Abstract: A multilayer ceramic capacitor includes a ceramic body with first and second internal electrodes facing each other and dielectric layers interposed therebetween. First and second external electrodes are on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. A dielectric layer includes dielectric grains including, respectively, first regions in which dysprosium (Dy) is not present and second regions surrounding the first regions. Where a shortest distance between boundaries of the first regions (in which dysprosium (Dy) is not present) of two of the dielectric grains is “L,” the concentration of dysprosium (Dy) in a region within ±0.2L from a halfway point between the boundaries is lower than that of dysprosium (Dy) in the second regions.

Abstract: A multi-layer ceramic capacitor includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction, and internal electrodes disposed between the ceramic layers. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction, the side margin having a higher concentration of a rare-earth element and a higher concentration of vanadium than center portions of the ceramic layers in the second direction.

Abstract: A dielectric resin composition for a film capacitor is a mixture containing an organic material A and an organic material B. The organic material A includes at least two kinds of organic material components A1, A2, . . . having reactive groups (for example, OH, NCO) that cross-link each other. The organic material B does not have a reactive site capable of reacting with the organic material A and has a dielectric loss tan ? of 0.3% or less at a temperature of 125° C. The mixture has a glass transition temperature of 130° C. or higher and preferably 280° C. or lower.

Abstract: Prismatic polymer monolithic capacitor structure operating at temperatures exceeding 140° C. and including multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The geometry of structure is judiciously chosen to increase sheet resistance of metal electrodes while reducing the capacitor's equivalent series resistance. Metal electrode layers are provided with a thickened peripheral portion to increase strength of terminating connections and are passivated to increase corrosion resistance. Materials for polymer dielectric layers are devised to ensure that the capacitor's dissipation factor remains substantially unchanged across the whole range of operating temperatures, to procure glass transition temperature that is no less than the desired operating temperature, and to optimize the absorption of ambient moisture by the polymeric layers.

Abstract: A multilayer ceramic capacitor includes: a capacitance layer including dielectric layers and first and second internal electrodes disposed with respective dielectric layers interposed therebetween; a protection layer disposed on one surface of the capacitance layer; an alpha connection electrode provided in an alpha via penetrating through the protection layer; and a beta connection electrode provided in a beta via penetrating through the capacitance layer and connected to the alpha via. The alpha via has a diameter greater than that of the beta via.

Abstract: A ceramic electronic component includes a ceramic body and external electrodes. The ceramic body includes ceramic layers formed of a ceramic material and laminated in a first axis direction, and internal electrode layers each including an extracted portion and disposed between the ceramic layers, the extracted portion being extracted to a circumference of each of the ceramic layers and having a width of 100 ?m or less along the circumference. The external electrodes contain the ceramic material, the external electrodes being provided to a surface of the ceramic body and each connected to the extracted portion.

Abstract: A MIM capacitor includes a bottom electrode, a middle electrode disposed over the bottom electrode, a top electrode disposed over the middle electrode, a first dielectric layer sandwiched between the bottom electrode and the middle electrode, and a second dielectric layer sandwiched between the middle electrode and the top electrode. A surface of the bottom electrode and a surface of the top electrode respectively comprise a Ra value lower than 0.35 nm and a Rq value lower than 0.4 nm.

Abstract: A capacitor component includes a substrate, a body disposed on one region of an upper surface of the substrate and having a porous structure, and a capacitor part including a first electrode, a dielectric layer, and a second electrode, formed on the porous structure of the body. The first and second electrodes extend to other regions of the upper surface of the substrate, respectively.

Abstract: A dielectric ceramic composition contains: a barium titanate-based powder as a main ingredient; a first accessory ingredient containing Na; a second accessory ingredient containing Ba; and a third accessory ingredient containing Si. A content of the first accessory ingredient (based on moles of Na) is 0.3 to 4.0 moles per 100 moles of the main ingredient, and a Ba/Si ratio is in a range of 0.16 to 1.44.

Abstract: A trenched base capacitive humidity sensor includes a plurality of trenches formed in a conductive layer, such as polysilicon or metal, on a substrate. The trenches are arranged parallel to the each other and partition the conductive layer into a plurality of trenched silicon electrodes. At least two trenched silicon electrodes are configured to form a capacitive humidity sensor. The trenches that define the trenched silicon electrodes can be filled partially (e.g., sidewall coverage) or completely with polyimide (Pl) or silicon nitride (SiN). A polyimide layer may also be provided on the conductive layer over the trenches and trenched electrodes. The trenches and the trenched silicon electrodes may have different widths to enable different sensor characteristics in the same structure.

