Abstract: An electronic equipment includes: a heat generating component; and a heat receiving device, wherein the heat receiving device includes: a case including a contacting surface which contacts the heat generating component; a flow passage, formed within the case, configured to flow a coolant flows, and an inflow port and an outflow port of the flow passage formed in an outer surface of the case, and a distance from a spot having higher heat generation density than the other portions on a surface of the heat generating component which contacts the contacting surface to the inflow port is shorter than a distance from the spot to the outflow port.

Abstract: Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.

Abstract: A thermal management system (201) is provided which includes a housing (203) equipped with a first set of apertures S1={a1, ai} (213), a second set of apertures S2={b1, . . . bj} (215) and a set of entrainment features S3={c1, Ck} (217), wherein i, j, k?1, and wherein, for any pair of adjacent apertures Pa={am, bn}, wherein am ? S1 and m ? I={1, . . . , i}, and wherein bn ? S2 and n ? J={1, . . . , j}, there is at least one entrainment feature cp ? S3 which is disposed between aperture am and aperture bn, wherein p ? K={1, . . . , k} . The thermal management system also includes a synthetic jet actuator disposed in said housing which is in fluidic communication with the sets of apertures S1 and S2 and which operates to create a synthetic jet at each aperture dr ? { S1, S2}, wherein r ? I?J.

Abstract: A computer system includes a rack-mountable server unit with a closed server housing. The server housing has a channel with a recessed channel wall in conductive thermal communication with a processor or other heat-generating component. An elongate conduit is received into the channel of the server housing in conductive thermal communication with an external surface of the server housing. The server is cooled by conductive fluid flow through the conduit, with no appreciable airflow through the server housing. The system may be operated in an optional burst cooling mode, wherein a volume of cooling fluid is trapped in the conduit for a period of time before being quickly released.

Abstract: The present invention is to provide an engaging structure applicable to a display device and including a housing and an inflatable element, wherein the housing serves as a protective case of the display device and is formed with at least one assembly hole, and the inflatable element is formed with at least one connecting portion, such that, when the housing is assembled into an accommodating space of the inflatable element and the inflatable element is fully inflated, the connecting portion is engaged in the corresponding assembly hole. Thus, the portions of the inflatable element that correspond in position to the accommodating space are tightly pressed against the sides of the housing other than the side where a screen is installed at the display device. Since the inflatable element is lightweight and occupies a tiny space while in a deflated state, it will effectively reduce storage space and transportation costs.

Abstract: The invention relates to a switch cabinet arrangement of a device for generating electrical energy, wherein the switch cabinet arrangement comprises at least two separate power switch cabinets. The technical object of achieving an optimum scalability of devices for generating electrical energy with at the same time a simple installation and maintenance of the power switch cabinets despite a small available installation space, is achieved according to the invention in that the power switch cabinets respectively comprise a machine connection, a power module, a mains connection and a decentralised control unit, wherein the power module comprises a machine converter, a mains converter, a direct voltage intermediate circuit and a chopper, and wherein the power switch cabinets are electrically connected in parallel to one another via the machine connection and the mains connection.

Abstract: Surfaces for electromagnetic shielding, retaining electrostatic charge and indeed collecting ion current in EHD fluid mover designs may be formed as or on surfaces of other components and/or structures in an electronic device. In this way, dimensions may be reduced and packing densities increased. In some cases, electrostatically operative portions of an EHD fluid mover are formed as or on surfaces of an enclosure, an EMI shield, a circuit board and/or a heat pipe or spreader. Depending on the role of these electrostatically operative portions, dielectric, resistive and/or ozone robust or catalytic coatings or conditioning may be applied.

Abstract: An example includes an apparatus to pump a fluid. The apparatus includes a housing extending along a length defining an elongate interior, an actuator in the housing, conforming to the elongate interior, the actuator including a plurality of lumens, each having a length extending substantially parallel to the elongate interior, each from around 10 to 200 micrometers across and an actuator configured to oscillate the actuator in the actuator housing along the length of the elongate interior with a rate differential between movement in a first direction versus movement in a second direction opposite the first direction to pump the fluid.

