Abstract: A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power management state of the respective cores with additional cooling being provided to those cores in a more active state and less cooling provided to those cores in a less active state.

Abstract: A synthetic jet assembly includes a synthetic jet having a cavity and an opening formed therein. The synthetic jet assembly also includes an actuator element coupled to a second surface of the body to selectively cause displacement of the second surface, and a control unit electrically coupled to the actuator element. The control unit is configured to transmit a multi-frequency drive signal to the actuator element, the multi-frequency drive signal comprising a cooling frequency component and an acoustic frequency component superimposed on the cooling frequency component. The cooling frequency component causes a cooling jet to eject from the opening of the body. The acoustic frequency component produces a desired audible output.

Abstract: A cooling coolant pipe of a server cabinet includes multiple tube bodies interconnected in series and at least one adjustable valve. In each of the tube bodies a first chamber and a second chamber that are adjacent to and separated from each other, the second chambers of the two adjacent tube bodies are in communication with each other, and a wall surface of each of the tube bodies has at least one connection port in communication with the first chamber. The adjustable valve is disposed in one of the tube bodies. The first chamber in each of the tube bodies is in communication with the second chamber in the tube body through the adjustable valve. In this way, the adjustable valve adjusts the flow rate of a cooling fluid flowing from the second chamber to the first chamber.

Abstract: Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically redundant pumps, and a leak containment apparatus. The example system may also include logics for selectively controlling air flow, liquid flow, and flow paths.

Abstract: An integrated circuit chip having micro-channels formed in multiple regions of the integrated circuit chip and a method of cooling the integrated circuit chip. The method includes for any region of the multiple regions, allowing a coolant to flow through micro-channels of the region only when a temperature of the region exceed a first specified temperature and blocking the coolant from flowing through the micro-channels of the region when a temperature of the region is below a second specified temperature.

Abstract: A cooling module applicable in an electronic device is provided. The electronic device includes a plurality of first heat sources and a plurality of second heat sources. The cooling module includes a cooling loop and a plurality of heat pipes. The cooling loop includes a plurality of cooling units. The cooling units are connected in series through a plurality of connection tube and each cooling unit is thermally coupled to one of the first heat source. The heat pipes are thermally coupled to the second heat sources and the cooling units. When the cooling unit is in failure, the cooling units can be directly removed and replaced. Also, the second heat sources of the electronic device are capable of exchanging heat with the cooling unit through the heat pipe.

Abstract: A data center includes one or more racks, one or more computing devices coupled to at least one of the racks, and one or more air moving devices. The computing devices include heat producing components. The computing devices may be inclined in the rack such that the lower ends of the computing devices are at a lower elevation than the higher ends of the computing devices. The air moving devices can move air from the lower end of the inclined computing devices to the higher end of the inclined computing devices such that heat is removed from heat producing components in the inclined computing devices.

Abstract: A cooling device for electronic components includes a substantially prismatic body made of a thermally conductive material, which has a pair of substantially planar main outer surfaces and encloses therein at least one circuit for the flow of a cooling fluid. Both main outer surfaces are designed to allow removable attachment of an electronic component to be cooled. A control apparatus incorporating the device.

Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s), and a boiling fluid mixture of first and second dielectric fluids within the fluid-tight compartment, with the electronic component(s) immersed within the mixture. A condensing fluid is also provided within the fluid-tight compartment, and is immiscible with the boiling fluid mixture. The condensing fluid has a lower specific gravity and a higher thermal conductivity than the boiling fluid mixture, and facilitates condensing of vaporized boiling fluid mixture. A cooling structure is provided within the compartment, and includes a condensing region and a sub-cooling region, with the condensing region being in contact with the condensing fluid, and the sub-cooling region being in contact with the boiling fluid mixture.

Abstract: A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed.

Abstract: A chassis extension module includes an extension housing structure and a support structure. The extension housing structure is to be attached to a housing structure of another module. Attachment of the extension housing structure to the housing structure of the other module expands an inner volume of an assembly.

