Abstract: A fluid cooling system comprising a pipe unit through which coolant fluid flows. The pipe unit is provided with one or more actuators at least a part of which is formed of shape memory alloy. The actuators are configured to extend by applied heat.

Abstract: A heat sink (1) for power module is capable of mounting a power device (101) on at least a surface of the heat sink. The heat sink includes a refrigerant passage (1d) in which cooling medium that dissipates heat generated by the power device (101) flows and a corrugated fin body (1a) arranged in the refrigerant passage (1d). The corrugated fin body (1a) has crests (21b) and troughs (21c) that extend in the flow direction of the cooling medium, and side walls (21a) each of which connects the corresponding one of the crests (21b) with the adjacent one of the troughs (21c). Each adjacent pair of the side walls (21a) and the corresponding one of the crests (21b) or the corresponding one of the troughs (21c) arranged between the adjacent side walls (21a) form a fin (21). Each of the side walls (21a) has a louver (31) that operates to, at least, rotate the cooling medium flowing in the associated fin (21). The heat sink (1) thus has a further improved heat dissipating performance.

Abstract: A casing houses: semiconductor modules constituting a main circuit for power conversion; a capacitor electrically connected to the main circuit; drive circuits that provide the main circuit with a drive signal used in power conversion operation; a control circuit that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules are housed inside the cooling chamber, and at least the capacitor and the control circuit are disposed outside the cooling chamber.

Abstract: In thermal management systems that employ EHD devices to motivate flow of air between ventilated boundary portions of an enclosure, it can be desirable to have some heat transfer surfaces participate in electrohydrodynamic acceleration of fluid flow while providing additional heat transfer surfaces that may not. In some embodiments, both collector electrodes and additional heat transfer surfaces are thermally coupled into a heat transfer path. Collector electrodes then contribute both to flow of cooling air and to heat transfer to the air flow so motivated. The collector electrodes and additional heat transfer surfaces may be parts of a unitary, or thermally coupled, structure that is introduced into a flow path at multiple positions therealong. In some embodiments, the collector electrodes and additional heat transfer surfaces may be proximate each other along the flow path. In some embodiments, the collector electrodes and additional heat transfer surfaces may be separate structures.

Abstract: The present invention relates to a cooling system. More particularly, the present invention relates to a cooling system for removing dust from air being drawn for cooling heat generation components of an electronic product, for improving convenience in maintenance or repair of the electronic product.

Abstract: A system for cooling an integrated circuit of an electronic device includes a cooling body and a shelf that is positioned relative to the cooling body for the device to be reversibly inserted onto the shelf so that the cooling body is in thermal contact with the integrated circuit. The cooling body is cooled by introducing a fluid therein via an input conduit. The hot fluid is received from the cooling body by an output conduit and is cooled for recycling. The housing of the electronic device includes a rearward gap that admits the cooling body into the housing of the electronic device. Preferably, further cooling is provided by forcing a gas to flow past the output conduit.

Abstract: A thermal management system for an electronic equipment enclosure is provided. The thermal management system includes an intake duct for routing cold air in the front of the electronic equipment enclosure to the side of electronic equipment enclosure and one or more blanking panels for separating cold air in the front of the electronic equipment enclosure and hot air in the back of the electronic enclosure, as needed, for example, depending on the configuration of the thermal management system and/or the electronic equipment enclosure. The intake duct includes a front cover, which acts as an additional blanking panel, when installed, changing the airflow pattern of the electronic equipment enclosure, for example, from side-to-side to front-to back.

Abstract: A discharge system of a stored energy for a construction machine is provided, which includes the energy storage, an electric discharge device discharging energy stored in the energy storage, and an energy cooling portion increasing the heat dissipation capacity of the electric discharge device by cooling heat generated in the electric discharge device for a time when the energy stored in the energy storage is discharged to the electric discharge device. Since the heat generated in the electric discharge device is cooled by a cooling device while the energy stored in the energy storage is discharged to the electric discharge device, the heat dissipation capacity of the electric discharge device is increased to shorten the discharge time. Also, the operation period of the cooling device is controlled in proportion to the residual voltage of the energy storage, and thus the cooling efficiency is maximized.

