Abstract: A fastening structure includes a first main body, a second main body, a first fixing member protruding from the first main body, and a second fixing member protruding from the second main body. The first fixing member includes a first clamping element and a second clamping element. The second fixing member includes a first positioning element and a second positioning element. The first positioning element is limited by the first clamping element to prevent the first main body from moving with respect to the second main body in first directions, the second positioning element is limited by the second clamping element to prevent the first main body from moving with respect to the second main body in second directions cooperating with the first the directions to contain all directions in the reference plane.

Abstract: A method of manufacturing an electronic component module and the electronic component module manufactured by the manufacturing method includes bumps, each including a thicker portion having a relatively large thickness and a thinner portion having a relatively small thickness and formed on one surface of the substrate. When looking at the electronic component in a mounted state in a plan view, the thicker portion is positioned on a side of a corresponding outer terminal closer to a center of the electronic component and the thinner portion is positioned on the opposite side of the corresponding outer terminal. In the plan view, joining portions joining the outer terminals respectively to the bumps are formed such that a height of each joining portion on the opposite side is lower than a height of the joining portion on the side closer to the center of the electronic component.

Abstract: An electric connection box according to the present invention can include a circuit board having a first surface capable of mounting an electronic component, and a second surface defining a non-mounting surface, a case housing the circuit board, the circuit board oriented in a substantially vertical direction, a vertical inner wall surface of the case formed opposite the non-mounting surface of said circuit board, the vertical inner wall and the non-mounting surface of said circuit board defining a substantially vertical air ventilation path, a suction port positioned in the case and in communication with the ventilation path, an exhaust port positioned in the case above said suction port and in communication with the ventilation path, and a heat generating component in communication with the ventilation path.

Abstract: The invention provides a device module including a base, a plastic part, and an external connection. The plastic part is provided on the base. The device is provided on the base and embedded in the plastic part. The device is a sensor, an electronic device, or a circuit board. The external connection includes an embedded portion and a lead-out portion. The embedded portion is connected to the device, extends along the base, and is embedded in the plastic part. The lead-out portion is contiguous with the embedded portion and led out of the plastic part.

Abstract: An electronic device includes an electronic module and an electronic module fixing structure that includes a main body, a position-limiting component slideably disposed on the main body along a first direction, at least one positioning component slideably disposed on the main body along a second direction, and at least one first elastic component. The position-limiting component has a position-limiting portion. The first elastic component is connected between the main body and the positioning component. The position-limiting component resists an elastic force of the first elastic component to limit the positioning component to be at a first position. When the electronic module moves into the main body, the electronic module pushes the position-limiting component to drive the position-limiting portion to move away from the positioning component, and the positioning component moves to a second position by the elastic force of the first elastic component to position the electronic module.

Abstract: The invention provides a device module that can be manufactured with a die. The device module includes a plastic part, a device, a holder, and an external connection. The device is embedded in the plastic part. The holder is embedded in the plastic part and includes an exposed portion exposed from the plastic part in a thickness direction of the plastic part in such a manner as to close a housing recess of the die. The external connection is connected to the device and partially fixed to the holder. The external connection includes a lead-out portion insertable in the housing recess of the die. The lead-out portion is embedded in the plastic part and being led out of the plastic part in the thickness direction. Alternatively, the lead-out portion is led through and out of the holder in the thickness direction.

Abstract: An LED display screen case includes a module, a HUB plate, a case frame, a power supply and a receiving card. One side of the HUB plate is connected with the module by a plug A and an interface A in a plugging mode. The other side of the HUB plate is connected with the receiving card by a plug B and an interface B in the plugging mode. A through hole is formed at a position corresponding to the plug B on the case frame. The plug B passes through the through hole. The receiving card and the HUB plate are connected by the plug B and the interface B in the plugging mode and fixed to the two sides of the case frame. This kind of connection type reduces the space inside the case for accommodating devices, and also ensures the good radiating effect of the case.

Abstract: A controller has a control board, a power module and a power board. MOS transistors, inverter input terminals, coil terminals, inverter ground terminals, control terminals, a control power input terminal and a control ground terminal are integrally molded in a molded portion of a power module. Electrical connections between the power module and the control and power boards are made through the terminals provided in the molded portion.

Abstract: A tire condition detecting device according to the present invention includes: an electronic component including a sensor configured to detect a tire condition; and a casing configured to house the electronic component. The casing includes a casing main body configured to house the electronic component and having an opening surface formed thereon, and a lid unit configured to cover the opening surface. An inside of the casing main body having the opening surface covered by the lid unit is filled with a sealant. Accordingly, tire conditions such as inner pressure and temperature of a tire can be surely detected and a breakdown of an electronic component can be prevented even in an environment where water content such as a coolant is injected in the tire.

