Abstract: A mounting base can comprise: a group of mounting areas, each mounting area of the group of mounting areas comprising: a respective mechanical connector member of a group of respective mechanical connector members for attaching to a complementary mechanical connector member on each direct-current to direct-current (DC/DC) converter unit of the group of DC/DC converter units, and a respective electrical connector of a group of respective electrical connectors for attaching to a complementary electrical connector on each DC/DC converter unit of the group of DC/DC converter units, a group of electrical conductors attached to the group of respective electrical connectors in each mounting area, and attached to a main connector on the mounting base for connecting to a high-voltage (HV) connector of a main HV supply, and a cooling channel extending in heat conducting contact with the group of mounting areas.

Abstract: The disclosure describes a heat-dissipating object having a reservoir structure so that a reservoir system can be formed in an electronic device, allowing for a liquid TIM in the gap between the heat-dissipating object and the heat-generating object of the electronic device. The reservoir structure comprises a seal ring, a connecting hole and a reservoir which is a space for taking in a liquid material and releasing it again when needed. As a specific case of the heat-dissipating object and the electronic device, a lid having a reservoir structure and a lidded flip chip package based on the lid are particularly described in details of the embodiments of the present invention.

Abstract: It is an object to reduce a difference in temperature of a refrigerant between an upstream side and a downstream side of a flow path even in a case where all semiconductor elements generate heat due to inverter operation and the like. A semiconductor device includes at least one semiconductor element, a base plate, a plurality of cooling fins, a jacket, and a partition. The partition is disposed below the plurality of cooling fins in the jacket. The partition has at least one inflow opening to allow the refrigerant having flowed in through the refrigerant inlet to flow through the plurality of cooling fins, and has a portion abutting the jacket on the side of the refrigerant inlet. The at least one inflow opening is located to correspond to the at least one semiconductor element.

Abstract: A modular integrated ultracapacitor-based energy storage and power delivery apparatus (UCAP module) is described. In some embodiments, the UCAP module comprises: at least one ultracapacitor cell coupled together in a series, parallel, or combination of both series and parallel configuration; an integrated charging unit; conductive hardware electrically coupling the ultracapacitors cells together; at least one UCAP terminal rod extending throughout the UCAP module and used to route power within the UCAP module and in some embodiments to other UCAP modules; and a protective casing. In some embodiments the UCAP terminal rod couples the UCAP module to at least one additional UCAP module in a series, parallel, or a combination of both series and parallel configurations. In other embodiments, the UCAP module further comprises connector rods that electrically and mechanically couple the UCAP module to at least one additional UCAP module.

Abstract: An example system includes a motive application having a prime mover, a load, a driveline, and a motor/generator that couples to the driveline. The system includes a number of batteries, and a battery assembly that electrically couples the batteries to the motor/generator. The battery assembly includes a power interface positioned at a first end of the battery assembly, the power interface including a low voltage coupling and a high voltage coupling, and a service electrically interposed between the batteries and the power interface. The service disconnect in a first position couples at least one of the batteries to the first low voltage coupling and couples the batteries to the second high voltage coupling. The service disconnect in a second position de-couples the batteries from the low voltage coupling and the high voltage coupling.

Abstract: A docking system for facilitating a connection of an electronics module to a mating connector comprises first and second rails. Each rail has an elongated guide slot for receiving a corresponding guide portion of the electronics module during sliding movement of the electronics module toward the mating connector. A first elastic structure is located on the first rail. The first elastic structure has a first engagement portion extending into the elongated guide slot of the first rail. A second elastic structure is located on the second rail. The second elastic structure has a second engagement portion extending into the elongated guide slot of the second rail. The first engagement portion and the second engagement portion are configured to engage the guide portions of the electronics module and to resist movement of the guide portions in a direction generally perpendicular to the sliding movement of the electronics module.

Abstract: A housing includes a cup-shaped, plastic housing case; a cooling channel guided in the housing case for fluid cooling of an electric or electronic device situated in an interior of the housing case; and a planar shielding body integrated into the housing case and traversing walls of the housing case for shielding from electromagnetic radiation. The shielding body is a metallic wire cage or trough. The cooling channel is a metallic tubing. The shielding body and the cooling channel are connected to form a frame-like, pre-assembled assembly. The pre-assembled assembly, consisting of the shielding body and the cooling channel, is extrusion-coated with a plastic or encapsulated in a plastic to form the housing case.

Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

Abstract: A head-mounted display (HMD) includes a hybrid fan, a printed circuit board (PCB) with one or more electronic components and a heat pipe to dissipate heat. The hybrid fan has a center axis extending from a rear side of the HMD to a front side of the HMD. The hybrid fan pulls air from a rear side of the HMD. The heat pipe has an end coupled to the PCB. The heat pipe partially surrounds a periphery of the hybrid fan and transfers heat away from at least the PCB. The HMD further includes a side cover and a front cover. The side cover encloses the hybrid fan, the PCB and the heat pipe. The front cover is attached to the side cover with a slit between an outer edge of the front cover and an outer edge of the side cover to discharge air from the hybrid fan.

Abstract: A cold plate includes a first side with a first surface, and a second side, opposite the first side. A coolant cavity is formed between the first side and the second side. A recessed base is machined into the first surface of the first side. The recessed base is bonded to a base copper plate and is a thinnest portion of the first surface.

Abstract: A power distribution system including a first power module and a second power module. The first power module including a first power input receiving an input power, a first transformer receiving the input power and outputting a transformed power, a first power output configured to output the input power, a second power output configured to output the transformed power, and a pass-through output configured to output input power. The second power module including a third power input receiving the input power, from the pass-through output of the first power module, a fourth transformer receiving the input power and outputting the transformed power, a first power output configured to output the input power, and a second power output configured to output the transformed power.

Abstract: A power electronics module includes a cold plate manifold, a heat sink base layer at least partially embedded in the cold plate manifold, an electrically-insulating layer in direct contact with the heat sink base layer, a conductive substrate positioned on the electrically-insulating layer, and a power electronics device coupled to and in direct contact with the conductive substrate.

Abstract: A heat sink includes a pipe through which cooled fluid flows and a cooling block having a first face on which the pipe is placed and a second face to which a heat emitting element is attached. The cooling block has a contact region and a noncontact region at positions where the cooling block faces the pipe. In the contact region, the first face contacts the pipe. In the noncontact region, the first face faces the pipe with a gap therebetween. The contact region is included in a projection region defined by projecting a region of attachment of the heat emitting element onto the first face.

Abstract: An electronic device may include a backplane and an electrical connector carried by a front side of the backplane, and a circuit board assembly removably coupled to the electrical connector. Each circuit board assembly may include a circuit board and electronic components carried by the circuit board and generating waste heat, and a cooling fluid arrangement thermally coupled to the electronic components. The electronic device may include a cooling fluid manifold, and a pair of multi-functional tubes that provide alignment, keying, structural rigidity and fluid supply and return capabilities extending between the cooling fluid manifold and the cooling fluid arrangement.

Abstract: The present invention relates to a power semiconductor module including a first heat dissipation substrate, a semiconductor chip, a lead plate, a PCB, and a heat dissipation plate that are packaged within a casing, wherein dualization of a heat dissipation structure is applied to facilitate superior heat dissipation performance compared to a conventional power semiconductor module.

Abstract: The present invention discloses a one-chambered constant pressure apparatus for liquid immersion cooling of servers, which are submerged within a non-conductive coolant maintained in the apparatus. When servers start to operate, a large amount of heat will be dissipated from servers. The coolant is vaporized into a coolant vapor by absorbing heat dissipated from servers, which enables servers to be cooled. The coolant vapor is condensed into a cooling liquid by a condenser. However, in the process of condensation, the rising coolant vapor tends to scatter in all directions resulting in a failure to condense all of the coolant vapor. Therefore, the uncondensed coolant vapor will cause the pressure in the apparatus to gradually rise, which eventually leads to the ineffective cooling of servers.

Abstract: A power distribution system including a first power module and a second power module. The first power module including a first power input receiving an input power, a first transformer receiving the input power and outputting a transformed power, a first power output configured to output the input power, a second power output configured to output the transformed power, and a pass-through output configured to output input power. The second power module including a third power input receiving the input power, from the pass-through output of the first power module, a fourth transformer receiving the input power and outputting the transformed power, a first power output configured to output the input power, and a second power output configured to output the transformed power.

