding stone (14) contacted the disk dresser (32), on the basis of a voltage (V) which is commensurate with the amplitude of the elastic wave generated in the threaded grinding stone (14) at the time when the threaded grinding stone (14) contacted the disk dresser (32).
    Type: Application
    Filed: September 28, 2009
    Publication date: September 20, 2012
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Yoshikoto Yanase, Kazuyuki Ishizu, Tomohito Tani
  • Publication number: 20120238184
    Abstract: A method for providing an edge preparation on a cutting edge of a tool by means of an edge processing operation includes clamping the tool in a processing machine for providing the edge preparation, recording as a reference value the position of the cutting edge to be processed by means of a sensor arranged on the processing machine, carrying out an edge processing operation by means of a preparation tool, recording the position of the cutting edge again by means of the sensor arranged on the processing machine and storing the position as an actual value, monitoring the edge processing operation on the basis of a comparison between the reference value and the actual value, and comparing the actual value with a desired value for material removed on the cutting edge.
    Type: Application
    Filed: February 17, 2012
    Publication date: September 20, 2012
    Inventor: Jürgen Schwägerl
  • Publication number: 20120164916
    Abstract: A system for sensing and controlling concentration of magnetic particles in magnetorheological fluid comprising a wire coil and an AC voltage generator that, when energized, creates a magnetic flux field including a fringing field. When the fringing field extends through the magnetorheological fluid, the impedance in the circuit is proportional to the concentration of magnetic particles. A reference wire coil identical to the sensing wire coil is connected therewith. A demodulator is connected to each of the coils sends an impedance difference signal to a feedback controller connected to controllable dispensing apparatus for adding a calculated amount of replenishing fluid to the magnetorheological fluid. The system may be incorporated into an integrated fluid management module having apparatus for receiving and replenishing spent magnetorheological fluid and a sensor system in accordance with the present invention for use in a magnetorheological finishing system having a carrier wheel.
    Type: Application
    Filed: April 13, 2011
    Publication date: June 28, 2012
    Applicant: QED Technologies International, Inc.
    Inventors: William Kordonski, Keith Beadle, Sergei Gorodkin, Arpad Sekeres
  • Publication number: 20120154813
    Abstract: A real-time monitoring of an equivalence ratio of a gas-fuel mixture of a gas turbine engine is provided. The system includes multiple optical probes arranged on a plurality of fuel nozzles for transmitting laser beams directly through a gas-fuel mixture or indirectly by reflecting the laser beams from a surface of a centerbody or burner tube of the fuel nozzle. The system also includes one or more detectors to measure the transmitted laser beams from the multiple optical probes. Further, the system includes a data acquisition subsystem for acquiring and processing signals from the one or more detectors to determine the equivalence ratio of the gas-fuel mixture of the nozzle.
    Type: Application
    Filed: December 17, 2010
    Publication date: June 21, 2012
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Hejie Li, Shawn David Wehe, Keith Robert McManus
  • Publication number: 20120149279
    Abstract: An abrasive article for polishing a substrate surface. The abrasive article includes a holder pad assembly and an abrasive member held in place with respect to a holder pad. The abrasive member further includes a first surface engaged with the holder pad assembly, and a second surface including an abrasive. A preload mechanism is positioned to bias the second surfaces of the abrasive member toward the substrate surface. One or more fluid bearing features on the second surface of the abrasive member is configured to generate lift forces during relative motion between the abrasive article and the substrate surface.
    Type: Application
    Filed: October 28, 2011
    Publication date: June 14, 2012
    Inventors: Karl G. Schwappach, Zine-Eddine Boutaghou
  • Publication number: 20120122374
    Abstract: A grinding device for the surface treatment of rolls, for example of rolls for machines producing, finishing and/or processing webs, such as paper, cardboard or tissue machines, includes stationary components and mobile components which can be separated from each other. The stationary components include guide rails, which extend substantially in parallel to a roll axis of the roll to be treated and which are connected to a substructure. Thus, the stationary components, such as the guide rails, can remain at the place of use of the rolls, while the components that are mobile or can be transported can be easily separated from the stationary components and can be transported to other locations.
