Abstract: A circuit module includes a plurality of electronic components and a single-layer conductive package substrate. The single-layer conductive package substrate is adapted to physically support and electrically interconnect the electronic components. The substrate has a peripheral portion and an interior portion. The peripheral portion includes a plurality of peripheral contact pads coupled to corresponding electronic components. The interior portion includes a plurality of floating contact pads that are electrically isolated from the peripheral contact pads and are coupled to corresponding electronic components.

Abstract: A connector assembly for an implantable medical device includes a plurality of feedthroughs mounted in a conductive array plate, each feedthrough in the plurality of feedthroughs including a feedthrough pin electrically isolated from the conductive array plate by an insulator and an electronic module assembly including a plurality of conductive strips set in a non-conductive block. The plurality of conductive strips is in physical and electrical contact with the feedthrough pins at an angle of less than 135 degrees. The connector assembly further includes at least one circuit, the circuit including a plurality of conductors corresponding to the plurality of feedthroughs. The plurality of conductors of the circuit is in physical and electrical contact with a corresponding one of the conductive strips of the plurality of conductive strips of the electronic module assembly at an angle of less than 135 degrees.

Abstract: An electronic device is disclosed. The electronic device may include a component made of a ceramic material. The electronic device may also include circuitry configured to transmit signals. The signals may pertain to input received through the component.

Abstract: An intelligent wall-mounted switch module is provided so that plural electric appliances can be turned on or off mechanically with a single switching element through touch-based selection. The switch module includes a switching element mounted on a wall. The switching element has a control unit electrically connected to the electric appliances and a display for displaying, under control of the control unit, plural identification images whereby the electric appliances or the space or spaces where they are located can be identified. A touch panel is provided on a surface of the display. A user may slide a finger along the touch panel, thus instructing the control unit to switch the identification images displayed by the display. Then, the switching element can be switched so as for the control unit to turn on or off the electric appliance corresponding to the identification image displayed. The switch module features enhanced durability.

Abstract: An electronic device with a detachable communication module is provided. The electronic device includes an electronic device casing and the communication module. The electronic device casing includes a receiving space and an opening. The communication module includes a covering plate, a fixing plate, a first circuit board, and a first connector. The covering plate has an aperture. The first connector has a connecting port. Moreover, the first circuit board is connected with a supporting member. The first connector is connected with the first circuit board. The connecting port is exposed to the aperture of the covering plate. After the first circuit board and the first connector are accommodated within the receiving space, the opening of the electronic device casing is covered by the covering plate. Moreover, by the fixing plate, the communication module is fixed on the electronic device casing.

Abstract: A method of manufacturing an electronic component module includes sealing a surface of an aggregate substrate on which a plurality of electronic components are mounted with a sealing resin and cutting boundary portions between electronic component modules from an outer surface of the sealing resin to a position at least partially through the aggregate substrate to form first grooves. A shield layer is formed by coating the outer surface of the sealing resin with a conductive resin and filling the first grooves with the conductive resin, and recesses are formed at positions on the shield layer where the first grooves are formed. The boundary portions between electronic component modules are cut along the corresponding recesses so that second grooves each having a width smaller than the width of a corresponding one of the recesses are formed, and the aggregate substrate is singulated into the individual electronic component modules.

Abstract: A module for use with a monitoring system is provided. The module includes a circuit board that includes a plurality of ground planes. At least two of the plurality of ground planes are coupled using a plurality of vias. The module further includes a copper pour coupled to the circuit board adjacent to the plurality of vias. The module further includes a housing that includes a dam wall that is coupled to the copper pour.

Abstract: According to one embodiment, there are provided a memory which is provided on a circuit board, a controller which is provided on the circuit board and controls the memory, and a signal line which is formed on the circuit board and configured to perform data transmission between the controller and the memory, in which a width of the signal line in the place where the signal line is led out from the memory is large compared with a place disposed under the memory.

