Abstract: A power semiconductor module includes semiconductor elements of a first system constituting each of arms in a circuit of the first system, semiconductor elements of a second system constituting each of arms in a circuit of the second system, a plurality of DC electrode conductors including a common DC electrode conductor joined to the semiconductor elements of the first and second systems, and a plurality of AC electrode conductors joined to the respective semiconductor elements of the first and second systems. Each of the semiconductor elements of the first and second systems is interposed between the DC electrode conductor and AC electrode conductor.

Abstract: A docking device for connecting an electronic device includes a base and a connector. The connector has a body and a connecting port on the base. The body is provided on the base to be moved between a first position and a second position. The connecting port is hidden in the base when the body is moved to the first position, and the connecting is exposed to connect the electronic device when the body is moved to the second position. The docking device may be incorporated in a portable projector.

Abstract: Embodiments of the present invention provide an integrated module. The integrated module includes a printed circuit board PCB and a modular device, where the modular device is mounted on the PCB; a group of front pin pads is disposed at four edges of a front surface of the PCB and the front pin pads are located around a mounted position of the modular device; and a group of bottom pin pads is disposed at four edges of a bottom surface of the PCB. Positions where the front pin pads are disposed are symmetric to positions where the bottom pin pads are disposed; and network properties of the front pin pads and those of the bottom pin pads are the same.

Abstract: An electronic module package that includes an electronic module configured to receive input signals and process the input signals to provide output signals. The module package also includes an interposer having a board substrate with opposite mounting and substrate surfaces. The mounting surface has a mounting array of electrical contacts. The substrate surface has a module array of electrical contacts and a component array of electrical contacts. The electronic module is attached to the substrate surface and electrically coupled to the module array. The interposer includes first conductive pathways that electrically couple the module array and the mounting array and also includes second conductive pathways that electrically couple the module array and the component array.

Abstract: There is provided a multi-layer ceramic circuit board. The multi-layer ceramic circuit board according to an aspect of the invention may include: a ceramic body having a plurality of ceramic green sheets stacked upon one another and an interlayer circuit having conductive vias and conductive patterns separately provided in the plurality of ceramic green sheets; a bump receiving portion provided in at least one surface ceramic green sheet adjacent to a surface of the plurality of ceramic green sheets, and having side walls inclined upward; and a bonding pad provided on the inclined side walls and a bottom surface of the bump receiving portion, and connected to the interlayer circuit.

Abstract: The invention specifies a module comprising a carrier substrate (6) having an electrical wiring and a component chip mounted on the carrier substrate (6) using flip-chip technology, wherein the component chip (1) has, on its surface (2) facing the carrier substrate (6), component structures (3), a supporting frame (4) and supporting elements (5), the supporting elements (5) produce an electrical connection between the component structures (3) and the electrical wiring of the carrier substrate (6), and the height of the supporting elements and the height of the supporting frame (4) correspond. Furthermore, the invention specifies a method for producing the module.

Abstract: An electronic device is disclosed. The electronic device may include a component made of a ceramic material. The electronic device may also include circuitry configured to transmit signals. The signals may pertain to input received through the component.

Abstract: An optical element module according to the present invention includes a plurality of optical elements laminated therein, each optical element including: an optical surface at a center portion thereof; and a spacer section having a predetermined thickness on an outer circumference side of the optical surface, wherein an adhesive is positioned on a further outer circumference side of the spacer section, and the upper optical element and the lower optical element are adhered to each other such that an inside and an outside of the adhesive are ventable through a ventilating section of the adhesive.

Abstract: The present invention is premised upon a connector and electronic circuit assembly (130) at least partially encased in a polymeric frame (200). The assembly including at least: a connector housing (230); at least one electrical connector (330); at least one electronic circuit component (430); and at least one barrier element (530).

Abstract: A manufacturing method of a package carrier is provided. A supporting board having an upper surface which a patterned circuit layer formed thereon is provided. A portion of the upper surface is exposed by the patterned circuit layer. An insulating layer and a conducting layer located at a first surface of the insulating layer are laminated onto the patterned circuit layer. The patterned circuit layer and the exposed portion of the upper surface are covered by the insulating layer. Plural conductive connection structures are formed on the patterned circuit layer. Plural of pads respectively connecting the conductive connection structures and exposing a portion of the first surface of the insulating layer is defined by patterning the conductive layer. The supporting board is removed so as to expose a second surface of the insulating layer. The second surface and a bonding surface of the patterned circuit layer are coplanar.

