Module Patents (Class 361/728)
  • Publication number: 20140153194
    Abstract: A memory module socket and a terminating resistor assembly. The terminating resistor assembly provides an elongate conductive bus bar and a plurality of conductive branches, wherein each conductive branch is in electronic communication with the elongate conductive bus bar through a resistor, wherein each conductive branch has a distal end disposed for contacting a signal pin within a memory module socket installed on a printed circuit board. A distal end of each conductive branch is inserted into a window on the connector shoulder adjacent to the slot of an empty memory module socket and engages a plurality of signal pins within the socket in response to the absence of a memory module in the slot. The plurality of signal pins engage contact pads on the memory module and are pushed out of contact with the conductive branch in response to the presence of a memory module in the slot.
    Type: Application
    Filed: December 5, 2012
    Publication date: June 5, 2014
    Applicant: International Business Machines Corporation
    Inventors: Sumanta K. Bahali, Tony C. Sass, Kevin S.D. Vernon, Paul A. Wormsbecher
  • Publication number: 20140152511
    Abstract: The invention relates to a portable electronic device comprising a supporting member receiving on one side conductive contact lands or tracks extending substantially as far as the edge of the side and connecting an electronic microcircuit, the conductive contact lands or tracks comprising a plurality of perforations. The device is noteworthy in that the interior of the perforations is free, or intended to be kept free, of metal.
    Type: Application
    Filed: June 22, 2012
    Publication date: June 5, 2014
    Applicant: GEMALTO SA
    Inventors: Lionel Merlin, Nizar Lahoui, Arek Buyukkalender, Lucile Dossetto, Laurence Robertet, Catherine Brondino, Frédérick Seban
  • Publication number: 20140153195
    Abstract: A communication module includes a housing member, an electronic module, and a slidable mechanism. The housing member includes at least one fastening and releasing region, which is disposed on an external surface thereof. The fastening and releasing region has a first slant. The electronic module is partially disposed within the housing member. The slidable mechanism includes at least one extension arm with a second slant. The extension arm is accommodated within the corresponding fastening and releasing region. The second slant is aligned with the first slant, and a slope of the second slant is larger than a slope of the first slant.
    Type: Application
    Filed: May 31, 2013
    Publication date: June 5, 2014
    Inventors: Hong-Bin You, Gow-Zin Yiu, Chia-Kai Weng
  • Publication number: 20140153196
    Abstract: An electronic module is provided with a circuit board 2, a chip component 3 surface-mounted on the circuit board 2 and a mold member 4 that seals the chip component 3. The circuit board 2 includes a land 7 and a resist pattern 8A that partially covers the land 7. The chip component 3 has a bottom electrode 6b and a side electrode 6c. The resist pattern 8A has an overlapped portion overlapped with the bottom electrode 6b of the chip component 3 in a planar view. A portion of the mold member 4 is filled at least in a first gap D1 between the resist pattern 8A and the first solder portion 10a.
    Type: Application
    Filed: November 26, 2013
    Publication date: June 5, 2014
    Applicant: TDK Corporation
    Inventors: Shuichi Takizawa, Kenichi Kawabata
  • Patent number: 8743552
    Abstract: A motherboard assembly includes a motherboard and an expansion apparatus. The motherboard includes a first expansion slot. An edge connector is set on a bottom side of the expansion apparatus to be detachably engaged in the first expansion slot. A number of SATA interfaces and a number of second expansion slots are arranged on the expansion apparatus, and are connected to signal pins and power pins of the edge connector.
    Type: Grant
    Filed: August 24, 2011
    Date of Patent: June 3, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Bo Tian, Kang Wu
  • Publication number: 20140147706
    Abstract: Disclosed herein is a secondary battery pack including a battery cell having an anode terminal and a cathode terminal formed at one face having a sealed surplus portion and a protection circuit module (PCM) electrically connected to the battery cell via the anode terminal and the cathode terminal, wherein the PCM includes a board having a protection circuit formed thereon, the board being provided with an anode terminal connection part and a cathode terminal connection part connected to the anode terminal and the cathode terminal, respectively, a PCM case configured to receive the board through an open face thereof so that the PCM case surrounds the board, and an electrically insulative lid to close the open face of the PCM case.
    Type: Application
    Filed: January 29, 2014
    Publication date: May 29, 2014
    Applicant: LG CHEM, LTD.