Abstract: An alignment device for a power module of a power electronic device is provided, which may be used for aligning the power module while the power module being plugging to or from a rear mounting part of a cabinet of the power electronic device. The rear mounting part is disposed at an inner side of a back plate of the cabinet, the alignment device comprises a first connector disposed on the power module; guide rail units disposed on inner sides of a left side plate and a right side plate of the cabinet; a second connector disposed on the rear mounting part; and a guide device for limiting an offset of the power module moving along the guide rail unit.

Abstract: The present invention pertains to a component-containing module that is: provided with a substrate configured from flat sections and a projecting section, and electronic components mounted on the flat sections and the projecting section; and characterized in that the electronic components mounted on the flat sections are sealed in resin, and the electronic component mounted on the projecting section has an upper part thereof exposed above the resin surface.

Abstract: Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.

Abstract: The invention relates to a control and display module for motor vehicles, comprising: a display screen for displaying data; a touchpad for entering user commands, said touchpad at least partially overlapping the display screen; and a casing in which the display screen and the touchpad are housed, said casing comprising a front frame. The module is characterised in that: the casing includes an internal rim protruding between the display screen and the touchpad, which rim maintains the display screen in position in the casing; and the control and display module also comprises a seal including a first portion inserted between the internal rim of the casing and the display screen and a second portion extending beyond the internal rim towards the centre of the display screen.

Abstract: A surface-mount package structure for reducing the ingress of moisture and gases thereto is disclosed. The surface-mount structure includes a sub-module having a dielectric layer, semiconductor devices attached to the dielectric layer, a first level interconnect structure electrically coupled to the semiconductor devices, and a second level I/O connection electrically coupled to the first level interconnect and formed on the dielectric layer, with the second level I/O connection configured to connect the sub-module to an external circuit. The semiconductor devices of the sub-module are attached to a substrate structure, with a dielectric material positioned between the dielectric layer and the substrate structure to fill in gaps in the surface-mount structure.

Abstract: The present disclosure relates to a device and method for a band pass filter with a reduced cost, area penalty, and manufacturing complexity relative to current solutions. An integrated passive device chip comprising a plurality of capacitors embedded in a common molding compound along with a transceiver chip, and arranged within a polymer package. Ultra-thick metallization layers are disposed within the polymer package and configured to couple the integrated passive device chip to the transceiver chip. The ultra-thick metallization layers also form a plurality of transmission lines, wherein the combined integrated passive device chip and transmission lines form a band pass filter with improved frequency response, noise immunity, and cost and area penalty as compared to conventional solutions. The band pass filter may also be coupled to a plurality of solder balls comprising a Flip Chip Ball Grid Array suitable for 2.5D and 3D integrated circuit applications.

Abstract: Aspects of the disclosure provide a circuit that includes a printed circuit board (PCB) substrate formed with an opening portion that is dimensioned to accommodate an integrated circuit (IC) package. When the IC package is disposed in the opening portion and is electrically coupled to the PCB substrate for PCB assembling, a thickness of the assembled PCB is less than a thickness sum of the IC package and the PCB substrate.

Abstract: An optical module includes: an optical receiving module 101 provided with a plurality of leads 105 for transmitting an electrical signal at 15 Gbit/s or more; a printed circuit board 103 provided with a pad 106 that is connected with the plurality of leads 105 by solder; and a metal thin plate 102 that is provided between the printed circuit board 103 and the optical receiving module 101 when the optical receiving module 101 is mounted on the printed circuit board 103. The thickness of the metal thin plate 102 is defined in such a manner that a distance between the plurality of leads 105 and the pad 106 is in the range of 50 to 500 ?m after the optical receiving module. 101 is mounted on the printed circuit board 103.

Abstract: For producing a three-dimensional circuit component, an electronic component is mounted on a synthetic resin block. A plurality of electrically-conductive patterns used to establish an electrical connection to the electronic component are formed on the block along a three-dimensional shape of the block. An end of each electrically-conductive patterns is provided with a solder-disposed section. A solder is provided between the solder-disposed section and an opposed surface of the electronic component. The section of each electrically-conductive patterns other than the solder-disposed section and a section on which the electronic component is mounted is internally formed in the block. Since the section of each electrically-conductive patterns other than the section on which the electronic component is mounted is internally formed in the block, the electrically-conductive patterns are not unnecessarily exposed.