    Type: Application
    Filed: November 15, 2011
    Publication date: May 17, 2012
    Inventors: Jochen Honold, Ulrich Priber, Steffen Ihlenfeldt
  • Patent number: 8137574
    Abstract: The present invention is to provide a processing method for manufacturing a highly flat and highly smooth glass substrate with good productivity. A highly flat and highly smooth glass substrate is obtained with good productivity by processing of a glass substrate, which comprises a step of measuring the surface shape of the glass substrate prior to processing, a step of processing the surface of the substrate by changing a processing condition for each site (first processing step), and a step of finish-polishing the surface of the glass substrate that has been subjected to the first processing step (second processing step).
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: March 20, 2012
    Assignee: Asahi Glass Company, Limited
    Inventors: Koji Otsuka, Hiroshi Kojima, Masabumi Ito
  • Publication number: 20120052771
    Abstract: The invention relates to a method for machining by grinding or polishing of very thin work pieces which are releasably fastened each to thin carriers. The work pieces are arranged together with the carriers in the recesses of at least on rotor disc of a double sided processing machine and are moved along cycloid paths between the working surfaces of the double sided processing machine. Thereby, the removal rate on the working surfaces of the double sided processing machine is either the same or the removal rate on a working surface is substantially less than the one on the opposing working surface, or on one of the working surfaces no material removal takes place. In one embodiment two work pieces are on carrier, that is, releasably fastened on upper and lower side.
    Type: Application
    Filed: April 1, 2010
    Publication date: March 1, 2012
    Applicant: Peter Wolters GmbH
    Inventor: Frank Runkel
  • Patent number: 8100001
    Abstract: Measuring construction for measuring use conditions of a tire, configured to be mounted to a support arrangement and provided with a tilting arrangement for tilting and/or adjusting a force on a tire, wherein the tilting arrangement is provided with a measuring instrument that is connected to the tilting arrangement, at least configured and measure forces and/or moments on a tire, a wheel axle supported by the measuring instrument, and at least one actuator for driving the tilting arrangement, wherein the tilting arrangement comprises a foldable construction connected to the at least one actuator.
    Type: Grant
    Filed: December 3, 2007
    Date of Patent: January 24, 2012
    Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
    Inventor: Dirk Okker De Kok
  • Publication number: 20120009693
    Abstract: A system and method for processing a wafer includes a charge neutralization system. The wafer processing system includes a wafer measuring device that can measure characteristics of a surface of the semiconductor wafer. One or more wafer processing stations perform a chemical mechanical polish (CMP) process on the wafer surface. A desica cleaning station can clean and dry the semiconductor wafer. The wafer processing system further includes a charge neutralizing device that can alter a surface charge of the wafer surface.
    Type: Application
    Filed: July 12, 2010
    Publication date: January 12, 2012
    Applicant: STMicroelectronics, Inc.
    Inventor: John H. Zhang
  • Publication number: 20110312246
    Abstract: A vane for a turbine assembly of a turbocharger includes a first airfoil that includes a length between a leading edge and a trailing edge, a second airfoil that includes a length between a leading edge and a trailing edge where the length of the first airfoil optionally differs from the length of the second airfoil, and one or more intra-vane throats defined at least in part by the first airfoil and the second airfoil. Various other examples of devices, assemblies, systems, methods, etc., are also disclosed.
    Type: Application
    Filed: June 20, 2010
    Publication date: December 22, 2011
    Inventors: Ashraf Mohamed, David Strott, Scott MacKenzie
  • Patent number: 8079120
    Abstract: A method of determining parameters for a burnishing operation includes: using a rolling burnishing element to burnish at least two segments on a selected surface of a material sample, the segments having a common width and overlapping each other by a preselected overlap value; measuring the resulting hardness of the surface; and selecting a working overlap value for a subsequent burnishing operation on a workpiece, based on the measured hardness.