    Inventors: Jong Woon CHOI, Hyung Gu YUN, Migeum CHOI
  • Publication number: 20140146484
    Abstract: An electromagnetic fixing mechanism includes a mounted component, a rotating component, a locating module, a fixing module, an electromagnetic component and a control unit. The locating module is for locating the rotating component on at least one fixing position while the rotating component pivots relative to the mounted component. The fixing module is installed on an end of the mounted component and used for fixing the rotating component while the rotating component is located on the at least one fixing position. The electromagnetic component is installed on the mounted component. The control unit is electrically connected to a touch display module and the electromagnetic component. The control unit is used for controlling the electromagnetic component to provide a magnetic attraction force to attract the fixing module for fixing the rotating component while the touch display module is activated.
    Type: Application
    Filed: June 20, 2013
    Publication date: May 29, 2014
    Inventor: Xiaoqing Chen
  • Publication number: 20140147707
    Abstract: A battery pack including a battery cell having an anode and cathode terminal at one face having a sealed surplus portion and a protection circuit module (PCM) connected to the cell via the anode and cathode terminal, the PCM including a board having a protection circuit thereon, the board being provided with an anode and cathode terminal connection part connected to the anode and cathode terminal, respectively, and a PCM case configured to receive the board through an open face thereof so that the PCM case surrounds the board. The board is coupled to the anode and cathode terminal of the cell via the anode and cathode terminal connection part, the board is disposed in the PCM case in a state in which the board is parallel to the cell, and the PCM case, in which the board is disposed, is mounted to the sealed surplus portion of the cell.
    Type: Application
    Filed: January 29, 2014
    Publication date: May 29, 2014
    Applicant: LG CHEM, LTD.
    Inventors: Jong Woon CHOI, Seog Jin YOON, Migeum CHOI
  • Publication number: 20140140012
    Abstract: Disclosed is a module structure including a front sheet, a back sheet, and an optotronic device disposed between the front sheet and the back sheet. A first encapsulate layer is disposed between the optotronic device and the front sheet. A second encapsulate layer is disposed between the optotronic device and the back sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the second encapsulate layer and the polyolefin layer.
    Type: Application
    Filed: March 8, 2013
    Publication date: May 22, 2014
    Applicants: KUO HSIN TECHNOLOGY CO., LTD., INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Hsien WANG, Min-Tsung KUAN, Tzong-Ming LEE, Wen-Hsien CHOU, Fu-Ming LIN, Wen-Kuei LEE, Chin Zeng YEH, Ming-Hung CHEN
  • Publication number: 20140140013
    Abstract: An electronic device includes a bottom plate, an installation board, a circuit board, a battery, and a power supply control module. The power supply control module includes a control member and an activating member, and the activating member is pressed against the control member when the electronic device is assembled. So long as the control member remains pressed by the activating member, a flow of electrical power from the battery to the circuit board is permitted. When the electronic device is disassembled, the disassembly moves the activating member away from the activating member and cuts off the power from the battery to the circuit board, to avoid electrical short circuits or other damage that might otherwise occur if the flow of electrical power was maintained during disassembly.
    Type: Application
    Filed: June 28, 2013
    Publication date: May 22, 2014
    Inventors: WEI-KUANG LIANG, HSIEN-PIN TSOU, CHUAN-XIANG WANG
  • Patent number: 8723283
    Abstract: An optical module includes a stem, an optical element, data signal lead pins, a printed circuit board, and a post portion. The optical element is mounted on one surface of the stem. The data signal lead pins are connected to the optical element, and protrudes through the other surface of the stem. The printed circuit board has one surface on which data signal transmission lines for contact with the data signal lead pins are formed and the other surface on a part of which a stiffener is formed to protrude. The post portion protrudes from the other surface of the stem, supports the printed circuit board while in close contact with the stiffener such that the data signal lead pins can contact the data signal transmission lines while being disposed linearly above the data signal transmission lines, and includes a coupling portion to be coupled with the stiffener.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: May 13, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Sae-Kyoung Kang, Joon-Ki Lee, Joon-Young Huh
  • Patent number: 8724331
    Abstract: An intelligent wall-mounted switch module is provided so that plural electric appliances can be turned on or off mechanically with a single switching element through touch-based selection. The switch module includes a switching element mounted on a wall. The switching element has a control unit electrically connected to the electric appliances and a display for displaying, under control of the control unit, plural identification images whereby the electric appliances or the space or spaces where they are located can be identified. A touch panel is provided on a surface of the display. A user may slide a finger along the touch panel, thus instructing the control unit to switch the identification images displayed by the display. Then, the switching element can be switched so as for the control unit to turn on or off the electric appliance corresponding to the identification image displayed. The switch module features enhanced durability.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: May 13, 2014
