Abstract: A fluid cooling system comprising a pipe unit through which coolant fluid flows. The pipe unit is provided with one or more actuators at least a part of which is formed of shape memory alloy. The actuators are configured to extend by applied heat.

Abstract: A power supply assembly includes an enclosure body, a cover panel mounted to the enclosure body, a power supply unit, and a positioning element. The enclosure body includes a bottom panel, a rear panel, and a side panel. The power supply unit is mounted in the enclosure body and is prevented from moving in a first direction substantially perpendicular to the rear panel and a second direction substantially perpendicular to the side panel. The positioning element includes a plate body, a first positioning portion, and a second positioning portion. The power supply unit is sandwiched between the bottom panel and the plate body. The first positioning portion is for preventing the power supply unit from moving along a first direction substantially parallel to the bottom panel. The second positioning portion for preventing the power supply unit from moving along a second direction parallel to the bottom panel.

Abstract: An open frame chassis has a top opening and a bottom opening permitting ambient airflow. A plurality of modules, each enclosing electrical components in thermal contact with a heat sink area of their corresponding module, can each be inserted in the chassis. Ambient air may flow from the bottom opening across the heat sink area of each module to the top opening to passively cool the modules and electrical components. Key pins guide the modules into place and prevent incorrect insertion of a different type of electrical module not corresponding to the electrical connection of the chassis for that slot. Guide pins on corners of the modules mate with guide holes in the chassis to secure the module to the chassis and decrease vibration. Both sides of the chassis have side openings through which the fins of the modules in the end slots of the chassis may be exposed.

Abstract: A tower computer system includes a tower chassis; a mounting assembly installed at a middle section of a widthwise surface of the tower chassis and coupled to internal sides of the front and rear racks to form a vertical connecting board for providing a longitudinally perpendicular fixing position to a predetermined board, and acting as a longitudinal corresponding line formed by connecting the front rack to the rear rack for the connecting board of the mounting assembly, such that the transverse widthwise surface of the tower chassis is separated into a first assembling chamber with an opening aligned towards the left side and a second assembling chamber with an opening aligned towards the right side; and a first electric connection port, disposed in a vertical direction on the rear rack and at a position proximate to the mounting assembly, and situated in an area inside the first assembling chamber.

Abstract: An ultracapacitor energy storage system and in particular a system for packaging and connecting ultracapacitors (15) for energy storage purposes is described which is applicable in automotive and stationary applications. The ultracapacitors (15) in the system can be in series or parallel or a Combination of both. A controller, relays, voltage monitoring and isolation fault detection are used to regulate the system. The mechanical construction of frame and different pluggable modules (2 and 7) lead to an easy in and de-installation of the different parts. The different constructions are designed with a safe handling by the operator in mind.

Abstract: An exhaust device applied to an electronic device is described. Memory deformable elements of the exhaust device are heated to shrink, and meanwhile, guide vanes located on an air outlet are driven to rotate and swing back and forth between a left outlet position and a right outlet position, such that the exhaust device reciprocatively changes an outlet position without requiring any external power.

Abstract: A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.

Abstract: The present invention relates to a cooling system. More particularly, the present invention relates to a cooling system for removing dust from air being drawn for cooling heat generation components of an electronic product, for improving convenience in maintenance or repair of the electronic product.

Abstract: Provided is a semiconductor module. The semiconductor module includes a substrate including a first surface and a second surface opposite to the first surface. A semiconductor device is disposed on the first surface of the substrate. An airflow guide is disposed on the second surface of the substrate. The airflow guide includes a plate including an end portion distantly from the second surface.

Abstract: A mounting apparatus for a fan includes an accommodating member, a bracket rotatably received in the accommodating member, a latching tab contractively exposed through the bracket, and a torsion spring. The accommodating member defines a latching hole for the latching tab. The torsion spring is connected between the accommodating member and the bracket. The fan is mounted to and received in the bracket. When the bracket is rotated to a predetermined position in the accommodating member, the latching tab is latched in the latching hole, and the torsion spring is deformed, these two elements operate to absorb and nullify any vibration from the working fan.