Abstract: An active thermal management system for electronic devices comprises: a heat spreader having an internal channel; a thermally conductive body moveably positioned in the internal channel; and two or more electronic devices in thermal contact with a back surface of the heat spreader and positioned adjacent to the internal channel. A location of the thermally conductive body within the internal channel determines a path for heat flow from the back surface to a front surface of the heat spreader. The location of the thermally conductive body within the internal channel may be selected to minimize a temperature differential (?T) between the electronic devices.

Abstract: A semiconductor package structure includes a package substrate and a semiconductor die. The package substrate includes a plurality of hollow vias extending through the package substrate. The semiconductor die is electrically connected to the package substrate. The hollow vias are disposed under the semiconductor die.

Abstract: A power semiconductor module including a cooling apparatus and a power semiconductor device mounted on the cooling apparatus, wherein the cooling apparatus includes: a ceiling plate that; a case; and a cooling fin, a ceiling plate and the case respectively include fastening portions that are used to fasten the ceiling plate and the case to an external apparatus, while the ceiling plate and the outer edge portion are arranged in an overlapping manner, the power semiconductor device includes a circuit substrate and a terminal case, the fastening portions protrude farther outward than a periphery of the ceiling plate, and the terminal case includes a case body arranged along a perimeter of the circuit substrate and reinforcing portions that extend to top surface sides of the fastening portions.

Abstract: An integrated device package is disclosed. The package can include a carrier and an integrated device die having a front side and a back side. A mounting structure can serve to mount the back side of the integrated device die to the carrier. The mounting structure can comprise a first layer over the carrier and a second element between the back side of the integrated device die and the first layer. The first layer can comprise a first insulating material that adheres to the carrier, and the second element can comprise a second insulating material.

Abstract: Dew condensation in a housing of an inverter device can be prevented. The inverter device includes: a housing accommodating a power electronic element and an electrolytic capacitor; an opening formed in the housing; a thermal insulator disposed along a periphery of the opening; and a water jacket having a body portion, and a flow-in pipe and a discharge pipe for cooling water, the water jacket being disposed such that a first surface of the body portion closes the opening from an outside of the housing, with the thermal insulator interposed therebetween. The power electronic element is mounted on the first surface of the body portion, and the electrolytic capacitor is mounted in the housing so as to be in contact with an inner surface of the housing.

Abstract: A head-mounted display (HMD) includes a hybrid fan, a printed circuit board (PCB) with one or more electronic components and a heat pipe to dissipate heat. The hybrid fan has a center axis extending from a rear side of the HMD to a front side of the HMD. The hybrid fan pulls air from a rear side of the HMD. The heat pipe has an end coupled to the PCB. The heat pipe partially surrounds a periphery of the hybrid fan and transfers heat away from at least the PCB. The HMD further includes a side cover and a front cover. The side cover encloses the hybrid fan, the PCB and the heat pipe. The front cover is attached to the side cover with a slit between an outer edge of the front cover and an outer edge of the side cover to discharge air from the hybrid fan.

Abstract: A liquid cooled information handling system (LC_IHS) includes a first liquid cooled node coupled to a first chassis. The LC_IHS further includes a supply conduit in fluid communication with the first chassis to cool a first liquid cooled node. The supply conduit includes a plurality of fluid paths configured such that when a first fluid path of the plurality of fluid paths is interrupted, cooling of the first liquid cooled node continues.

Abstract: A battery thermal management system includes a battery pack, a heat exchanger in fluid communication with the battery pack, a pump interposed between the heat exchanger and the battery pack to cause a heat exchange fluid to flow in a coolant loop between the heat exchanger and the battery pack. A heat capacitor is disposed downstream from the battery pack with respect to a direction of a flow of the heat exchange fluid through the coolant loop and upstream from the heat exchanger in the direction of the flow of the heat exchange fluid through the coolant loop. A valve is disposed in the coolant loop upstream from the heat capacitor in the direction of the flow of the coolant through the coolant loop. The valve controls at least a portion of the flow of the coolant through at least one of the heat capacitor and the heat exchanger.

Abstract: An electric power conversion device is provided with a case (60) which includes: a first member (61) having a first region (73) defining therein a first passage (78, 79) in which a cooling medium flows, and a second region (74) disposed on a side of the first region; and a second member (88) disposed so as to at least partly overlap with the second region as seen from a direction orthogonal to the second region in a spaced apart relationship to the second region, and internally defining a second passage (91) connected to the first passage. A reactor (31) is positioned in the first region, and a switching device (33) is positioned on the surface of the second member facing away from the first member while a capacitor (35) is positioned between the second member and the second region of the first member.