Abstract: A power conversion apparatus is equipped with grommets each of which hermetically seals between one of a coolant inlet tube and a coolant outlet tube of a cooler. Each of the grommets has a sealing protrusion and is fit in a cut-out formed in an end of a side wall of a casing with the sealing protrusion pressed against an inner wall of the cut-out. The installation of each of the grommets is achieved by inserting the grommet through the cut-out in a direction from outside to inside the casing so that a portion of the grommet protrudes from the wall into the casing. The visual perception of such protrusion made by an assembly worker, therefore, enables the assembly worker to determine whether the grommet has been installed in place in the cut-out to establish a desired hermetical seal or not.

Abstract: Embodiments of the present invention relate to a board cooling apparatus comprising a shell and a board, where the board and an interior wall of the shell form a closed space, a cooling medium inlet and a cooling medium outlet are disposed on the shell, a separator plate that separates the board into a first part and a second part, a through opening between the first part and the second part, a cooling medium flows into the first part from the cooling medium inlet and then flows into the second part, and flows out from the cooling medium outlet, a flow guiding mechanism that is disposed on the board and configured to divert the cooling medium flowing into the first part from the cooling medium inlet, so as to directly guide part of the cooling medium into the second part.

Abstract: Provided are a power management system and method. At least one frame module includes at least one bay and a plurality of first connectors at a rear portion of the at least one bay and at least one power conversion unit positioned in the at least one bay. The at least one power conversion unit includes a plurality of second connectors. Each second connector is removably coupled to a first connector of the plurality of first connectors. The first and second connectors include a combination of high power, cooling, and control connectors.

Abstract: Disclosed herein is a heat radiation system for a power module, including: a heat radiation member having an internal space and a cooling medium circulated in the internal space; a heat generation module formed on the heat radiation member; and a pair of electrodes formed at regions facing each other in the internal space of the heat radiation member and having different volumes.

Abstract: Disclosed herein is a heat dissipation system for a power module, including: a manifold including an inlet and an outlet and formed so as to be opened at a surface thereof contacting a nozzle member; a nozzle member formed at an upper portion of the manifold and including inclined nozzles through which a cooling medium introduced through the inlet of the manifold passes; and a nozzle chamber formed on the nozzle member and forming a spacing space spaced from the nozzle member.

Abstract: A cooling device of the present invention includes: a substrate having a first surface which supports an electronic component and a second surface on an opposite side to the first surface; a container which can form a space between itself and the second surface of the substrate; and an evaporation section which is thermally connected to the electronic component supported on the substrate, which is arranged in the space so that at least a portion thereof is in contact with a liquid within the space, and which changes a phase of at least a portion of the liquid to gas on a basis of heat generated by the electronic component.

Abstract: A cooling device of a computer rack equipped with a back panel including an evacuation zone, toward the exterior of the rack, of air having circulated over electric power components arranged within the computer rack, and a rear door in the thickness of which air cooling means is arranged. The cooling device also includes a supporting frame on which the rear door is mounted, molded to surround the air evacuation zone of the computer rack, and removable positioning means of the supporting frame against the back panel of the computer rack.

Abstract: In a power conversion apparatus, electronic components and a cooler are integrated in a frame as an internal unit. The internal unit is fixed within a case through the frame. The frame has such a shape that the electronic components are surrounded by the frame, and includes a first wall section, and second and third wall sections extending from both sides of the first wall section. The cooler includes a coolant introduction tube and a coolant discharge tube. The coolant introduction tube and the coolant discharge tube project outward from to the frame. The first to third wall sections include a support wall section supporting at least one of the coolant introduction tube and the coolant discharge tube, and a frame wall section not supporting the coolant introduction tube and the coolant discharge tube. The thickness of the support wall section is larger than the thickness of the frame wall section.

Abstract: A heat sink, and cooled electronic structure and cooled electronic apparatus utilizing the heat sink, are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s) and the vapor-condensing channel(s). The membrane includes at least one vapor-permeable region, at least a portion of which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s) to the vapor-condensing channel(s). The heat sink further includes one or more coolant inlets coupled to provide a first liquid coolant flow to the coolant-carrying channel(s), and a second liquid coolant flow to condense vapor within the vapor-condensing channel(s).

Abstract: In order to achieve reduction in loss, a semiconductor power module comprises DC terminals to be connected to a condenser module and the semiconductor power module is used in combination with a cooling jacket for cooling, and the DC terminals protrude toward the condenser module beyond the cooling jacket.