Abstract: A motherboard includes a first connector, a fan device comprising a fan and a second connector connected to the fan, and a fan control circuit. The fan control circuit includes a primary power terminal connected to a first power terminal of the motherboard, a standby power terminal connected to a second power terminal of the motherboard, a voltage output terminal, and a detection terminal connected to a power state signal terminal of the motherboard to receive a power state signal. When the motherboard is turned off, the fan control circuit is configured to output the voltage of the second power terminal of the motherboard to the power terminal of the fan for a predetermined time according to the power state signal, to make the standby power terminal supply a working voltage to the fan to maintain its rotation for the predetermined duration.

Abstract: A rackable server system includes a rack, a fan assembly mounted to a rear of the rack, and a number of server units slidably mounted in the rack. The fan assembly includes a frame defining a number of air passages, a number of door plates mounted to the frame and correspondingly arranged in the passages, and a number of fans fixed to a rear of the frame. The air passages are correspondingly aligned with the fans. The server units are correspondingly aligned with the air passages and resist against the door plates to pivot the door plates, thereby uncovering the air passages.

Abstract: The present invention relates to a device for eliminating dust for a computer and a control method thereof. A control unit and a heat-radiating fan controlled by the control unit are provided in the main body. In addition, there is provided a cooling fin through which air stream formed by the heat-radiating fan passes. While the air stream formed by the heat-radiating fan passes through the cooling fan, heat is exchanged between the air stream and the cooling fin and the air stream is then exhausted to the outside of the main body. A vibration-generating element for generating vibration supplied with power is provided at one side of the cooling fin. The control unit controls the driving of the vibration-generating element. Vibration of the vibration-generating element is transmitted to the cooling fin to shake off dust accumulated on the cooling fin. Then, the air stream formed by the heat-radiating fan is exhausted to the outside of the main body together with the dust.

Abstract: An image reading device, and more particularly an image reading device having a cooler capable of preventing introduction of impurities and reducing vibration and noise. The image reading device includes a body having a reading unit, and a cooler disposed in the body cooling the reading unit. The cooler includes a housing, a cooling unit disposed in the body and moving air into the body, a filter member disposed apart from the cooling unit and removing dust contained in the air, and a damper member having one side supported by the filter member and the other side supported by the cooling unit.

Abstract: A portable terminal includes a cooling structure configured to allow air flow into the portable terminal. A display support frame encompasses an opening and is arranged between the display and the main board including heat generating components of the portable terminal. The display support frame support's the display and a window of the portable terminal and has at least one air injection opening. The portable terminal may include a heat dissipating plate encompassing at least one hole therethrough and arranged on at least a portion of the opening of the display support frame. The portable terminal may include a structural body to dissipate heat and to be connected to a battery of the portable terminal.

Abstract: A frequency converter includes a housing, which is designed and envisaged for the peripheral assembly on an electric motor. The base of the housing is provided in the middle region on the outside with longitudinal ribs and is connected to heat-producing components of the power circuit of the frequency converter, is provided in outer regions with cooling ribs which are arranged on the outside transversely or obliquely to the longitudinal ribs, and on the inside is connected in a heat-conducting manner to heat-producing components of the input circuit and/or output circuit.

Abstract: An enclosure for electronics includes a chassis and an interface connector positioned within the chassis and configured to provide power. A fan shelf module is received within the chassis and has at least one fan to provide air flow through the chassis. The fan shelf module includes a pinout connector along a horizontal or vertical line of symmetry and configured to engage the interface connector and receive power therefrom, such that the fan shelf module is selectively installed in one of two opposing directions allowing a fan air flow direction to the chassis to be selected as either pulling air or pushing air through the chassis depending on the installed direction of the fan shelf module.