    Inventor: Ching-Hsiung Chu
  • Patent number: 8724333
    Abstract: An electronic expansion module which has at least one circuit board, that has a contact region with contacts for mechanical and electrical contact-making with mating contacts connected to the circuit board of the expansion module and a circuit board recess formed such that, with the expansion module inserted into an opening formed on a side of the housing of an electrical field device for use in industrial control, the circuit board of the expansion module does not have any conductive connection to the electrical field device except in the contact region so that reliable electrical isolation between the interior of the device and the user is ensured.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: May 13, 2014
    Assignee: Phoenix Contact GmbH & Co. KG
    Inventors: Christoph Leifer, Andre Korrek
  • Publication number: 20140126157
    Abstract: An electronic circuit module includes a substrate with built-in component, a mount component mounted on the substrate with built-in component, a sealing portion covering the mount component, and a shield made of a conductive synthetic resin covering the sealing portion. The substrate with built-in component has a core layer made of a metal, an outer cover made of an insulating synthetic resin, and a first protrusion. The core layer has corners and side faces. The outer cover covers the corners and the side faces, and has a first surface. The first protrusion has a first end face exposed at the outer cover and a second surface adjacent to the first surface, and is formed away from the corners of the side faces to protrude outwardly. The sealing portion covers the mount component. The shield covers the sealing portion, and has a third surface bonded to the first surface and the second surface.
    Type: Application
    Filed: November 6, 2013
    Publication date: May 8, 2014
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Tatsuro SAWATARI, Masashi MIYAZAKI, Yoshiki HAMADA, Yuichi SUGIYAMA, Kazuaki IDA
  • Patent number: 8716884
    Abstract: There is provided a vehicle controller that is mounted in a box-shaped manner beneath the floor or on the roof of a vehicle so as to supply electric power to vehicle apparatuses. The vehicle controller is configured with a plurality of functional modules 4; each of the functional modules 4 has at one side thereof an interface side 22 in which a first interface region 5 where signal-line terminals are arranged and a second interface region 6 where power-line terminals are arranged are separated; in each of the interface sides 22, the first interface region 5 is disposed in the vicinity of one and the same end and the second interface region 6 is disposed in the vicinity of the other and the same end; the plurality of functional modules includes a monitoring circuit, an overvoltage protection circuit, and an inverter.
    Type: Grant
    Filed: January 26, 2007
    Date of Patent: May 6, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Minoru Ikemoto, Hideo Okayama, Hidetoshi Kitanaka, Hidetoshi Sumita, Yoshinobu Koji, Kiyonobu Ueda, Yasuhisa Adachi, Makoto Sugiura
  • Publication number: 20140118961
    Abstract: Disclosed herein is a power module package including: a base substrate; a post having one end and the other end, the one end being formed on the base substrate; and a case formed on the base substrate such that it covers a lateral surface and an upper surface of the base substrate, and spaced apart from the upper surface of the base substrate.
    Type: Application
    Filed: February 1, 2013
    Publication date: May 1, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Seob Hong, Young Hoon Kwak, Kwang Soo Kim, Bum Seok Suh
  • Publication number: 20140118959
    Abstract: A chip-housing module is provided, the chip-housing module including a carrier configured to carry one or more chips; the carrier including a first plurality of openings, wherein each opening of the first plurality of openings is separated by a first pre-determined distance, and is configured to receive a chip connection for providing a voltage lying within a first range of voltage values to a chip; the carrier including a second plurality of openings, wherein each opening of the second plurality of openings is separated by a second pre-determined distance, and is configured to receive a chip connection for providing a voltage lying within a second range of voltage values to a chip; and wherein a pair of openings consisting of one opening of the first plurality of openings and one opening of the second plurality of openings is separated by a distance different from at least one of the first pre-determined distance and the second pre-determined distance.
    Type: Application
    Filed: January 7, 2014
    Publication date: May 1, 2014
    Applicant: Infineon Technologies AG
    Inventor: Ralf Otremba
  • Publication number: 20140118956
    Abstract: Disclosed herein is an all-in-one power semiconductor module including a plurality of first semiconductor devices formed on a substrate; a housing molded and formed to include bridges formed across upper portions of the plurality of first semiconductor devices; and a plurality of lead members integrally formed with the housing and electrically connecting the plurality of first semiconductor devices and the substrate. According to the present invention, reliability can be improved by increasing bonding areas and bonding strength of semiconductor devices as well as processibilty can be enhanced and failure is reduced by adjusting a step difference with respect to an arrangement and height of the semiconductor devices. Further, a processing time resulting from an omission of a wire bonding process is reduced.