Abstract: A power electronics module includes a frame, a jet impingement cooler assembly, and a power electronics assembly. The frame includes a first surface, a second surface, a power electronics cavity within the first surface of the frame, a fluid inlet reservoir, and a fluid outlet reservoir. The fluid inlet and outlet reservoirs extend between the first surface of the frame and the second surface of the frame. The fluid inlet reservoir and the fluid outlet reservoir are configured to be fluidly coupled to one or more additional modular power electronics devices. The jet impingement assembly is sealed within the frame and fluidly coupled to the fluid inlet reservoir and the fluid outlet reservoir. The power electronics assembly includes at least one power electronics component, is positioned within the power electronics cavity, and is thermally coupled to the jet impingement cooler assembly. Power electronic module assemblies are also disclosed.

Abstract: The invention concerns a converter as well as a cooling device and a method for cooling at least a first and a second group of electrically interconnected electrical components (SWA1, SWA2, SWA3, SWA4, SWA5, SWA6, SWA7, SWA8, SWB1, SWB2, SWB3, SWB4, SWB5, SWB6, SWB7, SWB8) in the converter, where the first and second groups are placed on opposite sides of a conductor leading to a connection terminal of the converter. The cooling device (22) comprises a first transporting arrangement (HSA1, HSA2, HSA3, HSA4, HSA5, HSA6, HSA7, HSA8, HSA9, COA1, COA2, COA3, COA4, COA5, COA6, COA7, COA8) transporting cooling medium (M) past the first group and a second transporting arrangement (HSB1, HSB2, HSB3, HSB4, HSB5, HSB6, HSB7, HSB8, HSB9, COB1, COB2, COB3, COB4, COB5, COB6, COB7, COB8) transporting the same cooling medium past the second group.

Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.

Abstract: An exemplary container data center includes a container, servers received in the container; and a ventilating system for cooling the servers. The ventilating system includes a filter, an exhaust pipe and a blower. The filter includes a chamber and filtering fluid received in the chamber for dissolving dust in ambient air. The chamber defines an air inlet for entering the ambient air and an air outlet. The exhaust pipe has one end coupled to the air outlet of the filter and another end communicating an interior of the container. The blower drives the ambient air out of the filter to flow along the exhaust pipe to the container to cool the servers.

Abstract: A power inverter includes a metallic chassis having a containing space at an inner portion thereof, having a lid on one side in a vertical direction, the other side thereof being enclosed by a bottom, a cooling block of forming a coolant path along a bottom side in the vertical direction of the chassis, and a side portion of the inner portion of the chassis, plural semiconductor modules each incorporating a semiconductor chip for configuring an inverter circuit of converting a direct current power into an alternate current power, and provided with a direct current terminal for making a current flow to the semiconductor chip and a control terminal for controlling an operation of the semiconductor chip to be protruded to an outer portion.

Abstract: A liquid cooling system includes a monolith that is configured to be coupled to a motherboard of the computer. The monolith may be monolithic planar body having a first surface and an opposite second surface, and may include a heat absorption region and a heat dissipation region. The heat absorption region may be at least one location on the monolith that is configured to be in thermal contact with a heat generating component of the motherboard, and the heat dissipation region may be at least one location on the monolith where a liquid-to-air heat exchanger is attached to the monolith. The liquid cooling system may also include a channel extending on the second surface of the monolith and a pump that is configured to circulate the liquid coolant through the channel. The channel may be a trench on the second surface of the monolith that is configured to circulate a liquid coolant between the heat absorption region and the heat dissipation region.

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer.

Abstract: A thermo-electric cooling (TEC) system is presented for cooling of a device, such a laser for example. The TECT system comprises first and second heat pumping assemblies, and a control unit associated at least with said second heat pumping assembly. Each heat pumping assembly has a heat source from which heat is pumped and a heat drain through which pumped heat is dissipated. The at least first and second heat pumping assemblies are arranged in a cascade relationship having at least one thermal interface between the heat source of the second heat pumping assembly and the heat drain of the first heat pumping assembly, the heat source of the first heat pumping assembly being thermally coupled to the electronic device which is to be cooled by evacuating heat therefrom.