Abstract: In one embodiment, a shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.

Abstract: In accordance with the teachings of the present disclosure, systems and methods for aligning blind-mate connectors are provided. In one embodiment, a system comprises an avionics processing canister that is coupled to a mounting block. The avionics processing canister comprises a first portion of a first blind-mate connector, and a face plate with a surface that defines a pin-hole and a slot. The slot has a short dimension substantially equal to the diameter of the pin-hole and a long dimension perpendicular to the short dimension. The long dimension is longer than the short dimension. The system also comprises a first fastener that is received through the pin-hole and then into a first hole defined by a surface of the mounting block. The pin-hole has a diameter that is substantially equal to an outer diameter of the first fastener. The system also comprises a second fastener that is received through the slot and then into a second hole defined by a surface of the mounting block.

Abstract: The present invention provides a peripheral device with limited relative angular movement. The peripheral device is configured for detachable operative interconnection with a computing device and comprises a first portion, a second portion, and an operatively connected peripheral device component. The first portion includes a first hinge portion, which defines an axis of rotation, and comprises a first protrusion and a second protrusion. The first protrusion is disposed axially separated at a predetermined distance from the second protrusion. The second portion includes a second hinge portion, which is operatively interconnected with the first hinge portion to allow the first portion and the second portion to rotate relative to one another about the axis of rotation between a first angle and a second angle. The peripheral device component provides one or more peripheral device functions. The first angle and the second angle at least in part are defined by the first protrusion and the second protrusion.

Abstract: A data center includes a housing and a number of server units arranged in the housing. Each server unit includes a server module and a cable management member. The first ends of a number of cables are connected to the back panel of the server module. The cable management member includes a bottom plate, a front plate, and two side plates. A number of connectors are set on the front plate. The second ends of the cables are connected to the connectors. The cable management member is fixed to one side of the server module. The cables are received in a space formed between the bottom plate and the server module. The cable management member includes a first clipping portion and a second clipping portion formed at opposite sides. The housing includes a number of rails, which can slide between the first and second clipping portions.

Abstract: A solid state drive is disclosed. The solid state drive includes a circuit board having opposing first and second surfaces. A plurality of semiconductor chips are attached to the first surface of the circuit board of the solid state drive, and the plurality of semiconductor chips of the solid state drive include at least one memory chip that is at least substantially encapsulated in a resin. An in-line memory module-type form factor circuit board is also disclosed. The in-line memory module-type form factor circuit board has opposing first and second surfaces. A plurality of semiconductor chips are attached to the first surface of the in-line memory module-type form factor circuit board, and these semiconductor chips include at least one memory chip that is at least substantially encapsulated in a resin.

Abstract: The invention provides a semiconductor package structure, comprising: a substrate having a first surface and a second surface; a first conductive layer plated on the first surface; a semiconductor element attached to the first conductive layer on the first surface of the substrate for electrically connecting; a second conductive layer plated on the first surface and surrounded the semiconductor element and the first conductive layer, wherein the height of the second conductive layer is higher than the first conductive layer; and a lid attached to the top of the second conductive layer for sealing the semiconductor element.

Abstract: Electronic devices with support frames and mechanically-bonded plastic and methods for forming such electronic devices are provided. A representative electronic device includes: a housing that incorporates: a metal chassis having a base and a sidewall extending outwardly therefrom to define an interior, the chassis having an opening extending there through; a plastic part mechanically bonded to the metal of the chassis, the plastic part spanning the opening; and a support frame mounted at least partially within the housing such that the support frame increases rigidity of the housing.

Abstract: A storage device transporter is provided for transporting a storage device and for mounting a storage device within a test slot. The storage device transporter includes a frame that is configured to receive and support a storage device. The storage device transporter also includes a conductive heating assembly that is associated with the frame. The conductive heating assembly is arranged to heat a storage device supported by the frame by way of thermal conduction.