Abstract: A multi-rack assembly is provided which includes first and second electronics racks. The first electronics rack includes one or more cooling units disposed within the first electronics rack, which are coupled in fluid communication with a primary coolant loop of the first electronics rack to, at least in part, provide cooled coolant to the primary coolant loop and facilitate cooling one or more first rack electronic components. The second electronics rack includes a secondary coolant loop coupled in fluid communication with the cooling unit(s) disposed within the first electronics rack. The multi-rack assembly further includes a controller to automatically provide cooled coolant to the secondary coolant loop, and wherein the controller controls flow of cooled coolant from the cooling unit(s) to the secondary coolant loop depending, at least in part, on cooling requirements of the first electronics rack.

Abstract: An enclosure that includes a box structure that includes a plurality of sides defining a sealed chamber for containing a heat producing component. At least one of the sides of the box structure includes a panel. The panel includes two outer sheets and an inner layer of material sandwiched between the two outer sheets. The two outer sheets and the inner layer of material collectively define a plurality of fluid flow channels extending from a first end of the two outer sheets to a second end of the two outer sheets. Heat generated by the heat producing component is transferred to at least one of the outer sheets which transfers the heat to fluid flowing through the fluid flow channels. The panel can be the main load bearing path of the box structure.

Abstract: A switching power supply has electronic parts that configure a switching circuit. The electronic parts are accommodated in a casing. A seat member is formed unitarily with the casing on which the electronic parts are mounted. A coolant channel is formed through the seat member so as to be open at least at two positions of an outer wall surface of the casing. Coolant that flows through the coolant channel cools the electronic parts mounted on the seat member.

Abstract: A power converter device is disclosed herein. The power converter device includes a printed wiring board assembly, a cold plate base and a shell plate assembly. The cold plate base is fastened under the printed wiring board assembly for dissipating heat generated by the printed wiring board assembly. The shell plate assembly having a top shell plate, a bottom shell plate, at least two side plates respectively mounted on the cold plate base in different orientations. The printed wiring board assembly and the cold plate base are enclosed with the shell plate assembly.

Abstract: A motor controller comprising an inverter module including an inverter circuit coupled to a baseplate, wherein the baseplate includes cooling features; a cooling channel configured to receive a cooling fluid, wherein the cooling features extend into the cooling channel; a capacitor; and a laminated bus electrically coupling the capacitor to the inverter circuit and thermally coupling the capacitor to the cooling channel.

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer.

Abstract: Embodiments of the present invention include a cooling system and method for cooling a computer rack by circulating liquid coolant through different sections of a rack heat exchanger under separately controlled flow and temperature conditions. In a method according to one embodiment, a first liquid coolant is supplied to a first section of an air-to-liquid heat exchanger. A second liquid coolant is supplied to a second section of the air-to-liquid heat exchanger at a different temperature than the first liquid coolant. Airflow is generated through rack-mounted computer components to the first and second sections of the air-to-liquid heat exchanger. The flow rates of the first and second liquid coolants are independently controlled to enforce a target cooling parameter. The independent operation of the first and second fin tube sections allows for the increased use of un-chilled water without sacrificing heat removal objectives.

Abstract: An impingement cooling system for cooling electronic components includes a nozzle array having a plurality of nozzles in fluid communication with a source of cooling fluid, each nozzle including a deflection structure that deforms above a threshold temperature. A plurality of thermally conductive pins respectively are in thermal contact with the deflection structures and conduct heat from at least one of the electronic components to the deflection structures. When a heated nozzle within the nozzle array reaches a temperature above the threshold temperature due to heat conducted from the respective thermally conductive pin, the deflection structure of the heated nozzle deforms from a closed position to an open position to permit cooling fluid to impinge upon the electronic component. The deflection structure may be a deflection plate formed of a bimetallic material having layers of different thermal expansion coefficients, or a thermally responsive two-way shape memory material.

Abstract: A processing module is provided that comprises a set of processing module sides, each comprising a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side couples to another processing module side to form a modular processing module. The modular processing module comprises an exterior connection to a power source and a communication system and a plurality of cold plates coupled to the plurality of processing nodes. Liquid coolant is circulated through the plurality of cold plates via a closed loop by at least one pump through a plurality of tubes and through at least one heat exchanger. The at least one heat exchanger is coupled to an exterior portion of the processing module. The at least one heat exchanger cools the liquid coolant using air surrounding the processing module.