Abstract: In an aspect, a phase-change material is used as part of the thermal management system to assist in maintaining a thermal load, such as a battery pack, within a selected temperature range, thereby reducing the consumption of battery power. The phase-change material may be conditioned to an initial state when the vehicle is on-plug and may be used to heat or cool the battery pack directly or indirectly, thereby reducing the use of an electric battery heater. The phase-change material may be used to heat coolant that flows to the thermal load. In another embodiment the phase-change material may be directly within the battery pack in contact with the cells. The phase-change material may be conditioned via the battery circuit heater when the vehicle is on-plug. The phase-change material may also be recharged during vehicle use off-plug using waste heat from the motor circuit thermal load.

Abstract: A device for connecting an electric line to a connection terminal for direct or indirect connection with a circuit breaker, which comprises at least one first electrically conducting body having a first end portion intended to be operatively connected to the terminal, and a second end portion intended to be operatively connected to a conductor element of the electric line, and at least one thermal conducting body comprising a hermetically sealed cavity containing a cooling fluid. The thermal conducting body is operatively coupled to the first electrically conducting body such that the hermetically sealed cavity has a first surface arranged in proximity to the first end portion and a second surface arranged in proximity to the second end portion.

Abstract: Disclosed is a member that contains electronic components. Using the member, when, for example, a vehicle or the like carrying electronic components such as an inverter collides with an external object, there is prevented damage to a housing containing the electronic components, which would otherwise occur due to interfering objects. Furthermore, the disclosed member can dissipate heat produced by the contained electronic components. The member includes a housing for containing electronic components, a cooling passage that is provided inside the housing and uses a refrigerant to cool the electronic components, and a heat dissipation part that dissipates heat from the cooling passage and prevents the housing from being damaged by impacts from external interfering objects.

Abstract: A datacenter cooling apparatus includes a portable housing having lifting and transporting structures for moving the apparatus, opposed sides in the housing, at least one of the opposed sides defining one or more air passage openings arranged to capture warmed air from rack-mounted electronics, opposed ends in the housing, at least one of the opposed ends defining one or more air passage openings positioned to allow lateral passage of captured air into and out of the housing, and one or more cooling coils associated with the housing to receive and cool the captured warm air, and provide the cooled air for circulation into a datacenter workspace.

Abstract: The invention concerns a unit with electronic components, which, when in operation, generate heat. The unit comprises a carrier plate, upon the first section of which a first group of electronic components is placed. Upon a second section thereof is installed a plurality of cooling ribs for the removal of heat produced by the electronic components. The cooling ribs are designed to be curved to a predetermined extent along their longitudinal axis and to lie in a plane parallel to the said carrier plate.

Abstract: A structure of heat dissipation of an electronic device includes at least one heat pipe and a cooler. The heat pipe has a condensation end and an evaporation end opposite to each other, and the evaporation end is disposed on a heat generating element of the electronic device. The cooler is disposed on a rack and has a chamber therein, and the chamber has an inner shell having a cooling fluid therein. When the electronic device is mounted in the rack, the condensation end of the heat pipe is inserted into the cooler and positioned into the inner shell. The evaporation end absorbs the heat energy of the heat generating element, and transfers the heat energy to the condensation end, such that the cooling fluid dissipates the heat energy of the condensation end.

Abstract: A high power drive stack system is provided which includes a cabinet (20) having a vaporizable dielectric fluid cooling system (110) and a plurality of receivers (22) for accepting a plurality of modules (30) containing power electronics. The modules are removably attachable to the receivers by at least two non-latching, dry-break connectors (210). Each of the at least two connectors providing both a fluid connection and an electrical connection between the cabinet and the module.

Abstract: A jet impingement cooling device may include a jet structure and a target layer. The jet structure may include at least one fluid jet operable to produce an impingement jet of cooling fluid. The target layer may further include a heat receiving surface configured to be coupled to a heat generating device and a jet impingement target surface. The jet impingement target surface may further include at least one target structure having a wavy-fin topology with a fin peak, wherein the fluid jet and the target structure are arranged such that the fin peak of the target structure is aligned with a centerline of the impingement jet of cooling fluid during operation of the jet impingement cooling device.

