Semiconductor device

Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device showing our new design;

FIG. 2 is a rear, top, and left side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a front, top and right side perspective view thereof, shown in a used condition attached to a mount shown in broken lines; and,

FIG. 10 is another front elevational view thereof, attached to a mount shown in broken lines.

The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.

Claims

The ornamental design for a semiconductor device, as shown and described.