Abstract: A flow control device and a related cooled electronic system are provided. The electronic system comprises a first heat dissipation component and a second heat dissipation component. The flow control device controls an amount of an air flow to the first heat dissipation component and the second heat dissipation component. In one illustrative embodiment, the flow control device comprises: a memory metal component coupled to the first heat dissipation component and the second heat dissipation component and a movable component comprising a first end and a second end. The first end is coupled to a point between two ends of the memory metal component and the second end is movable with respect to the first end. In response to a temperature difference between the first heat dissipation component and the second heat dissipation component, the second end approaches the first heat dissipation component or the second heat dissipation component.

Abstract: Gimbal system, including apparatus and methods, with forced flow of external air through a channel to remove heat. The system may comprise a support portion including at least one electronic component and defining a channel, a gimbal assembly pivotably connected to and supported by the support portion, and a payload pivotably orientable with respect to the support portion by the gimbal assembly. The support portion alone or collectively with the gimbal assembly may define a chamber in which the electronic component is disposed. The support portion may include a forced-air device configured to drive flow of external air through the channel, thereby removing heat transferred to the channel from the electronic component.

Abstract: An apparatus for fixing a fan on a specific surface is disclosed, which comprises: a bracket, formed with a hollow section; a plurality of side panels, disposed on the specific surface as an array while enabling each side panel to be disposed perpendicular to the specific surface and the bracket; a first clamping piece; and a second clamping piece. The fan is sandwiched between any two neighboring side panels while enabling an end of the fan module where the first clamping piece is mounted to face toward the hollow section. The first clamping piece is configured with a spring that is capable of moving relatively to the fan so as to enable a first protrusion formed on the spring to inset into the hollow section when the spring is moved to a first position, and detach from the hollow section when the spring is move to a second position.

Abstract: Methods of providing arc resistant switchgear enclosures for dry-type transformers are provided. The enclosures have one or more arc-resistant features, including arc channels, arc fault dampers, and arc fault plenums. In a preferred embodiment, the method comprises providing a base structure with a dry-type transformer seated thereon, providing walls and a roof, wherein at least the front wall contains at least one longitudinal seam covered by an arc channel.

Abstract: A server cabinet adapted for receiving servers therein includes a top plate and a bottom plate opposite to the top plate, a left side plate and a right side plate connecting with the top and bottom plates respectively, and a curtain assembly disposed at a front side of the server cabinet. The curtain assembly includes a pivot and a curtain coiled on the pivot. The curtain assembly defines through holes therein. The curtain is capable of spreading out from the pivot toward the bottom plate to thereby cover the front side of the server cabinet.

Abstract: The invention relates to a method for regulating a cooling system for cooling electrical built-in devices housed in control panels or racks by means of cooling units assigned thereto, through which a liquid cooling medium, cooled down from a return temperature to a flow temperature by means of a cooling apparatus of the cooling system flows, wherein a cooling power for cooling the built-in devices can be regulated by a primary reference variable according to specification. Energy-efficient cooling is achieved in that the flow temperature is variably adjusted according to a cooling power demand in the region of the built-in devices, wherein the primary reference variable is formed from the cooling power demand in the region of the built-in devices.

Abstract: An electronic device includes a main body and a rotating base. The rotating base has a first vent and is pivoted at the main body and adapted to rotate between an operating position and a retracted position relatively to the main body. When the rotating base is located at the operating position, the first vent is exposed out of the main body, and when the rotating base is located at the retracted position, the first vent is retracted into the main body.

Abstract: A computer system includes a computer case, a cover, and an air duct. The computer case includes a display, a housing connected to the display, a motherboard attached to the housing, and a fan module. The motherboard includes a heat generating component. An input opening and an output opening are defined in the cover. The output opening corresponds to the fan module. The air duct is mounted over the heat generating component. The air duct includes a top plate substantially parallel to the motherboard and a first side plate extending from the top plate. The first side plate is substantially perpendicular to the top plate. The first side plate defines a plurality of first airflow holes corresponding to the input opening. The top plate defines a plurality of through holes corresponding to the heat generating component.