Abstract: The invention relates to a method for creating a multi-component device, including the following steps, creating a module having a multilayer structure comprising electrical/electronic components arranged on at least one substrate in stacked layers, the components each having a main surface exposed to the outside, wherein the components are arranged such that the respective main surfaces thereof are oriented in mutually opposite directions. The invention also relates to the corresponding device.

Abstract: A printed circuit board (PCB) includes a wire pattern having first and second surfaces facing in opposite directions from each other, the wire pattern including a first region having a first thickness and a second region having a second thickness greater than the first thickness; a core insulation layer on the second surface in the first region, the core insulation layer having a third surface adjacent to the second surface in the first region and a fourth surface facing in an opposite direction from the third surface, the fourth surface being connected to the second surface; and a first protection layer covering a portion of the fourth surface of the core insulation layer and a portion of the second surface in the second region.

Abstract: An improved a mobile electronic device (10) is disclosed. The mobile electronic device (10) includes: a housing (12) including a display assembly (14) and a cover assembly (16), the display assembly (14) being complementarily configured to be partially received in the cover assembly (16), to define an enclosure (18) for electrical components; a gasket (20) located between the display assembly (14) and the cover assembly (16); and a sacrificial retention structure (22) including a plurality of connectors (24) configured to interconnect the cover assembly (16) with the display assembly (14). Advantageously, this structure allows: disassembly and reassembly of the housing (12), in the event of rework, enhanced water and dust resistance and a simple and secure snap-connected housing (12).

Abstract: A circuit substrate includes a resin layer; and an inorganic insulating layer including a groove portion penetrating the inorganic insulating layer in a thickness direction thereof. A part of the resin layer is in the groove portion.

Abstract: A three-dimensional semiconductor module and an electronic system including the same are provided. The semiconductor module includes a module substrate, a logic device formed on a part of the module substrate, and a plurality of memory devices formed on another part of the module substrate, wherein the plurality of memory devices are disposed perpendicular to the logic device, and the module substrate on which the plurality of memory devices are formed is supported by a supporter. The electronic system includes the semiconductor module.

Abstract: A computer enclosure includes a shell body, and an expansion card retention assembly. The shell body includes a main chassis, and a side wall perpendicular to the main chassis. The side wall defines an elongated through hole extending along a first direction perpendicular to the main chassis. The expansion card retention assembly includes a first and second expansion frames fixed on the side wall. The first expansion frame includes a main board with a length in the first direction less than that of the through hole, and is configured for fixing a first expansion card. The second expansion frame includes an elongated main plate extending along the first direction, and a first support platform perpendicularly extending from an end of the main plate. The main plate and the first support platform are configured for matingly engaging with an expansion card bracket of a second expansion card.

Abstract: A locking retainer for retaining an electronic module or printed circuit card in slots of a chassis. The retainer includes at least three wedge members movably linked to each other and disposed in longitudinal sequence along a longitudinal axis. The retainer can be made relatively larger in height by moving the wedge members longitudinally such that a longitudinal distance between a first wedge member and a last wedge member of the sequence becomes smaller without the wedge members being longitudinally displaced along a common internal longitudinal element. All portions of the locking retainer that the middle wedge member is longitudinally moveable relative to do not extend through a theoretical plane disposed at a longitudinal midpoint of the middle wedge member and oriented normal to the longitudinal axis. The elimination of a central rail permits the wedge segments to have much greater contact area for greater thermal energy flow.

Abstract: A power module includes a power source comprising an end defining a socket, an external power line comprising a plug inserted into the socket, a fixing piece fixed at the end of the power source, and a clamping piece. The clamping piece includes a base mounted on the fixing piece, two parallel fixing portions extending from the base and defining a slot therebetween, a hook positioned on one of the fixing portions and extending in the slot, and a clamping band. The clamping band includes a fixed end fixed on the base and a slide end. The slide end includes spaced fixing teeth, a fixing groove is defined between each two of the fixing teeth, the clamping band winds around the external power line, the hook is engaged with one fixing groove to lock the slide end, and the clamping band and the base cooperatively hold the external power line.