    Type: Grant
    Filed: December 30, 2006
    Date of Patent: December 20, 2011
    Assignee: General Electric Company
    Inventors: Alberto Luna, Michael Jay Brunck
  • Patent number: 8066547
    Abstract: A lapping row tool comprising a plurality of bending nodes having a space between adjacent ones of said nodes and each of which has an end surface to manipulate a row of magnetic heads during lapping. A bridge extends along the end surfaces of the bending nodes and across the space between the adjacent bending nodes. The bridge provides a surface for holding the row of magnetic heads that prevents the flexing of the row into the space between the bending nodes during lapping while allowing the bending nodes to manipulate the row during lapping.
    Type: Grant
    Filed: November 18, 2004
    Date of Patent: November 29, 2011
    Assignee: Veeco Instruments Inc.
    Inventors: Gregory W. Schuh, Tracy Lytle
  • Patent number: 8041446
    Abstract: A post-process sizing control device is provided with origin compensation means for controlling a size measuring device to measure an actual size of a workpiece portion and for compensating the origin of a wheel head by a position compensation amount which corresponds to a difference between the actual size and a theoretical size derived from calculation and size measuring interval setting means for setting the number of workpieces which should be ground during the next size measuring interval which begins after the preceding origin compensation operation and ends with the next origin compensation operation. The size measuring interval setting means sets the number of workpieces which should be ground during the next size measuring interval, based on an average position compensation amount derived by dividing a position compensation amount for the last workpiece ground during the present size measuring interval by the number of workpieces ground during the present size measuring interval.
    Type: Grant
    Filed: January 30, 2009
    Date of Patent: October 18, 2011
    Assignee: JTEKT Corporation
    Inventors: Masaharu Inoue, Tomohisa Yamaguchi
  • Publication number: 20110223833
    Abstract: In the case of a method for the material-removing fine machining of a workpiece surface of a workpiece, in particular for the honing or finishing of workpiece portions having substantially rotationally symmetrically curved workpiece surfaces, at least one fine machining tool machines the workpiece surface and, by means of a measuring system, a measurement of the workpiece surface is performed. In this case, at at least one measuring position, radar radiation is directed onto the workpiece surface, and the radar radiation reflected from the workpiece surface is acquired and evaluated for the purpose of determining at least one surface measurement value.
    Type: Application
    Filed: March 8, 2011
    Publication date: September 15, 2011
    Applicant: Nagel Maschinen-und Werkzeugfabrik GmbH
    Inventors: Herbert Rauscher, Joachim Klima
  • Patent number: 7930058
    Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.
    Type: Grant
    Filed: December 31, 2007
    Date of Patent: April 19, 2011
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Sumeet S. Bhagavat, Roland R. Vandamme, Tomomi Komura, Tomohiko Kaneko, Takuto Kazama
  • Publication number: 20110086578
    Abstract: An apparatus and method for lens surfacing. The apparatus includes a voice coil, piezo stack and cutter connected by a connection mechanism and regulated by a hierarchical sliding mode control system. The invention allows for both coarse and fine movements of the cutter during surfacing.
    Type: Application
    Filed: September 25, 2008
    Publication date: April 14, 2011
    Applicant: GERBER SCIENTIFIC INTERNATIONAL, INC.
    Inventors: Yasser Eldeeb, Jeff Murray
  • Publication number: 20110076922
    Abstract: When surface grinding finish for decoration or other purposes is performed by applying a film to the front surface of a metal plate that is welded linearly with penetration from the rear surface side thereof. In this manner, the metal plate can be subjected to the surface grinding finish such that an appearance similar to weld marks is not created.
    Type: Application
    Filed: December 10, 2010
    Publication date: March 31, 2011
    Applicant: THE KINKI SHARYO CO., LTD.