Abstract: A slave control apparatus including a receiver and a controller. The receiver is configured to receive a sensed physical quantity of a battery and a sensed output physical quantity of a converter corresponding to the battery. The controller is configured to determine state information of the battery based on the sensed physical quantity and the sensed output physical quantity, transmit the state information to a master control apparatus, and control the converter based on output information from the master control apparatus that corresponds to the state information.

Abstract: An information processing system (TS) includes: a set of information processing devices forming a plurality of electrical circuits (C1, C2, C3 . . . Cn) supplied with power via a power supply source (S), cooling elements (MR) being placed near at least part of the electrical circuits; at least one Stirling engine, the cooling elements (MR) of which form a hot source and produce a mechanical movement (Mvt) on the basis of a temperature differential (?T) between the hot source and a cold source (SF); and a generator (G) providing an electric current (iG) on the basis of the mechanical movement.

Abstract: The present invention provides an electromagnetic wave blocking device having electromagnetic wave shielding and absorbing capacity. The electromagnetic wave blocking device having electromagnetic wave shielding and absorbing capacity includes: an electromagnetic wave blocking device body part configured such that an identical material is mixed with shielding and absorbing materials or different materials are arranged on both sides of a boundary of their sides to thus enable electromagnetic wave absorption and electromagnetic wave shielding; and an edge electromagnetic wave absorbing part formed along the boundary of the blocking device body part to thus additionally block electromagnetic waves. Furthermore, the present invention provides a method for manufacturing the electromagnetic wave blocking device.

Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a cooling apparatus that includes a first heatsink, a second movable heatsink and a flexible thermal conductor physically and thermally coupled with the first and second heatsinks, where the flexible thermal conductor is to flex and remain thermally coupled with the first heatsink and the second heatsink, when the second heatsink is moved relative to the first heatsink. The first heatsink may be coupled to a heat source such as a processor that may be coupled with a PCB. Also, the movable heatsink may allow access to components, such as dual in-line memory modules (DIMMs) that are next to the first heatsink and under the movable second heatsink. Other embodiments may be described and/or claimed.

Abstract: An electric power converter is provided which includes a stack body made of a stack of a plurality of electronic devices and cooling medium flow paths in which cooling medium flows. The electric power converter also includes a housing in which the stack body is disposed. The housing 3 has a stack facing wall which faces the stack body in a stacking direction. The stack facing wall has an in-wall flow path in which the cooling medium flows and which communicates the cooling medium flow paths. This structure enables the electric power converter to be reduced in size thereof.

Abstract: An electrified vehicle capacitor assembly including a film capacitor assembly and a support structure is provided. The film capacitor assembly may include a stack of alternating electrodes and film layers. The electrodes may be offset from one another to alternatively contact opposing terminals. The support structure may include coolant channels and may be arranged to orient the film capacitor assembly adjacent an inverter assembly and such that each is in conductive thermal communication with at least one of the coolant channels. The film capacitor assembly further includes a stack of alternating metal foils and film layers disposed between a pair of contact layers, a pair of terminals, and a first thermal plate. Each of the pair of terminals is disposed on an outer side of one of each of the pair of contact layers.

Abstract: Accroding to the present disclosure, a heat sink, which may be used e.g. for LED lamps or bulbs for motor vehicle lights, includes: a plate-like portion extending along an axis with opposed mounting surfaces for at least one heat source, such as e.g. a LED lighting source, and a finned portion thermally coupled with the plate-like portion and including a plurality of annular fins extending around said axis.

Abstract: In one general aspect, a converging split-flow microchannel evaporator is disclosed. It includes a conductive contact surface to mate to a surface to be cooled, with a core mounted in thermal connection with the conductive surface that defines at least one layer of microchannels. Within the core, one inlet restriction restricts the flow into each microchannel in a first group of the microchannels, and another restricts the flow into each microchannel in a second group. A centrally located fluid outlet receives the flows from opposite ends of the microchannels in the two groups. A check valve can be provided to help ensure ready startup without reverse flow.