Abstract: A component of an implantable medical device may include a first member, a second member, and a composite seam weld formed between the first member and the second member. In some examples, the composite seam weld includes a continuous wave (CW)-welded portion formed using CW welding and a pulse-welded portion formed using pulsed welding. A first end of the pulse-welded portion may partially overlap a first end of the CW-welded portion and may be offset from the first end of the CW-welded portion in a direction substantially perpendicular to a longitudinal orientation of the first end of the CW-welded portion. Techniques for forming composite seam welds are also described.

Abstract: An electronic component housing unit includes: a substrate including a mounting region on which an electronic component is mounted; a connection conductor extending from a top face to a bottom face of the substrate, the connection conductor being electrically connected to the electronic component; a wiring conductor disposed on the bottom face of the substrate, one end of the wiring conductor being electrically connected to the connection conductor, another end of the wiring conductor being drawn out from a side face of the substrate; and a ground conductor disposed on the bottom face of the substrate, the ground conductor forming a coplanar line along with the wiring conductor. A bottom face of the wiring conductor is located above a bottom face of the ground conductor.

Abstract: The present invention discloses a backlight module, a backplane and an LCD device. The backlight module comprises a backplane, a PCB and locking piece(s) for fixing the PCB on the backplane; the backplane comprises a frame formed by multiple brackets, and bridges arranged on the brackets; each bracket or bridge is provided with a chute, and the locking piece is arranged in the chute by a fixed structure at the bottom of the locking piece. Because the backplane comprises a frame formed by multiple brackets, the frame is provided with bridges for arranging PCB and the like, and both the brackets and bridges are formed by combining universal shaped parts, the present invention has the advantages of low manufacturing cost, and material saving; meanwhile, because each bridge is provided with a chute for arranging the hillock, the hillock is fixed in the random position of the chute.

Abstract: A display system includes a display and a control circuit operable with the display. The display is configured to provide visual output having a presentation orientation. When user input is received, the control circuit can alter the presentation orientation from an initial orientation in response to user input. When non-user events or device events are detected, the control circuit can revert the presentation orientation to the initial orientation in response to the non-user event or device event. Where the presentation orientation has a user input configuration associated therewith, the user input configuration can either be altered with the presentation orientation or retained in an initial disposition.

Abstract: A thin display for pivotally connecting a main body of notebook PC is provided. The thin display includes a back cover, a front frame and a display module. The front frame is assembled to the back cover. The display module is assembled to and between the back cover and front frame. The display module abuts against the back cover or keeps a gap equal to or less than 0.5 mm with the back cover.

Abstract: A method of fabricating a substrate core structure comprises: providing first and second patterned conductive layers defining openings therein on each side of a starting insulating layer; providing a first and a second supplemental insulating layers onto respective ones of a first and a second patterned conductive layer; laser drilling a set of via openings extending through at least some of the conductive layer openings of the first and second patterned conductive layers; filling the set of via openings with a conductive material to provide a set of conductive vias; and providing a first and a second supplemental patterned conductive layer onto respective ones of the first and the second supplemental insulating layers, the set of conductive vias contacting the first supplemental patterned conductive layer at one side thereof and the second supplemental patterned conductive layer at another side thereof.

Abstract: In an embodiment a first module can include a first side and a first edge. An optical transmitter connector can be a first distance from the first side at a first position along the first edge. An optical receiver connector can be a second distance from the first side wherein the first and the second distances are different and wherein the optical receiver connector is at a second position along the first edges. In an embodiment a chassis includes a first slot and a second slot with a first waveguide and a second waveguide.

Abstract: According to one embodiment, a television receiver includes: a housing; a circuit board arranged in the housing; an electronic component mounted on the circuit board; a reinforcing member comprising a first surface in contact with the circuit board, and a second surface located on an opposite side of the first surface and exposed to an inside of the housing; a component contained in the housing, the component comprising a first supported area located at a distance from a surface of the circuit board; and a support member configured to support the component, the support member comprising a first end portion fixed to the first supported area of the component, and a second end portion fixed to the second surface of the reinforcing member.