    Inventors: Tomonori SUMIKAWA, Katsuji NISHITANI
  • Publication number: 20110059679
    Abstract: The present invention is a method for slicing a workpiece into wafers by pressing a cylindrical workpiece held with a workpiece holder against a wire row formed by a wire spirally wound between a plurality of wire guides and making the wire travel while supplying a slurry to a contact portion between the workpiece and the wire, wherein the workpiece is sliced with an axis direction of the workpiece inclined with respect to a plane formed by the wire row, after the workpiece is inclined in such a manner that a side far from the wire row plane is a side where the wire guides are to be axially expanded. As a result, there is provided a method for slicing that enable wafers having a good Warp shape to be obtained by precisely slicing a workpiece with a wire saw.
    Type: Application
    Filed: June 4, 2009
    Publication date: March 10, 2011
    Applicant: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Koji Kitagawa, Kazuya Tomii
  • Patent number: 7869896
    Abstract: A tangential grinding resistance measuring method includes obtaining an abrasive grain section area which is at a predetermined infeed depth from the highest top surface of abrasive grains on a grinding wheel; calculating the tangent of a half vertex angle of a conical model for cutting edges of the abrasive grains which model takes the abrasive grain section area as its bottom surface and the predetermined depth as its height; setting grinding parameters; and calculating a tangential grinding resistance from the grinding parameters and the tangent.
    Type: Grant
    Filed: August 13, 2007
    Date of Patent: January 11, 2011
    Assignee: JTEKT Corporation
    Inventors: Yasuhira Yamada, Hiroshi Morita
  • Publication number: 20100330880
    Abstract: A machine tool is provided which comprises a machine base (10), a first support (20,100) mounted on a first rotational machine axis on the base, and a second support (22,102) mounted on a second rotational machine axis on the base. The second rotational axis is parallel to and spaced laterally from the first rotational axis and carries a mount (38,112) moveable relative to the second support along a first linear machine axis orthogonal to the second rotational axis. A control arrangement is operable to control the orientation of the first support on the first rotational axis, and the orientation of the mount relative to the second rotational axis and its location along the linear axis, so as to govern the position and orientation of the first support and the mount relative to each other. Existing machine tools often use long linear guide rails and stacked orthogonal axes which introduce alignment and offset errors.
    Type: Application
    Filed: January 21, 2009
    Publication date: December 30, 2010
    Applicant: Cinetic Landis Limited
    Inventor: Mark Andrew Stocker
  • Patent number: 7840305
    Abstract: The disclosure relates to abrasive articles useful in chemical-mechanical polishing (CMP), the articles including a substrate with opposite major surfaces, an abrasive material overlaying at least a portion of at least one of the major surfaces, and at least one of a radio frequency identification (RFID) tag, a RFID tag reader, or a sensor for providing CMP information to a transmitter positioned near the substrate, the transmitter positioned near the substrate and adapted to wirelessly receive CMP information and wirelessly transmit the CMP information to a remote receiver. The disclosure also relates to a CMP pad conditioner for wirelessly communicating CMP information to a remote receiver, a CMP process monitoring system for wirelessly communicating CMP information to a remote receiver, and a method for conditioning a CMP pad using a CMP process monitoring system for wireless communicating CMP information to a remote receiver.
    Type: Grant
    Filed: June 28, 2006
    Date of Patent: November 23, 2010
    Assignee: 3M Innovative Properties Company
    Inventors: Andrew H. Behr, Brian D. Goers, Vincent J. Laraia, Gary M. Palmgren, Daniel B. Pendergrass, Jr.
  • Patent number: 7818080
    Abstract: It is one object of the present invention to provide a program writing method of numerical controller, a numerical controller and a cutting machine controlled thereby, achieving the writing of a plurality of programs relating to one axis to perform a high efficiency in a lot of productions. A next or later user-set-program controlling a duplicated axis controlled by plural user set programs identifies a virtual axis virtually controlled by one user set program. A program is written to replace the duplicated axis with the virtual axis. A control amount calculated by the user set program identifying the virtual axis is added to a control amount inputted to a correspondent axis driving program as a control amount of the duplicated axis before replacing the virtual axis.