Abstract: A semiconductor cooling device for transferring heat from a semiconductor die (111). The semiconductor cooling device includes a heat dissipator (112) that may be thermally coupled to a semiconductor module (111) to be cooled for dissipating heat from the semiconductor die (111); a housing (150) in or on which the semiconductor die (111) is mounted; a fluid flow passage (153) for providing a forced fluid flow within the housing (150); and a fluid path (155) arranged to guide the forced fluid flow in a first direction between the fluid flow passage (153) and the heat dissipator (112) and further arranged to guide the fluid flow along the heat dissipator (112) in a second direction different to the first direction. In a particular embodiment, the semiconductor cooling device is used to dissipate heat from an array of LEDs.

Abstract: A communication module is provided. In one embodiment, the communication module includes at least one transceiver, a filter communicatively coupled with the at least one transceiver, a power amplifier communicatively coupled to the at least one transceiver and the filter, a primary module chassis configured to hold the at least one transceiver, the filter, and the power amplifier, and a filter suspension frame assembly attached to the primary module chassis. The filter suspension frame assembly is configured to float the at least one transceiver in relation to the primary module chassis.

Abstract: In a fixing structure of a circuit board to a cooler, the circuit board includes a wiring part, electronic parts electrically connected to the wiring part and an insulating base material embedding the wiring part and the electronic parts therein. The insulating base material includes embedding portions in which the electronic parts are embedded and a bent portion having flexibility between the embedding portions. The cooler has fixing parts arranged in a first direction. The circuit board is fixed to the cooler while bending the bent portion. The bent portion is opposed to an end portion of one of the fixing parts, and each of the embedding portions is held between adjacent two fixing parts such that opposite surfaces of the embedding portion are closely in contact with surfaces of the adjacent two fixing parts.

Abstract: The invention relates to a device for conducting a cooling fluid for cooling an electrical component. The device comprises a fluid conducting chamber for conducting the cooling fluid, and an at least partially flexible cover, which seals the fluid conducting chamber in a fluid-tight manner and which forms a heat transmission zone for conducting heat between the cooling fluid and the electrical component.

Abstract: A power conversion apparatus includes a plurality of semiconductor modules and a plurality of bus bars. The plurality of bus bars include a positive electrode bus bar connected to a positive electrode power terminal, a negative electrode bus bar connected to a negative electrode power terminal, and a plurality of AC bus bars connected to an AC power terminal. Of a DC bus bar group Including the positive electrode bus bar and the negative electrode bus bar, and an AC bus bar group including the plurality of AC bus bars, part of one of the bus bar groups is sealed with insulating resin, and the other of the bus bar groups is not sealed with insulating resin. A seat is formed on the insulating resin sealing the one of the bus bar groups, and the other of the bus bar groups is mounted on a seat face of the seat.

Abstract: A cable management system is provided that includes a cable management rack for accommodating a heat generating device, a first baffle mounted with respect to a first upright of the rack and for redirecting a rearward flow of cool air sideways from a space adjacent a front side of the rack, and/or a second baffle mounted with respect to a second upright of the rack and for redirecting a sideways flow of exhaust air from the rack and through the second upright into a space adjacent a rear side of the rack. A method of cooling a heat-generating device mounted in or on a cable management rack includes providing a sideways flow of cooling air into the rack and into the device.

Abstract: A server cabinet includes a rack, at least one assembling frame, a radiator and at least one fan. The rack has a first frame and a second frame opposite to each other. The assembling frame and the radiator are mounted on the first frame in sequence. The radiator transfers a coolant to flow inside a plurality of heatsink fins thereof in a circulating manner. The fan is mounted in the assembling frame, and the fan guides an airflow to flow into the first frame from the radiator, and blows the airflow in the rack to the second frame, thus lowering the temperature inside the rack.

Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.

Abstract: Disclosed is an embodiment of a rack system including a cooled universal hardware platform having a frame, a module insertion area on a first side of the rack system and a universal backplane mounting area on a second side of the rack system opposite to the first side, a power bus, a plurality of cooled partitions, a plurality of module bays, two or more service unit backplanes and a coolant source. The power bus may be configured to provide power to the universal backplane mounting area and the plurality of cooled partitions. The rack system may also include a plurality of service units that may be configured to have different functions within the rack system.