Abstract: Provided are a conductive structure including a) a base. b) a conductive pattern provided on at least one side of the base. and c) a darkening layer provided on the upper surface and lower surface of the conductive pattern, provided on at least a part of the side of the conductive pattern, and provided in an area corresponding to the conductive pattern area, and a touch panel including the same and a manufacturing method thereof.

Abstract: Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. Locations of where the racetrack can be adjusted (for example, narrowed) and/or removed without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, a portion of the racetrack can be removed to create a break and/or a portion of the racetrack can be narrowed in a selected area.

Abstract: The invention relates to a control device for executing an open mode of a motion module of an electric apparatus. The electric apparatus includes a motion module and a machine body module. The control device disposed on a path of the relative movement includes a combination of a carrier and an elastomer, in which the carrier has a blocking portion. The elastomer normally keeps the carrier at a first position, and the elastomer allows the carrier to motion toward a second position when the carrier is pressed. The control device allows the motion module to rotate (in an open mode) when the motion module crosses the blocking portion of the carrier. Accordingly, the invention promotes visual artistic effects by eliminating the essential exposure of the rotary shaft in the rotation-open mode of conventional skills.

Abstract: A cabinet for server includes a frame, and a plurality of guiding rails. Each guiding rail includes a connection portion and an inclined portion. An acute angle is defined between the inclined portion and the connection portion.

Abstract: A server equipped with touch display module is illustrated. The server is placed in a rack enclosure and includes a rack, an information gathering unit, a rack connecting unit, and the touch display module. The rack includes a receiving slot in front side of the rack. The information gathering unit is coupled with a plurality of system components of the server and used for gathering operation information of the system components. The operation information is transmitted to the touch display module through the rack connecting unit. The touch display module slidably received in the receiving slot can be drawn out for displaying operation information. The operation information includes identification data and state data of the system components. When error information associated with the system component is identified in the received operation information, the touch display module drawn out displays an alert message related to the failed system component.

Abstract: A pen-type computer peripheral device includes an elongated housing containing a PCBA having a plug connector, and cap/cover that is slidably connected to a front portion of the housing. Locking structures are respectively integrally molded onto opposing surfaces of the housing and cap/cover that cooperate to prevent separation of the cap/cover from the housing. By manually pushing (sliding) the cap/cover relative to the housing, the plug connector is effectively moved between a retracted position, in which the plug connector is disposed inside the cap/cover, and a deployed position in which the plug connector extends through a front housing opening of the cap/cover such that the plug connector is operably exposed for insertion into a host system.

Abstract: Systems and methods are disclosed for processing radio frequency (RF) signals using one or more bipolar transistors disposed on or above a high-resistivity region of a substrate. The substrate may include, for example, bulk silicon, at least a portion of which has high-resistivity characteristics. For example, the bulk substrate may have a resistivity greater than 500 Ohm*cm, such as around 1 kOhm*cm. In certain embodiments, one or more of the bipolar devices are surrounded by a low-resistivity implant configured to reduce effects of harmonic and other interference.

Abstract: The present invention provides a non-insulated type DC-DC converter having a circuit in which a power MOS•FET for a high side switch and a power MOS•FET for a low side switch are connected in series. In the non-insulated type DC-DC converter, the power transistor for the high side switch, the power transistor for the low side switch, and driver circuits that drive these are respectively constituted by different semiconductor chips. The three semiconductor chips are accommodated in one package, and the semiconductor chip including the power transistor for the high side switch, and the semiconductor chip including the driver circuits are disposed so as to approach each other.

Abstract: A printed circuit board (PCB) assembly includes a PCB having a core substrate, a plurality of conductive traces on a first surface of the PCB, and a ground layer on the second surface of the PCB. The conductive traces comprise a pair of differential signal traces. An intervening reference trace is disposed between the differential signal traces. A connector is disposed at one end of the plurality of conductive traces. A semiconductor package is mounted on the first surface at the other end of the plurality of conductive traces.

Abstract: A power supply and circuit module includes a housing, a power supply and a circuit module received in the housing. The power supply and the circuit module can be removably installed into and removed from a cage of an electronic system as a unit by a sliding action. The cage includes a first bottom plate, a backplane connected to the first bottom plate. A plurality of standoffs are formed on the first bottom plate for supporting a motherboard thereon. An electrical connector, such as a card connector, is directly formed on the backplane for connecting a circuit card.