    Type: Grant
    Filed: September 10, 2007
    Date of Patent: October 19, 2010
    Assignee: JTEKT Corporation
    Inventors: Toshihiro Yonezu, Hiroaki Sugiura, Satoshi Abeta
  • Publication number: 20100248589
    Abstract: The part to be machined (2) is attached so that its axis lies in a position exactly determined relative to the base of the machine (1) and to the pedestal (3) due to the flanges (8) and the rear face (9) of the V formed on the pedestal, and due to an intermediate member (11) having the shape of a crown sector in which the concave cylindrical faces (23) are adapted to the part (2). The part is pressed against the faces (23) by a lug (14) actuated by the calliper (15). The part (2) can be rotated by a floating pin actuated by a servomotor in a determined position relative to the base of the machine (1).
    Type: Application
    Filed: August 28, 2008
    Publication date: September 30, 2010
    Inventors: Pierre-Louis Piguet, Pierre Pahud
  • Publication number: 20100203804
    Abstract: A micro-abrasive blasting device and method for perturbation control using a plurality of delivery conduits of various lengths and/or apertures. The user is able to individually open and close bypass conduit pinch valve(s) external to micro-abrasive blasting device to affect the perturbation intensity internal to the mixing chamber. By selectively opening and closing flow through delivery conduits it is possible to provide a more consistent perturbation rate and select the perturbation intensity internal to mixing chamber.
    Type: Application
    Filed: April 21, 2010
    Publication date: August 12, 2010
    Inventor: Boaz Barry Groman
  • Publication number: 20100105287
    Abstract: The present invention particularly relates to a hand-held sanding machine with an outer housing (1), a tool shaft (2) and a brushless electric drive motor. In the present invention, the rotor of the drive motor is fastened to the tool shaft (2) of the sanding machine, and the stator (6) is positioned in the outer housing (1). The present invention also relates to a control method for an electric sanding machine.
    Type: Application
    Filed: March 20, 2008
    Publication date: April 29, 2010
    Applicant: OY KWH MIRKA AB
    Inventor: Caj Nordstrom
  • Patent number: 7643928
    Abstract: A system and method for controlling the speed of a turbine engine, the turbine engine being operative to provide power to a primary load. When a decrease in the power requirement of the primary load is detected, at least a portion of the power generated by the turbine engine is redirected to a secondary load, thereby maintaining the speed of the turbine engine below a rated maximum speed. In the example of a turbine-powered train in which the turbine engine provides power to electric traction motors driving the wheels of the train, when a wheel spin is detected, at least a portion of the power generated by the turbine engine is diverted from the respective electric traction motor to rheostats for conversion to heat.