Abstract: A voltage sensor housing includes a top portion including a conductive top portion composed of conductive material and non-conductive top portions composed of non-conductive material, a bottom portion composed of non-conductive material, side portions composed of non-conductive material, wherein the top portion the bottom portion and the side portions define an interior area structured to hold a voltage sensor, and conductive side portions composed of conductive material and being disposed adjacent to the side portions. The conductive top portion is electrically floating and the conductive side portions are electrically grounded.

Abstract: The present invention provides a water block for a water-cooling CPU radiator. The water block includes an upper shell, a bottom shell, an external pipe and a water pump. The upper shell includes a shell body and an upper cover. The shell body is provided with a first cavity, a side wall of the shell body is provided with a water outlet. The upper cover is provided with a water inlet, and both the water inlet and the water outlet are in fluid communication with the first cavity. The bottom shell is arranged at the lower end of the shell body and is provided with a second cavity, and the two sides of the bottom shell are provided with an upper water port and a water inlet, respectively, which are communicated with the second cavity. The external pipe is arranged outside the upper shell and the bottom shell.

Abstract: A power semiconductor device has a metal molded body forming a first connecting conductor. From a first main surface of the metal molded body there is a first recess having a first base in which a first power semiconductor component is arranged which faces the first base and is connected in an electrically conductive manner. From a second main surface of the metal molded body, a second recess has a second base, and a second power semiconductor component is arranged with the first contact surface thereof associated with the second base connected in an electrically conductive manner to this base. An insulating material layer is on both main surfaces, filling and completely covering the recess, wherein the first insulating layer has an electrically conductive first via which connects a second contact surface of the first power semiconductor component in an electrically conductive manner to a first conducting surface arranged on the first insulating layer.

Abstract: A cooling assembly comprising a plurality of fin elements stacked in a stack direction, a plurality of coolant channels each located between adjacent fin elements and extending in a coolant channel direction perpendicular to the stack direction, a first heat transfer surface adapted to be in contact with a heat generating element, and a second heat transfer surface spaced apart from the first heat transfer surface, the plurality of fin elements and the plurality of coolant channels being located between the first heat transfer surface and the second heat transfer surface. Each of the fin elements comprises a pulsating heat pipe embedded therein, a main pulsating direction of each of the pulsating heat pipes being substantially parallel to a normal of the first heat transfer surface.

Abstract: An object of the invention is to improve the cooling performance for a bus bar and a smoothing capacitor in an electric power converter. The electric power converter of the present invention includes a power semiconductor module including a power semiconductor element that converts a DC current to an AC current, a capacitor cell that smooths a DC voltage, a bus bar that electrically connects the power semiconductor module and the capacitor cell, a base plate that is disposed between the bus bar and the capacitor cell, and a sealing material that seals the capacitor cell, the bus bar, and the base plate. The base plate forms an opening through which a capacitor terminal extending from the capacitor cell passes.

Abstract: An electric power converter includes a stacked body in which a plurality of semiconductor modules and a plurality of coolers are stacked. Each of the semiconductor modules is provided with a main body that has semiconductor elements therein, a plurality of power terminals, and control terminals. Among the plurality of the power terminals respectively included in the two semiconductor modules adjoining in a stacking direction of the stacked body, at least parts of the power terminals are configured so as not to overlap each other when viewed from the stacking direction.

Abstract: An interposer structure including a dielectric base material, and a metal based interconnect structure extending through the dielectric base material from a first side of the dielectric base material to an opposing second side of the dielectric base material. At least one metal line of the metal based interconnect structure extends from the first side of the dielectric base material to the second side of the dielectric base material and has a first non-linear portion. A fluidic passage extends through the dielectric base material, wherein the fluidic passage has a second non-linear portion.

Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes each comprising a chassis received in a respective chassis-receiving bay of a rack and containing heat-generating functional components. Each LC node is configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. A cooling subsystem has a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduits, each including first and second terminal connections attached on opposite ends of a central conduit that can be rack-unit dimensioned. The MLD conduits seal to and enable fluid transfer between a port of a selected LC node and a port of an adjacent LC node.