Abstract: A portable terminal includes a display module and a case member coupled to the display module. A face of the case member is formed to have a center portion and an edge, which are different from each other in their heights to thereby support a center portion of the display module in lengthwise and widthwise directions of the display module respectively. The portable terminal configured above supports a rear face of the flat display module using at least one of a portion protruded from the case member and a stiff material film, to thereby diffuse an impact exerted on a display device to the case member. Thus, it is possible to relieve the damage to the flat display device due to an external impact.

Abstract: With respect to an electronic component, in particular a power module, and in a corresponding method for producing or contact-connecting said component, the component (1) is fastened to an electrically insulating carrier film (3) having at least one first inorganic material and at least one opening (5) in which at least one electrical contact-connection (7) of the component (1) to outside the component (1) is provided. This makes it possible to provide electronic components (1), in particular power modules, for a temperature range of >175 DEG C.

Abstract: An electronic device includes a casing with a side plate and encasing a power module. The power module includes a locking member, a sliding member, and an elastic member sandwiched between the base and the cover. The sliding member is movable relative to the locking member between a locked position in which the locking portion of the locking member is pushed by the elastic member to extend through the cover to be blocked by the side plate of the casing, and an unlocked position in which the locking member is pressed by the sliding member to withdraw from the side plate to allow removal of the power module from the casing.

Abstract: An arrangement is described for receiving an electrical converter module for converting a first frequency of an electrical input signal into a second frequency of an electrical output signal. A rack includes input terminals for receiving the electrical input signal and output terminals for providing the electrical output signal. A slot receives the converter module in a first and second positions where in first position the converter module is electrically connected both to the input and output terminals and in the second position the converter module is electrically disconnected both from the input and output terminals. An actuator, which is mounted to the rack and which, in response to a disconnect trigger signal, is adapted to move the electrical converter module from the first position to the second position. A frequency converter system equipped with such an arrangement and a method for disconnecting a converter module are provided.

Abstract: Electronic devices are provided with housing components that have improved aesthetics. One or more holes may be formed through an extruded portion of the housing.

Abstract: Electrical apparatus comprises: a housing; an electrical circuit in the housing comprising a circuit component; a metallic component in the housing, for dissipating heat generated in the circuit component; and a thermally conductive body arranged between a surface of the circuit component and a surface of the metallic component. The housing comprises a first housing portion and a second housing portion, the second housing portion being adapted to locate on the first housing portion in a closed position in which the electrical circuit, metallic component, and body are enclosed within the housing, the second housing portion being adapted such that, when in the closed position, the second housing portion urges the surface of the circuit component towards the surface of the metallic component such that the body is in contact with both of these surfaces to assist transfer of heat generated in the circuit component to the metallic component.

Abstract: A printed circuit board assembly is disclosed, including a printed circuit board including at least one opening, and a system in package assembly, wherein the system in package assembly includes a system in package module and a lead frame bonded to the system in package module. The lead frame includes a plurality of pins.

Abstract: A central processing unit (CPU) expansion card may be inserted into a first connector of a motherboard. The CPU expansion card includes a board, a CPU socket mounted on the board, a number of memory slots mounted on the board and electrically connected to the CPU socket, and a second connector electrically connected to the CPU socket and mounted on the bottom side of the board to be inserted into the first connector of the motherboard.

Abstract: The present invention relates to a compliant leaded interposer for resiliently attaching and electrically connecting a ball grid array package to a circuit board. The interposer may include a substrate, a plurality of pads, and a plurality of pins. The plurality of pads may be positioned substantially on the top surface of the substrate and arranged in a predetermined pattern substantially corresponding to the solder ball pattern on the ball grid array package. The plurality of pins may be positioned substantially perpendicular to the substrate and may extend through the substrate and the plurality of pads. The interposer may be configured to attach the ball grid array package to the circuit board such that each of the solder balls on the ball grid array package contacts at least a portion the plurality of pins and at least a portion of the plurality of pads and such that the each of the plurality of pins also connects to a contact on the circuit board.