    Type: Grant
    Filed: January 5, 2004
    Date of Patent: January 5, 2010
    Assignee: Bombardier Transportation GmbH
    Inventor: Richard Soucy
  • Patent number: 7627390
    Abstract: Method for the optimization of the surface geometry or of a variable, dependent on this, or variables, dependent on this, of bevel or hypoid gears for their production on a free-form machine which can be mapped to a free-form basic machine with at most six axes uniquely in a reversible way, even to symmetries, which has a gearwheel to be machined and a tool which are in each case rotatable about an axis, and the tool and the gearwheel to be machined are moveable, preferably displaceable or rotatable, with respect to one another along or about a plurality of axes, the optimization of the surface geometry or of the variable or variables, dependent on this, of the bevel or hypoid gearwheel taking place in that one or more control parameters, which has or have influence on the surface geometry or the variable or variables, dependent on this, of the bevel or hypoid gearwheel, is or are varied by means of a simulation of the gearwheel production process and/or a roll and/or a load-contact analysis on the free-form
    Type: Grant
    Filed: January 12, 2009
    Date of Patent: December 1, 2009
    Assignee: Klingelnberg GmbH
    Inventors: Hartmuth Mueller, Olaf Vogel, Roland Dutschk, Carsten Huenecke
  • Patent number: 7627389
    Abstract: Method for the optimization of the surface geometry or of a variable, dependent on this, or variables, dependent on this, of bevel or hypoid gears for their production on a free-form machine which can be mapped to a free-form basic machine with at most six axes uniquely in a reversible way, even to symmetries, which has a gearwheel to be machined and a tool which are in each case rotatable about an axis, and the tool and the gearwheel to be machined are moveable, preferably displaceable or rotatable, with respect to one another along or about a plurality of axes, the optimization of the surface geometry or of the variable or variables, dependent on this, of the bevel or hypoid gearwheel taking place in that one or more control parameters, which has or have influence on the surface geometry or the variable or variables, dependent on this, of the bevel or hypoid gearwheel, is or are varied by means of a simulation of the gearwheel production process and/or a roll and/or a load-contact analysis on the free-form
    Type: Grant
    Filed: June 13, 2006
    Date of Patent: December 1, 2009
    Assignee: Klingelnberg GmbH
    Inventors: Hartmuth Muller, Olaf Vogel, Roland Dutschk, Carsten Hunecke
  • Patent number: 7557904
    Abstract: A wafer holding mechanism for holding a wafer affixed to a frame with a tape utilizing a suction force. The wafer holding mechanism includes a suction body, a wafer holder with a holding surface for holding the wafer via the tape, and a suction unit with a suction portion disposed at an outer peripheral edge of the wafer holder. The suction portion transmits a suction force across the holding surface though the outer peripheral edge of the wafer holder such that when the suction portion is covered and sealed by the tape, the wafer holder is held at the suction unit and the wafer is held at the holding surface.
    Type: Grant
    Filed: February 24, 2006
    Date of Patent: July 7, 2009
    Assignee: Disco Corporation
    Inventors: Naoki Ohmiya, Satoshi Genda, Noboru Takeda, Koichi Takeyama, Yukio Morishige, Hiroshi Morikazu, Hiroshi Nomura
  • Patent number: 7552630
    Abstract: A method of positioning a load wheel in a tire uniformity machine to load a tire for testing, the method comprising providing a drive assembly including a drive motor and a drive controller, electrically connected to each other, said drive controller being adapted to switch between analog velocity control and position control; moving the load wheel with the drive motor using analog velocity control; and switching to position control to cause said motor to maintain a selected position of said load wheel without a mechanical brake.
    Type: Grant
    Filed: February 28, 2005
    Date of Patent: June 30, 2009
    Assignee: Akron Special Machinery, Inc.
    Inventors: Richard Delmoro, David Krause, David Poling, Sr.
  • Publication number: 20090124170
    Abstract: Disclosed in the present application is a sharpening apparatus and method for sharpening a cutting bit. The apparatus comprises a sharpening member and a laser for accurately positioning the cutting bit surface to be sharpened with respect to the sharpening member. The apparatus and method are particularly useful for sharpening a router or shaper bit.
    Type: Application
    Filed: October 2, 2008
    Publication date: May 14, 2009
    Inventor: Charles M. Thomas
  • Publication number: 20090108266
    Abstract: Apparatus comprising, in use, a wide bandgap semiconductor, a conductor which is moveable relative to the semiconductor and means for applying a potential across the junction between a conductor and semiconductor to control the friction generated by the relative movement between the semiconductor and the conductor. A method of controlling friction between a wide bandgap semiconductor and conductor which are moveable relative to each other comprising applying a potential across the junction between the semiconductor and the conductor.