Abstract: In one embodiment, a system, comprising: a first non-magnetic conductive electrode; a second non-magnetic conductive electrode; a dielectric layer disposed between the first and second electrodes, the dielectric layer extending between the first and second electrodes; and first and second layers comprising plural pairs of magnetically coupled pairings of discrete magnets, the first and second layers separated by a non-magnetic material, wherein the magnets of at least the first layer are conductively connected to the first non-magnetic conductive electrode.

Abstract: In an embodiment, a multilayer ceramic capacitor 10 is constituted in such a way that four capacitive components C1 to C4 that are connected in series are formed between a first internal electrode layer group 14 and a second internal electrode layer group 15 adjacent to it, wherein, among the four capacitive components C1 to C4, the facing area Sc1 that defines the capacitance value of the capacitive component C1 closest to the first external electrode 12 and the facing area Sc4 that defines the capacitance value of the capacitive component C4 closest to the second external electrode 13 are greater than the facing areas Sc2 and Sc3 that define the capacitance values of the two remaining capacitive components C2 and C3, respectively. The multilayer ceramic capacitor is capable of satisfying the needs for both size reduction and voltage resistance increase.

Abstract: A printed circuit board including a circuit board having a cavity between an upper surface of the circuit board and a lower surface of the circuit board that are substantially parallel to each other, and a connection board including insulating layers substantially parallel with metal layers, the metal layers including metal patterns. The connection board is disposed in the cavity with the insulating layers and the metal layers of the connection board substantially perpendicular to the upper and lower surfaces of the circuit board.

Abstract: In an electronic component, each of a distance between a first outer electrode and a third outer electrode along a length direction and a distance between a second outer electrode and the third outer electrode along a length direction is about 8% to about 13% of a dimension of the electronic component along the length direction.

Abstract: Improved electrodes and currents through the use of organic and organometallic high dielectric constant materials containing dispersed conductive particles in energy storage devices and associated methods are disclosed. According to an aspect, a dielectric material includes at least one layer of a substantially continuous phase material comprising a combination of organometallic having delocalized electrons, organic compositions and containing metal particles in dispersed form, in another aspect, the novel material is used with a porous electrode to further increase charge and discharge currents.

Abstract: A electric storage device that includes a device body having a first end face that has a first portion and a second portion, and second end face that has a third portion and a fourth portion. The second portion is inclined relative to the first portion, and the fourth portion is inclined relative to the third portion. A first electrode film extends from the first portion to the second portion, and a second electrode film extends from the third portion to the fourth portion.

Abstract: A manufacturing method for a multilayer capacitor includes alternately laminating dielectric layers and conductor layers including less than 50 included in a first arrangement and a second arrangement different from the first arrangement when viewed from a lamination direction to form a laminate in which at least one pair of the conductor layers adjacent to each other with the dielectric layer interposed therebetween are included in the first or second arrangement, pressing the laminate to stretch the conductor layers in a direction perpendicular or substantially perpendicular to the lamination direction, pressing the laminate to bend the conductor layers in the lamination direction, and forming first and second outer electrodes on laminate surfaces such that the first outer electrode is connected to the conductor layers included in the first arrangement and the second outer electrode is connected to the conductor layers included in the second arrangement.

Abstract: A printed circuit board includes: a core board including, on a first surface thereof, an element mounting part and an element non-mounting part; an insulation layer disposed on the element non-mounting part; a copper-clad laminate plate disposed on the insulation layer; a first penetration via penetrating the insulation layer and the copper-clad laminate plate; and a second penetration via disposed in the core board and connected to the first penetration via.

Abstract: A multilayer ceramic capacitor includes a laminated body including an inner layer portion including ceramic dielectric layers and internal electrodes, and outer layer portions including ceramic dielectric layers. External electrodes connected to the internal electrodes are provided on both ends of the laminated body. The main constituent of the inner layer portion is a perovskite-type compound represented by ABO3. The outer layer portions include first outer layers and second outer layers respectively containing oxides that differ from each other in main constituents, and boundary reaction layers are provided between the first outer layers and the second outer layers. First ceramic dielectric layers outside the boundary reaction layers differ in color from second ceramic dielectric layers inside the boundary reaction layers.

Abstract: An electrode coating composition that includes at least one crosslinkable monomer; at least one hydrophobic monomer; and at least one dielectric constant enhancing agent selected from dielectric enhancing monomers, ferroelectric particulates, and electroactive polymers. Coatings including the polymer of compositions, and articles including electrically isolating layers are also disclosed.