Abstract: An electronic device including a main body, a rotating base, a motherboard and a driving module is provided. The rotating base has a first vent. The rotating base is pivoted to the main body and suitable for being rotated between an operating position and a retracting position. When the rotating base is located at the operating position, the first vent is exposed from the main body, and when the rotating base is located at the retracting position, the first vent is retracted in the main body. The driving module includes a controlling element and a first locking element. The controlling element is disposed on the main body and suitable for moving between an enable position and a disable position. The first locking element is connected to the controlling element, and the controlling element drives the first locking element to position the rotating base.

Abstract: An exemplary container data center includes a container, servers received in the container; and a ventilating system for cooling the servers. The ventilating system includes a filter, an exhaust pipe and a blower. The filter includes a chamber and filtering fluid received in the chamber for dissolving dust in ambient air. The chamber defines an air inlet for entering the ambient air and an air outlet. The exhaust pipe has one end coupled to the air outlet of the filter and another end communicating an interior of the container. The blower drives the ambient air out of the filter to flow along the exhaust pipe to the container to cool the servers.

Abstract: A heat dissipation device is used for heat dissipating for an electronic element. The heat dissipation device includes a heat sink and a buffer arranged between the heat sink and the electronic element. The buffer is made of elastic and thermally conductive material.

Abstract: A thermal management system for an electronic device comprising thermal management controller configured to adjust a temperature level of at least a portion of an interior of a housing of the electronic device based on a signal indicative of a change in an electrostatic field exterior to the housing of the electronic device.

Abstract: A liquid cooling system includes a monolith that is configured to be coupled to a motherboard of the computer. The monolith may be monolithic planar body having a first surface and an opposite second surface, and may include a heat absorption region and a heat dissipation region. The heat absorption region may be at least one location on the monolith that is configured to be in thermal contact with a heat generating component of the motherboard, and the heat dissipation region may be at least one location on the monolith where a liquid-to-air heat exchanger is attached to the monolith. The liquid cooling system may also include a channel extending on the second surface of the monolith and a pump that is configured to circulate the liquid coolant through the channel. The channel may be a trench on the second surface of the monolith that is configured to circulate a liquid coolant between the heat absorption region and the heat dissipation region.

Abstract: A modular processing module is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side in the set of processing module sides couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system.

Abstract: Systems and methods for direct cooling of transceivers, including transceivers used in electrical and optical communications systems. An electrical system includes a transceiver module with a housing that contains a plurality of apertures to allow air flow into and out of the transceiver module. The transceiver includes an internal heat sink located within the housing of the transceiver module, where the internal heat sink is thermally coupled to at least one internal component of the transceiver module. The electrical system also includes a cage for receiving and electrically connecting to the transceiver module.

Abstract: An electronic control device for controlling an electric actuator, including an air passage within a casing that is fixable to an actuator housing of the electric actuator. A circuit board is accommodated in the casing. A projecting portion is formed in the casing, on which a region of the circuit board in which the heat generating part is installed is seated. A vent hole extends through the casing to communicate to an outside of the casing. A communication hole extends through the casing to communicate to an inside of the actuator housing. The air passage allows air to flow between the vent hole and the communication hole when the electric actuator is driven in a state that the casing is fixed to the actuator housing.

Abstract: A container data center includes a mobile container and a number of server systems. The mobile container includes a bottom wall, an inner container portion and an outer container portion. The inner container portion includes a first top wall opposite to the bottom wall, and a number of first sidewalls connected between the first top wall and the bottom wall. The outer container portion includes a second top wall facing the bottom wall, and a number of second sidewalls connected between the second top wall and the bottom wall. The second sidewalls surround the inner container portion. A passage is formed between the first and second top walls and between the first and second sidewalls. The second top wall and the second sidewalls define a number of through holes. The server systems are installed in the inner container portion.

