Abstract: A module includes a wiring board; a plurality of mounting electrodes for component mounting, the mounting electrodes being disposed on one principal surface of the wiring board; a plurality of components mounted on the one principal surface of the wiring board and solder-connected to the mounting electrodes; a solder resist being a photosensitive resin configured to cover the one principal surface of the wiring board, with a plating electrode layer of each mounting electrode exposed; and a sealing resin layer disposed on the one principal surface of the wiring board, the sealing resin layer being configured to cover the photosensitive resin and the components connected to the mounting electrodes. A recess substantially wedge-shaped in cross section is provided at a boundary between the plating electrode layer of each mounting electrode and the solder resist, and the recess is filled with resin of the sealing resin layer.

Abstract: The present invention pertains to a package module of a battery protection circuit, and the package module of the battery protection circuit according to the present invention comprises: a first internal connection terminal area and a second internal connection terminal area, which are respectively disposed at both edge parts thereof, and in which first and second internal connection terminals connected to a battery can provided with a bare cell are respectively disposed; an external connection terminal area, which is adjacent to the first internal connection terminal area, and in which a plurality of external connection terminals are disposed; and a protection circuit area comprising a device area in which a plurality of passive devices forming the battery protection circuit are disposed and a chip area, which is adjacent to the device area, and in which a protection IC and a dual FET chip forming the battery protection circuit are disposed, are disposed between the external connection terminal area and the

Abstract: A locking assembly includes a guiding post and a hollow locking member. The guiding post includes a locking portion. A clamp hook is formed on a flange of the locking portion. The locking member includes an opening end. The locking member sleeves on the locking portion of the locking member, in which at least one clamping depression is formed on an inner wall of the locking member corresponding to the clamp hook, and the clamp hook is clamped in one clamping depression.

Abstract: An ultrasonic sensor includes a transceiver block having a transceiver device for transmitting and receiving ultrasonic waves and a circuit board mounted with an electronic circuit for processing ultrasonic signals transmitted and received through the transceiver device. A housing of the ultrasonic sensor has an opening and a communication hole, and the circuit board is stored into the housing through the opening. The transceiver block is attached to the housing. An electric connector extends through the communication hole of the housing to electrically interconnect the transceiver device and the electronic circuit of the circuit board; and a cover member closes the opening of the housing. The communication hole is sealed by a filler material.

Abstract: Prior to loading into a vehicle, a duct is attached to a battery such that the duct is moveable between a loading position and a post-loading position. Before the battery and duct are loaded into the vehicle, the duct is positioned in the loading position. After the battery and duct are loaded into the vehicle, the duct is positioned in the post-loading position and secured.

Abstract: There is provided a circuit module, including: a circuit substrate including a mount surface; a mounting component mounted on the mount surface; a sealing body that is formed on the mount surface, covers the mounting component, and includes a trench formed from a main surface of the sealing body toward the mount surface, the trench including a first trench portion extending in one of a parallel direction and an orthogonal direction with respect to a direction parallel to the main surface and a second trench portion that is connected to the first trench portion, is parallel to the main surface, and extends in a direction that is not parallel nor orthogonal to the first trench portion; and a shield that covers the sealing body and includes an inner shield portion formed inside the trench and an outer shield portion provided on the main surface and the inner shield portion.

Abstract: Provided is a display device in which a panel module can be fixed to a front cabinet without using screws, and when performing maintenance, the panel module can be easily removed from the front cabinet. The display device including a panel module having a display surface on the front side thereof, a front cabinet surrounding a peripheral edge part of the panel module, and a back cabinet covering a back side of the panel module includes a flexible hook part protruded toward the back cabinet from the inner surface of the front cabinet, and an L-shaped fixing member which has an L shape and includes a latch plate having a hole part in which the flexible hook part is latched and a contact plate which contacts with a back surface of the panel module so as to fix the front cabinet to the panel module.

Abstract: An electronic device with a detachable communication module is provided. The electronic device includes an electronic device casing and the communication module. The electronic device casing includes a receiving space and an opening. The communication module includes a covering plate, a fixing plate, a first circuit board, and a first connector. The covering plate has an aperture. The first connector has a connecting port. Moreover, the first circuit board is connected with a supporting member. The first connector is connected with the first circuit board. The connecting port is exposed to the aperture of the covering plate. After the first circuit board and the first connector are accommodated within the receiving space, the opening of the electronic device casing is covered by the covering plate. Moreover, by the fixing plate, the communication module is fixed on the electronic device casing.

