Abstract: The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation.

Abstract: A packaging substrate includes: a dielectric layer unit having top and bottom surfaces; a positioning pad embedded in the bottom surface of the dielectric layer unit; at least a passive element having a plurality of electrode pads disposed on upper and lower surfaces thereof, the passive element being embedded in the dielectric layer unit and corresponding to the positioning pad; a first circuit layer disposed on the top surface of the dielectric layer unit, the first circuit layer having first conductive vias electrically connected to the electrode pads disposed on the upper surface of the passive element; and a second circuit layer disposed on the bottom surface of the dielectric layer unit, the second circuit layer having second conductive vias electrically connected to the electrode pads disposed on the lower surface of the passive element. Through the embedding of the passive element, the overall structure may have a reduced height.

Abstract: A driver assembly includes a driver housing and a driver, the driver including at least one first portion and a second portion, the first portion having a lower heat resistance than the second portion, wherein the driver housing includes at least one first cavity for at least partially accommodating the first portion and a second cavity for accommodating the second portion, and a potting material is potted into the first cavity to envelop the first portion.

Abstract: A module includes an insulating substrate that is a first base material; a cover member having a cavity section and a second recess section that form an internal space between the cover member and the insulating substrate, which is a second base material bonded to the insulating substrate on a first surface thereof; an element piece that is a first functional element, accommodated in the internal space; a recess section formed on a second surface that is a rear surface of the first surface of the cover member; and a semiconductor device that is a second functional element, connected in the recess section.

Abstract: The disclosure describes a cover for a frame for mounting a device above a printed circuit board (PCB) in an electronic device. The cover comprises: a surface to cover a bottom of the display device and to be located on top of a frame section of a frame that is mounted on the PCB and surrounds a surface device on the PCB; a raised region in the surface to allow a part of the surface device to jut above the frame section; and a depressed region in the surface to receive a feature on a bottom of the display device to allow the feature to extend into an interior cavity bounded by the frame section.

Abstract: A mounting system for a control module in a vehicle comprises a housing with a flange formed with an opening adapted to receive a fastener for securing the housing to the vehicle. A crack initiator causes a crack to occur in the flange or the housing and thus reduces bending of the housing during a side impact collision causing lateral forces. Preferably, an attachment bolt extends through the opening into the vehicle and the flange forms a C-shape around the opening to allow lateral forces during the side impact collision to force the attachment bolt to slide out of the opening. Preferably, electronic components in the module include an event data recorder for recording data about the vehicle collision and relaying the data after the collision, a communications system for calling for assistance and a controller for cutting off the vehicle fuel supply.

Abstract: Provided is a financial device, which comprises a medium cassette, a cassette box, and a shock prevention apparatus. The medium cassette accommodates a medium. The medium cassette is installed on the cassette box. The shock prevention apparatus is disposed between a portion of the medium cassette and a portion of the cassette box facing the portion of the medium cassette. The shock prevention apparatus prevents a shock from being applied to the medium cassette while the medium cassette is installed on the cassette box.

Abstract: Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical wiring may include a first RF device and at least one first via-hole. A second wafer may include a second RF device and at least one second via-hole disposed at a location corresponding to the at least one first via-hole. A vertical wiring may connect the at least one first via-hole and the at least one second via-hole. The vertical wiring may be configured to be connected to an external device through a bottom surface of the at least one first via-hole or a top surface of the at least one second via-hole.

Abstract: The present invention among other things relates to a housing and a construction kit for a control apparatus, e.g. in the form of a controller for a window lifter of a motor vehicle. A controller module with a printed circuit board here is to be accommodated in a housing at least in part, and there are provided two different types of controller modules, e.g. for a right vehicle side on the one hand and for a left vehicle side on the other hand. According to a first aspect of the invention the housing is suitable for both types of controller modules, so that the housing can selectively be combined with the one or the other type of controller module, in order to mount a control apparatus.