Abstract: A power conversion device includes a laminated unit, a reactor, a shield, and coolant passages. In the laminated unit, flat-plate semiconductor modules housing semiconductor elements and flat-plate cooling plates are laminated. The shield is interposed between the reactor and electronic components. The coolant passages supply coolant to or discharge coolant from the laminated unit. The coolant passages pass through an interior of the shield.

Abstract: A cooling type switching element module includes an outer conductor pipe, an inner conductor pipe that transmits electric power in conjunction with the outer conductor pipe, and first and second switching elements. The first switching elements are provided on outer surfaces of the outer conductor pipe, and the second switching elements are provided on outer surfaces of a projecting portion of the inner conductor pipe. A coolant flows within the inner conductor pipe, and outside the outer conductor pipe. The first and second switching elements are cooled from both sides by the coolant flowing within the inner conductor pipe, and by the coolant flowing outside the outer conductor pipe. By employing the above-described structure, it is possible to provide a switching element module having a cooling function, in which improved cooling performance, improved electrical performance, and downsizing are achieved.

Abstract: A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating through cold plates mounted on electronic components. In the computing system, the liquid coolant is circulated in a closed loop by at least one pump through a plurality of hoses through at least one of a plurality of heat exchangers. In the computing system, the plurality of heat exchangers is coupled to an exterior portion of the surface of the computing system. In the computing system, the plurality of heat exchangers cool the liquid coolant through tinned tubes exposed to the surrounding air.

Abstract: A thermal management system for an electrical component includes a printed circuit board (PCB) capable of receiving the electrical component on a first side of the PCB. An elongate member has one end attached to a second side of the PCB, and another end disposed away from the PCB. The elongate member also has an open interior that facilitates fluid communication between the two ends. One of the ends defines an at least partially closed boundary on the PCB. The PCB includes an aperture disposed therethrough proximate the boundary such that fluid communication is facilitated between the first side of the PCB and the second side of the PCB, and along at least a portion of the elongate member.

Abstract: An electrical device and method are presented, the device having an enclosure defining an interior volume sealed from the environment and an electronic lighting apparatus, which may include a heat generating element such as a light source, a heat sink, and a fluid flow generator. The heat sink may be positioned partially within the sealed interior volume and adjacent the heat generating element and transfer heat therefrom. The fluid flow generator may create a flow of fluid to transport heat away from the heat sink and to the enclosure. The electronic lighting apparatus may be carried by the enclosure and partially disposed within the interior volume of the enclosure. The electrical device may further include an optic carried by the enclosure that may cooperate with the enclosure to define the sealed interior volume.

Abstract: An electronic device includes a central processing module having a base board, a central processing unit fixed to the base board, and a heat dissipation assembly secured to the base board. The heat dissipation assembly has a first heat sink, a second heat sink and an air deflector. The air deflector blocks an opening of the channel to deflect and guide airflow flow through the first heat sink and the second heat sink.

Abstract: A high power drive stack system is provided which includes a cabinet having a vaporizable dielectric fluid cooling system and a plurality of receivers for accepting a plurality of modules containing power electronics. The modules are removably attachable to the receivers by at least two non-latching, dry-break connectors. Each of the at least two connectors providing both a fluid connection and an electrical connection between the cabinet and the module.

Abstract: A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed.

Abstract: A container data center is disclosed in the present invention, relating to the field of data centers. The container data center includes: a container box, in which the inside of the box is divided into an equipment compartment, a power supply and distribution compartment and a water chilling set compartment; doors set in the box; a power supply equipment installed in the power supply and distribution compartment; an electronic equipment and a water chilling terminal installed in the equipment compartment; a water chilling set installed in the water chilling set compartment, in which the water chilling set is in communication with the water chilling terminal to provide cold water for the water chilling terminal.

Abstract: An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet.

Abstract: In one embodiment, the disclosure includes a telecom utility cabinet including a heat load chamber. The telecom utility cabinet also includes an air introducing duct configured to conduct air from the heat load chamber to a geothermal cooling system. The telecom utility cabinet also includes an air discharging duct configured to conduct air from the geothermal cooling system to the heat load chamber. In another embodiment, the disclosure includes a method for managing temperature in a telecom utility cabinet. The method includes introducing air from a heat load chamber to a geothermal cooling system and discharging air from the geothermal cooling system to the heat load chamber.