Abstract: The disclosure provides for electrochemical supercapacitors with high energy densities, based on paired groups of carbon nanotube mounted to conductive substrates. In one variation, the electrochemical supercapacitors are double layer capacitors, or electrochemical double layer capacitors, containing opposing groups of carbon nanotubes on opposing substrates. In another variation, the capacitor is an interdigitated capacitor of alternating electrode containing carbon nanotubes, mounted on a common substrate. Processes and devices are also described.

Abstract: A multi layer fuse device includes a substrate and an elongated fuse element, having a pair of contact pads formed therewith at opposed longitudinal ends thereof formed on one surface of the substrate. A pair of passivation layers are provided covering the fuse and contact pads. Windows may be opened through both passivation layers above both of the contact pads, and conductive electrode material is electroplated through the windows to contact the contact pads and to extend partially above a top surface of the passivation layers. Exposed electroplated material may be coated with solderable conductive material or a surface mount termination may be provided. Electroplated material may cover a portion of the fuse surface prior to application of the passivation layers and extend to an end of the substrate so that windows are not required.

Abstract: A multi-layered capacitor device is provided in which the multi-layered capacitor device includes a metal or metal-oxide ground electrode, a capacitor dielectric layer, a metal or metal-oxide top electrode, a hole blocking layer and an electron blocking layer. The hole blocking layer is located at the interface of the metal or metal-oxide ground electrode and the capacitor dielectric layer to increases the effective barrier height at the interface. The electron blocking layer is located at the interface of the metal or metal-oxide top electrode and the capacitor dielectric layer to increases the effective barrier height at the interface.

Abstract: A multilayer ceramic capacitor may include: an active part including dielectric layers and internal electrodes which are alternately stacked therein; and a cover part disposed on at least one of an upper surface and a lower surface of the active part. The cover part may include an active part protective cover and an exterior cover, and the active part protective cover may be disposed adjacent to the active part.

Abstract: An electrical capacitor includes a dielectric spacer. Metal electrodes are held in contact with opposite surfaces of the dielectric spacer by magnetic force.

Abstract: A multilayer ceramic capacitor has a laminate including dielectric layers laminated alternately with internal electrode layers of different polarities, wherein the dielectric layer contains ceramic grains having Ba, Ti, and X (wherein X represents at least one type of element selected from the group consisting of Mo, Ta, Nb, and W) and a variation in the concentration distribution of X above in the ceramic grain is within ±5%. The multilayer ceramic capacitor can offer excellent service life characteristics even when the thickness of the dielectric layer is 0.8 ?m or less, as well as excellent bias characteristics.

Abstract: A laminated ceramic capacitor that includes a laminated body that has dielectric ceramic layers including crystal grains and crystal grain boundaries and has internal electrode layers; and external electrodes on the surface of the laminated body and electrically connecting the internal electrode layers exposed at the surfaces of the laminated body. When a direct-current voltage is applied to the laminated ceramic capacitor, the voltage/current curve has a critical point dividing the curve into a first area on the lower-voltage side and a second area on the higher-voltage side, an electric field obtained by dividing the critical voltage at the critical point by the thickness of one of the dielectric ceramic layers when the voltage (V)/current (I) characteristics are measured at 25° C. is 10 V/?m or more, and the voltage/current curve has a slope of 3 or less in the second area.

Abstract: There are provided a multilayer ceramic electronic component capable of preventing problems occurring due to a difference in sintering behavior between ceramic layers and internal electrodes and having excellent reliability, and a manufacturing method thereof. The multilayer ceramic electronic component may include a ceramic body including a plurality of ceramic layers; and internal electrodes disposed in the ceramic body. The internal electrodes may contain a conductive ceramic oxide.

Abstract: A multilayer ceramic capacitor includes an external electrode that is unlikely to be peeled. First and second external electrodes each include base layers provided over a ceramic body and including a metal and glass, and Cu plated layers provided over the base layers. The multilayer ceramic capacitor includes a reactive layer. The reactive layer contains about 5 atomic % to about 15 atomic % of Ti, about 5 atomic % to about 15 atomic % of Si, and about 2 atomic % to about 10 atomic % of V.

Abstract: The present invention is to provide a semiconductor device in which the generation of the eddy current in a metal flat plate is reduced, and the Q value of the RF circuit of the semiconductor device is improved even using the metal flat plate as a support.

Abstract: There are provided a multilayer ceramic capacitor and a board having the same. The multilayer ceramic capacitor may include: three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from each other and connected to lead portions of internal electrodes, wherein an interval between adjacent lead portions is 500.7 ?m or less, widths of one-side margin portions of the external electrodes in a length direction of the ceramic body that are not in contact with the corresponding lead portions are 20.2 ?m or more.