    Type: Application
    Filed: August 28, 2008
    Publication date: April 30, 2009
    Inventors: Jonathan Hird, Avik Chakravarty, Satyendra Chakravarty, Chhaya Chakravarty
  • Patent number: 7465214
    Abstract: A substrate holding apparatus holds a substrate such as a semiconductor and presses the substrate against a polishing surface. The substrate holding apparatus includes a top ring body (2) for holding the substrate, a plurality of fluid passages (33, 34, 35, 36) for supplying a fluid to a plurality of pressure chambers (22, 23, 24, 25) defined in the top ring body, and a plurality of sensors (S1, S2, S3, S4) disposed in the fluid passages, respectively, for detecting flowing states of the fluid which flows through the fluid passages.
    Type: Grant
    Filed: February 25, 2004
    Date of Patent: December 16, 2008
    Assignee: Ebara Corporation
    Inventors: Tetsuji Togawa, Osamu Nabeya
  • Patent number: 7448261
    Abstract: An eraser having the capability of absorbing oil or wax as a formulation of more than 50% styrene butadiene rubber (SBR). The eraser is particularly well suited for use in testing tires having oil or wax therein.
    Type: Grant
    Filed: June 14, 2007
    Date of Patent: November 11, 2008
    Assignee: Cooper Tire & Rubber Co.
    Inventor: George B. Ouyang
  • Patent number: 7434454
    Abstract: There is provided a method and a apparatus for measuring tire uniformity. The apparatus comprises a spindle, a rotating drum, a sensor and a computing means. The method comprises the steps of mounting a tire on the spindle, pressing a circumferential surface of a rotating drum against the tread surface of the tire with a first pressing force, rotating the tire around rotational axis thereof, and computing the forces which the tire acts on first and second planes of the tire by the computing means while the tire is rotating. The first plane is perpendicular to the rotational axis and in one sidewall side of the tire. The second plane is perpendicular to the rotational axis and in the other sidewall side of the tire. The forces are computed based on values obtained by the sensor measuring forces transmitted to the spindle from the tire at first and second positions. The first and second positions have different distances from the tire in the rotational axis direction.
    Type: Grant
    Filed: August 25, 2004
    Date of Patent: October 14, 2008
    Assignee: Kokusai Keisokuki Kabushiki Kaisha
    Inventor: Sigeru Matsumoto
  • Publication number: 20080227374
    Abstract: A polishing head is tested in a test station having a pedestal for supporting a test wafer and a controllable pedestal actuator to move a pedestal central wafer support surface and a test wafer toward the polishing head. In another aspect of the present description, the test wafer may be positioned using a positioner having a first plurality of test wafer engagement members positioned around the pedestal central wafer support surface. In another aspect, the wafer position may have a second plurality of test wafer engagement members positioned around an outer wafer support surface disposed around the pedestal central wafer support surface and adapted to support a test wafer. The second plurality of test wafer engagement members may be distributed about a second circumference of the ring member, the second circumference having a wider diameter than the first circumference. Additional embodiments and aspects are described and claimed.
    Type: Application
    Filed: March 15, 2007
    Publication date: September 18, 2008
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Jeffrey P. Schmidt, Jay Rohde, Stacy Meyer
  • Publication number: 20080188161
    Abstract: A method for shaping a workpiece having a base portion using a tool is provided. The method includes rotating the tool at a fixed rotational speed in a first direction and rotating the workpiece in the first direction. The tool is positioned in contact with the workpiece at a first portion of the base portion of the workpiece. The workpiece is rotated at a first rotational speed when the tool contacts the first portion of the base portion of the workpiece. The workpiece is rotated at a second rotational speed when the tool contacts a second portion of the base portion of the workpiece. The first rotational speed and the second rotational speed are different.
    Type: Application
    Filed: February 5, 2007
    Publication date: August 7, 2008
    Applicant: GM Global Technology Operations, Inc.
    Inventors: SHANE E. BREMER, Ihab M. Hanna, Jason J. Wiedyk, Aleksandar J. Filipovic