Abstract: A heat exchanger apparatus is provided and includes a motor controller housing, supportively disposed with a turbofan within an aircraft engine nacelle, in which motor controller components are mounted, a fuel cooled cold plate, forming a surface of the housing, which forms a heat transfer path by which motor controller component generated heat is dissipated during first conditions and an air cooled cold plate, disposed in thermal communication with the fuel cooled cold plate, which extends into a flow path of nacelle air generated by the turbofan to form an extended heat transfer path by which the motor controller component generated heat is dissipated during second conditions.

Abstract: A computer system includes an enclosure having an air intake, a heat sink and an electronic element. The heat sink includes a first heat dissipating portion, a second heat dissipating portion, and a third heat dissipating portion interconnecting the first and second heat dissipating portions. Each of the first heat dissipating portion, second heat dissipating portion, and third heat dissipating portion includes a number of fins and passages formed between each two adjacent fins. The passages of the first heat dissipating portion face toward the air intake. A space is maintained between the first heat dissipating portion and the second heat dissipating portion, and the electronic element is mounted in the space.

Abstract: A forming method for a heat dissipating structure is provided. According to the method, an extrudate is formed by extrution molding, wherein the extrudate includes protruding bending portions extending in parallel. Fins are extruded monolithically on the bending portions. One or more cut channels are formed by cutting the fins and the extrudate with a cutting tool. The cutting tool cuts the fins for forming a notch on each fin at first, and then cuts the bending portions for forming a cut-through slot on each bending portion, wherein each cut-through slot is formed for cooling air flowing through two side of the extrudate. By cutting the bending portions and the fins by the cutting tool at the same time, a large number of cut-through slots are formed in despite of the existence of the fins, and the performance of heat dissipation is enhanced.

Abstract: A fan duct includes a top plate, two side plates extending downward from opposite sides of the top plate, and plural guiding plates extending downward from the top plate. The side plates and the top plates cooperatively define an air inlet and an air outlet. The air inlet and the air outlet are located at another two opposite sides of the top plates, respectively. The guiding plates are located between the side plates and adjacent to the air outlet. Each of the guiding plates forms a guiding face facing the air inlet. The guiding face is obliquely oriented with respect to the top plate. An electronic device incorporating the fan duct is also provided.

Abstract: A power converter design is disclosed with a novel approach to thermal management which enhances the performance and significantly reduces the cost of the converter compared to prior art power converters. The invention minimizes the heating of one power component by another within the power converter and therefore enables the power converter to work at higher power levels. Essentially, the power converter uses a heatsink having a high length to width ratio, a linear array of power components thermally coupled to the heatsink parallel to the long axis of the heatsink and a heat removal system which produces the highest cross sectional thermal flux perpendicular to said long axis. In addition, a number of ancillary thermal management techniques are used to significantly enhance the value of this basic approach.

Abstract: A case includes a box, a top cover, a first airflow guide member, and a second airflow guide member. The box has an opening sealed by the top cover. The first airflow guide member and the second airflow guide member are fixed on at least one of the top cover and a side plate of the box. The first airflow guide member and the second airflow guide member are spaced from each other, and cooperatively define a guide channel. The box defines an inlet and an outlet communicating with the guide channel.

Abstract: A chassis extension module includes an extension housing structure and a support structure. The extension housing structure is to be attached to a housing structure of another module. Attachment of the extension housing structure to the housing structure of the other module expands an inner volume of an assembly.

Abstract: A power converting apparatus includes a housing, a cylindrical capacitor, and a cylindrical capacitor cover. The housing includes a housing base, a main body, and an air duct. The main body includes a plurality of electronic components on a first surface of the housing base. The air duct is disposed on a second surface of the housing base. The capacitor penetrates through the housing base so that a part of the capacitor is disposed in the main body while a rest part of the capacitor is disposed in the air duct. The capacitor cover is disposed on the housing base and covers the rest part of the capacitor. The capacitor cover includes an elastic material and an inner surface. The capacitor cover includes a groove disposed on the inner surface in an axial direction of the capacitor cover.

Abstract: A housing includes a first chamber having an exhaust aperture to provide fluid communication with an outside environment, a wall disposed in the first chamber and containing an electrical component, wherein a thermal energy generated by the electrical component is transferred from the first chamber to the outside environment through the exhaust aperture, a second chamber formed adjacent the first chamber and including a control means for the electrical component, and a means for selectively providing access to the first chamber and the second chamber.