Abstract: An exemplary computer case includes an external shell, a circuit board received in the external shell, and a dehumidification device. The circuit board includes a PCI socket providing an auxiliary power supply when the computer shuts down but the computer case retains electrical connection with an external AC power source. The dehumidification device includes a dehumidification card received in the PCI socket for obtaining the auxiliary power supply therefrom and a remote device. The dehumidification card includes a fan for generating airflow to remove moisture from the computer case and a sensor detecting a humidity inside the computer case. The remote device includes a display unit for displaying the result. When the humidity exceeds a predetermined value, the computer is not powered up until the fan evacuates the excess moisture from the computer case and the humidity falls below the predetermined value.

Abstract: A heat dissipation device is used to dissipate heat generated by a number of memory chips of a motherboard. The heat dissipation device includes two brackets attached to the motherboard and at opposite sides of the memory chips, are a support, and a fan. The support includes a fixing plate and two clamping plates extending from opposite ends of the fixing plate. The clamping plates are rotatably mounted to the brackets, and are positioned above the memory chips. The fan is sandwiched between the clamping plates or mounted to the fixing plate.

Abstract: A server assembly includes a first server and a first airflow guiding pipe. The first server comprises a front wall. An input hole is defined in the front wall. A first input opening and a first output opening are defined in the first airflow duct. The first output opening corresponds to the input hole so as to guide airflow into the inner of the first server to dissipate heat generated by the first server. The first airflow guiding pipe is connected to the first input opening of the first airflow duct, the first airflow guiding pipe is configured to receive and guide airflow into the first airflow duct.

Abstract: Improved electronic device protection enclosures are generally described. In an example, an illustrative apparatus for protecting an electronic device is provided. The apparatus includes a drive enclosure structure, a gripping pad, and a deformation mechanism. The drive enclosure structure includes a sidewall. The gripping pad is located on the sidewall and includes a plurality of angled slots. The deformation mechanism is connected to the sidewall and configured to facilitate selective deformation of the gripping pad.

Abstract: The present invention pertains to a cage for thermal management and housing an electric module comprising a cage housing and having a top, bottom and side walls joined to form an interior cavity and the side walls defining a width of the interior cavity. The top wall may have an air inlet port and an air outlet port and the air inlet and outlet ports spaced apart by a length. The length may be most or all of the width, so that air entering the inlet port will travel over a portion of a side of an electronic module mounted in the cavity prior to exiting the outlet port.

Abstract: This electronic system comprises : a fixed structure including a protective casing and electronic equipment positioned inside the protective casing, a mobile structure capable of performing a movement relatively to the fixed structure. The mobile structure includes at least one aperture forming a means for suction of air from the outside of the casing towards the inside of the casing when the mobile structure is moving relatively to the fixed structure, in order to cool the electronic equipment.

Abstract: A heat generating component (3) is mounted on one surface of a circuit board (2). A heat release member (4) is disposed between the one surface and an opposite wall (12) of a housing (1). The heat release member (4) has a plate (41) that extends in a specified direction and is in contact with the heat generating component (3), and fins (42) that project from the plate (41) toward the opposite wall (12). In a region of the opposite wall (12) of the housing overlapping with the heat release member (4), an air inlet (1c) is provided so as to extend in the specified direction. The heat release member (4) is, at both end portions thereof in the specified direction, in contact with the opposite wall (12) via heat-conductive spacers (9), and a gap (8) is formed between the fins (42) and the opposite wall (12).

Abstract: According to one embodiment, a television apparatus includes a main body, a housing, an exothermic component, and a heat transfer mechanism. The main body has a display screen, and is used in a first orientation where one side of the display screen is positioned on the upper side and in a second orientation where another side is positioned on the upper side. The housing at least partially constitutes the outline of the main body. The exothermic component is housed in the housing. The heat transfer mechanism includes a heat receiving portion that receives heat from the exothermic component, a heat releasing portion that releases heat, and a heat transferring portion that houses a medium to transfer heat from the heat receiving portion to the heat releasing portion. In both the first orientation and the second orientation, the heat receiving portion is located lower than the heat releasing portion.