Abstract: A micro grid apparatus and associated method of formation. Multiple tiers are formed. The tiers are distributed and sequenced in a vertical direction such that each tier is at a different vertical level in the vertical direction. Each tier includes a multiplicity of complex shapes interconnected by bridge modules. Each complex shape is a physical structure having an exterior boundary. Each complex shape includes multiple docking bays such that each docking bay is configured to have a module latched therein.

Abstract: An electronic module includes a substrate, a built-in electronic component and a surface mount electronic component. A suckable region is provided on a front surface of the substrate. When viewed in a see-through manner in a direction perpendicular or substantially perpendicular to the front surface of the substrate, the suckable region is inside of a region in which one built-in electronic component is built in and a center of gravity of the electronic module is located inside of the suckable region. A protective layer is not provided on the front surface of the substrate on which the surface mount electronic component is mounted.

Abstract: Embodiments of provide an integrated circuit (IC) device. The IC device can include a substrate having first and second opposing surfaces, an IC die electrically coupled to the first surface of the substrate, a plurality of contact members coupled to the first surface of the substrate, and an interposer. The interposer can include a plurality of contact elements located on a first surface thereof, each conductive element being coupled to a respective one of the plurality of contact members, and an antenna formed using a conductive layer of the interposer, the antenna being electrically coupled to the IC die through at least one of the plurality of contact elements and at least one of the plurality of contact members.

Abstract: The present invention provides for a protective enclosure comprising a base comprising a first continuous mating surface and at least one conveyance aperture, a cover comprising a second continuous mating surface, wherein the second continuous mating surface is configured to form a seal with the first continuous mating surface, and a clamp, wherein at least a portion of the clamp is coupleable to the base, wherein a mouth of the clamp is configured to be offset from the aperture when the clamp is coupled to the base, wherein the clamp comprises a first sealing layer, and wherein the clamp is configured to seal the aperture against contaminants. The protective enclosure may be configured for use in a remotely controllable model vehicle to protect a control module.

Abstract: There is provided a receptacle for a modular telematic unit. An exemplary receptacle comprises a body, at least one housing, and at least one solar panel. The body comprises at least two rails positioned opposite from each other. The housing is configured to be detachably slid into the rails. The solar panel is configured to be detachably slid into the rails. An outer surface of the solar panel, when slid into the rails, is slanted at an angle ? relative to at least one outer surface of the body. The outer surface of the body is positioned opposite the solar panel.

Abstract: A circuit module includes a substrate that has a substantially rectangular parallelepiped shape and includes a plurality of inner conductive layers, an electronic component disposed on a first main surface of the substrate, an insulating layer disposed on the first main surface of the substrate so as to cover the electronic component, a shielding layer disposed on a surface of the insulating layer, and a ground electrode connected to the plurality of inner conductive layers. At least two of the inner conductive layers are directly connected to the shielding layer.

Abstract: A sealed compressor has an electric motor driving a compressor pump unit, and a shell enclosing the electric motor and compressor pump unit. An electrical connector with the shell supplies electrical power to the motor. A terminal housing is mounted to an outer surface of the shell, and a terminal plug is received within the terminal housing. The terminal plug has electric connections to connect into the electric connector within the shell. The housing includes a cover plate enclosing a chamber for the housing and which receives the terminal plug. A spring extends from the terminal plug, and reacts against a surface of the cover to bias the terminal plug to maintain the electric connection between the terminal plug and the electrical connector in the shell.

Abstract: A connecting member for a portable electronic device includes a central cylinder, a first flange portion, a second flange portion, a plurality of first clasps and a number of second clasps. The first flange portion and the second flange portion surround on the central cylinder. The first clasps extend from the first flange portion, and the second clasps extend from the second flange portion.

Abstract: Disclosed are a hinged connector and a video display assembly containing an attachment panel having a front surface and a back surface, with a video display attached to the front surface and at least one hinged connector attached to the back surface.