    Type: Application
    Filed: March 14, 2013
    Publication date: May 1, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Samsung Electro-Mechanics Co., Ltd.
  • Publication number: 20140118958
    Abstract: An input/output module is configured to achieve at least one of a function of acquiring a measurement signal from a measurement target and a function of outputting data. The input/output module includes a casing, a rotational connector disposed on the casing, the rotational connector including an arc-shaped notch, the rotational connector being configured to interlock with a connection mechanism of a base to serve as a rotation point so that the input/output module is rotatable to get connected to the base and a latch-shaped fixer configured to fit into a groove formed in at least one of an upper inner surface and a lower inner surface when the input/output module is pushed into a slot having the upper inner surface and the lower inner surface to get connected.
    Type: Application
    Filed: October 24, 2013
    Publication date: May 1, 2014
    Applicant: YOKOGAWA ELECTRIC CORPORATION
    Inventors: Takayuki HAMADA, Akio MORITA, Yuusuke FUJITANI, Ken-ichi YOSHIDA
  • Publication number: 20140118957
    Abstract: An input/output module is commonly usable to a recorder and a data logger. The input/output module includes an input/output unit and a power unit. The input/output unit is configured to achieve at least one of a function of acquiring a measurement signal from a measurement target and a function of outputting data. The power unit is configured to supply an operation voltage to the input/output unit The power unit includes an insulated power device. The power unit is configured to use a voltage, which has been converted by the insulated power device from a power supply voltage, as an operation voltage when the input/output module is connected with a base of the data logger and the power unit receives a power voltage supply via the base. The power unit is configured to use a power supply voltage as the operation voltage, when the input/output module is connected with the recorder and the power unit receives the power voltage supply from the recorder.
    Type: Application
    Filed: October 23, 2013
    Publication date: May 1, 2014
    Applicant: YOKOGAWA ELECTRIC CORPORATION
    Inventors: Kouji KITAGAWA, Yuusuke FUJITANI
  • Publication number: 20140118955
    Abstract: The present invention provides a display device which is configured with a front cover, a rear cover, and a display module and flexible printed circuit sandwiched between the front and rear covers, wherein the display device further includes an elastic member arranged between a bottom surface of the front cover and the flexible printed circuit. A bending or folding contour of the flexible printed circuit can be readily controlled so as to prevent the flexible printed circuit from being damaged resulted from bending and folding. In addition, the display device made in accordance with the present invention featured a lowered manufacturing cost.
    Type: Application
    Filed: October 29, 2012
    Publication date: May 1, 2014
    Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
    Inventors: Shih Hsiang Chen, Gege Zhou
  • Patent number: 8711568
    Abstract: The mechanical and moisture protection apparatus for handheld electronic devices generally comprises a handle for the user, a bearing plate that covers an electrical connector recess in an electronic device, and an insert that fits within the recess. In addition, a sealing means may also be utilized to further ensure a fluid tight seal. The apparatus may be constructed as a one-piece unitary structure or may comprise individual components. The apparatus may be constructed from any number of materials and utilizing any number of fabrication techniques. The apparatus is preferably light weight, inexpensive and easy to assemble.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: April 29, 2014
    Inventor: Zachary Edward Evens
  • Publication number: 20140111947
    Abstract: A control device for a motor vehicle includes a housing having a housing cover and a housing base, a sealing device between the housing cover and the housing base, at least one circuit carrier having electrically conductive tracks, and at least one electronic component disposed on the circuit carrier. The control device further includes at least one conductor structure extending out of the interior of the housing, and at least one electrically conductive connecting line which connects the electronic component to the conductor structure. A getter layer is thermally sprayed on the inner face of the housing to protect the metal parts, which transmit current or data in the interior of the control device, against corrosive gases. The getter layer has a high specific surface area.