Abstract: A terminal module is configured to fit inside an internal power source receptacle in a housing of a process field device, and comprises a wired power source connection, power conditioning electronics, and a field device connection. The wired power source connection is configured to receive power from an external source. The power conditioning electronics are capable of conditioning power from the wired power source connection for reception by the industrial field device. The field device connection is configured to provide power conditioned by the power conditioning electronics to the process field device via a terminal configured to receive and mate with the internal power source.

Abstract: An improved capacitor packaging solution is presented that incorporates both thermal and electrical considerations. A package can include capacitor elements electrically coupled to a bus bar, and a thermally enhanced isolation layer between the bus bar and a case. The isolation layer can be provided adjacent a case base and sidewall portions. The bus bar can be disposed adjacent the isolation layer and be configured to extend along the package side and along the package length below the capacitor elements to provide an extended path for heat dissipation from the bus bar prior to its contact with capacitor elements. The enhanced isolation layer is configured to conduct heat away from the bus bar to the case to avoid the hotspot temperature of the capacitor. Reduced capacitor temperature allows use of smaller, cheaper capacitors, reducing inverter costs without compromising performance.

Abstract: A semiconductor package module including a self-assembled organic molecule layer and a method of manufacturing the semiconductor package module is provided. The semiconductor package module may include a module printed circuit board (PCB) having a plurality of metal line patterns and a plurality of mounting pads formed thereon. The semiconductor package may further include an insulation thin film self-assembled on at least one metal line pattern selected from among the plurality of metal line patterns. In order to manufacture the semiconductor package module, the insulation thin film is formed in a manner that the plurality of metal line patterns are formed on the module PCB wherein a plurality of via holes are formed, and then an organic compound is self-assembled on a surface of at least one metal line pattern selected from the plurality of metal line patterns.

Abstract: An electronic component module includes a wiring board on which at least one electronic component is mounted, an outer layer portion that is made of prepreg and covers the wiring board so that all of the at least one mounted electronic component is not exposed, and a terminal portion that is exposed from the outer layer portion to the outside and is configured to electrically connected to a mating connection member.

Abstract: A processor module can include a circuit board, a first programmable circuitry coupled to the circuit board, wherein the first programmable circuitry is configurable to implement different physical circuits, and a processor configured to execute program code. The processor can be coupled to the circuit board and to the first programmable circuitry. The processor module also can include random access memory (RAM) devices coupled to the circuit board and electrically coupled to the first programmable circuitry. The RAM devices can be coupled to the first programmable circuitry to form parallel channels of the RAM devices. The processor module further can include an interface coupled to the circuit board and electrically coupled to the first programmable circuitry for coupling input and output between the first programmable circuitry and external circuitry.

Abstract: A mobile terminal includes a first member disposed on an inner or outer surface of a terminal body, a second member adjacent to the first member and having a gap formed between the first and second members, a filler configured to fill the gap so as to block the gap, and a cover layer configured to cover the first member, the second member and the filler.

Abstract: A coil with variable inner diameter is disclosed. The coil includes a coil body consisting of a plurality of turns of winding, and a connecting terminal configured to be connected to an external device, wherein the winding is wound to form at least two different inner diameters. And an electronic module made from the coil with variable inner diameter is also disclosed. The electronic module includes; electronic components including at least an integrated circuit chip; a coil with variable inner diameter, including a coil body having at least two different inner diameters and a connecting terminal; a connector, configured to be electrically connected with the electronic component and the coil; and a magnetic conductor, configured to enclose in and around the coil body and the electronic component.

Abstract: There is disclosed a method of manufacturing an electrical component, involving bonding a thin metal foil to an insulating substrate and thereby forming a component blank, and laser machining at least the metal foil of said component blank to produce at least one trench for defining one or more foil tracks, said trench being at least equal in depth to the thickness of the foil so as to prevent current flow across the trench.