Abstract: A printed circuit board (PCB) for an energy storage module is disclosed which includes a first side having a plurality of low current traces useful for monitoring and balancing applications and a second side coated with high current traces, useful for current or power transmission purposes. Vias connect the high current traces to the low current traces thereby electrically connecting both sides of the board together. The disclosed PCB is particularly useful for energy storage modules whereby monitoring and/or balancing of the modules is required in addition to the transmission of high current levels for power applications.

Abstract: A display device with a replaceable housing, applicable to an electronic product using a flip form, includes: a display panel module, a positioning plate, and an outer cover. The display panel module has a display portion on one side thereof. The positioning plate has a frame piece and a metal plate. The frame piece is disposed at the periphery of the display panel module. The metal plate is fixed at the frame piece to cover the other side of the display panel module. The outer cover is detachably joined with the positioning plate and covers the positioning plate.

Abstract: The invention relates to a high voltage module for motor vehicles. The high voltage module includes the a manually operated circuit breaker in a module housing which is disposed in a socket of the module housing. By removing the circuit breaker from the socket, at least one high voltage cable within the module housing is interrupted. A manually operated tool with a plug-type housing adapted to the socket includes a pivotable cover. The pivotable cover can assume an opened and a closed position. The tool includes at least one measuring lead which is connected to the at least one high voltage cable and a measuring terminal in the plug-type housing.

Abstract: A test slot assembly is provided for testing a storage device. The test slot assembly is configured to receive and support a storage device, or a storage device supported by a storage device transporter. The test slot assembly also includes a conductive heating assembly. The conductive heating assembly is arranged to heat a storage device by way of thermal conduction.

Abstract: This publication discloses an electronics module and a method for manufacturing it. The electronic module includes at least one first embedded component (6), the contact terminals (7) of which face essentially towards the first surface of the insulating-material layer (1) and which is connected electrically by its contact terminals (7) to the conductor structures contained in the electronic module. According to the invention, a second embedded component (6?), the contact terminals (7?) of which face essentially towards the second surface of the insulating-material layer and which is connected electrically by its contact terminals (7?) to the conductor structures contained in the electronic module, is attached by means of glue or two-sided tape to the first component (6), and the contact terminals (7, 7?) are connected to the conductor structures with the aid of a conductive material, which is arranged in the insulating-material layer in holes (17) at the locations of the contact terminals (7, 7?).

Abstract: Disclosed herein is a card-type peripheral apparatus including: a case body configured to accommodate an electronic package including a circuit board between a first surface and a second surface that are opposite to each other; a first electronic package including a memory mounted on the circuit board; a second electronic package including an electronic part for controlling the memory mounted on the circuit board; a first thermal conductive material arranged inside the case body, the first thermal conductive material in contact with a surface of at least one of the first electronic package and the second electronic package; and a second thermal conductive material formed with the first surface and the second surface of the case body, wherein the first thermal conductive material and the second thermal conductive material are in contact with each other inside the case body.

Abstract: A method and apparatus for retaining a removable module (such as a memory card) in engagement with an interface structure of a printed circuit board (PCB). The PCB is coupled to a tray, wherein the module is positioned between the PCB and the tray. The tray includes one or more forms configured to receive the module, and prevent the module from moving out of engagement with the interface structure of the PCB. A first form includes a depressed region formed in the tray, wherein the module is fitted within the depressed region. A slot, which extends through the tray, may be located adjacent to the depressed region, wherein an edge of the slot restricts movement of the module. A second form may include a raised lip, which is located adjacent to the module, and restricts movement of the module.