Abstract: The present disclosure is related to a device for cooling the surface of a semiconductor device such as an integrated circuit or the like, the cooling device comprising a plurality of channels (3?) which are non-parallel to the surface to be cooled, each channel comprising a plurality of separate electrodes (5) or equivalent conducting areas arranged along the length of each channel, the device further comprising or being connectable to means for applying a voltage to the electrodes or conducting areas in each channel according to a sequence, the sequence being such that a droplet (6) of cooling liquid in a channel may be moved from one electrode to the next, thereby transporting the droplet from the top of the channel to the bottom, from where the droplet impinges on the surface to be cooled.

Abstract: A power module includes at least one semiconductor die holding structure. Each die holding structure has a substantially cylindrical outer profile and a central axis. Each die holding structure is disposed within a common cylindrical EMI shield. A plurality of semiconductor devices are mounted to each die holding structure to form a substantially symmetric die mounting pattern respect to the central axis of the die holding structure.

Abstract: A manifold is provided for supporting a power module assembly with a plurality of power modules. The manifold includes a first manifold section. The first face of the first manifold section is configured to receive the first power module, and the second face of the first manifold section defines a first cavity with a first baseplate thermally coupled to the first power module. The first face of the second manifold section is configured to receive the second power module, and the second face of the second manifold section defines a second cavity with a second baseplate thermally coupled to the second power module. The second face of the first manifold section and the second face of the second manifold section are coupled together such that the first cavity and the second cavity form a coolant channel. The first cavity is at least partially staggered with respect to second cavity.

Abstract: This invention provides a motor control method which comprises the steps of operating a motor at a fanless operation mode when a ambient temperature is lower than a lower temperature, operating the motor at a silent operation mode when the ambient temperature is higher than the lower temperature and lower than a higher temperature, and operating the motor at a cooling operation mode when the ambient temperature is higher than the higher temperature. When the motor operates at the fanless operation mode, the rotation speed of the motor is zero rpm. When the motor operates at the silent operation mode, the motor operates at a constant rotation speed. When the ambient temperature is higher than the higher temperature, the rotation speed of the motor is a linear function of the temperature and varies between the higher temperature and a maximum temperature corresponding to the full rotation speed of the motor.

Abstract: A container data center system includes a plurality of container data centers and a dissipation system. Each container data center includes a container and a number of servers arranged in the container. The containers of the container data centers communicate with each other. The heat dissipation system includes a refrigerating device configured for generating cooling air to one of the containers.

Abstract: A power system for connecting high voltage components includes an enclosure having an interior space. A plurality of high voltage (HV) components are removably coupled to the enclosure and positioned in the interior space of the enclosure. The plurality of HV components are electrically coupled to each other. A motor is positioned outside the enclosure, and the motor is electrically interconnected through the enclosure to one of the HV components. A heat sink is positioned within the interior space for providing thermal heat transfer away from the components.

Abstract: A heat sink comprises a vapor chamber base formed in a three-dimensional arrangement that mirrors topology of underlying structures on a substrate upon which the heat sink can be mounted, and at least one fin coupled to the vapor chamber base.

Abstract: An exemplary electronic device includes a cover, a circuit board and a driving module both mounted on the bottom cover, an electronic component fixed on the circuit board, and a top cover covering the bottom cover. The driving module has a rotating shaft adapted for supportively driving an optical disk to rotate. The electronic component generates heat during operation. Through holes are defined in the top cover and located at a periphery of the rotating shaft. When the optical disk is mounted on the rotating shaft and driven to rotate by the rotating shaft, air heated by the electronic component in the electronic device can flow out of the top cover via the through holes, and rotation of the optical disk facilitates such airflow.

Abstract: Arc resistant enclosures for dry-type transformers. More particularly, transformer enclosures having one or more arc-resistant features, including arc channels, arc fault dampers, and arc fault plenums, and methods for providing same.

Abstract: A load calculation device for determining the maximum electrical load that can be applied to an electrical circuit includes determines the temperature differential (?T) between a section of the electrical circuit and the ambient air temperature in which the section of the electrical circuit resides. The actual electrical load applied to the electrical circuit is also determined as is the design load of the electrical circuit. The maximum electrical load that can be applied to the electrical circuit is then determined based on the temperature differential and the electrical load applied to the electrical circuit and the circuit designed load. The load calculation device may be applied to an electrical joint and may be used to calculate the maximum temperature differential allowed for a given current to be applied at the electrical joint. This is particularly beneficial in connection with detecting and preventing electrical joint failure.