Abstract: A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding, and an IC chip placed in a cavity provided in the multilayer board. A gap is provided between a side of the IC chip and an inner wall of the cavity. The multilayer board includes a via-hole conductor provided near the inner wall of the cavity for preventing the resin sheets from being softened and flowing into the cavity upon thermocompression bonding.

Abstract: A memory connection structure of a storage device is disclosed. The storage device includes a circuit board, a memory controller, a bus, and a memory module. The memory controller, the bus, and the memory module are electrically connected on the circuit board. The memory module is composed of a plurality of memory sockets and a plurality of volatile memories. The volatile memories are connected to the same bus via the corresponding memory sockets and connected to the memory controller via the bus. The bus has at least one connection point and each connection point is connected to two memory sockets. The circuit board has a front surface and a rear surface, and two memory sockets connected to the same connection point are correspondingly installed on each of the two surfaces of the circuit board. In addition, two distances between the each memory socket and the memory controller are identical.

Abstract: A power backfeed apparatus includes a housing configured be removably positioned in a compartment of a motor control center (MCC), a contact assembly supported by the housing and comprising at least one contact configured to face a corresponding at least one power conductor of the MCC when the housing is disposed in the compartment and a power cable connector supported by the housing and configured to support connection of an external power cable thereto when the housing is disposed in the compartment, the power cable connector configured to be electrically coupled to the at least one contact of the contact assembly. A contact engagement mechanism forces the at least one contact into contact with the at least one power conductor to electrically couple the at least one contact and the at least one power conductor.

Abstract: According to one embodiment, an electronic apparatus includes a first case, module accommodated in the first case, a first cushion between the first case and the module, and a holding member to hold the module with respect to the first case movably.

Abstract: One variation of the invention is a electronic module comprising: a housing with external faces and electrically-conductive first, second, and third toes, each of which extends from one face to an adjacent face; first, second, and third magnetic elements arranged within the housing and proximal the first, second, and third toes, respectively; and a circuit arranged within the housing and electrically coupled to the toes. The circuit is operable between: a first mode when the first and second toes are in contact with a first terminal and a second terminal of a second electronic module, respectively; and a second mode when the second and the third toes are in contact with the second terminal and a third terminal of the second electronic module. The magnetic elements are configured to transiently retain the second electronic module against the housing, in both stacked and adjacent configurations, in the first and second modes.

Abstract: A waterproof structure of an electronic unit includes a case that defines a housing portion housing a first terminal, and a connector that includes an insulating body attached to the case. The connector includes a second terminal that is supported by the insulating body and connects a conductor end portion of a cable to the first terminal. The insulating body includes a wall portion that partitions a part of the housing portion by covering an open portion of the case. The insulating body includes a cable lead-in portion that defines a cable lead-in hole for leading the cable into the case and is joined to the wall portion. A potting resin is filled in a space between the inner periphery of the cable lead-in hole and the outer periphery of the cable and the housing portion and cured.

Abstract: A rack for electronic plug-in boards has board cages on the front and rear sides and at least one vertical backplane arranged between the board cages. The rack has an installation space provided underneath or above the board cages and into which fan modules can be horizontally inserted from the front side. A power supply module with an electronics unit supplies power to the backplane. The installation space continuously extends up to the region of the board cage on the rear side. The electronics unit is arranged in the region of the rear side of the rack underneath or above the board cage and defines the installation space toward the rear. The electronics unit is connected to the backplane by rigid electric conductors horizontally extending between the board cage on the rear side and the installation space parallel and at a distance from one another.

Abstract: Disclosed are apparatus and methods related to conformal coating of radio-frequency (RF) modules. In some embodiments, a module can include an overmold formed over an RF component mounted on a packaging substrate. The overmold can also cover a surface-mount device (SMD) such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD). The module can further include a conductive layer formed over the overmold and configured to provide RF shielding functionality for the module. The conductive layer can be electrically connected to a ground plane of the packaging substrate through the SMD. An opening can be formed in the overmold over the SMD; and the conductive layer can conform to the opening to electrically connect the conductive layer with an upper surface of the SMD and thereby facilitate the grounding connection.