Abstract: An electronics chassis comprises an electronics module residing in the chassis and fronted by a multi-piece faceplate system. The multi-piece faceplate system includes a faceplate and a faceplate assembly. The faceplate assembly includes an ejection lever pivotally coupled to the electronics module. The ejection lever includes an ejection latch coupled to the faceplate assembly. The ejection latch is configured to facilitate retention of the electronics module within the chassis when said faceplate assembly is in a closed position. The ejection latch is further configured to facilitate ejection of the electronics module from the chassis when the faceplate assembly is in an open position.

Abstract: A mobile power system includes a plurality of energy sources including a solar powered generating source and a plurality of electronic and telecommunications components configured to receive the power generated by the plurality of energy sources and convert the power generated to direct current power. The system also includes a plurality of batteries configured to store the direct current power and a main distribution panel including one or more short circuit ground fault protection devices configured to isolate a short circuit ground fault in less than approximately two hundred milliseconds. The system also includes one or more transportable housings configured to hold the plurality of energy sources, the plurality of electronic and telecommunications, the main distribution panel and the plurality of batteries during transport of the housing.

Abstract: A semiconductor module arrangement is provided having a first subassembly, a second subassembly and a third subassembly. The third subassembly has a quantity of adjustment pins which are fixedly connected to one another. The first subassembly has a number N1 of first adjustment openings, and the second subassembly has a number N2 of second adjustment openings. Each of the adjustment pins engages into a different one of the first adjustment openings and/or into one of the second adjustment openings. A corresponding method of producing the semiconductor module arrangement is also provided.

Abstract: A controller for controlling the utilization of resources within a zone having a housing having an interior carrying a barrier for utilization in defining a line voltage compartment delineated from a low voltage compartment within said housing interior. A power control board is carried within the line voltage compartment for receiving line voltage. A low voltage board is carried within the low voltage compartment for communicating with low voltage components. A controller board is carried by the housing for receiving data associated with the low voltage components and receiving line voltage from the line power control board. A first cover encloses a first portion of the interior of the housing for defining the line voltage compartment. A second cover encloses a second portion of the interior of the housing for defining the low voltage compartment.

Abstract: A multiple cable strain relief and electronic assembly having such multiple cable strain relief includes a body, a plurality of cable cutouts and a compression member. The body has at least two spaced apart sidewalls thereby defining a cavity between the sidewalls. The plurality of cable cutouts are in each of the sidewalls. Each cable cutout in one of the sidewalls is aligned with a cable cutout in the other of sidewalls thereby defining a cable cutout pair. The compression member has a retention position that is at least partially extending into the cavity. With the compression member in the retention position a cable extending though a cable cutout pair is deflected in the cavity to retain that cable between the sidewalls and the compression member.

Abstract: With the objective of improving an energy storage device comprising a transducer unit and a capacitor module which interacts with the transducer unit so it can be inserted as a physical device into a motor vehicle in particular, it is proposed to provide a housing to accommodate the capacitor cells of the capacitor module, for the housing to comprise a capacitor chamber accommodating the capacitor cells, and for the capacitor chamber to have a gas-tight seal.

Abstract: In embodiments of a double hinge torsion bar, a portable device includes a first housing integrated with a display device, and a second housing movably coupled to the first housing. Double hinges attach to the first and second housings of the portable device, and the double hinges are operable to open and close the first and second housings relative to each other. A torsion bar movably couples the double hinges to open and close at approximately a same timing rate, which can prevent the double hinges from binding when the first and second housings are opened and closed relative to each other.

Abstract: There are provided a flat panel display device in which a flat display panel and an optical member are layered and fixed to each other without using an OCA (Optical Clear Adhesive) film and a method for manufacturing the same. A flat panel display device according to an exemplary embodiment of the present invention includes a display module that is formed by layering a flat display panel and one or more optical members having a pair of flat planes; and an adhesive that occupies mold spaces formed so as to include sides of the display module and is cured while adhering to the sides of the display module, in which the display module is fixed by the cured adhesive.