Abstract: A communications cabinet includes a housing defining a location for mounting communications equipment, the housing having a wall formed of a first material with a first penetration resistance, a vent opening in the wall, and a door. At least one plate of material having a second penetration resistance greater than or about equal to the first penetration resistance is mounted between the vent opening and the location for mounting the communications equipment, and the plate is positioned to stop projectiles larger than a given size from traveling in a straight line from the at least one vent opening to the location for mounting communication equipment while leaving an airflow path from the vent opening to the location for mounting the communications equipment that passes around at least one edge of the plate of material through a gap between the at least one plate and the wall.

Abstract: According to one embodiment, an antenna cooling system, comprises a first cylinder and a second cylinder substantially concentric to the first cylinder. The first and second cylinders form a chamber between the first cylinder and the second cylinder. The chamber is configured to receive a fluid flow. A plurality of fins are disposed within the chamber and rigidly coupled to the first cylinder and the second cylinder. The plurality of fins are configured to transmit thermal energy to the fluid flow. A plurality of ports are coupled to the second cylinder. Each port is configured to receive an antenna unit.

Abstract: An electronic device enclosure for suppressing Electro-Magnetic Interference (EMI) includes a first plate defined on a first plane, a second plate defined on a second plane and a number of polygonal holes defined in the first plate at an angle of orientation. The second plane is substantially perpendicular to the first plane. The angle of orientation of the number of polygonal holes in the first plate is set according to a number of maximum dimensions in a direction substantially perpendicular to the second plane. The angle of orientation is defined such that there are a minimum number of maximum dimensions.

Abstract: The set-top box includes an outer casing having micro-perforations, an interior bottom frame having a centrally located heatsink, a circuit board on the bottom frame and a louvered heatsinking element over the circuit board and in thermal contact with the heatsink.

Abstract: A cover is provided on one surface of a rack of an electronic device provided with an outlet, and includes a sheet that guides exhaust air exhausted from the outlet in one direction along the one surface. An electronic device rack and an air conditioning system are also disclosed.

Abstract: This storage unit includes a storage portion that stores power, a converter that converts power, a first temperature detection portion arranged in the vicinity of the converter, and a housing that houses at least the converter, the first temperature detection portion, and the storage portion.

Abstract: The present invention provides for repeatedly pulsing coolant through a first channel exposed to heat-generating computer components. The pulsing involves a relatively low baseline coolant flow rate with repeated excursions to a relatively high expulsion coolant flow rate.

Abstract: A chassis for a plurality of computers for use in a data center, the chassis at least one extensible fin, the fin either extensible perpendicularly from the front of the chassis or extensible parallel with the front of the chassis.

Abstract: A heat sink having auto switching function, a heat sink system and a heat sinking method are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.

Abstract: A number of structural modules are configured to be secured together and to be secured to a foundation. Each of the structural modules is without one or more sidewalls, such that when the structural modules are secured together they form a building structure that encloses an open region which continuously extends through interiors of the structural modules. Each of the number of structural modules is structurally formed to be independently transported. A power module is configured to be secured to one of the structural modules and to the foundation. The power module is defined as an enclosed structure and is structurally formed to be independently transported. The power module is equipped with electrical components for supplying and distributing electrical power to a pre-defined layout of data equipment to be deployed within the open region of the building structure formed by the number of structural modules.

Abstract: The present invention provides a display apparatus including a display panel, and a plurality of adjustment mechanisms respectively arranged for a plurality of areas on a rear surface of the display panel and configured to adjust a temperature of the display panel for each of the areas, each of the plurality of adjustment mechanisms including a heat radiating unit mounted on a rear surface of the display panel and configured to form a gas flow passage on the rear surface of the display panel, and a changing unit configured to change a flow rate of a gas flowing into the gas flow passage in accordance with a temperature of an area on the rear surface of the display panel which corresponds to the heat radiating unit.

Abstract: A method of cooling electronic equipment mounted in an enclosure includes routing air from beneath the enclosure to an upper portion of the enclosure, selectively routing air to electronic equipment mounted in the upper portion of the enclosure, and exhausting heated air from the electronic equipment to an enclosure outlet. In addition, preventing recirculation includes installing and arranging an internal air duct within an enclosure in such a manner that recirculation is prevented, and balancing air temperature around an enclosure includes using an internal air duct.

Abstract: A data center includes a housing, a number of heat units arranged in the housing, and a fan mounted in the housing. When the data center runs, cool air comes into the housing through the front wall, the back wall, and the bottom wall of the housing, for cooling the heat units. The heated air is vented out of the housing through the top wall by the fan.