    Type: Application
    Filed: May 8, 2012
    Publication date: April 24, 2014
    Applicant: CONTI TEMIC MICROELECTRONIC GMBH
    Inventors: Juergen Henniger, Matthias Wieczorek, Thomas Urbanek, Marion Gebhardt, Bernhard Schuch, Andreas Reif, Stefan Gottschling
  • Patent number: 8702605
    Abstract: The present invention provides a module for a computer interface including a transducer wherein the transducer receives a measurement value and makes this measurement value available for monitoring an individual's health by means of the computer interface, for example, for monitoring an individual's blood glucose level, wherein the measurement value is obtained by means of a sensor.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: April 22, 2014
    Assignee: Roche Diagnostics International AG
    Inventors: Ulrich Haueter, Erich Imhof
  • Patent number: 8705242
    Abstract: In two systems of three-phase alternating-current inverter devices that drive a motor, power elements on power supply sides of bridge circuits are mounted on unit bases to constitute upper arm units. Power elements on ground sides of the bridge circuits are mounted on unit bases to constitute lower arm units. The upper arm units and the lower arm units are arranged separately on upper surfaces and outside surfaces of heat dissipation blocks of a heat sink. Heats generated by the power elements do not interfere with each other and are emitted to the heat sink, whereby heat dissipation performance of the power elements constituting the bridge circuits is improved.
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: April 22, 2014
    Assignee: Denso Corporation
    Inventors: Tatsuya Abe, Masashi Yamasaki
  • Patent number: 8705244
    Abstract: A projector includes: a mounting unit for mounting optional unit (2) having an extension function section, connection substrate (7), and cable (6) for electrically connecting the extension function section and connection substrate (7); mother substrate (31) having connector (31a) to which terminal (7a) is electrically connected; Z-shaped guide metal fitting (40) located on the mounting unit and configured to movably guide terminal (7a) to connector (31a); and a case having mother substrate (31) located therein. One side face of the case has an opening for inserting/removing optional unit (2) into/from the case, and a side panel for covering the opening being removably located in the opening. When optional unit (2) is inserted into the case from the opening, connection substrate (7) is guided by Z-shaped guide metal filling (40), and optional unit (2) functions when terminal (7a) is electrically connected to connector (31a).
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: April 22, 2014
    Assignee: NEC Display Solutions, Ltd.
    Inventor: Mikiya Takeda
  • Publication number: 20140105767
    Abstract: A power supply module configured to supply power to a load having a first connector terminal includes a body, an insulating member, and a second connector terminal. The body includes a frame for power supply. The insulating member seals the body such that the frame is exposed from the insulating member. The second connector terminal is configured to be fitted with the first connector terminal and is bonded to the frame.
    Type: Application
    Filed: October 14, 2013
    Publication date: April 17, 2014
    Applicant: DENSO CORPORATION
    Inventors: Akira IWABUCHI, Masao Yamada, Kenji Onoda, Satoru Sugita, Takayoshi Sakashita
  • Publication number: 20140104814
    Abstract: A display apparatus includes a frame, a panel module and an adjusting pad. The frame has a supporting surface, and the panel module includes a substrate and a plurality of chips. The substrate is disposed on the supporting surface and has a bonding region at a side of the substrate. The chips are disposed on the bonding region, wherein the chips and the supporting surface are located at two opposite surfaces of the substrate. The adjusting pad is disposed between the supporting surface and the bonding region, and the thickness of the adjusting pad is gradually reduced from a center portion of the adjusting pad toward two sides of the adjusting pad. Another display apparatus, in which a frame and an adjusting pad are integrated into one piece, is provided.
    Type: Application
    Filed: July 9, 2013
    Publication date: April 17, 2014
    Inventors: Wen-Hung HUANG, Tung-Shin LIN, Cheng-Min TSAI
  • Publication number: 20140104766
    Abstract: An electronic interconnect system comprises: a motherboard having electrical contacts on its upper and lower surfaces along a selected edge; an electronic module comprising a circuit board with electronic devices mounted thereon, and further comprising two opposing flexible portions that are openable outwardly from one another, the flexible portions having electrical contact pads on the opposing surfaces, so that when the flexible portions are placed on either side of the edge of the motherboard the pads align with contacts on the respective surfaces of the motherboard and make electrical contact therewith.
    Type: Application
    Filed: October 17, 2012
    Publication date: April 17, 2014
    Inventors: James E. Clayton, Zakaryae Fathi
  • Publication number: 20140092338
    Abstract: A display module 1 of the present invention includes a first board 3, a second board 4, a base film 5, and a circuit member 2. The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3. The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4. The circuit member 2 is formed on the base film 5.