Abstract: Disclosed are apparatus and methods related to ground paths implemented with surface mount devices to facilitate shielding of radio-frequency (RF) modules. In some embodiments, a module can include a packaging substrate configured to receive a plurality of components. The module can further include an RF component mounted on the packaging substrate and configured to facilitate processing of an RF signal. The module can further include an RF shield disposed relative to the RF component, with the RF shield being configured to provide shielding for the RF component. The RF shield can include at least one shielding-component configured to provide one or more electrical paths between a conductive layer on an upper surface of the module and a ground plane of the packaging substrate. The shielding-component can include a surface-mount device such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD).

Abstract: A fixing mechanism for fixing an electronic component is disclosed in the present invention. The fixing mechanism includes a first casing, a boss disposed on the first casing. The electronic component is disposed on the boss. The fixing mechanism further includes a resilient component disposed on the boss and located between the first casing and the electronic component, a circuit board putting on the electronic component and fixed on the first casing, and a second casing pressing the circuit board and fixed on the first casing. The circuit board contacts against the electronic component tightly by an assembly of the first casing and the second casing.

Abstract: A portable computer device and a screw rod device are provided. The portable computer device includes a computer body, a display, a support member and a screw rod structure. The support member is rotatably connected to the computer body and the display respectively. The screw rod structure is disposed in the computer body, and includes a fixing base, a free gear, a screw rod, a transmission gear and a driving gear. The fixing base has an accommodating portion and a connecting portion, and is connected to the display through the connecting portion. The free gear is disposed in the accommodating portion and screwed to the screw rod. The driving gear drives the free gear through the transmission gear, so that the free gear moves along an axial direction of the screw rod, thereby pushing the fixing base to adjust an included angle between the display and the computer body.

Abstract: A cover structure for an electronic circuit module includes a circuit board and a box-shaped cover integrated to each other. An electronic component is mounted on the circuit board. The cover has at least one open side. The cover includes a top plate and a mounting leg. The top plate is disposed so as to oppose the circuit board. The mounting leg is joined to the circuit board. The mounting leg is bent and extends from an outer periphery of the top plate. The top plate includes a bend portion and a cutaway portion. The bend portion is connected to the mounting leg. The cutaway portion is provided near the bend portion.

Abstract: A circuit module includes: a wiring substrate including a mounting surface having first and second areas and a terminal surface on the other side of the mounting surface; a plurality of electronic components mounted on the first and second areas; a sealing layer that covers the plurality of electronic components, is formed of an insulation material, and includes a groove portion formed along a boundary between the first and second areas; a conductive shield including a first shield portion that covers an outer surface of the sealing layer and a second shield portion provided in the groove portion; and a conductive layer including a wiring portion that is provided on the mounting surface and electrically connects the terminal surface and the second shield portion, and a thickening portion that is provided in the wiring portion and partially thickens a connection area of the wiring portion with the second shield portion.

Abstract: A circuit substrate has the following elements. A stacked circuit structure has a first surface and a second surface opposite thereto surface. A first patterned inner conductive layer is disposed on the first surface and has multiple pads. A first patterned outer conductive layer is disposed on the patterned inner conductive layer and has multiple conductive pillars, wherein each of the first conductive pillar is located on the corresponding first pad. The first dielectric layer covers the first surface, the first patterned inner conductive layer and the first patterned outer conductive layer, and has multiple first concaves, wherein the first concave exposes the top and side of the corresponding first conductive pillar. A semiconductor package structure applied the above circuit substrate and a process for fabricating the same are also provided here.

Abstract: An atomic oscillator includes a first unit and a second unit arranged to be separated from each other and a package including an internal space in which the first unit and the second unit are housed in a state in which the internal space is decompressed to pressure lower than the atmospheric pressure. The reflectance of the outer surfaces of the first unit and the second unit to an electromagnetic wave having a wavelength of 4 ?m is equal to or higher than 50%.

Abstract: The invention relates to a communication cartridge (1) characterized in that—it is adapted to be integrated in a removable manner into a recess (25) of a host equipment (2), during normal operation, an external front part (13) of the cartridge being intended to be external to the recess (25) of the host equipment (2), and in that—it comprises at least one front port, placed in an internal space of the cartridge (1) and intended to cooperate with a wireless communication module also placed in the internal space of the cartridge (1), during normal operation, the front port being moreover adapted to have an adjustable position in the internal space, so that the module is at least partially positioned in the external front part (13) of the cartridge (1), during normal operation. The invention also relates to an equipment, an assembly and a system corresponding thereto.