Abstract: A power module substrate includes an insulating substrate, and a circuit layer that is formed on one surface of the insulating substrate. The circuit layer is formed by bonding a first copper plate onto one surface of the insulating substrate. Prior to bonding, the first copper plate has a composition containing at least either a total of 1 to 100 mol ppm of one or more kinds among an alkaline-earth element, a transition metal element, and a rare-earth element, or 100 to 1000 mol ppm of boron, the remainder being copper and unavoidable impurities.

Abstract: A system includes: a controller, a first memory module connected to the controller through a first data bus, and a second memory module connected to the controller through a second data bus, wherein the first memory module includes: first and second memory chips; a first data terminal connected to the first data bus, and a first switch unit that electrical connects the first data terminal with either the first memory chip and the second memory chip, and the second module includes: third and fourth memory chips; a second data terminal connected to the second data bus, and a second switch unit that switches over electrical connection of the second data terminal with either the third memory chip or the fourth memory chip.

Abstract: A terminal mounting construction includes a housing and a terminal. The housing accommodates a substrate and including a locking portion. The terminal connects the substrate to an electric wire. The terminal includes a conductive portion, a substrate connecting terminal portion, a wire connecting portion and a locked portion. The conductive portion is connected to a pattern on the substrate. The substrate connecting terminal portion holds the substrate together with the conductive portion. The wire connecting portion is connected to the electric wire from an opposite direction to an inserting direction in which the substrate is inserted between the conductive portion and the substrate connecting terminal portion. The locked portion is locked in the locking portion. The housing includes an accommodating portion accommodating the substrate connecting terminal portion so as to receive an end face of the substrate connecting terminal portion which faces to follow the opposite direction.

Abstract: Preferred embodiments of a radio-frequency and electrical power distribution duct are implemented with high-definition multimedia interface HDMI receptacles to deliver high-bandwidth digital signals to multiple signal receivers.

Abstract: To provide a module board capable of suppressing depression of a top face of insulating resin near the center of a substrate by arranging multiple columnar connection terminals not only on a peripheral area of the substrate but also between multiple electronic components that are mounted. Multiple electronic components 4 and 4h are mounted on one face of a substrate 5 and the multiple electronic components 4 and 4h are sealed with insulating resin 3. Multiple columnar connection terminals 2 and 7 are arranged on a peripheral area of the substrate 5 and in one or more small areas 8 on the substrate 5, respectively. The one or more small areas 8 are set at positions on the substrate 5, which is not on the peripheral area of the substrate 5 and on which the multiple electronic components 4 and 4h are not mounted.

Abstract: Disclosed are a method, system, and/or apparatus to stack a processor power module on a populated printed circuit board. A stacked processor power module includes a bare printed circuit board comprising a top surface and a bottom surface. The stacked processor power module also includes a first pair of metal lead legs coupled to an upper region of the bottom surface of the bare printed circuit board and a second pair of metal lead legs coupled to a lower region of the bottom surface of the bare printed circuit board. An integrated circuit board assembly includes a populated printed circuit board having a mounting region upon which to stack the stacked processor power module above the mounting region of the populated printed circuit board by coupling the first pair of metal lead legs and the second pair of metal lead legs to the mounting region.

Abstract: A system includes a module having a connector at a leading end and a handle pivotally coupled to a trailing end. The handle pivots between open and closed positions, and includes landing and grip portions. The system further includes a chassis having a bay, a connector disposed in the bay, and a spring latch assembly adjacent an open end of the bay for receiving the leading end of the module. The spring latch has a catch adjacent to a spring element. Receiving the leading end of the module into the bay aligns the module connector with the connector in the bay and aligns the landing of the handle with the catch of the spring latch assembly. Pivoting the handle from the open position to the closed position will then cause the landing of the handle to engage the catch and then load the spring element to couple the connectors.

Abstract: A pluggable module, includes: an insertion gate through which an electronic module is inserted and removed; a guide rail, including a spring support unit provided with a spring unit and a bearing unit located near the insertion gate, to guide the electronic module; and a heat sink plate, including, at one end portion, a fulcrum bar to be inserted into the bearing unit so as to move in a pressing direction of the spring unit, the heat sink plate being pushed up at the other end portion by a leading end of the electronic module so as to be pressed against the electronic module.