Abstract: An enclosure for electronic assemblies is provided, with a first deck surface and a first side wall with a short side and a long side and a second deck surface, disposed such that it faces the first deck surface, and a second side wall, disposed such that it faces the first side wall, with a short side and a long side, as well as with a first venting element, which extends in the direction of the long side along one of both side walls, and a plurality of plug-in slots for electronic assemblies that are arranged in parallel to one another, whereby the electronic assemblies are disposed, in the plugged-in state, vertically to both long sides of both side walls, and the first deck surface includes, along the end oriented toward the first side wall, a first opening and the first venting element, on the enclosure's outer side of the first deck surface, is disposed at least partially above the first opening, and the first and/or the second deck surface includes a second opening, along the end that faces the second

Abstract: An air duct installed in a chassis is configured to have a heat dissipating device mounted thereon during shipping. The heat dissipating device defining a number of mounting holes corresponding to a number of fixing members extending from a surface of the air duct to accomplish the mounting. Thereby, the heat dissipating device may be conveniently and securely packaged and transported with the air duct and chassis.

Abstract: An electrical control cabinet includes a casing, a plurality of heat elements, a heat exchanger, and two fans. The casing includes a first receiving portion and a second receiving portion. The first receiving portion communicates outside of the casing through the heat exchanger. The fans are received in the second receiving portion. The heat elements include a plurality of first heat members received in first receiving portion and a plurality of second heat members received in the second receiving portion. The first heat members is isolated from airborne contaminants and moisture. The first heat members in the first receiving portion disperse heat by the heat exchanger, and the second heat members in the second receiving portion disperse heat by the fans.

Abstract: A data center includes a server module. The server module includes a housing, and a number of heat-generating elements arranged in the housing. The housing includes a front wall, a back wall, and left and right sidewalls. When the server module runs, cool air comes into the housing through the front wall and the back wall, for cooling the heat elements, then the heated air in the housing is vented out of the housing through the left and right sidewalls by a number of fans.

Abstract: A data center includes a housing, a number of server modules arranged in the housing, a number of cooling units arranged in the housing and above the server modules, and a fan mounted in the housing near the cooling units. When the data center is operating, heated air is driven to the cooling units by fans, and then the cooled air is driven to enter the server modules.

Abstract: Provided is an electronic apparatus capable of preventing an unnecessary space from being made inside the housing, and of improving ventilation efficiency of the air flowing along the power circuit. An electronic apparatus includes: a power circuit; a power circuit case (4) housing the power circuit; and a housing (2) for housing the electronic apparatus and the power circuit case (4). The power circuit case (4) includes a rear wall portion (43) having an air outlet (43a) formed therein, and the housing (2) having an opening (2a) formed therein, a shape of the opening corresponding to the rear wall portion (43) of the power circuit case (4). The power circuit case (4) is arranged such that the rear wall portion (43) is exposed through the opening (2a).

Abstract: The main claim involves a system that ensures a self-guiding, electronic positioning of a secondary coil in a vehicle, without the aid of indicators or kinematic or mechanical aids, in relation to a primary coil that is fixed in a structure, in order to guarantee a transfer of energy with over 90% efficiency without the disadvantages of moving, frictional and elastic components in terms of energy consumption, functional safety and wear. To achieve this aim, the coil housing in the structure fulfills the role of an electronics housing, reflective element and cooling element thanks to the choice of material used, the surface and the inner supports and can thus be retrofitted, as a single installation on the structure in the form of an operation-ready complete package, to any flat base with an electric connection.

Abstract: DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.

Abstract: A system for providing computing capacity includes a base module and two or more fin modules coupled to the base module. At least one of the fin modules includes one or more fins and two or more computer systems coupled to the fins. At least one of the fins to which the computer systems are coupled extends from the base module such that the fin has a primarily vertical orientation. An electrical power bus in the base module supplies power to computer systems of the fin modules. The site of operation may be indoors, out of doors, or in a limited shelter.

Abstract: A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.

Abstract: A monolithic combination radiator grill and retention structure for computer add-in cards includes a longitudinally extending rectangular frame defining a longitudinally extending rectangular aperture. Transversely extending crossbars traverse the aperture. The crossbars are spaced so as to leave transversely extending gaps therebetween. The crossbars have transversely extending and upwardly facing grooves. Each of the grooves is dimensioned for receiving and retaining an end of a computer add-in card or extension to an add-in card.