Abstract: There is disclosed an apparatus of planar heat pipe for cooling, which may be embedded in a printed circuit board for cooling of heat-dissipating components. The apparatus includes two panels that are both metal clad on one side, at least one of the panels being grooved on its metal clad side, the panels being assembled by their metal clad sides to form a sealed cavity, the cavity being filled with a fluid, the fluid circulating by capillary action along the grooves towards zones exposed to heat where it vaporizes.

Abstract: A method of deploying space-saving, high-density modular data pods is disclosed. The method includes installing a plurality of modular data pods in proximity to one another, each data pod including a fluid and electrical circuit section in fluidic and electrical communication with the modular data pod; and coupling a plurality of the fluid and electrical circuit sections in series with each other to form a fluid and electrical circuit having a first end and a second end. A modular data center includes a central cooling device coupled to a central cooling fluid circuit. The central cooling device supports at least a portion of the cooling requirements of the chain of modular data pods. Adjacent common fluid and electrical circuit sections form a common fluid and electrical circuit that connects to the central cooling system.

Abstract: A fan duct includes a top plate, two side plates extending downward from opposite sides of the top plate, and plural guiding plates extending downward from the top plate. The side plates and the top plates cooperatively define an air inlet and an air outlet. The air inlet and the air outlet are located at another two opposite sides of the top plates, respectively. The guiding plates are located between the side plates and adjacent to the air outlet. Each of the guiding plates forms a guiding face facing the air inlet. The guiding face is obliquely oriented with respect to the top plate. An electronic device incorporating the fan duct is also provided.

Abstract: A heat exchanger apparatus is provided and includes a motor controller housing, supportively disposed with a turbofan within an aircraft engine nacelle, in which motor controller components are mounted, a fuel cooled cold plate, forming a surface of the housing, which forms a heat transfer path by which motor controller component generated heat is dissipated during first conditions and an air cooled cold plate, disposed in thermal communication with the fuel cooled cold plate, which extends into a flow path of nacelle air generated by the turbofan to form an extended heat transfer path by which the motor controller component generated heat is dissipated during second conditions.

Abstract: A thermal system is disclosed in thermal communication with an electrical device. In one form the thermal system is a refrigeration system having a compressor, condenser, and evaporator. The electrical device can be disposed within the thermal system such that a working fluid of the thermal system exchanges heat with the electrical device. In one embodiment the thermal system includes a container in which the electrical device is disposed. The working fluid in the container can, but need not, remain in substantially the same physical state when transferring heat with the electrical device.

Abstract: A power electronics card assembly includes a printed circuit board assembly including a printed circuit board substrate, a power electronics device opening, a fluid inlet channel extending from a perimeter of the printed circuit board assembly to the power electronics device opening, a fluid outlet channel within the printed circuit board substrate extending from the perimeter of the printed circuit board assembly to the power electronics device opening, and electrically conductive power connections. A power electronics device is positioned within the power electronics device opening and includes a fluid inlet layer fluidly coupled to the fluid inlet channel, a fluid outlet layer fluidly coupled to the fluid outlet channel, a target heat transfer layer fluidly coupled to the fluid inlet layer, a second pass-heat transfer layer and a power device layer. The second-pass heat transfer layer is fluidly coupled to the target heat transfer layer and the fluid outlet layer.

Abstract: An electric power conversion apparatus includes first and second electric power conversion devices and a housing. The first and second electric power conversion devices are arranged to overlap each other in an overlap direction. The housing receives both the first and second electric power conversion devices therein. The housing has a partition wall that extends between the first and second electric power conversion devices to partition the housing into first and second parts in which the first and second electric power conversion devices are respectively received. The partition wall has a coolant passage formed therein, thereby allowing a coolant to flow through the coolant passage.

Abstract: A semiconductor module includes an upper arm and a lower arm of an inverter circuit. The upper arm has a switching element and a rectifying device and the lower arm has a switching element and a rectifying device. The upper arm and the lower arm are laminated such that the switching elements overlap each other and the rectifying devices overlap each other. Refrigerant flow paths constituting cooling sections respectively extend along both sides in the lamination direction of the switching elements and the rectifying devices and are folded back at the rectifying device lamination section side.