Abstract: A telecommunication panel may comprise a chassis configured to receive insertable Digital Signal Cross-connect (DSX) modules and a backplane connected to the chassis. The DSX module is compact to fit into the telecommunication panel. A ratio of the number of the insertable 6-port DSX modules over the backplane surface area at least about 0.37 modules per square inch is achieved. The DSX module may include a printed circuit board and a light emitting diode (LED) light pipe on the printed circuit board to minimize the width of the DSX module. The DSX module may be inserted into the telecommunication panel horizontally or vertically so that the telecommunication panel receives a maximum number of DSX modules.

Abstract: An electrical control system for fixtures, devices and appliances that safety isolates a power source using the features of the safety block, and consolidates multiple control points to remotely activate a combination of fixtures, devices and appliances using the features of the control module, thereby promoting safety and facilitating energy conservation. The system has a safety block where a safety-block AC power supply connector on the rear attaches to a household alternating current (AC) power supply. The safety-block AC power supply connector passes through a cavity to the safety-block AC power transfer connector located on the front. The system also has a control module with a control-module user interface on the front. A control-module AC power connector connects to the control-module user interface and passes through the control-module cavity to connect to the safety-block AC power transfer connector located on the front of the safety block.

Abstract: A plurality of sensors are embedded in a form fitting garment similar to exercise togs such that the sensors are held in contact with or close proximity to the body. The sensors are connected via a plurality wires to an electronics module which is unintrusive being literally in its ultimate configuration the size of a credit card. A range of thickness, from 6 mm (6 credit cards) down to 1 mm or less, is possible for the module inclusive of a rechargeable lithium polymer battery. The electronics module can be easily removed for garment maintenance (laundering).

Abstract: Attachment structures for electrically coupling a microelectronic package to a microelectronic board/interposer including joint pads formed on the microelectronic board/interposer which provide a gap between respective openings in a solder resist layer of the microelectronic substrate and each of the joint pads. Such attachment structures may reduce or substantially eliminate contact between a solder interconnect and a solder resist layer of the microelectronic board/interposer, which may, in turn, reduce or substantially eliminate the potential of crack initiation and propagation at contact areas between the solder interconnect and a solder resist layer of the microelectronic board/interposer due to stresses induced by a mismatch of thermal expansion between the microelectronic package and the microelectronic board/interposer during thermal cycling.

Abstract: The electric box includes a box body, a control assembly and a protection structure. The box body has a chamber. The control assembly is received in the chamber. The protection structure includes a protector and at least one passing hole located on a side of the box body and communicating with the chamber. The protector is received in the chamber and located on a side of the control assembly. The protector is provided with at least one through hole corresponding to the at least one passing hole. The passing hole and through hole are used for being passed by a wire.

Abstract: A data communication module tab is sufficiently compliant in off-axis directions that it resists damage from forces in such off-axis directions, yet is sufficiently rigid in the direction of its longitudinal axis that a person can insert the data communication module into a cage and withdraw it from a cage by pushing and pulling the tab, respectively.

Abstract: An electronic device includes a motherboard and a chip module. The motherboard includes a first connector. The chip module includes a circuit board parallel to the motherboard, a chip mounted on the circuit board, a second connector, and a fastener. The second connector of the chip module is electronically connected to the first connector of the motherboard. The fastener extends through the circuit board, to fix the chip module compactly and firmly in place.

Abstract: A semiconductor module, an upper and lower arm kit, and a three-level inverter can be provided with low cost and broad current ratings and voltage ratings using existing packages, without developing new packages. A first semiconductor module (100) on an upper arm side and a second semiconductor module (200) on a lower arm side are formed using an existing package, and the semiconductor modules (100) and (200) are used to configure an upper and lower arm kit (300). Further, the upper and lower arm kit (300) is used to configure a three-level inverter (500). These devices can be formed using existing packages (56), and semiconductor modules (100), (200), an upper and lower arm kit (300), and a three-level inverter (500) can be therefore provided with low cost and broad current ratings and voltage ratings.