Abstract: A cast raw sheet for a capacitor film, prepared by heating and melting a polypropylene resin and extruding the resin from a T-die, wherein the polypropylene resin has: a weight average molecular weight, determined by gel permeation chromatography, of 100,000 or more and 500,000 or less; and a molecular weight distribution Mw/Mn of 7 or more, the resin contains 97% by mass or more of an isotactic component that is an extraction residue obtained by sequential extraction, and the cast raw sheet contains a ?-form in a proportion of 1% or more and less than 20%, the proportion being determined by X-ray diffraction intensity.

Abstract: MEMS and/or NEMS differential pressure measurement sensor comprising at least one first membrane and at least one second membrane, each suspended from a substrate, the first membrane having a face subjected to a reference pressure and a second face subjected to a first pressure to be detected, the second membrane having a first face subjected to the reference pressure and a second face subjected to a second pressure to be detected, a rigid beam of longitudinal axis articulated with respect to the substrate by a pivot link around an axis, said beam being solidly connected by a first zone to the first membrane and by a second zone to the second membrane such that the pivot link is situated between the first zone and the second zone of the beam, a sensor of measuring the movement of the beam around the axis, said sensor being arranged at least in part on the substrate.

Abstract: A method of forming thin film heater traces on a wafer chuck includes positioning a pattern, that forms openings corresponding to a desired layout of the heater traces, in proximity to the wafer chuck. The method includes sputtering a material toward the pattern and the wafer chuck such that a portion of the material passes through the openings and adheres to the wafer chuck to form the heater traces. A method of forming thin film heater traces on a wafer chuck includes sputtering a blanket layer of a material onto the wafer chuck, and patterning a photoresist layer utilizing photolithography. The photoresist layer covers the blanket layer in an intended layout of the heater traces, exposing the blanket layer in areas that are not part of the intended layout. The method removes the areas that are not part of the intended layout by etching, and removes the photoresist layer.

Abstract: The invention relates to a biaxially oriented electrical insulating film which is constituted of a base layer and at least one cover layer, the base layer containing a mixture from a polypropylene P1 and a polypropylene P2 which is different therefrom, the polypropylene P1 being a linear polypropylene and having an Mw/Mn>5 and a mesopentadene isotactic index of at least 95% and the polypropylene P2 having a long-chain branching.

Abstract: A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding strength between the chip-type ceramic component and an internal conductor or a surface electrode of the ceramic multilayer substrate is greatly improved and increased. The ceramic multilayer substrate includes a ceramic laminate in which a plurality of ceramic layers are stacked, an internal conductor disposed in the ceramic laminate, a surface electrode disposed on the upper surface of the ceramic laminate, and a chip-type ceramic component bonded to the internal conductor or the surface electrode through an external electrode. The internal conductor or the surface electrode is bonded to the external electrode through a connecting electrode, and the connecting electrode forms a solid solution with any of the internal conductor, the surface electrode, and the external electrode.

Abstract: The present invention provides a thin-film capacitor device having a charging circuit and a discharge circuit and capable of stably producing a constant voltage during discharging a thin-film capacitor by an inexpensive configuration. The thin-film capacitor device is characterized by a hybrid type for temporarily storing charge upon receiving DC current from the thin-film capacitor while the voltage becomes lowering, and for supplying DC current in a state of a DC/DC inverter having a base voltage remaining so that a discharge effect continues until the amount of storage in the thin-film capacitor completely runs out.

Abstract: The present application describes a multilayer ceramic electronic component including a ceramic body having a thickness greater than a width and includes a dielectric layers, and has upper and lower surfaces opposing each other in a thickness direction. First and second side surfaces oppose each other in a width direction, and first and second end surfaces oppose each other in a length direction. First and second internal electrodes are stacked with at least one of the dielectric layers interposed therebetween within the ceramic body in the width direction. A volume increasing part is disposed in a lower portion of the ceramic body in the thickness direction to allow a volume of a lower margin portion of the ceramic body to be greater than that of an upper margin portion thereof.

Abstract: In a ceramic electronic component, a first internal electrode includes a first opposed section and a first extraction section. The first opposed section is opposed to a second internal electrode with a ceramic layer interposed therebetween. The first extraction section is located closer to a first end surface than the first opposed section. The first extraction section is connected to a first external electrode. The number of cross-linked sections per unit area in the first extraction section is less than the number of cross-linked sections per unit area in the first opposed section.

