Semiconductor module

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Description

FIG. 1 is a top perspective view of a semiconductor module, showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a underside plan view thereof.

The broken lines in the Figures are for environmental purposes only and form no part of the claimed design.

Claims

The ornamental design for a semiconductor module, as shown and described.

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Patent History
Patent number: D877102
Type: Grant
Filed: Mar 28, 2018
Date of Patent: Mar 3, 2020
Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. (Hanno-Shi, Saitama)
Inventor: Yoshihiro Kamiyama (Saitama)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/642,232