    Type: Application
    Filed: April 23, 2012
    Publication date: April 3, 2014
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Hiroki Miyazaki, Motoji Shiota, Takatoshi Kira, Gen Nagaoka, Seiji Muraoka, Makoto Tamaki, Keiji Aota, Yukio Shimizu, Takashi Matsui, Hiroki Nakahama, Hiroki Makino, Minoru Horino
  • Patent number: 8687376
    Abstract: An apparatus includes a first body part comprising a first user interface and a second body part comprising a second user interface. The apparatus further comprises a mechanism configured to rotate the first body part with respect to the second body part over a pivot axis, and move the first body part with respect to the second body part substantially parallel to the pivot axis.
    Type: Grant
    Filed: April 4, 2011
    Date of Patent: April 1, 2014
    Assignee: Nokia Corporation
    Inventor: Tom Travis
  • Publication number: 20140084452
    Abstract: Prepared in advance is a substrate formed of metallic material where slits are formed between mounting regions. Oxide films are generated all over the substrate including end faces of the substrate. Exposed are only lateral faces corresponding to the cross sections cut when tie bars are cut. This structure and the fabrication method minimize the area of cutting faces in the metallic material.
    Type: Application
    Filed: November 27, 2013
    Publication date: March 27, 2014
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Masayuki NAGAMATSU, Mayumi NAKASATO, Masurao YOSHII, Yasuhiro KOHARA, Kotaro DEGUCHI
  • Publication number: 20140085833
    Abstract: A chip packaging substrate includes a dielectric layer, a first inner wiring layer embedded in the dielectric layer, an outer wiring layer, and many conductive connection points. The outer wiring layer is formed at one side of the dielectric layer, and is electrically connected to the first inner wiring layer through many first conductive vias in the dielectric layer. The conductive connection points are formed at the other side of the dielectric layer, and are electrically connected to the first inner wiring layer through many second conductive vias in the dielectric layer.
    Type: Application
    Filed: September 17, 2013
    Publication date: March 27, 2014
    Applicant: ZHEN DING TECHNOLOGY CO., LTD.
    Inventors: SHIH-PING HSU, E-TUNG CHOU, CHIH-JEN HSIAO
  • Publication number: 20140078684
    Abstract: A power module substrate includes: a ceramics substrate composed of AlN, having a top face; a metal plate composed of pure aluminum and joined to the top face of the ceramics substrate with a brazing filler metal including silicon interposed therebetween; and a high concentration section formed at a joint interface at which the metal plate is joined to the ceramics substrate, having a silicon concentration that is more than five times the silicon concentration in the metal plate.
    Type: Application
    Filed: November 13, 2013
    Publication date: March 20, 2014
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshirou Kuromitsu, Kazuhiro Akiyama, Takeshi Kitahara, Hiroshi Tonomura
  • Publication number: 20140078683
    Abstract: In one embodiment, a high frequency module may include a substrate. The substrate may include a first surface and a second surface substantially opposite of the first surface. The high frequency module may include a component coupled to the second surface. A direct current may be provided to the component using the substrate. The high frequency module may include a core coupled to the second surface of the substrate. In some embodiments, the core may include at least one opening extending through the core. The component may be positioned in at least one of the openings. In some embodiments, the high frequency module may include a cover coupled to the core. The component may be positioned in at least one of the openings between the substrate and the cover.
    Type: Application
    Filed: February 21, 2013
    Publication date: March 20, 2014
    Applicant: NATIONAL INSTRUMENTS CORPORATION
    Inventors: Tamir Moran, Gregory S. Gonzales
  • Publication number: 20140071632
    Abstract: A semiconductor device includes a plate shaped semiconductor package substrate, a semiconductor chip mounted on the semiconductor package substrate, a plurality of electrodes formed on a lower surface of the semiconductor package substrate, the plurality of electrodes being electrically connected to a mother board; and a connector formed at an end of the semiconductor package substrate. The connector includes a plurality of terminals to be electrically connected to a plurality of spring terminals of a mating connector which is mated in a parallel direction to the semiconductor package substrate.
    Type: Application
    Filed: July 17, 2013
    Publication date: March 13, 2014
    Inventors: Yoshinori SUNAGA, Kinya Yamazaki, Hidenori Yonezawa, Yoshiaki Ishigami
  • Patent number: 8670242
    Abstract: A data storage device comprising a card-shaped body, a memory within the card-shaped body, and a connector for connecting the memory to a personal computer. The card-shaped body comprises a swipable portion with a magnetic stripe arranged to be read by a magnetic stripe card reader. The card-shaped body can comprise a main portion with a recess and a connector portion comprising the memory and connector. In that case, the connector portion is hingably mounted on the main portion to be rotatable between a closed position in which the connector portion is located within the recess, and an open position in which the connector of the connector portion is located outside of the recess so that it can be used to connect the memory to a personal computer.