Abstract: Cooling assemblies including a porous three dimensional surface such as a heat sink are disclosed. In one embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface, a metal mesh bonded to a surface of the thermally conductive fin, and sintered metal particles bonded to the metal mesh and the surface of the thermally conductive fin. The metal mesh defines a macro-level porosity, and the sintered metal particles define a micro-level porosity. In another embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface of the heat transfer substrate, and sintered metal particles bonded to the surface of the thermally conductive fin. An average diameter of the sintered metal particles increases from a base of the thermally conductive fin to a top of the thermally conductive fin.

Abstract: An electric power converter includes a semiconductor module, a capacitor, and a DC bus bar that electrically connects them. The capacitor has a capacitor element and a capacitor terminal connected to the capacitor element. The capacitor terminals and the DC bus bar are connected to each other at least at two connecting portions. The DC bus bar has a bus bar main body portion that is connected to the semiconductor module. The two connecting portions are connected by at least a portion of the bus bar main body portion. The capacitor terminal has a terminal main body portion that is connected to the capacitor element. The two connecting portions are connected by at least a portion of the terminal main body portion.

Abstract: A frame portion is a plate-like member to which a cooler is attached for cooling an electric circuit element configured to operate for power conversion that causes generation of heat. The capacitor is a structural member disposed in a direction perpendicular to the frame portion and including a capacitor element electrically connected to the electric circuit element. The capacitor includes a first support surface and a second support surface that are external surfaces facing in opposite directions from each other and parallel to the direction perpendicular to the frame portion. The first frame and the second frame each have an end portion fixed to a connection frame. The first frame includes a first attachment surface fixed to a first support surface. The second frame includes a second attachment surface fixed to a second support surface.

Abstract: An arrangement comprising a power semiconductor module, a capacitor, a DC-voltage busbar and a connection device. The module has two flat DC-voltage connection conductors each having a contact section. The DC-voltage connection conductors are arranged closely adjacent to one another on and close to the respective contact sections in the normal direction. The capacitor has two flat capacitor connection conductors each having a contact section. The DC-voltage busbar has two partial busbars each having a contact section. The connection device has a yoke with a die and a bearing. The respective contact sections of the DC-voltage connection conductors are clamped flat above one another between the die and the bearing. The contact sections, of the capacitor or the DC-voltage busbar, are arranged closely adjacent to one another on and close to the respective contact sections in the normal direction, and are thus force-fittingly and electrically conductively connected to one another.

Abstract: A connecting structure includes a housing, a cooler, an inner refrigerant pipe, an outer refrigerant pipe, and a joint pipe. The joint pipe is attached to a through hole of the housing. The inner refrigerant pipe is fitted to the joint pipe from a housing inner side. The outer refrigerant pipe is fitted to the joint pipe from a housing outer side. A tip of the inner refrigerant pipe and a tip of the outer refrigerant pipe define a gap inside the joint pipe. An end surface of a flange or a rib of the outer refrigerant pipe in a refrigerant-pipe axis direction abuts with an end surface of a flange or a rib of the joint pipe in the refrigerant-pipe axis direction.

Abstract: An electronic component includes: a laminate busbar structure comprising at least two busbar layers separated by an insulating layer; a transistor connected to the laminate busbar structure on a first side thereof; and a capacitor that is mounted on the first side of the laminate busbar structure and is positioned further away from the laminate busbar structure than the transistor, the capacitor having respective planar terminals parallel to each other and perpendicular to the laminate busbar structure, each of the planar terminals comprising a rectangular member with one side thereof connected to the capacitor and an opposite end connected to a corresponding one of the busbar layers.

Abstract: An apparatus for dissipating heat is presented. The apparatus comprises a base provided with a recess on a top thereof for containing a portion of a flat panel electronic device. It also comprises a base heat sink disposed in the base. Finally, it comprises a heat-conducting plug with a first end thereof thermally contacting with the base heat sink, and a second end thereof extending upward from a bottom of the recess for plugging into a heat-conducting socket of the flat panel electronic device when the flat panel electronic device is placed on the base.

Abstract: Chassis for an automated test system including a housing and at least a first and a second backplane in the housing. The first backplane provides electrical connections for at least one functional module of a first type when engaged with the first backplane, while the second backplane provides electrical connections for at least one functional module of a second type different than the first type when engaged with the second backplane. The first and second backplanes include electrical circuitry to enable signals to be provided for the functional modules when engaged therewith. A bottom of the housing includes ducts to enable cooling of both types of functional modules when engaged with the housing.