Abstract: A system for transferring heat from an electrical enclosure is provided. An electrical enclosure defines a housing area in which one or more electrical devices are housed. A heat pump extends through the electrical enclosure, the heat pump defining a channel configured to communicate fluid for transferring heat from the one or more electrical devices. The electrical enclosure is substantially sealed from the heat pump channel and from other areas outside the electrical enclosure.

Abstract: Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.

Abstract: A server including a rack, chassis, a power module, first copper columns, and second copper columns is provided. The rack has a front end and an opposite back end. The chassis are disposed in the rack and suitable for being pulled out from the front end. Each chassis contains a motherboard module. The power module is disposed in the rack. The first copper columns are fixed on the rack, electrically connected to the power module, and are suitable for electrically connecting an external power supply. The second copper columns are fixed on the rack and electrically connected to the power module and the motherboard modules. A high voltage from the external power supply is transmitted to the power module via the first copper columns. The power module converts the high voltage into a low voltage and transmits the low voltage to the motherboard modules via the second copper columns.

Abstract: A power converter assembly includes a housing and at least one transistor module. The housing has a liquid cooled heat transfer surface. The at least one transistor module is mounted directly to the liquid cooled heat transfer surface and positioned at least partially within the housing.

Abstract: A power semiconductor system and method for producing a power semiconductor system. In one embodiment, the application relates to a power semiconductor system, comprising a line system for a fluid working medium; wall element having an outer side and an inner side; and a power semiconductor circuit arranged at the outer side of the wall element, wherein the inner side of the wall element forms a fluid-tight wall of the line system.

Abstract: A hybrid drive has first and second electrical machines (12, 11) and an energy store (13). A converter (14) is assigned to the energy store (13). First and second converters (16, 15) are assigned to the first and second electrical machines (12, 11) and combine to form a modular unit (17) with a basic module (18) and a supplementary module (19). The basic module (18) has the first converter (16), cooling connections (20, 21), fasteners (24) for attachment to a body, a connection (22) for the converter (14) of the energy store (13) and a connection (23) for the first electrical machine. The supplementary module (19) is coupled to the basic module (18) and has the second converter (15) and a connection (25) the second electrical machine (11). The supplementary module (19) is cooled via the basic module (18) and coupled to the converter (14) of the energy store (13).

Abstract: A cooling apparatus comprising an impeller, a housing that encloses the impeller, an inlet opening formed between the hosing and impeller and a projection formed on the housing that extends from the housing towards the impeller.

Abstract: A multi-modular data center includes at least one modular computing module and at least one modular power supply module. The modular computing module includes a transportable container, a plurality of computing systems, a cooling system, a surveillance system, and a network interface. The modular power supply module includes a transportable container and a plurality of power supply systems. The transportable containers are configured for transport via a transport infrastructure. The plurality of computing systems is mounted within the transportable container. The cooling system is disposed in the transportable container. The surveillance system is configured to monitor the transportable container. The network interface is configured to interface between an Internet access connection and the computing systems. The plurality of power supply systems is mounted within the transportable container.

Abstract: A power conversion apparatus is provided, which accommodates electronic components configuring at least part of a power conversion circuit, and a terminal block collecting wires running from the electronic components, in a case. The terminal block includes a plurality of terminal connecting parts at which a plurality of high-voltage cables, through which electric power is received from and provided to the outside of the case, and the wires are connected to each other, and insulating parts provided between the terminal connecting parts and ensuring insulation between the high-voltage cables and between the wires. A plurality of insertion holes, into which the high-voltage cables are inserted, are formed in one side wall of the case. An opening part for performing an operation for fixing the high-voltage cables to the terminal connecting parts is formed in a wall of the case opposed to the terminal connecting parts and the insulating parts.

Abstract: A server cooling system may include, but is not limited to: a server rack; and a flexible duct apparatus, the flexible duct apparatus comprising: a flexible frame; and a fabric portion disposed over at least a portion of the frame, wherein the flexible frame and fabric cooperatively define at least a cooling system aperture and a server aperture.