Abstract: An interlocking system for connecting a programmable module and an automation controller of an industrial control and automation system is provided. The interlocking system includes a key comprising a shaft with a head and a first attachment feature. The interlocking system also includes a first keyhole in a programmable module cover. The first keyhole is configured to enable the head to pass upwardly there through. The interlocking system also includes a second keyhole in an automation controller cover. The second keyhole is configured to enable the first attachment feature to slide downwardly there through such that disengagement of the key from the second keyhole is resisted. The interlocking system also includes a second attachment feature on a lower surface of the automation controller cover. The second attachment feature is configured to engage with the first attachment feature when the first attachment feature is rotated about an axis of the shaft.

Abstract: A package includes a ground plate, a chip mounting plate disposed at a side of the ground plate and having a top surface lower than a top surface of the ground plate, a chip on the chip mounting plate, a first input/output terminal opposite to the chip mounting plate and disposed at another side of the ground plate, and a second input/output terminal opposite to the ground plate and disposed at a side of the chip mounting plate. The first and second input/output terminals are electrically connected to the chip.

Abstract: A display is provided. The display includes a frame, a display module, and a bendable cover. The frame includes a bottom surface and a lateral surface, the display module is disposed on the frame, and the bendable cover has a surface layer and an adhesive layer, the adhesive layer is located on the surface layer, a part of the surface layer is adhered to the display module through the adhesive layer, another part of the surface layer is attached to the lateral surface of the frame and adhered to the bottom surface of the frame through the adhesive layer.

Abstract: Methods and apparatus for an interposer with a dam used in packaging dies are disclosed. An interposer may comprise a metal layer above a substrate. A dam or a plurality of dams may be formed above the metal layer. A dam surrounds an area of a size larger than a size of a die which may be connected to a contact pad above the metal layer within the area. A dam may comprise a conductive material, or a non-conductive material, or both. An underfill may be formed under the die, above the metal layer, and contained within the area surrounded by the dam, so that no underfill may overflow outside the area surrounded by the dam. Additional package may be placed above the die connected to the interposer to form a package-on-package structure.

Abstract: Disclosed is a portable adjunct device that includes a case having a first recess and a second recess. Mounted in the first recess is a docking connector movable between closed and open positions. Detachably mounted in the second recess is a universal serial bus connector operably connected to the docking connector. The case defines a chamber and a battery operably connected to the docking connector is disposed in the chamber.

Abstract: An electronic device includes a main body, an electronic assembly and an ejecting mechanism. The main body is formed with a retaining space, and the electronic assembly is retained in the retaining space of the main body. The ejecting mechanism includes an operating member that has a main portion and a connecting portion disposed on the main portion. The operating member is rotatable on the connecting portion and is disposed in the main body while the lifting section is disposed between the main body and the electronic assembly. The operating section is operable to drive the lifting section to push the electronic assembly out of the retaining space.

Abstract: A memory module socket and a terminating resistor assembly. The terminating resistor assembly provides an elongate conductive bus bar and a plurality of conductive branches, wherein each conductive branch is in electronic communication with the elongate conductive bus bar through a resistor, wherein each conductive branch has a distal end disposed for contacting a signal pin within a memory module socket installed on a printed circuit board. A distal end of each conductive branch is inserted into a window on the connector shoulder adjacent to the slot of an empty memory module socket and engages a plurality of signal pins within the socket in response to the absence of a memory module in the slot. The plurality of signal pins engage contact pads on the memory module and are pushed out of contact with the conductive branch in response to the presence of a memory module in the slot.

Abstract: The invention relates to a portable electronic device comprising a supporting member receiving on one side conductive contact lands or tracks extending substantially as far as the edge of the side and connecting an electronic microcircuit, the conductive contact lands or tracks comprising a plurality of perforations. The device is noteworthy in that the interior of the perforations is free, or intended to be kept free, of metal.