Abstract: A container data center includes a container, a number of shock absorbers installed in the container, and a support plate installed on the shock absorbers. Each shock absorber includes a support bracket and two damping elements positioned at opposite ends of the support bracket. Each damping element includes a first connecting end fixed to a corresponding end of the support bracket, and a second connecting end fixed to the container. The first connecting ends of the damping elements are movable relative to the corresponding second ends of the damping elements through overcoming resistance. The support plate is installed on the support bracket and can support a number of servers.

Abstract: The present disclosure is generally directed to efficiently cooling converter and inverter components of a drive system. Present techniques relate to a motor drive duct system that facilitates efficient cooling and access to motor drive components. The motor drive duct system includes duct channel paths that are parallel and adjacent to one another. The duct system includes a converter section that houses a converter heat sink, an inverter section that houses an inverter heat sink, an exhaust section, and an air inlet section. The converter section and the inverter section are configured to be attached and detached from each other at end sections that are angled to receive one another. Further, the inverter section, converter section, and air inlet section are configured to roll into and out of a cabinet, which facilitates access to field wiring.

Abstract: Heat sinks for distributing a thermal load are disclosed that include: a bottom plate; a front top plate; a back top plate; and a plurality of heat-dissipating fins connected to the bottom plate, the front top plate, and the back top plate, wherein the front top plate and the back top plate are separated by a predetermined distance.

Abstract: The present invention relates generally to tuning the flow of cooling air across converter and inverter heat sinks in a motor drive system. More specifically, present techniques relate to motor drive duct systems having parallel cooling air duct channels dedicated to providing cooling air for a converter heat sink and an inverter heat sink, respectively. In particular, a first duct channel through an inverter duct and a converter duct is dedicated to providing cooling air to the converter heat sink without cooling the inverter heat sink, whereas a second duct channel through the inverter duct and the converter duct is dedicated to providing cooling air to the inverter heat sink without cooling the converter heat sink.

Abstract: For improving a cooling efficiency of a display panel in a flat-type image display, various substrates and an image display element are disposed within a thin-sized housing thereof, including: a display panel; a chassis supporting the display panel from a rear surface side thereof; a front surface-side cover on a front side of the display panel; a rear surface-side cover on a rear side of the display panel; an image display element connected to the display panel; a display driver substrate connected to the display panel, and on a surface thereof opposite to the chassis are provided circuit parts; a power source substrate, supplying driving power to the display driver substrate and the image display element, and on a surface thereof opposite to the chassis are provided circuit parts thereof; and a first insulator board opposite to the display driver substrates and the power source substrate of the chassis.

Abstract: A kit for providing front-access cable terminations for rear-access shelf unit mounted in a rack system may comprise a terminal block panel, a terminal block, a set of extension cables, a rear panel, and a baffle. The terminal block panel may be configured to mount to the shelf unit. The terminal block may be mounted to the terminal block panel to provide front-access terminations for the shelf unit. The set of extension cables may provide electrical connection between the terminal block and one or more terminals disposed on a back plane associated with the shelf unit. The rear panel may be configured to attach to the shelf unit and to cover the set of extension cables. The baffle may be configured for installation in the rack system above the shelf unit and removable for access to the front-access terminations. The baffle may be configured to direct air flow rising from the rear-access equipment to the rear of the rack.

Abstract: A server cabinet adapted for receiving servers therein includes a top plate, a bottom plate opposite to the top plate, a left side plate and a right side plate connecting with the top and bottom plates respectively, and a front side plate disposed between the top and bottom plates. The front side plate defines through holes therein. A total area of the through holes in an upper half portion of the front side plate is different from a total area of the through holes in a lower half portion of the front side plate. The front side plate is rotatable in a plane defined by the front side plate.

Abstract: This electronic device includes a filter circuit including a coil, a resistor, and a condenser, and a heat radiating member radiating heat generated from the coil and the resistor, arranged in proximity to the coil and the resistor of the filter circuit.