Abstract: According to one embodiment, an antenna cooling system, comprises a first cylinder and a second cylinder substantially concentric to the first cylinder. The first and second cylinders form a chamber between the first cylinder and the second cylinder. The chamber is configured to receive a fluid flow. A plurality of fins are disposed within the chamber and rigidly coupled to the first cylinder and the second cylinder. The plurality of fins are configured to transmit thermal energy to the fluid flow. A plurality of ports are coupled to the second cylinder. Each port is configured to receive an antenna unit.

Abstract: Provided is a resin-sealed electronic control device reduced in size, which includes a double-sided mounting board as at least one of a plurality of electronic boards obtained by division so that a large mounting surface with a small plane area is ensured. Each of a first electronic board (30A) and a second electronic board (40A) bonded onto an upper surface and a lower surface of each of a pair of separate beam members (20A) includes two surfaces on which outer circuit components (31, 32, 41, 42) and an inner circuit component (33, 43) are respectively mounted. A height of each of the inner circuit components is equal to or less than a thickness of each of the separate beam members (20A). Heat-generating components (32, 42) in the outer circuit components are provided to be adjacent to and opposed to the separate beam members (20A).

Abstract: A module system is provided that includes at least one module support and at least one module support and at least one energy storage module that is connected to the at least one module support. The module support and the energy storage module have cooling fluid connections, electric contacts, and coupling elements that are adapted to each other.

Abstract: Solid state lighting devices and methods for heat dissipation with rotary cooling structures are described. An example solid state lighting device includes a solid state light source, a rotating heat transfer structure in thermal contact with the solid state light source, and a mounting assembly having a stationary portion. The mounting assembly may be rotatably coupled to the heat transfer structure such that at least a portion of the mounting assembly remains stationary while the heat transfer structure is rotating. Examples of methods for dissipating heat from electrical devices, such as solid state lighting sources are also described. Heat dissipation methods may include providing electrical power to a solid state light source mounted to and in thermal contact with a heat transfer structure, and rotating the heat transfer structure through a surrounding medium.

Abstract: A power electronics module includes a frame, a jet impingement cooler assembly, and a power electronics assembly. The frame includes a first surface, a second surface, a power electronics cavity within the first surface of the frame, a fluid inlet reservoir, and a fluid outlet reservoir. The fluid inlet and outlet reservoirs extend between the first surface of the frame and the second surface of the frame. The fluid inlet reservoir and the fluid outlet reservoir are configured to be fluidly coupled to one or more additional modular power electronics devices. The jet impingement assembly is sealed within the frame and fluidly coupled to the fluid inlet reservoir and the fluid outlet reservoir. The power electronics assembly includes at least one power electronics component, is positioned within the power electronics cavity, and is thermally coupled to the jet impingement cooler assembly. Power electronic module assemblies are also disclosed.

Abstract: The flow path structure includes a flow path introducing fluid from an inlet to an outlet, and a flow velocity control structure provided in a portion between the inlet and the outlet in the flow path to reduce difference in flow velocity that the fluid flowing into the flow path has in a direction intersecting with a flow direction of the fluid. The flow velocity control structure includes, in the direction intersecting with the flow direction, plural flow velocity control members provided alternately with spaces through which the fluid passes. The flow velocity control members have different sizes from each other, the sizes increasing as the flow velocity of the fluid at areas, in the direction intersecting with the flow direction, where the respective flow velocity control members are provided increases.

Abstract: Disclosed herein is a capacitor module including at least one capacitor, a cooling case accommodating the capacitor, and a cooling unit disposed in the cooling case and cooling a side surface of the capacitor. According to the present invention, cooling efficiency of the capacitor is maximized and fixing force of the capacitor in the cooling case is superior so that product reliability of the capacitor module can be improved.

Abstract: A cooling member for withdrawing heat from a heat containing device is disclosed. The cooling member can have a housing with a fluid inlet, a fluid outlet and a plurality of irregular-shaped fins located at least partially therewithin. In addition, a plurality of irregular-shaped and hierarchical branched fluid pathways can be located between the plurality of fins and the housing and/or the plurality of fins can be in physical contact with the heat containing device.

Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.