Abstract: An electronic device may include wireless circuitry such as infrared sources that control external equipment such as televisions and set-top boxes. An infrared source may be mounted within an electronic device housing in a visually inconspicuous location such as in a connector port. A button may be provided with transparent structures that allow infrared light to pass through the button. A removable accessory port may be provided with an infrared transmitter accessory that allows an electronic device to serve as a remote control device. Portions of an electronic device housing may be provided with thin housing walls or holes that are too small to be noticeable to the naked eye to serve as windows for infrared light. An audio port may serve as an infrared light window. Gasket structures, bezel structures, and the edges of displays and other planar glass members may be used in transmitting infrared light.

Abstract: An external EMI diverting structure to electrically shield an electronic device from EMI is presented. The electronic device is physically isolated from the case ground which interrupts the EMI or lightning fault path. This shield provides a return path to ground for the EMI away from the electronic device and replaces conventional EMI filter capacitors, which are not connected to case ground. The external EMI diverter comprises a first conducting enclosure enclosing the electrical circuit and is electrically coupled to the electric circuit and a second conducting enclosure enclosing the first conducting enclosure and being electrically isolated from the first conducting enclosure and the electric circuit. The diverter is physically and electrically connected to the case ground at an attachment point.

Abstract: A terminal module is configured to fit inside an internal power source receptacle in a housing of a process field device, and comprises a wired power source connection, power conditioning electronics, and a field device connection. The wired power source connection is configured to receive power from an external source. The power conditioning electronics are capable of conditioning power from the wired power source connection for reception by the industrial field device. The field device connection is configured to provide power conditioned by the power conditioning electronics to the process field device via a terminal configured to receive and mate with the internal power source.

Abstract: An electronic module includes a shell, a circuit board, and a connector. The shell defines a receiving slot. The circuit board includes a main body and an extension body connected to the main body. The main body of the circuit board is received in the shell, and the extension body of the circuit board extends out of the shell via the receiving slot. The connector is fixed in place by being attached to the extension body of the circuit board.

Abstract: The invention relates to an electrical module (100) for being received by automatic placement machines by means of generating a vacuum, comprising a carrier substrate (10), at least one component (20, 21) disposed on the carrier substrate (10), and a cover element (30) disposed above the at least one component (20, 21). A fixing component (40) by which the cover element (30) is attached to the at least one component (21) is disposed between the cover element (30) and the at least one component (21). The cover element can be implemented as a dimensionally stable, flat film by means of which it is possible to suction the module by means of vacuum for a placement method, and to place said module at a position on a circuit board.

Abstract: An exemplary electronic device assembly includes a cabinet and electronic devices received in the cabinet. The cabinet includes four columns substantially positioned at four corners of the cabinet. A window is defined between two front columns. Each electronic device includes a casing, which includes a bottom plate, a lateral side and an actuator. The bottom plate defines an inserting opening therein. The lateral side defines an engaging opening therein. The actuator movably connects to the casing and includes an engaging portion and an abutting portion. The abutting portion extends through the inserting opening. The engaging portion extends through the engaging opening and engages with one of the columns. When the abutting portion is pushed up, the actuator moves and the engaging portion disengages from the column.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a board in the housing, an electrically conductive shield unit, a connector, and an extending portion. The housing includes an opening. The electrically conductive shield unit includes a first section and a second section intersecting the first section at an end portion of the first section and configured to be secured to the board. The connector is on the board, configured to be secured to the first section of the shield unit, and exposed through the opening of the housing. The extending portion extends from the end portion of the first section of the shield unit and is configured to be secured to the board.

Abstract: Provided is a power module substrate including a ceramic substrate, and a metal plate which contains aluminum or an aluminum alloy, and which is stacked and bonded on a surface of the ceramic substrate, wherein one or more additional elements selected from Ag, Zn, Ge, Mg, Ca, Ga, and Li are solid-solubilized in the metal plate, and the Ag concentration in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.05% by mass and less than or equal to 10% by mass, or the total concentration of Zn, Ge, Mg, Ca, Ga, and Li in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.01% by mass and less than or equal to 5% by mass.

Abstract: A pre-molded cavity 3D packaging module with layout is disclosed. The 3D packaging module includes a pre-molded cavity. A wall and a vertical plane of the pre-molded cavity form an inclined angle of more than 3°. An intersecting region between a bottom and a sidewall of the 3D packaging module has a curved profile to facilitate smooth circuit layout.

Abstract: Provided herein is an electronic display assembly for use with a housing as well as a method for assembling an electronic display assembly within a housing. The assembly preferably contains an electronic display module having an electronic display secured within a mounting frame having a top and bottom surface. Top brackets and bottom brackets may be secured to the mounting frame and then secured to the interior of the housing. A front glass assembly can also be secured to the brackets. In some embodiments the housing may contain interior hangers which correspond to hangers that are fastened to the mounting frame of the electronic display module.