Abstract: An accessory system for a vehicle includes a windshield that has a mounting element adhesively attached to its inner surface, an interior rearview mirror assembly, and an accessory support adapted for mounting to and demounting from the mounting element. The accessory support includes an accessory receiving portion configured to receive an accessory. The accessory support may comprise part of the interior rearview mirror assembly or may include a mirror mounting element with the interior rearview mirror assembly adapted for mounting to the mirror mounting element of the accessory support. The accessory comprises an imaging sensor and the accessory receiving portion is configured to receive the imaging sensor in a manner that compensates for the windshield angle of the windshield so that the imaging sensor has a more generally horizontal forward field of view through the windshield when the accessory support is mounted to the mounting element.

Abstract: A display module includes a display panel, a unit disposed on an outer side of the display panel, and an adhesive sheet with which the display panel and the unit are stuck together. The adhesive sheet has a first adhesive surface adhering to the display panel and a second adhesive surface adhering to the unit. The edge of the first adhesive surface and the edge of the second adhesive surface are displaced from each other in the adhesive surface direction.

Abstract: According to one embodiment, the electronic device of this embodiment includes a module, a first plate which has a first surface and a second surface, the first plate supporting the module, a cover which includes an attaching surface that is attached to the first plate, and an engaging part that includes a tip part, a second plate which is attached to the first plate from a side of the second surface and fill a space between the second surface and the tip part, the second plate being engaged with the engaging part and fixing the cover onto the first plate, and a fixing member which fixes the second plate onto the first plate.

Abstract: A touch panel having improved visibility is provided. The touch panel includes a window part, at least one ultraviolet (UV) resin layer attached to a bottom surface of the window part, and a display part including a touch sensor film module attached to a bottom surface of the at least one UV resin layer such that the UV resin layer prevents refractions and reflections of light.

Abstract: An electronic component module includes a rectangular insulating substrate; lands that are arranged on a substrate surface thereof; electronic components that are connected to the lands using solder, and are mounted on the substrate surface; a solder resist protective layer that protects a wiring pattern by covering the substrate surface, and that is raised from the substrate surface toward the electronic components; a non-resist forming region that is not subjected to the solder resist and that exposes the substrate surface; and a sealing resin that seals the electronic components on the substrate surface. The non-resist forming region is formed in such a way as to communicate one side which partitions the substrate surface with another side which is separated from the one side, which partitions the substrate surface, through bottoms of component rear surfaces of the electronic components on the substrate surface.

Abstract: The mechanisms for forming bumps on packaged dies and package substrates reduce variation of bump heights across the packaged dies and packaged substrates. Bumps are designed to have different widths to counter the higher plating current near edge(s) of dies or substrates. Bump sizes can be divided into different zones depending on the bump patterns and densities across the packaged die and/or substrates. Smaller bumps near edges reduce the thickness of plated film(s), which would have been thicker due to being near the edges. As a result, the bump heights across the packaged dies and/or substrates can be kept significantly constant and chip package can be properly formed.

Abstract: A cable management apparatus for managing a switch cable includes a mounting bracket, a resilient member fixed to the mounting bracket, and a number of positioning members mounted to the mounting bracket. The switch cable is positioned between the resilient member and the positioning members, and stretched by the resilient member, thereby extending sinuously along a lengthwise direction of the mounting bracket. A rear end of the switch cable is retained to the mounting bracket.

Abstract: A communication module including a circuit board having leading and trailing ends and a module axis extending therebetween. The communication module also includes a support wall that is coupled to the circuit board proximate to the leading end. The support wall extends transverse to the module axis and has a wall opening. The communication module also includes an electrical connector that is held by the support wall within the wall opening and has a mating face. The communication module also includes a board interconnect coupled to the circuit board. The communication module also includes a flex cable assembly that is coupled at one end to the array of electrical contacts and at an opposite end to the board interconnect. The electrical connector is permitted to float within the wall opening relative to the support wall.

Abstract: The electronic unit base includes a body and a first conducting layer. The body includes a supporting face, a bottom face, and a first incline. The supporting face and the bottom face are disposed on the opposite sides of the body. The first incline is disposed on one side of the body between the supporting face and the bottom face, wherein the first incline and the bottom face substantially have a first angle. The first conducting layer is disposed on the supporting face and extends toward the first incline, wherein the first conducting layer covers a portion of the supporting face and a portion of the first incline.