Abstract: A cooling device (1) using pulsating fluid for cooling of an object, comprising: a transducer (2) having a membrane adapted to generate pressure waves at a working frequency (fw), and a cavity (4) enclosing a first side of the membrane. The cavity (4) has at least one opening (5) adapted to emit a pulsating net output fluid flow towards the object, wherein the opening (5) is in communication with a second side of the membrane. The cavity (4) is sufficiently small to prevent fluid in the cavity (4) from acting as a spring in a resonating mass-spring system in the working range. This is advantageous as a volume velocity (u1) at the opening is essentially equal to a volume velocity (u1?) at the second side of the membrane, apart from a minus sign. Thus, at the working frequency the pulsating net output fluid can be largely cancelled due to the counter phase with the pressure waves on the second side of the membrane resulting in a close to zero far-field volume velocity.

Abstract: In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.

Abstract: A semiconductor element cooling structure includes a plurality of semiconductor elements, and electrode structure, which has cooling medium channels therein and is electrically connected to the plurality of semiconductor elements. The electrode structure includes an alternating current electrode having the semiconductor elements on each of opposite surfaces, and a plurality of direct current electrodes holding therebetween the alternating current electrode and the semiconductor elements respectively mounted on the opposite surfaces of the alternating current electrode. Each of the alternating current electrode and the direct current electrodes has the cooling medium channels therein.

Abstract: An arrangement and a method for transferring surplus heat away from electronic components. An arrangement (300) at a rack (302) for transfering surplus heat away from at least one heat generating electronic component arranged in the rack (302) is provided. At least one heat-pipe (304) is arranged adjacent to the electronic component (s), the heat-pipe (s) containing a self-circulating cooling medium which in use, absorbs heat from the electronic component (s) and transports the heat by self-circulation away from the electronic component(s) through the heat-pipe(s) (304). By arranging heat-pipes at racks/cabinets comprising electronic equipments, surplus heat from the equipments can be transferred away in an efficient way, without supplying additional energy for the transferring. In addition, the surplus heat can be taken care of for other purposes, e.g. for warming up buildings, which further decreases the needs for additional energy.

Abstract: A heat dissipation apparatus is arranged in a housing of an electronic device. The electronic device includes a motherboard mounted in the housing. The heat dissipation apparatus includes a heat dissipation block mounted to an electronic element of the motherboard, a heat sink, a number of pipes connecting the heat sink to the heat dissipation block, and a plate plugged in a socket of the motherboard. The heat sink is mounted to the plate.

Abstract: A cooling device may include a fluid inlet manifold, a case body, and a fluid outlet manifold that are formed of a molded polymer composite material. The fluid inlet manifold may include a fluid inlet channel and a fluid inlet reservoir. The case body may include a plurality of cooling channels extending from a first surface of the case body to a second surface of the case body. The cooling channels may fluidly couple the first surface of the case body to the fluid inlet reservoir. The fluid outlet manifold may further include a fluid outlet channel and a fluid outlet reservoir. The cooling channels may fluidly couple the second surface of the case body to the fluid outlet reservoir. The fluid inlet channel, cooling channels, and fluid outlet channels may include a cross-section topology.

Abstract: An integrated circuit coupling device includes an integrated circuit package; and an optical data transmission medium connected to the integrated circuit package, and comprising a movable coolant, adapted to remove heat from the integrated circuit package, in operation.

Abstract: In a particular embodiment, a system to dissipate heat in an information handling system includes a first heat-generating component adapted to process first data and a second heat-generating component adapted to process second data. The system also includes a cooling fluid guide including an electroactive material. The cooling fluid guide is adapted to change from a first shape to a second shape, in response to receiving a trigger voltage or in response to no longer receiving the trigger voltage. The system also includes a controller adapted to detect a data load processed at the second heat-generating component and, in response to detecting the data load, to cause the trigger voltage to be received at, or no longer received at, the cooling fluid guide. The cooling fluid guide is adapted to direct an increased portion of cooling fluid toward the first heat-generating component when the cooling fluid guide is in a form of the second shape, as compared to the first shape.

Abstract: Cylindrical packages are provided. The cylindrical package includes a cylindrical substrate having a hollow region therein and at least one semiconductor chip mounted on an outer circumference of the cylindrical substrate. Related electronic products and related fabrication methods are also provided.