Abstract: An implantable bio-compatible integrated circuit device and methods for manufacture thereof are disclosed herein. The device includes a substrate having a recess. An input/output device including at least one bio-compatible electrical contact is coupled to the substrate in the recess. A layer of hermetic bio-compatible, hermetic insulator material is deposited on a portion of the input/output device. An encapsulating layer of bio-compatible material encapsulates at least a portion of the implantable device, including the input/output device. At least one bio-compatible electrical contact of the input/output device is then exposed. The encapsulating layer and the layer of bio-compatible, hermetic insulator material form a hermetic seal around the at least one exposed bio-compatible electrical contact.

Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

Abstract: A supporting mechanism for supporting a display module on a base includes a stand and a buckling structure. An end of the stand is pivoted to the base, and the buckling structure is pivoted to the other end of the stand and for buckling the display module. The buckling structure includes a housing, at least one buckling component and at least one resilient component. The housing is pivoted to the other end of the stand. The at least one buckling component is movably installed in the housing. The at least one resilient component is installed inside the housing and connected to the at least one buckling component. The at least one resilient component drives the at least one buckling component to buckle a fastening portion of the display module as the housing and the at least one buckling component are inserted into a containing portion on the display module.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a board in the housing, a pad on the board, and a component. The pad includes a first portion and a second portion. The second portion includes a protrusion toward the first portion. The component includes a first electrode connected to the first portion and a second electrode connected to the second portion.

Abstract: The structure comprises at least a device, for example a microelectronic chip, and at least a getter arranged in a cavity under a controlled atmosphere delineated by a substrate and a sealing cover. The getter comprises at least one preferably metallic getter layer, and an adjustment sub-layer made from pure metal, situated between the getter layer and the substrate, on which it is formed. The adjustment sub-layer is designed to modulate the activation temperature of the getter layer. The getter layer comprises two elementary getter layers.

Abstract: A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.

Abstract: An electronic device of the invention includes a base and a touch-vibration module. The base has an opening. The touch-vibration module includes a supporting bracket, a mass balancing element, a vibrating unit and a touch unit. The supporting bracket is connected to the base at the opening of the base. The mass balancing element is disposed at the supporting bracket. The vibrating unit is disposed at the supporting bracket. The touch unit is disposed at the supporting bracket and the vibrating unit is located between the supporting bracket and the touch unit.

Abstract: A semiconductor module according to one embodiment includes a semiconductor chip, a wiring substrate, a mounting plate provided with the wiring substrate thereon, a frame body defining a case for the wiring substrate, together with the mounting plate, a bus bar extending from the case and being inserted into a side wall of the frame. The side wall has a projection. The bus bar includes a first region in the side wall, a second region extending from a first end of the first region outward from the frame, a third region extending from a second end of the first region into the frame. The third region is bent based on the shape being close to the wiring substrate of the projection. The mounting plate with the wiring substrate is attached to the frame such that the third region is in press-contact with the wiring pattern.

Abstract: A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; first and second external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer; and additional electrode layers disposed irrespective of a formation of capacitance within the lower cover layer.

Abstract: A mobile power system includes a plurality of energy sources, a plurality of electronic and telecommunications components configured to convert power generated by the plurality of energy sources to direct current (DC) power, wherein the plurality of electronic and telecommunications components condition the DC power and direct the conditioned DC power to a Public Switch Telephony Network (PSTN), and one or more transportable housings configured to hold the plurality of energy sources and the plurality of electronic and telecommunications components during transport of the one or more housings.

Abstract: A control panel having a pivotable connector has a body, a rear cover and a connector. The connector is pivotally mounted inside the body and the rear cover, and has a plug being pivotable and freely aligned with an intended direction. Accordingly, users can adjust the orientation of the connector based on a position on which the control panel is to be mounted, placed or hung, so that the connector of the control panel can be smoothly connected with a connection port of the machine directly or through a connection cable.

Abstract: A control module includes a circuit board having conductor paths arranged on at least one plane and having at least one rigid, inflexible conductor path section. The control module also includes an electronic control circuit which electrically contacts the conductor paths and has electrical components. The control module also includes a pan-shaped cover part protecting the control circuit. The cover part is arranged over a part of the electronic control circuit and contacts a side of the circuit board in a sealing manner with a flat contact region aligned parallel to the side. At least part of the electronic control circuit is protectively arranged in a housing inner chamber between the cover part and the circuit board, and electrical contacts of the circuit board are provided outside of the housing inner chamber, which is covered by the cover part, to contact electrical components of the control module.