Abstract: Semiconductor devices on a diffusion barrier coated metal substrates, and methods of making the same are disclosed. The semiconductor devices include a metal substrate, a diffusion barrier layer on the metal substrate, an insulator layer on the diffusion barrier layer, and a semiconductor layer on the insulator layer. The method includes forming a diffusion barrier layer on the metal substrate, forming an insulator layer on the diffusion barrier layer; and forming a semiconductor layer on the insulator layer. Such diffusion barrier coated substrates prevent diffusion of metal atoms from the metal substrate into a semiconductor device formed thereon.

Abstract: A ceramic material for capacitors uses multilayer technology of the general formula: Pb1?1.5a?0.5b+1.5d+e+0.5f)AaBb(Zr1?xTix)(1?c?d?e?f)LidCeFefSicO3+y.PBO wherein A is selected from the group consisting of La, Nd, Y, Eu, Gd, Tb, Dy, Ho, Er and Yb; B is selected from the group consisting of Na, K and Ag; C is selected from the group consisting of Ni, Cu, Co and Mn; and 0<a<0.12; 0.05?x?0.3; 0<b<0.12; 0?c?0.12; 0<d<0.12; 0?e?0.12; 0?f?0.12; 0?y?1, and wherein b+d+e+f>0.

Abstract: A supercapattery includes at least one tank filled with a conductive material. The conductive material has an arrangement-variable crystal lattice. The conductive material is graphite, grapheme, graphene oxide, a composite of graphite, metal, and a polymer, or a composite of graphene, metal, and a polymer. A magnetic member is mounted outside of the at least one tank. The magnetic member can be supplied with electricity to create a magnetic field. A method for controlling charge/discharge of a supercapattery includes supplying electricity to a supercapattery filled with a conductive material having an arrangement-variable crystal lattice. The crystal lattice of the conductive material supplied with electricity is transformed from an isotropic phase into an electro-nematic phase and absorbs electrons. An external magnetic field is created to return the crystal lattice of the conductive material from the electro-nematic phase to the isotropic phase, releasing the electrons.

Abstract: An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.

Abstract: A multilayer ceramic composition showing good characteristics, even when electric intensity on dielectric layers is high and a stacked number of a multilayer ceramic capacitor is increased, and an electronic device thereof. Said composition comprises: a perovskite compound ABO3, and with respect to 100 moles of said compound, 0.6 or more to 1.4 or less moles of Ra2O3 in which Ra is at least one of Dy, Gd and Tb, 0.2 or more to 0.7 or less moles of Rb2O3 in which Rb is at least one of Ho and Y, and 0.2 or more to 0.7 or less moles of Rc2O3 in which Rc is at least one of Yb and Lu, in terms of each oxide, 0.6 or more to 1.6 or less moles of Mg oxide in terms of Mg, and 0.6 or more to less than 1.2 moles of Si included compound in terms of Si.

Abstract: A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.

Abstract: An electrostatic capacitor device is disclosed including first and second spaced apart electrode structures separated by a dielectric structure in which the first and second electrode structures are each formed from a composite material which includes electrically conductive fibers in a binder matrix.

Abstract: In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.

Abstract: A multilayered ceramic capacitor includes a ceramic body in which a plurality of dielectric layers having an average thickness of 0.2 to 2.0 ?m are stacked; an active layer including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, to form capacitance; an upper cover layer formed above the active layer; a lower cover layer formed below the active layer and thicker than the upper cover layer; and first and second external electrodes covering both end surfaces of the ceramic body, wherein the dielectric layer is configured of dielectric grains, and when an average thickness of the dielectric layer is defined as td, an average thickness of the first and second internal electrodes is defined as te, and an average grain size of the dielectric grains is defined as Da, Da?td/3 and 0.2 ?m<te<(td)1/2 are satisfied.

Abstract: There is provided a multilayered ceramic capacitor, including: a ceramic body having a plurality of dielectric layers laminated therein; an active layer including a plurality of internal electrodes having the respective dielectric layers interposed therebetween; an upper cover layer; a lower cover layer; external electrodes; and a plurality of dummy electrodes, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as the thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as the thickness of the upper cover layer, a ratio of deviation between a center portion of the active layer and a center portion of the ceramic body, (B+C)/A, satisfies 1.063?(B+C)/A?1.745.

Abstract: A multilayer ceramic capacitor includes a ceramic body; first and second internal electrodes including first and second body parts overlapped with each other and first and second lead-out parts having an overlap region and exposed to one surface of the ceramic body; first and second external electrodes formed on one surface of the ceramic body; and an insulating layer formed on one surface of the ceramic body, wherein first and second connection surfaces extended from end portions of the first and second body parts to end portions of the first and second lead-out parts are inclined, and when half of length of the internal electrode is defined as A and length from a center of the ceramic body to a starting point of the connection surface is defined as B, B/A satisfies 0.03?B/A?0.90.