Abstract: The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

Abstract: A server rack system includes a rack, servers, and a heat-dissipating wall. The rack has guiding rails, a front end, and a rear end opposite to the front end. The servers slidably configured on the guiding rails and in the rack are adapted for being moved into or out of the rack from the front end. The heat-dissipating wall is pivoted to the rear end and adapted for being folded against or unfolded away from the rear end. The heat-dissipating wall includes a fan wall. Fans lie on the fan wall. The fans are adapted for sucking cool air, such that the cool air enters the rack from the front end and passes through the servers. Heat exchange between the cool air and the servers is carried out to generate hot air that flows out of the rack through the heat-dissipating wall to dissipate heat of the servers.

Abstract: A power semiconductor system and method for producing a power semiconductor system. In one embodiment, the application relates to a power semiconductor system, comprising a line system for a fluid working medium; wall element having an outer side and an inner side; and a power semiconductor circuit arranged at the outer side of the wall element, wherein the inner side of the wall element forms a fluid-tight wall of the line system.

Abstract: A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.

Abstract: An apparatus for supplemental cooling of a docked mobile device that includes a docking module having a docking interface that provides a communication connection for a separable mobile device having several heat generating electronic components that emanate heat when the separable mobile device is in an operating mode. In addition, the separable mobile device has an integrated heat sink structure that spreads the heat emanating from the operating heat generating electronic components across the entire heat sink structure. An air mover is integrated into the docking module to provide a volume of air flow that is directed to the separable mobile device while it is docked to the docking module. Accordingly, an air mover controller receives a first signal from an input sensor and therein controls the air mover to modulate the volume of air flow according to a predetermined tolerance corresponding to the heat generating electronic components.

Abstract: The method of the invention makes it possible to cool electrical switchgear operating at medium voltage and high current, such as a circuit breaker. The method consists in inserting serially two heat pipes (11) inside said switchgear, putting a first end (11A) of the first heat pipe (11) in the hot portion of the hot portions (10A, 10C) of the circuit breaker (10) and a second end (11B) of the first heat pipe (11) in a portion that is cooler (10A) of the hot portions (10A, 10C). The other heat pipe (11) is put between the cooler of the hot portions (10A) and a cooler part of the circuit breaker (10). A particular application is provided for medium-voltage, high-current circuit breakers.

Abstract: A method for controlling a motor comprises steps of: first, determining whether a switch of a motor control circuit in an electronic system is in a first state; then, operating the motor at a fanless operation mode when a temperature inside an enclosure of the electronic system is higher than zero and lower than a first threshold temperature, wherein the rotation speed of the motor is zero rpm; operating the motor at a silent operation mode when the temperature is higher than the first threshold temperature and lower than a second threshold temperature, wherein the rotation speed of the motor is a constant rotation speed; and operating the motor at a cooling operation mode when the temperature is higher than the second threshold temperature, wherein the rotation speed of the motor is a function of the temperature and varies between the constant rotation speed and a maximum rotation speed.

Abstract: An electric power conversion apparatus includes first and second electric power conversion devices and a housing. The first and second electric power conversion devices are arranged to overlap each other in an overlap direction. The housing receives both the first and second electric power conversion devices therein. The housing has a partition wall that extends between the first and second electric power conversion devices to partition the housing into first and second parts in which the first and second electric power conversion devices are respectively received. The partition wall has a coolant passage formed therein, thereby allowing a coolant to flow through the coolant passage.

Abstract: A power semiconductor module includes a first package having an upper arm circuit section, a second package having a lower arm circuit section, a metal case having a storage space to store the first package and the second package and an opening connecting with the storage space, and an intermediate connecting conductor to couple the upper arm circuit section with the lower arm circuit section; the case includes a first radiating section and a second radiating section facing the first radiating section through the storage space; the first package is arranged so that the arrangement direction of the first and second packages may be parallel to the respective surfaces facing the first and second radiating sections; and the intermediate connecting conductor couples an emitter side terminal extending from the first package with a collector side terminal extending from the second package in the storage space.