Abstract: The present application relates to a microwave module comprising a printed circuit board, a first housing part, a second housing part, and a diplexer. It is specifically proposed that the first and second housing parts are adapted to act as a shielding cover, and that the diplexer and its filter are an integrated part in the module and are made out of the shielding cover and the printed circuit board.

Abstract: The invention relates to a power semiconductor module including a module underside, a module housing, and at least two substrates spaced from each other. Each substrate has a topside facing an interior of the module housing and an underside facing away from the interior of the module housing. The underside of each substrate includes at least one portion simultaneously forming a portion of the module underside. At least one mounting means disposed between two adjacent substrates enables the power semiconductor module to be secured to a heatsink.

Abstract: The optoelectronic device includes a sleeve, an optical subassembly, an electrical connector, and a substrate. The sleeve includes a longitudinal axis, and the sleeve is mountable to a bulkhead. The substrate forms a plane. The substrate is attached to the optical subassembly and to the electrical connector. The substrate includes electrical signal conditioning components mounted thereon. The electrical signal conditioning components electrically connect the optical subassembly to the electrical connector. The substrate is mounted to the sleeve, and the plane of the substrate is substantially perpendicular to the longitudinal axis of the sleeve.

Abstract: A serial advanced technology attachment (SATA) DIMM device includes a board body. A control chip is arranged on the board body. First and second extending boards extend from an end of the board body and a space is defined between the first and the second extending boards. A first edge connector is set on the first extending board and a second edge connector is set on the bottom edges of the second extending board and the board body. The first edge connector includes a number of signal pins connected to the control chip, and a number of ground pins.

Abstract: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) an ethylene interpolymer comprising an overall polymer density of not more than 0.905 g/cm3; total unsaturation of not more than 125 per 100,000 carbons; and; up to 3 long chain branches/1000 carbons; vinyl-3 content of less than 5 per 100,000 carbons; and a total number of vinyl groups/1000 carbons of less than the quantity (8000/Mn), wherein the vinyl-3 content and vinyl group measurements are measured by gel permeation chromatography (145° C.) and 1H-NMR (125° C.), (2) a graft polymer to enhance the adhesion, (3) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt % based on the weight of the copolymer, and (3) optionally, a co-agent in an amount of at least about 0.05 wt% based upon the weight of the copolymer.

Abstract: According to one embodiment, an electronic apparatus includes a casing, a module unit, an installation portion, and a holding portion. The module unit includes an elastic cover member including a projection, and a module fitted in the cover member. The installation portion is provided inside the casing and configured to receive the module unit. The holding portion is projected from the installation portion and configured to surround and hold the module unit. The holding portion includes a fitting portion which is located at a peripheral region thereof and in which the projection is fitted, and a pair of edge portions configured to define the fitting portion and being more away from each other at positions closer to a peripheral region of the holding portion. The projection is in contact with the edge portions and is exposed in the fitting portion to an outside region of the holding portion.

Abstract: A multilayer electronics assembly and associated method of manufacture are provided. The multilayer electronics assembly includes a plurality of stacked substrate layers. Each of the substrate layers is fusion bonded to at least an adjacent one of the plurality of substrate layers. A first discrete electrical circuit component is bonded to a first layer of the plurality of layers. A bonding material is interposed between the discrete electrical circuit component and the first layer. The bonding material has a reflow temperature at which the bonding material becomes flowable that is higher than a fusion bonding temperature of the substrate layers.

Abstract: A power module assembly for being mounted to headgear is provided. The power module assembly can include a housing member and a cover member configured to mount thereto. The housing member and cover member can have a generally curved profile configured for fitting against a user's head. The housing member can be generally rigid, and the cover member generally flexible and resilient, so that the cover member can mount to the housing member with a snap fit connection therebetween. The housing member can further include a plurality of handles, so that straps of the headgear can extend through openings between the handles corresponding surfaces of the housing member to secure the power module assemble to the headgear.