Abstract: A laser apparatus may include: a first module including an oscillator configured to output a laser beam and an oscillator support portion for supporting the oscillator; a second module including a beam delivery unit for delivering the laser beam and a beam delivery unit support portion for supporting the beam delivery unit; a third module including an amplifier for amplifying the laser beam and an amplifier support portion for supporting the amplifier; and a frame on which the modules are placed, the frame including mounts on which the oscillator support portion, the beam delivery support portion and the amplifier support portion are placed.

Abstract: The invention relates to electronic equipment including at least one housing shaped to receive an external module, the external module having at least one connector for co-operating with at least one complementary connector of the equipment arranged at the end of the housing when the external module is placed in the housing. According to the invention, the device includes isolation means for responding to a contactor being activated by switching off at least an electrical power supply at least for the power supply contacts of the connector of the equipment, the contactor being arranged on the equipment so as to be activated by the external module before the connectors connect together and to be deactivated once the connectors are connected together when the external module is properly in place in the housing.

Abstract: A multi-chip stack module provides increased circuit density for a given surface chip footprint. Support structures are alternated with standard surface mount type chips to form a stack wherein the support structures electrically interconnect the chips. One aspect is a structure and method for interconnecting a plurality of generally planar chips in a vertical stack such that signals, which are common to the chips, are connected in the stack and signals, which are accessed individually, are separated within the stack.

Abstract: Embodiments of the present application provide an insulating ring for packaging, an insulating ring assembly and a package. A through hole of the insulating ring drills through a top surface and a bottom surface of the insulating ring to accommodate a chip. An outer sidewall of the insulating ring has an outward extending protrusion. A side surface of the protrusion which faces the top surface is lower than the top surface. A pin is disposed on the side surface, and an adhesive material layer and a surface metallization layer in the pin are lower than the top surface. Therefore, silver ions in the adhesive material cannot pass around the outer sidewall and the top surface above the side surface to enter the package, thereby ensuring the reliability of a power amplifier (PA) device.

Abstract: A circuit substrate includes a single-layer insulating substrate, a through-hole, and wiring conductors that are provided in both main surfaces of the single-layer insulating substrate. The through-hole includes first and second concave portions that are formed in both of the main surfaces of the single-layer insulating substrate, respectively, and a through-portion through which both of the concave portions communicate with each other. An opening area of a portion at which the first and second concave portions overlap each other is a half or less of an opening area of any large concave portion between both of the concave portions, and a metallic film is formed on the respective inner wall surfaces of the first and second concave portions, and the through-portion.

Abstract: An expansion apparatus includes a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a first circuit board, an expansion card with a second circuit board, and a cable member. A first edge connector is set on a bottom edge of the first circuit board and includes a number of first power pins connected to a control chip, a number of first storage chips, and a first connector, and a number of first ground pins. A second edge connector is set on a bottom edge of the second circuit board and includes a number of second power pins connected to a number of second storage chips and a second connector, and a number of second ground pins. The cable member includes a cable, a third connector connected to the first connector, and a fourth connector connected to the second connector.

Abstract: An AMB component and a connection interface for a memory installation with fully buffered Dimm memory modules connected in series. The AMB component is disposed on a connecting line from memory modules to a memory controller of the memory installation to re-amplify the connecting line between two consecutive FBD memory modules. The connection interface includes an AMB amplifier component for the connection of a main memory card that includes at least one processor, to an auxiliary memory card of the type having a series of memory modules. Two series of FBD memory modules are connected to respective FBD channels in the auxiliary memory card using FBD connectors in a daisy-chain arrangement.

Abstract: An electronic module for use as a subsea electronic module (SEM) for an underwater fluid extraction well, as provided. An example of such an SEM includes a plurality of substantially planar electronics cards to operate devices in the SEM. The cards are arranged in a stack such that major faces of each card are oriented substantially parallel to, and coaxial with, major faces of the other cards in the stack. The SEM also includes a substantially planar switch card orientated relative to the stack such that its major faces are oriented substantially parallel to a main axis of the stack and orthogonal to the orientation of the major faces of the electronics cards within the stack. The switch card includes a first Ethernet switch blade configured to control traffic on a LAN area network and a second Ethernet switch blade configured to control traffic on a second LAN.