    Type: Grant
    Filed: July 14, 2009
    Date of Patent: March 11, 2014
    Assignee: Goosewire Holdings Limited
    Inventors: Peter Anthony Ronald Ellul, Stephen James Brown
  • Publication number: 20140063821
    Abstract: An enclosure assembly and systems and methods for using the same are disclosed. The enclosure assembly may include a base plate, a plurality of sidewalls, and one or more insulator layers disposed on the sidewalls. When coupled to a module, the enclosure assembly may least partially enclose the module to prevent the spread of EMI, to assist in heat dissipation, to protect the structural integrity of the module, and the like.
    Type: Application
    Filed: September 6, 2012
    Publication date: March 6, 2014
    Applicant: APPLE INC.
    Inventors: Shashikant G. Hegde, Ashutosh Y. Shukla, Kenta K. Williams
  • Publication number: 20140063751
    Abstract: A circuit module includes a circuit board and electronic components mounted on the circuit board. The mounted electronic components include at least one discrimination-target electronic component and at least one module-discrimination electronic component. In addition, the circuit board includes land electrodes allowing the module-discrimination electronic component to be mounted at different positions and/or orientations with respect to the circuit board, and the module-discrimination electronic component is mounted at any one position and/or orientation among different positions and/or orientations with respect to the circuit board in accordance with the type of the discrimination-target electronic component.
    Type: Application
    Filed: August 5, 2013
    Publication date: March 6, 2014
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Tomoko SAITO
  • Publication number: 20140063750
    Abstract: A hinge for pivotally interconnecting first and second brackets includes a shaft having a shaft body extending through the first and second brackets and formed with an engaging end portion proximate to the second bracket, a fixing member connected to the engaging end portion, a ratchet sleeved rotatably on the shaft body between the fixing member and the second bracket, a friction mechanism having an urging unit sleeved on the shaft body between the ratchet and the fixing member and pressing the ratchet toward the second bracket, and a brake mechanism disposed on the second bracket and having a pawl member releasably engaged to the ratchet.
    Type: Application
    Filed: March 18, 2013
    Publication date: March 6, 2014
    Applicants: LITE-ON TECHNOLOGY CORP., LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
    Inventors: SHU-HUA MAU, YUE-WEN JIANG
  • Publication number: 20140063753
    Abstract: An electronic module includes: a first substrate having first surface on which a first sensor element is provided and a second surface on which a circuit element is provided; a second substrate having a third surface on which a second sensor element is provided; a third substrate having a fifth surface on which a third sensor element is provided; a first connecting portion connecting the first substrate and the second substrate to each other; and a second connecting portion connecting the first substrate and the third substrate to each other. A shield layer is provided between the first sensor element and the circuit element.
    Type: Application
    Filed: August 29, 2013
    Publication date: March 6, 2014
    Applicant: Seiko Epson Corporation
    Inventor: Taketo CHINO
  • Publication number: 20140063752
    Abstract: Maintenance of reliable and highly available electronic systems to perform servicing and preventive maintenance may need to be performed without interruption of operations. Removal of circuit cards from a chassis may render the connectors on a chassis vulnerable to inadvertent short circuiting of power sources by stray metallic objects. A configuration where the power is removed from a connector as the circuit card is being extracted eliminates his possibility. The control circuits for the power supply connections and the power supplies are themselves redundant so that they may be similarly serviced.
    Type: Application
    Filed: September 4, 2013
    Publication date: March 6, 2014
    Inventors: John R. Sisler, John C. Ottesen, Russell T. Baca, Jean-Phillipe Fricker
  • Patent number: 8665601
    Abstract: The present invention pertains to a hard disk drive form factor compatible solid-state storage device enclosure assembly that protects circuit boards contained within the enclosure from environmental disruption, such as mechanical stress, vibration, external electronic disruption, or any combination of these, while allowing for a variable number of circuit boards in the SSD enclosure. In another embodiment, the solid-state storage device enclosure assembly, or a similar circuit board assembly, includes an alignment guide that precludes a circuit board from being misaligned within the enclosure.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: March 4, 2014
    Assignee: BiTMICRO Networks, Inc.