Abstract: A power semiconductor module, and method for its manufacture, comprising a first housing part having a cutout and a DC voltage load connection apparatus forming a structural unit, wherein the DC voltage load connection apparatus has first and second DC voltage load connection elements. The first DC voltage load connection element has a first leadthrough section arranged in the cutout, and the second DC voltage load connection element has a second leadthrough section arranged in the cutout forming a gap therebetween. The first and second leadthrough sections are sheathed by an elastomer, which fills the gap, is cohesively connected to the first and second leadthrough sections and seals off the first and second leadthrough sections with respect to the first housing part. The inventive power semiconductor module exhibits a high resistance to thermal cycling, and the distance between the DC voltage load connection elements can be configured to be small.

Abstract: The instant disclosure relates to a data access module, which includes a plurality of data access devices, a circuit board defining a plurality of holes, a base frame, a plurality of partition panels, a cover frame, and a plurality of locking pieces. The base frame includes a bottom plate and a pair of sidewalls. A plurality of fixing pieces and ridges are formed on the bottom plate. The partition panels are directed along the retrieving direction of the data access devices and fixed on the bottom plate. Each partition panel has a hooking portion for engaging the corresponding hole of the circuit board. The cover frame includes a top plate and a pair of side plates. The locking pieces are rotatably disposed on the cover frame. Each locking piece has a pressing portion selectively pressing against the circuit board. A chassis is also discussed.

Abstract: The present disclosure relates to the field of fabricating microelectronic packages and the fabrication thereof, wherein a microelectronic device may be formed within a bumpless build-up layer coreless (BBUL-C) microelectronic package and wherein a warpage control structure may be disposed on a back surface of the microelectronic device. The warpage control structure may be a layered structure comprising at least one layer of high coefficient of thermal expansion material, including but not limited to a filled epoxy material, and at least one high elastic modulus material layer, such as a metal layer.

Abstract: In a capacitor module, a capacitor, a seal member that seals the capacitor, an electronic element electrically connected to the capacitor, a temperature sensor that measures a temperature around the capacitor, and a wire member electrically connected to the temperature sensor are provided. A holder holds at least the electronic element, the temperature sensor, and the wire member. The holder is fixed to the seal member while the temperature sensor is located between the electronic element and at least part of the capacitor via the seal member.

Abstract: A junction box is affixed to, and electrically coupled with, a solar panel. The junction box is configured to releaseably engage and disengage accessory modules, thereby allowing accessory modules to be replaced or exchanged easily. Accessory modules are electrically coupled with other accessory modules in the solar panel string. The furthest downstream accessory module is connected to a wire harness, which is connected to a central combiner box.

Abstract: Disclosed herein is a 3D power module package, including: a power converting unit packaged to include a heat radiating substrate, a power device connected to the heat radiating substrate, and a lead frame; a controlling unit packaged to include a controlling unit substrate and IC and controlling devices mounted on an upper portion of the controlling unit substrate; and an electrical connecting unit electrically connecting the packaged power converting unit and the packaged controlling unit.

Abstract: The present invention discloses a circuit board interconnection architecture, which includes at least one first plugboard and at least two second plugboards substantially perpendicular to the first plugboard, where at least one of the first plugboard and the second plugboards is provided with several slots; the first plugboard and the second plugboards are mated and electrically connected by using signal connectors on both sides of the slots. The circuit board interconnection architecture solves a fitting precision problem of the first plugboard and the second plugboards in orthogonal directions. Even though there is an assembly tolerance between the first plugboard and the second plugboards, the connectors still satisfy assembly precision requirements, which can also avoid overall deformation of a first circuit board and a second circuit board after the first plugboard and the second plugboards are interconnected and mated orthogonally.

Abstract: A system includes an inductive backplane, at least one communications interface, and a control unit. The inductive backplane is configured to secure and inductively power a plurality of detachable medical device modules. The control unit controls, via the at least one communications interface, at least one attribute of each medical device module when the medical device module is secured to the inductive backplane. Related apparatus, systems, techniques and articles are also described.