Abstract: In a first aspect, the present invention provides an air inlet cover (1) comprising a grille (2) having a plurality of radial elements (3) radiating from a center of said grille (2), each said radial element (3) comprising a vane (4) having a leading edge (5) for positioning further from a fan and a trailing edge (6) for positioning closer to a fan, the leading edge (5) of each said vane being offset from the respective trailing edge (6) thereof by substantially the same angular amount (?) for each said vane (4), whereby the vanes are pitched more steeply closer to the center of said grille (2) than remote from the center of said grille, and a circumferential element (7) comprising a bell-shaped mouth enclosing said vanes (4) and having a plurality of apertures (8) formed in a surface thereof, each respective one of said apertures (8) having a first edge (9) parallel to the pitch of a first respective vane closer to the center of said grille and a second edge (10) parallel to the pitch of a second, adjacent r

Abstract: An enclosure of an electronic device includes a front panel including a plurality of first air guiding boards and a plurality of second air guiding boards. The plurality of first air guiding boards arrange a first air guiding layer, and the plurality of second air guiding boards arrange a second air guiding layer. A first gap is defined between adjacent two of the plurality of first air guiding boards, a second gap is defined between adjacent two of the plurality of second air guiding boards, and a third gap is defined between the first air guiding layer and the second air guiding layer. Each second air guiding board is located opposite to the first gap. An absorbing layer is placed on a side surface of each second air guiding board towards the first gap. The first gap communicates with the second gap and the third gap.

Abstract: A method and apparatus for thermally processing a substrate is provided. In one embodiment, a method for thermally treating a substrate is provided. The method includes transferring a substrate to a chamber at a first temperature, the chamber having a heating source and a cooling source disposed in opposing portions of the chamber, heating the substrate in the chamber during a first time period to a second temperature, heating the substrate in the chamber to a third temperature during a second time period, and cooling the substrate in the chamber to a fourth temperature that is substantially equal to the second temperature during the second time period, wherein the second time period is about 2 seconds or less.

Abstract: A computer system is disclosed having an enclosure having a plurality of components. The computer system further includes a first chamber including a first set of cooling devices; and a second chamber including solely a set of components and a second set of cooling devices. The second chamber is located adjacent to the first chamber, and the set of components includes components not included in the first chamber. The set of components includes solely a plurality of storage components selected from the group consisting of a CD-ROM and a hard drive. Air flow is unidirectional from a front side of the enclosure to a rear side of the enclosure. Further, air flow is prevented from flowing between the first chamber and the second chamber by a solid separation mechanism there between. The first chamber has an air flow path independent of the air flow path of the second chamber.

Abstract: An exemplary electronic device includes a cover, a circuit board and a driving module both mounted on the bottom cover, an electronic component fixed on the circuit board, and a top cover covering the bottom cover. The driving module has a rotating shaft adapted for supportively driving an optical disk to rotate. The electronic component generates heat during operation. Through holes are defined in the top cover and located at a periphery of the rotating shaft. When the optical disk is mounted on the rotating shaft and driven to rotate by the rotating shaft, air heated by the electronic component in the electronic device can flow out of the top cover via the through holes, and rotation of the optical disk facilitates such airflow.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: A computer system has a chassis, a plurality of interconnected panels mounted on the chassis in a manner defining an interior space at least partially encompassed by the panels, a circuit assembly, an electrically-powered fan within the interior space, and an energy conversion device mounted within the interior space. One or more of the panels has an airflow opening therein. The circuit assembly is mounted on the chassis within the interior space and includes a heat generating system component. The heat generating system component includes a surface from which energy in the infrared (IR) electromagnetic spectrum is emitted during operation thereof. The energy conversion device is configured for converting the emitted infrared energy to electrical energy and is electrically connected to the electrically-powered fan for providing the electrical energy thereto.

Abstract: A container that holds rack mountable electronics equipment includes a plurality of rack enclosures and a corresponding plurality of enclosure cooling units. Each rack enclosure is movably mounted in the container such it can move from a position abutting a front of an enclosure cooling unit to a maintenance and access position spaced apart from the enclosure cooling unit. Each enclosure cooling unit is capable of providing varying amounts of cool air to the rack enclosure it abuts, so that the interior of each rack enclosure can be maintained at a different temperature.

Abstract: An air duct includes a top plate, two side plates extending from two lateral sides of the top plate, a baffle plate extending from the top plate and located between the side plates, and a torsion spring connected between the top plate and the baffle plate. The top plate and the side plates cooperatively define an air passage in the air duct. The baffle plate includes a first end pivotally connected with the top plate and an opposite second end. The second end of the baffle plate is rotatable relative to the top plate. The torsion spring includes two arms abutting against the top plate and the baffle plate, respectively. When the baffle plate is rotated relative to the top plate under an external force, the torsion spring resists such force.