Abstract: A microelectronic package can include a substrate having first and second opposed surfaces, and first and second microelectronic elements having front surfaces facing the first surface. The substrate can have a plurality of substrate contacts at the first surface and a plurality of terminals at the second surface. Each microelectronic element can have a plurality of element contacts at the front surface thereof. The element contacts can be joined with corresponding ones of the substrate contacts. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto. The element contacts of the first microelectronic element can be arranged in an area array and are flip-chip bonded with a first set of the substrate contacts. The element contacts of the second microelectronic element can be joined with a second set of the substrate contacts by conductive masses.

Abstract: A power semiconductor module in which a substrate is provided with at least one power semiconductor and has first and second contact areas, wherein a first load connection element with first contact elements provided thereon is supported on the first contact areas and a second load connection element with second contact elements provided thereon is supported on the second contact areas. Wherein at least one spring element is provided for producing a pressure contact between the contact elements and the contact areas. To reduce the structural size of the module, the pressure contact between the contact elements and the contact areas is exerted by at least one electrical component arranged between the spring element and one of the load connection elements.

Abstract: In one example, a pluggable module comprises a shell, a module connector, and one or more thumbscrews. The shell defines a cavity within which a PCB and one or more components are disposed and includes a front, back, first side, and second side. The module connector is operatively connected to the PCB near the back of the shell and extends from within the cavity to outside the shell through an opening defined in the back of the shell. The module connector is configured to operatively couple the pluggable module to a host device. The thumbscrews are housed within one or more portions of the shell and are configured to threadably secure the pluggable module to the host device. Each of the thumbscrews comprises a torque limiter. The pluggable module can further comprise protecting means for protecting a portion of the module connector extending outside the cavity from damage.

Abstract: A micro grid apparatus and associated method of formation. Multiple tiers are formed. The tiers are distributed and sequenced in a vertical direction such that each tier is at a different vertical level in the vertical direction. Each tier includes a multiplicity of complex shapes interconnected by bridge modules. Each complex shape is a physical structure having an exterior boundary. Each complex shape includes multiple docking bays such that each docking bay is configured to have a module latched therein. Each complex shape is either a power hub including rechargeable batteries or a processor hub including processors. A sensor module is latched in a sensor docking bay and an actuator module is latched in an actuator docking bay of each complex shape in one or more tiers of the multiple tiers.

Abstract: Enables coupling or retrofitting a golf club with active motion capture electronics that are battery powered, passive or active shot count components, for example a passive RFID, and/or a visual marker on the cap for use with visual motion capture cameras. Does not require modifying the golf club. Electronics package and battery can be easily removed and replaced, for example without any tools. May utilize a weight that is removed when inserting the electronic package in the mount, wherein the weight element may have the same weight as an electronics package, for no net change or minimal change in club weight. May be implemented with a shaft enclosure and expander that may be coupled with a screw aligned along an axis parallel to the axis of the shaft. May utilize non-permanently and/or friction coupling between the mount and shaft. Cap may include a visual marker and/or logo.

Abstract: A method and apparatus for reducing pressure effects on an encapsulated device. In one embodiment, the apparatus comprises a power module comprising an equipment box assembly containing (i) an equipment module housing, (ii) a potted electronic device disposed within the equipment module housing, and (iii) a resilient expansion absorption layer disposed between at least a portion of the potted electronic device and at least a portion of the equipment module housing.

Abstract: Provided are a pin module and a universal serial bus (USB) device. The USB device includes: a substrate including a first side and a second side, the second side opposite to the first side; at least one memory chip mounted on the first side of the substrate; at least one controller chip mounted on the first side of the substrate; a plurality of first planar electrodes formed on the second side of the substrate; a plurality of second planar electrodes formed on the second side of the substrate; and a sealing material housing the memory chip, the controller chip, the first planar electrodes, and the second planar electrodes, wherein the sealing material exposes one sides of the first planar electrodes and the second planar electrodes.

Abstract: A die package includes a substrate, a die mounted on the substrate, and a ZQ resistor disposed in the die package and connected to the substrate and the die. The ZQ resistor may be used to calibrate impedance of the die.