Abstract: A power converter including a semiconductor module; a cooler having a pair of coolant pipes; a casing provided with a pair of openings, housing the semiconductor module and the cooler; and a pair of grommets being fitted to the pair of openings where the pair of coolant pipes are interested into the pair of grommets. Each of the grommet includes: a grommet body having a through hole through which a corresponding coolant pipe is inserted and a sealing surface that intimately contacts an inner peripheral surface of a corresponding opening; and a guide provided to one end of the grommet body, with respect to a direction of inserting the coolant pipe, so as to be projected outward further than the sealing surface. Each of the grommet is embedded with a reinforcement member with at least a part of the reinforcement member being located in the guide.

Abstract: A cooling apparatus is disclosed. The cooling apparatus comprises a first outer portion comprising a fluid inlet and a first exterior cooling surface. A first fluid-diverting structure is in fluid communication with the fluid inlet. A second outer portion comprises a fluid outlet and a second exterior cooling surface. A second fluid-diverting structure is in fluid communication with the fluid outlet. An electrical substrate is coupled to at least one of the first and second exterior cooling surfaces. An intermediate portion is in a facing relationship with the first and second outer portions. The intermediate portion defines an aperture for transferring a fluid between a first cavity and a second cavity. The first cavity is defined between the first outer portion and the intermediate portion. The second cavity is defined between the second outer portion and the intermediate portion. The fluid absorbs heat from the electrical substrate.

Abstract: A cooling unit is provided to facilitate cooling of coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.

Abstract: A heat exchanging system comprising circulating fluid through a tube coupled to an electronic component in a first part of a computing device and to a heat transfer plate in a second part of the computing device.

Abstract: According to one embodiment, a radome includes two dielectric layers separated by an internal layer. The internal layer is configured with an internal cooling system including a fluid channel that receives a fluid through an inlet port, conducts heat from the radome to the fluid, and exhausts the heated fluid through an outlet port.

Abstract: In a power converter in which semiconductor modules are arranged on both surfaces of a cooler for downsizing, an excellent connection between control boards and a low inductance connection between smoothing capacitors and the semiconductor modules are performed at the same time. The semiconductor modules are disposed on both surfaces of the cooler, and control boards that control the semiconductor modules are arranged opposite to the respective semiconductor modules. The semiconductor modules and the cooler are held between the control boards. A current detector or a terminal block is disposed at a position perpendicular to a surface on which the cooler and the semiconductor modules contact each other, opposite to the cooler. The respective control boards disposed on both surfaces of the cooler are electrically connected by using wirings provided in the current detector or the terminal block.

Abstract: A heat transferring module adapted to an electronic device is provided. The electronic device includes at least one heat source and a plurality of ready-to-heat elements. The heat transferring module includes at least one water head, at least two loop heat pipes, at least two pumps, and a working fluid. The water head is thermally connected to the heat source. The loop heat pipes are connected to the water head respectively, and at least one of the loop heat pipes is thermally connected to the ready-to-heat elements. Each pump is connected to the corresponding loop heat pipe. The working fluid flows into the water head and at least one of the loop heat pipes by at least one of the pumps, so heat generated by the heat source is transferred to at least one of the ready-to-heat elements. A method of starting up an electronic device is also provided.

Abstract: An electronic display which can be mounted above a paved surface in an outdoor environment. A surface or plate is placed behind the electronic display to define a gap where cooling air can be drawn through said gap in order to cool the electronic display. A plurality of ribs may be placed within the gap and in thermal communication with the electronic display. The density of the ribs may be varied according to the inlet and exhaust openings for the cooling air. The ribs may be placed at a higher density near the exhaust to account for the increase in temperature of the cooling air as it travels through the gap.

Abstract: A cooling system has an inlet plenum and at least one cooling channel which communicates with the inlet plenum. The cooling channel passes adjacent to a component to be cooled from an upstream inlet to a downstream outlet. A pair of electrodes are positioned adjacent the inlet to create an electric field tending to resist a bubble formed in an included dielectric liquid from moving in an upstream direction due to a dielectrophoretic force. Instead, a dielectrophoretic force urges the bubble in a downstream direction.

Abstract: A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.

Abstract: Cooling apparatuses and methods are provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The cooling apparatus includes a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.

Abstract: Cooling apparatus and methods are provided for facilitating cooling of electronic components of an electronic system. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and an immersion-cooling fluid is disposed within the compartment. At least one component of the electronic system is at least partially non-immersed within the fluid in the compartment. A wicking film element is physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment. A coupling element physically couples the wicking film element to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.

Abstract: A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.