Abstract: An electrical gasket provides an electrical seal between first and second components in an electrical module. The electrical gasket includes an attachment portion for fixedly attaching the electrical gasket to one of the first and second components and a plurality of spring members for engaging the other of the first and second components to make mechanical and electrical contact between the first and second components such that the electrical seal is provided between the first and second electrical components. One of the components of the module can be an EMI shield or printed circuit board of the module, and another of the components can be the module housing.

Abstract: A portable terminal including a module, in which one or more storage members are disposed, and a method for manufacturing the portable terminal are provided. The portable terminal includes a first assembly that includes a shield can and a flexible circuit board attached to a surface of the shield can. The portable terminal also includes at least one socket unit mounted to an upper side of the first assembly. The socket unit is mounted to an upper side of the flexible circuit board while the first assembly is positioned on a jig.

Abstract: A display apparatus includes a display module for displaying an image, and a variable member for varying a shape of the display module. The variable member includes a first portion capable of varying in shape, and a second portion having opposite ends respectively fixed to opposite ends of the first portion, where a distance between the opposite ends of the second portion is varied such that the opposite ends of the first portion protrudes with respect to a central region of the first portion and thereby, the display module is varied in shape.

Abstract: A substrate of a semiconductor package comprises a conductor pattern which is formed in a surface layer, and is electrically connected to one terminal out of a power terminal and a ground terminal of a semiconductor element. The substrate also comprises in the surface layer a conductor pattern which is arranged while being separated from the conductor pattern, and a conductor pattern which is formed so as to have a wiring width thinner than that of the conductor pattern and connects the conductor pattern with the conductor pattern. The substrate also comprises a conductor pattern which is formed in an inner layer, faces the conductor pattern through a dielectric and is electrically connected to the other terminal out of the power terminal and the ground terminal of the semiconductor element.

Abstract: An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating substrate in contact with the resin layer, the contact surface forming the side surface of the connecting component.

Abstract: A flexible display module includes a panel having a display unit thereon, and a built-in battery which supplies an internal power source to the panel, for driving the display unit.

Abstract: An electronic device including a rear cover, a transparent front cover, a first electronic element, a second electronic element, a conductive tape, and an elastomer is provided. The transparent front cover is disposed on the rear cover. The first electronic element is disposed between the transparent front cover and the rear cover. The second electronic element is disposed between the first electronic element and the rear cover. The conductive tape is disposed between the first electronic element and the second electronic element, and contacts the first electronic element and the second electronic element to electrically connect the first electronic element to the second electronic element. The elastomer is disposed between the first electronic element and the second electronic element, and is attached to the conductive tape under pressure. An electronic module including the first electronic element, the second electronic element, the conductive tape, and the elastomer above is provided.

Abstract: An electronic module and method of making an electronic module include a printed circuit board (PCB) having a surface, at least one conductive trace being formed on the surface. A housing element for mechanically mating with the PCB includes at least one mating surface aligned with the conductive trace on the PCB when the PCB and the housing element are mechanically mated, the mating surface comprising a plurality of alternating protrusions and spaces between the protrusions.

Abstract: A mobile terminal includes a first body and a second body, a first display unit mounted to the first body, and a slide module configured to move the first body and the second body with respect to each other. Further, the slide module includes a first slide member coupled to the first body, and a second slide member having a first bending portion and a second bending portion extending from a side end thereof in directions crossing each other, and configured to encompass at least part of side surfaces of the first slide member. In addition, the first bending portion and the second bending portion are spaced from at least one side surface of the first display unit with a predetermined gap from the side surface of the first display unit.

Abstract: A display device is provided. The display device may include a display module, a back cover that supports a back surface of the display module, and a top case that covers an edge portion of a front surface and/or a lateral surface of the display module. The top case may include a coupling portion formed in a lateral surface thereof to be coupled to the lateral surface of the display module and an edge portion of the back cover. A rear cabinet may cover a back surface of the back cover. The lateral surface of the top case may be exposed, such that a number of elements of the display device may be reduced so as to reduce production costs and processes, with a reduced size bezel on a front screen.