Publication number: 20080150127
Abstract: A microelectronic package includes a substrate (110, 210, 310, 410, 510, 731), a die (120, 220, 320, 420, 520, 732), and a heat spreading region (130, 230, 330, 430, 530, 733). The die, which has an active side (121, 221, 321, 421, 521) and a passive side (122, 222, 322, 422, 522) located opposite the active side, is located over the substrate, and the heat spreading region is adjacent to the passive side of the die. The heat spreading region includes a composite (135, 235, 335, 435, 535) of nanotubes and a thermally conducting material.
Type:
Application
Filed:
December 21, 2006
Publication date:
June 26, 2008
Inventors:
Nachiket Raravikar, Leonel Arana, Daewoong Suh