Abstract: According to an embodiment of the present invention, there is provided a system for cooling. The system comprises an equipment rack installable in a facility and for accommodating a plurality of electronic equipment. The system further comprises an exhaust duct into which the electronic equipment, when installed in the rack, exhausts gas drawn from a first section of a facility. The system further comprises a gas flow meter for measuring gas flow in the exhaust duct, and a controller for generating control signals to control, based on the measured gas flow, the output of a cooling unit arranged to provide cooled gas to the first section of the facility.

Abstract: An open frame chassis has a top opening and a bottom opening permitting ambient airflow. A plurality of modules, each enclosing electrical components in thermal contact with a heat sink area of their corresponding module, can each be inserted in the chassis. Ambient air may flow from the bottom opening across the heat sink area of each module to the top opening to passively cool the modules and electrical components. Key pins guide the modules into place and prevent incorrect insertion of a different type of electrical module not corresponding to the electrical connection of the chassis for that slot. Guide pins on corners of the modules mate with guide holes in the chassis to secure the module to the chassis and decrease vibration. Both sides of the chassis have side openings through which the fins of the modules in the end slots of the chassis may be exposed.

Abstract: An electronic equipment includes: an attachment plate; attachments disposed on the attachment plate and each provided with a female screw; a printed circuit board placed on the attachments; electronic parts mounted on the surface of the printed circuit board opposite to the attachments, and whose surfaces opposite to the surface of the printed circuit board serves as heat release surfaces; and a heat sink having a thermal-conduction surface and screw insertion holes. The thermal-conduction surface is abutted in common against the heat release surfaces with a heat release grease between them, male screws inserted into the screw insertion holes are penetrated through the printed circuit board, and meshed with the female screws threaded in the attachments, the heat sink is attached together with the printed circuit board to the attachments, and at least one of the attachments can be displaced in the thickness direction of the printed circuit board.

Abstract: A rack mount assembly measurement tool, for determining physical values including air flow and heat loads, includes a front assembly and a rear duct assembly that are non-intrusively and releasably mounted on the front and rear of such rack mount enclosure. Physical values are sensed at multiple vertical locations to enable a determination of overall and localized heat loads within the enclosure. Front sensor values are collected and wirelessly transmitted from the front assembly to a receiver/processor supported on the rear duct, which generates computed values that are displayed in addition to the sensed values.

Abstract: Ceramic inserts and hermetically sealed or sealable connectors incorporating a ceramic insert providing conductive pathways between opposing faces and/or side-walls and fabricated using multi-layer ceramic fabrication techniques are described. Conductive pads provided as metalized surfaces on the ceramic insert facilitate conductive communication between the conductive pathways transiting the ceramic inserts and conductive structures contacting the conductive pads, such as sockets, pins, wires, and the like.

Abstract: Dehumidifying and re-humidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet side of the rack, wherein air flows through the rack from the air inlet side to an air outlet side. The heat exchanger, which is positioned for ingressing air to pass thereacross before passing through the electronics rack, is in fluid communication with a coolant loop for passing coolant through the heat exchanger, and the heat exchanger dehumidifies ingressing air to the electronics rack to reduce a dew point of air flowing through the rack. A condensate collector disposed at the air inlet side collects liquid condensate from the heat exchanger's dehumidifying of ingressing air, and an evaporator disposed at the air outlet side humidifies air egressing from the electronics rack employing condensate from the condensate collector.

Abstract: In a particular embodiment, a system to dissipate heat in an information handling system includes a first heat-generating component adapted to process first data and a second heat-generating component adapted to process second data. The system also includes a cooling fluid guide including an electroactive material. The cooling fluid guide is adapted to change from a first shape to a second shape, in response to receiving a trigger voltage or in response to no longer receiving the trigger voltage. The system also includes a controller adapted to detect a data load processed at the second heat-generating component and, in response to detecting the data load, to cause the trigger voltage to be received at, or no longer received at, the cooling fluid guide. The cooling fluid guide is adapted to direct an increased portion of cooling fluid toward the first heat-generating component when the cooling fluid guide is in a form of the second shape, as compared to the first shape.

Abstract: An electronic apparatus and a keyboard supporting module thereof are provided. The electronic apparatus includes a heat source, the keyboard supporting module and a push-button key module. The keyboard supporting module includes a keyboard supporting structure and an insulator. The keyboard supporting structure is thermally connected to the heat source. Particularly, the keyboard supporting structure supports the push-button key module with the insulator.