    Inventors: Rogelio Gazmen Mangay-Ayam, Jr., Elbert Castro Esguerra, Jerico Alge Parazo, Christopher Dayego Galvez, Allan Famitanco Cruz
  • Patent number: 8665599
    Abstract: A portable external power-supplying device is disclosed. The portable external power-supplying device implements a unique mechanism to detachably assemble battery units whose number can be adjusted according to user needs, which means the overall aggregate capacity of the portable external power-supplying device is adjustable. The portable external power-supplying device is adaptive to connect and charge a portable electronic device.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: March 4, 2014
    Assignee: Hugee Technology Co., Ltd.
    Inventors: Hung-Pin Shen, Lung-Hua Wu, Yen-Ling Chen
  • Patent number: 8665608
    Abstract: The circuit board packaging structure capable of inserting and extracting an interface part of a circuit board into and from a connector part of the processing equipment in a direction different from a direction of attaching and detaching the circuit board to and from the processing equipment includes: an operating part which turns on receiving force; a plate part which is fixed to the circuit board to be rotatable in a direction reverse to a turning direction of the operating part, and converts the force received by the operating part to force in a direction different from the attaching and detaching direction to move the circuit board in that direction; a link part which connects the operating part with the plate part to transmit the force received by the operating part to the plate part; and a fastener which fastens the circuit board and the operating part with play.
    Type: Grant
    Filed: March 24, 2011
    Date of Patent: March 4, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Yoshito Hayashi, Masakatsu Tanji
  • Publication number: 20140055958
    Abstract: A 3 dimensional touch module of the present invention including: a base plate protruding outwards, an adhesive layer on the base plate, an induction thin film fixed on the base plate by means of the adhesive layer and a substrate layer combined with the induction thin film by a mode of injection shaping. The method of manufacturing mainly has the base integrally press shaped after being stuck firm with each other to form a protruding shape, this can not only provide a feeling of 3 dimensional touching, but also can simplify the process of manufacturing.
    Type: Application
    Filed: August 23, 2012
    Publication date: February 27, 2014
    Inventors: Li-Te HSU, Lin-Yeh YANG
  • Publication number: 20140056010
    Abstract: A modular controller for a lamp allows for the easy addition of remote control to multiple lamp fixture designs. The controller housing protects circuitry from shorts and has a window included for receiving remote control signals. The window is detachable and can be re-oriented relative to the controller housing to accommodate different lamp fixture designs. The position of the sensors within the controller housing can also be reconfigured, and it is also possible to connect external sensors to the controller for situations where sensors must be placed in a tight space. In some embodiments, the lamp power supply is incorporated within the modular controller, saving space and cost, and allowing for dimming of individual lamps.
    Type: Application
    Filed: March 27, 2012
    Publication date: February 27, 2014
    Applicant: Loto Lighting LLC
    Inventor: Thomas E. Devlin
  • Publication number: 20140055959
    Abstract: A module for mounting in a rack, the module including a frame and a tray, the frame being arranged such that it may be mounted to the rack, and the tray being slidably and pivotably connected to the frame, such that the tray may be moved between a first position, in which the tray is received within the frame and lies substantially parallel to the frame, and a second position, in which the tray lies outside the frame and at an angle to the frame.
    Type: Application
    Filed: May 10, 2012
    Publication date: February 27, 2014
    Inventor: Ion Manda
  • Publication number: 20140055942
    Abstract: A module may be configured for connection with a microelectronic assembly having terminals and a microelectronic element. The module may include a circuit panel bearing conductors configured to carry command and address information, co-support contacts coupled to the conductors, and module contacts coupled to the conductors.
    Type: Application
    Filed: March 15, 2013
    Publication date: February 27, 2014
    Applicant: INVENSAS CORP.
    Inventors: Richard Dewitt Crisp, Belgacem Haba, Wael Zohni
  • Patent number: 8657031
    Abstract: The universal control module is designed for controlling the operation of a plurality of motors and/or configured for a plurality of different motor applications. In an example, the control module is configurable within a housing of a power tool. The control module includes a top cover, a bottom cover and a printed circuit board (PCB) with control components thereon. The control module includes a spacer configured between the top and bottom covers and attached to the PCB for providing tolerances for the control components during a soldering process to fixedly attach the control components to the PCB.
    Type: Grant
    Filed: May 26, 2006
    Date of Patent: February 25, 2014
    Assignee: Black & Decker Inc.
    Inventors: George Kononenko, Zollie W. Privett