Abstract: An input/output module for a building automation system includes a mounting plate, a circuit board, and a cover. The mounting plate has at least two fastener receptacles (24-30) positioned to align with fastener receptacles of a standard electrical junction box (90). The mounting plate further includes at least two openings, each opening sized to receive one or more wires therethrough. The circuit board supports an interface circuit configured to communicate on a building network. The circuit board also includes device input terminals and device output terminals. The interface circuit is configured to provide an interface between the building network and devices connected to the input and output terminals. The circuit board is configured to be mounted to the mounting plate. The cover is sized to fit over the mounting plate and circuit board.

Abstract: A computer system includes a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a circuit board, a motherboard, and an indicating unit. An edge connector is set on a bottom edge of the circuit board to engage in a memory slot of the motherboard. A SATA connector is arranged on the circuit board and connected to a storage device interface of the motherboard. The indicating unit is connected to the motherboard for indicating the data transfer rates of the SATA DIMM module through two light emitting diodes.

Abstract: A system manages cables to connect to a device provided in a device chassis. The system includes a cable management boom connected to a top portion of the device chassis, cable management shelves connected to a side portion of the device chassis, and a cable management arm connected to and supported by the cable management shelves. The cable management arm is to retain the cables, pivot through an angle to provide access to the device provided in the device chassis, and route the cables from the device to the cable management boom. The cable management boom is to gather the cables, retain the cables, and route the cables above the device chassis.

Abstract: An electronic module includes a mold body in which an electronic component mounted on a circuit substrate is sealed by a mold resin; and a shield film formed to cover upper and side surfaces of the mold body, the shield film being a metal evaporated film formed by physical vapor deposition.

Abstract: An apparatus, comprising a housing; a first connector coupled to the housing and having a first plurality of contacts; a second connector coupled to the housing and having a second plurality of contacts; and a circuit electrically connected to at least one of the first contacts and at least one of the second contacts. The circuit is encapsulated within the housing. The circuit is configured to generate an output signal in response to a resistance sensed at the at least one of the first contacts.

Abstract: Apparatuses, multi-chip modules, capacitive chips, and methods of providing capacitance to a power supply voltage in a multi-chip module are disclosed. In an example multi-chip module, a signal distribution component may be configured to provide a power supply voltage. A capacitive chip may be coupled to the signal distribution component and include a plurality of capacitive units. The capacitive chip may be configured to provide a capacitance to the power supply voltage. The plurality of capacitive units may be formed from memory cell capacitors.

Abstract: A communication protocol interface module conceived to be applied to an electromechanical equipment (1) provided with an opening (3) for coupling the module (2) that is provided with an electronic board (11) inside same having a circuit for defining the communication protocols.

Abstract: A printed circuit assembly, along with a server and method incorporating such printed circuit assembly, are disclosed for determining a storage configuration for use in a computer system via a simple hardware change. The printed circuit assembly may comprise a paddle board slot for connection to a paddle board for determining a storage configuration; a bus coupled to the paddle board; and a southbridge coupled to the bus, the southbridge comprising signal lines coupled to the paddle board slot through the bus. The storage configuration of the printed circuit assembly may be determined via the paddle board when the paddle board is connected to the paddle board slot.

Abstract: An external accessory that can be attached to and detached from an electronic apparatus equipped with a power source unit includes: a first power receiving unit that receives power from the power source unit of the electronic apparatus; a second power receiving unit that receives power from the power source unit of the electronic apparatus; a decision-making unit that makes a decision as to whether or not the first power receiving unit is receiving power; a function execution unit that executes a predetermined function by using power received at one of the first power receiving unit and the second power receiving unit; and a control unit that engages the function execution unit in operation continuously when an affirmative decision is made by the decision-making unit, and engages the function execution unit in operation intermittently when a negative decision is made by the decision-making unit.