Semiconductor module

- ROHM CO., LTD.
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Description

1. Semiconductor module

1.1 : Perspective

1.2 : Perspective

1.3 : Front

1.4 : Top

1.5 : Bottom

1.6 : Right

1.7 : Left

The broken lines in the drawings form no part of the claimed design; the dash-dotted lines in the drawings represent the unclaimed boundaries and form no part of the claimed design; the back view is omitted since it is symmetrical to the front view.

Claims

The ornamental design for a semiconductor module, as shown and described.

Referenced Cited
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Other references
  • RoadPak SiC e-mobility module, https://www.hitachienergy.com/products-and-solutions/semiconductors/e-mobility-modules,https://www.hitachienergy.com/products-and-solutions/semiconductors/e-mobility-modules, 2024. (Year: 2024).
  • AON6403,https://www.digikey.com/en/products/detail/alpha-&-omega-semiconductor-inc./AON6403/3060880?utm_adgroup=& utm_source=google&utm_medium=cpc&utm_campaign=PMax%20Shopping_Product_Medium%20ROAS%20Categories&utm_term=&utm_content=&utm_id=go_cmp-20223376311_adg-_ad-_dev-c, 2024. (Year: 2024).
  • GAL16V8QS-15QVC,https://www.digikey.com/en/products/detail/rochester-electronics,-llc/GAL16V8QS-15QVC/12600520?utm_adgroup=General&utm_source=google&utm_medium=cpc&utm_campaign=PMax%20Shopping_Product_Zombie%20SKUs&utm_term=&utm_content=General&utm_id=go_cmp-17815035045_adg-_ad, 2024. (Year: 2024).
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Patent History
Patent number: D1042376
Type: Grant
Filed: Aug 24, 2022
Date of Patent: Sep 17, 2024
Assignee: ROHM CO., LTD. (Kyoto)
Inventors: Koshun Saito (Kyoto), Koki Nakano (Kyoto)
Primary Examiner: Elizabeth J Oswecki
Application Number: 35/518,119